JPH0543499Y2 - - Google Patents
Info
- Publication number
- JPH0543499Y2 JPH0543499Y2 JP6313587U JP6313587U JPH0543499Y2 JP H0543499 Y2 JPH0543499 Y2 JP H0543499Y2 JP 6313587 U JP6313587 U JP 6313587U JP 6313587 U JP6313587 U JP 6313587U JP H0543499 Y2 JPH0543499 Y2 JP H0543499Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- spacer
- circuit
- conductive portion
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 125000006850 spacer group Chemical group 0.000 claims description 23
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 239000004831 Hot glue Substances 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000003990 capacitor Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000012943 hotmelt Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
【考案の詳細な説明】
(a) 産業上の利用分野
本考案は、電子卓上計算機の回路基板の構造に
関するものであり、特にフイルムシート状の回路
基板と電子部品及びケース本体との固着構造に関
するものである。[Detailed description of the invention] (a) Industrial application field The present invention relates to the structure of a circuit board for an electronic desktop computer, and particularly relates to the fixing structure between a film sheet-like circuit board, electronic components, and a case body. It is something.
(b) 従来技術
従来の電子卓上計算機においては、回路基板上
に形成されているスイツチ用のパターンを一定距
離だけ離すためにスペーサがこのスイツチ用のパ
ターン間に配設されており、このスペーサとは別
体の固着用シートを用いてIC等の電子部品を回
路基板に固着していた。(b) Prior art In conventional electronic desktop calculators, spacers are placed between the switch patterns formed on the circuit board to separate them by a certain distance. used a separate adhesive sheet to adhere electronic components such as ICs to the circuit board.
(c) 考案が解決しようとする問題点
上記従来技術においては、IC等の電子部品を
固着するための部品及び工程が増加するという問
題点があつた。(c) Problems to be solved by the invention The above-mentioned conventional technology had the problem of increasing the number of parts and processes for fixing electronic parts such as ICs.
また、部品点数及び製造工程が増加すると、製
造コストも上昇するという問題点があつた。 Furthermore, as the number of parts and manufacturing steps increase, manufacturing costs also rise.
さらに、電子部品の数、形状又は位置が変わる
と、固着用シートの形状も変えなければならず、
汎用性が乏しいという問題点もあつた。 Furthermore, if the number, shape, or position of electronic components changes, the shape of the fixing sheet must also change.
Another problem was that it lacked versatility.
(d) 問題点を解決するための手段
本考案の目的は、部品点数及び製造工程を削減
し、量産性に優れた汎用性の高い回路基板の構造
を提供することにある。(d) Means for Solving Problems The purpose of the present invention is to provide a highly versatile circuit board structure that reduces the number of parts and manufacturing processes, and is excellent in mass production.
このため本考案の電子卓上計算機の回路基板構
造は、表面に回路パターンが形成され、対向する
２つの回路基板と、該２つの回路基板の間に配設
された絶縁性のスペーサとからなる電子卓上計算
機の回路基板において、前記スペーサの表面に絶
縁性のホツトナルトタイプ接着剤を印刷し、前記
２つの回路基板の一方に塔載されるICを含む電
子部品を、前記スペーサを加熱、加圧することに
より固着したことを特徴とする。 Therefore, the circuit board structure of the electronic desk calculator of the present invention is composed of two circuit boards facing each other, each having a circuit pattern formed on its surface, and an insulating spacer disposed between the two circuit boards. In the circuit board of a desktop computer, an insulating hot glue type adhesive is printed on the surface of the spacer, and the spacer is heated and pressurized to place an electronic component including an IC mounted on one of the two circuit boards. It is characterized by being firmly fixed.
(e) 実施例
第１図は本考案の一実施例に係る回路基板構造
を示す平面図、第２図はその側面図、第３図乃至
第５図は第１回路基板、スペーサ及び第２回路基
板をそれぞれ示す平面図である。(e) Embodiment Fig. 1 is a plan view showing a circuit board structure according to an embodiment of the present invention, Fig. 2 is a side view thereof, and Figs. 3 to 5 show the first circuit board, spacer and second circuit board. FIG. 3 is a plan view showing each circuit board.
第３図に示す第１回路基板１は、フイルムシー
トの片側の表面１ａに印刷してパターン（図示せ
ず）を形成したものであり、さらにIC４、LED
５、チツプコンデンサ６、表示装置を取り付ける
電子部品取付部１ｂ〜１ｅ、後述する第２回路基
板との接続をはかる導通部１ｆ及び第２回路基板
との位置決めをするための位置決め部１ｇ〜１ｋ
にそれぞれホツトメルトタイプの接続剤が印刷さ
れている。 The first circuit board 1 shown in FIG. 3 has a pattern (not shown) printed on one surface 1a of a film sheet, and further includes an IC 4 and an LED.
5. Chip capacitor 6, electronic component attachment parts 1b to 1e for attaching a display device, conduction part 1f for connection with a second circuit board to be described later, and positioning part 1g to 1k for positioning with the second circuit board.
A hot melt type connecting agent is printed on each.
第４図に示すスペーサ２は、フイルムシートの
表面に絶縁性のホツトメルトタイプの接着剤を印
刷して形成したものである。 The spacer 2 shown in FIG. 4 is formed by printing an insulating hot melt type adhesive on the surface of a film sheet.
このスペーサ２には、スイツチに対応する部分
に複数の貫通穴２ａが設けられており、またIC
４に対応する部分及び回路基板の導通部及び位置
決め部に対応する部分にもそれぞれ貫通穴２ｂ〜
２ｈが設けられている。 The spacer 2 has a plurality of through holes 2a at the portions corresponding to the switches, and an IC
4 and the conductive portion and the positioning portion of the circuit board are also provided with through holes 2b to
2h is provided.
第５図に示す第２回路基板３は、第１回路基板
と同じくフイルムシートの第１回路基板１に対向
する側の表面に印刷にてパターン７（一部のみ図
示）を形成してなるものである。 The second circuit board 3 shown in FIG. 5, like the first circuit board, is formed by printing a pattern 7 (only a portion shown) on the surface of the film sheet facing the first circuit board 1. It is.
この第２回路基板３には、IC４、LED５及び
チツプコンデンサ６に対応する位置に貫通穴３
ａ，３ｂが設けられており、また、導通部３ｃ及
び位置決め部３ｄ〜３ｈには切り込みが設けられ
ている。 This second circuit board 3 has through holes 3 at positions corresponding to the IC 4, LED 5, and chip capacitor 6.
a, 3b are provided, and cuts are provided in the conductive portion 3c and positioning portions 3d to 3h.
上記第１、第２回路基板１，３にIC等の電子
部品を固着すると、第６図乃至第７図に示す第１
図のＡ−Ａ，Ｂ−Ｂ，Ｃ−Ｃ断面のようになる。 When electronic components such as ICs are fixed to the first and second circuit boards 1 and 3, the first circuit board shown in FIGS.
The cross-sections shown are AA, BB, and CC in the figure.
即ち、はじめにIC４、LED５、チツプコンデ
ンサ６は第１回路基板１の電子部品取付部１ｂ，
１ｃ，１ｄに設けられた接着剤によりこの第１回
路基板１上に仮固定される。 That is, first, the IC 4, the LED 5, and the chip capacitor 6 are mounted on the electronic component mounting portion 1b of the first circuit board 1.
It is temporarily fixed onto this first circuit board 1 by the adhesive provided on 1c and 1d.
次に、スペーサ２をこの第１回路基板１上に熱
圧着する。 Next, the spacer 2 is thermocompression bonded onto the first circuit board 1.
このときに、IC４はその端子４ａがスペーサ
２の貫通穴２ｂの周縁部により第１回路基板１上
に固着され、LED５及びチツプコンデンサ６は
熱により引き伸ばされたスペーサ２により包み込
まれて固着される。 At this time, the terminal 4a of the IC 4 is fixed on the first circuit board 1 by the peripheral edge of the through hole 2b of the spacer 2, and the LED 5 and chip capacitor 6 are wrapped and fixed by the spacer 2 stretched by heat. .
このように電子部品を第１回路基板１に固着し
た後、スペーサ２を挾むようにして第２回路基板
３を第１回路基板１に重ねる。 After the electronic components are fixed to the first circuit board 1 in this manner, the second circuit board 3 is stacked on the first circuit board 1 with the spacer 2 in between.
このときにIC４、LED５、チツプコンデンサ
６はそれぞれ第２回路基板３の貫通穴３ａ，３ｂ
から突出し、第１、第２回路基板１，３のスイツ
チ部分は、第９図に示す第１図のＤ−Ｄ断面のよ
うに、スペーサ２の貫通穴２ａを介して対向す
る。 At this time, the IC 4, LED 5, and chip capacitor 6 are connected to the through holes 3a and 3b of the second circuit board 3, respectively.
The switch portions of the first and second circuit boards 1 and 3 are opposed to each other through the through hole 2a of the spacer 2, as shown in the DD cross section of FIG. 1 shown in FIG.
また、第２回路基板３の導通部３ｃと位置決め
部３ｄ〜３ｈは切り込みから押し込んで折り曲
げ、第１０図及び第１１図に示す第１図のＥ−
Ｅ，Ｆ−Ｆ断面のようにスペーサ２の貫通穴２ｃ
〜２ｈを介して第１回路基板１の導通部１ｆ及び
位置決め部１ｇ〜１ｋに熱圧着され、これにより
第１、第２回路基板１，３は導通し、位置決めさ
れる。 Further, the conductive portion 3c and the positioning portions 3d to 3h of the second circuit board 3 are pushed through the notch and bent, and the E-
Through hole 2c of spacer 2 as shown in E, FF cross section
2h to the conductive portion 1f and the positioning portions 1g to 1k of the first circuit board 1, whereby the first and second circuit boards 1 and 3 are electrically connected and positioned.
この第２回路基板３の導通部３ｃは、略Ｓ字形
の切り込みにより形成されており、互い違いに折
り曲げられて第１回路基板１の導通部１ｆに固着
されている。 The conductive portion 3c of the second circuit board 3 is formed by a substantially S-shaped cut, and is bent alternately and fixed to the conductive portion 1f of the first circuit board 1.
このように導通部３ｃを形成すると、第５図に
おける導通部３ｃの上下方向の幅を狭くして、基
板上のスペースを有効に利用することができ、ま
たパターンの引きまわしも容易にすることができ
る。 By forming the conductive portion 3c in this manner, the vertical width of the conductive portion 3c in FIG. 5 can be narrowed, space on the board can be used effectively, and the pattern can be easily routed. Can be done.
上記のように結合された第１、第２回路基板
１，３とスペーサ２は、第１２図に示す両面テー
プ８により、第１３図に示すようにケース本体９
に固着される。 The first and second circuit boards 1 and 3 and the spacer 2 that have been combined as described above are attached to the case main body 9 as shown in FIG. 13 using double-sided tape 8 shown in FIG.
is fixed to.
この両面テープ８には、IC４、LED５、チツ
プコンデンサ６及び導通部３ｃ，１ｆに対応する
部分と、位置決め部３ｄ等に対応する部分にそれ
ぞれ貫通穴８ａ〜８ｄが設けられている。 This double-sided tape 8 is provided with through holes 8a to 8d in portions corresponding to the IC 4, LED 5, chip capacitor 6, and conductive portions 3c and 1f, and in portions corresponding to the positioning portion 3d, respectively.
この両面テープ８は、第２回路基板３とケース
本体９との間に張り付けられるため、第１回路基
板１に固着された第２回路基板３の導通部３ｃ等
がこの両面テープ８に張り付いて第１回路基板１
から引き離されないように貫通穴８ａ〜８ｄが設
けられている。 Since this double-sided tape 8 is pasted between the second circuit board 3 and the case body 9, the conductive portion 3c of the second circuit board 3 fixed to the first circuit board 1 is stuck to this double-sided tape 8. first circuit board 1
Through-holes 8a to 8d are provided so as not to be separated from each other.
従つて、この両面テープ８により本体ケース９
に固着された第１回路基板１等の断面は、第１４
乃至第１６図に示す第１３図のＧ−Ｇ，Ｈ−Ｈ，
Ｉ−Ｉ断面のようになる。 Therefore, with this double-sided tape 8, the main body case 9
The cross section of the first circuit board 1 etc. fixed to the 14th
GG, H-H in FIG. 13 shown in FIG. 16,
It will look like the II cross section.
(f) 考案の効果
本考案によれば、スペーサによりIC等を固定
することができるので、IC固着シート等を使用
する必要がなく、部品点数を削減し、製造工程も
削減することもできる。(f) Effects of the invention According to the invention, since ICs and the like can be fixed using spacers, there is no need to use IC fixing sheets, etc., and the number of parts and manufacturing processes can also be reduced.
また、第１、第２回路基板の導通部も、スペー
サの貫通穴を介して固着することにより、どこに
でも設けることができ、さらに両面テープのこの
導通部に対応する部分にも貫通穴を設けているの
で接触不良等がなく信頼性を向上させることもで
きる。 Furthermore, the conductive parts of the first and second circuit boards can also be provided anywhere by being fixed through the through holes of the spacer, and the through holes are also provided in the portions of the double-sided tape that correspond to the conductive parts. Because of this, there is no contact failure and reliability can be improved.
第１図は本考案の一実施例に係る回路基板構造
を示す図、第２図は第１図に示す回路基板の側面
図、第３図乃至第５図は第１図に示す第１回路基
板、スペーサ及び第２回路基板をそれぞれ示す平
面図、第６図乃至第１１図はそれぞれ第１図のＡ
−Ａ，Ｂ−Ｂ，Ｃ−Ｃ，Ｅ−Ｅ，Ｆ−Ｆ断面図、
第１２図は両面テープを示す平面図、第１３図は
第１２図に示す両面テープを使用して回路基板を
ケース本体に固着した状態を示す平面図、第１４
図乃至第１６図はそれぞれ第１３図のＧ−Ｇ，Ｈ
−Ｈ，Ｉ−Ｉ断面図である。
１……第１回路基板、２……スペーサ、３……
第２回路基板、４……IC、５……LED、６……
チツプコンデンサ、７……パターン、８……両面
テープ、９……ケース本体、１ｆ，３ｃ……導通
部、２ａ〜２ｈ……貫通穴、８ａ〜８ｄ……貫通
穴。
FIG. 1 is a diagram showing a circuit board structure according to an embodiment of the present invention, FIG. 2 is a side view of the circuit board shown in FIG. 1, and FIGS. 3 to 5 are the first circuit shown in FIG. 1. Plan views showing the substrate, spacer, and second circuit board, respectively, and FIGS. 6 to 11 are A of FIG.
-A, B-B, C-C, E-E, F-F sectional views,
FIG. 12 is a plan view showing the double-sided tape, FIG. 13 is a plan view showing the circuit board fixed to the case body using the double-sided tape shown in FIG. 12, and FIG.
Figures 16 to 16 are GG and H in Figure 13, respectively.
-H, II sectional view. 1...First circuit board, 2...Spacer, 3...
Second circuit board, 4...IC, 5...LED, 6...
Chip capacitor, 7...Pattern, 8...Double-sided tape, 9...Case body, 1f, 3c...Conducting portion, 2a to 2h...Through hole, 8a to 8d...Through hole.
Claims (1)
つの回路基板と、該２つの回路基板の間に配設
された絶縁性のスペーサとからなる電子卓上計
算機の回路基板において、 前記スペーサの表面に絶縁性のホツトナルト
タイプ接着剤を印刷し、前記２つの回路基板の
一方に塔載されるICを含む電子部品を、前記
スペーサを加熱、加圧することにより固着した
ことを特徴とする電子卓上計算機の回路基板構
造。 (2) 前記回路基板の一方に切り込みを設け、該切
り込みを設けた部分を他方の回路基板に当接、
固着することにより導通部を形成し、前記スペ
ーサの該導通部に対応する位置に貫通穴を設け
たことを特徴とする実用新案登録請求の範囲第
１項記載の電子卓上計算機の回路基板構造。 (3) 前記回路基板には、ケース本体に粘着するた
めの両面テープが固着され、該両面テープの前
記導通部に対応する位置に貫通穴を設けたこと
を特徴とする実用新案登録請求の範囲第２項記
載の電子卓上計算機の回路基板構造。[Claims for Utility Model Registration] (1) A circuit pattern is formed on the surface of two facing
In the circuit board for an electronic desk calculator, which is composed of two circuit boards and an insulating spacer disposed between the two circuit boards, an insulating hot glue type adhesive is printed on the surface of the spacer, and the A circuit board structure for an electronic desktop calculator, characterized in that electronic components including an IC mounted on one of two circuit boards are fixed by heating and pressurizing the spacer. (2) providing a notch in one of the circuit boards, and abutting the part with the notch against the other circuit board;
The circuit board structure for an electronic desk calculator according to claim 1, wherein a conductive portion is formed by fixing the spacer, and a through hole is provided in the spacer at a position corresponding to the conductive portion. (3) A utility model registration claim characterized in that a double-sided tape for adhering to the case body is fixed to the circuit board, and a through hole is provided at a position corresponding to the conductive portion of the double-sided tape. Circuit board structure of the electronic desktop calculator according to item 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6313587U JPH0543499Y2 (en) | 1987-04-25 | 1987-04-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6313587U JPH0543499Y2 (en) | 1987-04-25 | 1987-04-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63170988U JPS63170988U (en) | 1988-11-07 |
| JPH0543499Y2 true JPH0543499Y2 (en) | 1993-11-02 |
Family
ID=30898078
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6313587U Expired - Lifetime JPH0543499Y2 (en) | 1987-04-25 | 1987-04-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0543499Y2 (en) |
-
1987
- 1987-04-25 JP JP6313587U patent/JPH0543499Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63170988U (en) | 1988-11-07 |
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