JP4013511B2 - Transparent touch panel - Google Patents

Transparent touch panel Download PDF

Info

Publication number
JP4013511B2
JP4013511B2 JP2001293799A JP2001293799A JP4013511B2 JP 4013511 B2 JP4013511 B2 JP 4013511B2 JP 2001293799 A JP2001293799 A JP 2001293799A JP 2001293799 A JP2001293799 A JP 2001293799A JP 4013511 B2 JP4013511 B2 JP 4013511B2
Authority
JP
Japan
Prior art keywords
substrate
electrode
conductive layer
electrodes
touch panel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2001293799A
Other languages
Japanese (ja)
Other versions
JP2003099204A (en
Inventor
功二 田邉
俊晴 福井
謙一 高畠
賢一 松本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2001293799A priority Critical patent/JP4013511B2/en
Publication of JP2003099204A publication Critical patent/JP2003099204A/en
Application granted granted Critical
Publication of JP4013511B2 publication Critical patent/JP4013511B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Position Input By Displaying (AREA)
  • Push-Button Switches (AREA)

Description

【0001】
【発明の属する技術分野】
本発明は、各種電子機器の操作に用いられる透明タッチパネルに関するものである。
【0002】
【従来の技術】
近年、電子機器の高機能化や多様化が進むに伴い、LCD等の表示素子の前面に透明タッチパネルを装着し、この透明タッチパネルを通して表示素子に表示された文字や記号、絵柄等の視認、選択を行い、透明タッチパネルの操作によって機器の各機能の切換えを行うものが増えている。
【0003】
このような従来の透明タッチパネルについて、図4〜図6を用いて説明する。
【0004】
図4は従来の透明タッチパネルの平面図、図5は同上下基板の平面図であり、同図において、1はポリエチレンテレフタレートやポリカーボネートフィルム等の透明な上基板で、この下面には、酸化インジウム錫や酸化錫等の、透明な上導電層2が真空スパッタ等によって形成されている。
【0005】
そして、3及び4は銀やカーボン等のペーストによって印刷形成された一対の上電極で、図5(a)に示すように、上導電層2の両端から、エッチングやレーザカッティングにより部分的に上導電層2が除去され素地を露出させた上基板1上を延出し、端部には一対の上導出部3Aと4Aが設けられている。
【0006】
また、5はガラスまたはアクリルやポリカーボネート樹脂等の下基板で、この上面には、上導電層2と同様に透明な下導電層6が形成されると共に、図5(b)に示すように、上導電層2とは直交方向の両端から一対の下電極7及び8が下導電層6が除去された下基板5上を延出している。
【0007】
そして、この下電極7及び8の端部には一対の下導出部7Aと8Aが設けられると共に、下導電層6上面には、上導電層2と所定の間隙を保つための複数のドットスペーサ(図示せず)が、エポキシやシリコン等の絶縁樹脂によって所定の間隔で形成されている。
【0008】
また、これら上基板1と下基板5は、図4に示すように、上下面に粘着剤が塗布された額縁状のスペーサ9によって、上導電層2と下導電層6が所定の間隙を空けて対向するように外周が貼り合わされると共に、上基板1と下基板5の導出部の間には、複数の配線パターンが下面に形成された配線基板10に挟持されている。
【0009】
そして、図6の断面図に示すように、上下基板1,5の各導出部と配線基板10の配線パターン間には異方導電接着剤11が塗布され、上基板1の上導出部3Aと4Aは、貫通孔内に導電剤が充填されたスルーホールによって下面の配線パターン12と13に接続された、配線基板10上面の配線パターン12Aと13Aに接着接続されている。
【0010】
また、下基板5の下導出部7Aと8Aは、同様に異方導電接着剤11によって、配線基板10下面の配線パターン14と15に接着接続されて、透明タッチパネルが構成されている。
【0011】
以上の構成において、配線基板10の各配線パターンが接続用コネクタ等によって電子機器の検出回路に接続され、上基板1の上面を指或いはペン等で押圧操作すると、上基板1が撓み、押圧された箇所の上導電層2が下導電層6に接触し、上電極3と4、及び下電極7と8の各々の間の抵抗比によって、この押圧された位置を検出するように構成されているものであった。
【0012】
【発明が解決しようとする課題】
しかしながら上記従来の透明タッチパネルにおいては、上電極3,4や下電極7,8が延出する上基板1、下基板5上の上導電層2や下導電層6はエッチング等で除去することが必要であり、この箇所の分だけ押圧操作及びその位置検出が可能な動作有効エリアが減じるため、所定の動作有効エリアに対し外形寸法は大きなものとなるという課題があった。
【0013】
本発明は、このような従来の課題を解決するものであり、所定の動作有効エリアを確保しつつ全体の小型化を図れる透明タッチパネルを提供することを目的とする。
【0014】
【課題を解決するための手段】
上記目的を達成するために本発明は、以下の構成を有するものである。
【0015】
本発明の請求項1に記載の発明は、上基板の下面側に形成された方形形状の透明な上導電層が、下基板の上面側に形成された方形形状の透明な下導電層に対して、所定間隔を保つと共に、上記上導電層の一方の対辺に設けた上電極が、上記下導電層の一方の対辺に設けた下電極に対して直交関係で位置するように上記上基板および下基板が配されて構成された透明タッチパネルであって、上記下基板は、上記下電極と平行関係となる側の一つの側面部に、上記上電極毎に対応する接続電極が個々に設けられると共に、その接続電極の各一端側と上記下電極のそれぞれからの引き回し部分に対して配線基板が装着され、上記接続電極の他端に対しての上記上電極の接続は、上記配線基板が装着される側面部側に突出形成された上記上基板の突出部の下面に上記上電極から延設された接合部を配したものとされ、その突出部が上記下基板の配線基板が装着される側面部側に折り曲げられて上記接合部を介して上記上電極が上記接続電極の他端にそれぞれ接続された透明タッチパネルとするものである。上下基板の導出部や接続部を下基板の側面に設ける当該構成であれば、上基板の下面及び下基板の上面の殆ど全面に動作有効エリアを形成できるため、所定の動作有効エリアを確保しつつ全体の小型化を図れる透明タッチパネルを得ることができるという作用を有する。
【0016】
【発明の実施の形態】
以下、本発明の実施の形態について、図1〜図3を用いて説明する。
【0017】
なお、従来の技術の項で説明した構成と同一構成の部分には同一符号を付して、詳細な説明を簡略化する。
【0018】
(実施の形態)
図1は本発明の一実施の形態による透明タッチパネルの外観斜視図、図2は同上下基板の外観斜視図であり、同図において、20は厚さ150〜200μm前後のポリエチレンテレフタレートやポリカーボネートフィルム等の透明な上基板で、両端に突出部20A,20Bが設けられ、下面全面に、酸化インジウム錫や酸化錫等の、透明な上導電層21が真空スパッタ等によって形成されている。
【0019】
そして、22A及び22Bは銀やカーボン等のペーストによって印刷形成された一対の上電極で、図2(a)に示すように、上導電層21の両端から延出し、突出部20A,20Bには接合部23A,23Bが設けられている。
【0020】
また、24はガラスまたはアクリルやポリカーボネート樹脂等の下基板で、この上面には、上導電層21と同様に透明な下導電層25が形成されると共に、図2(b)に示すように、上導電層21とは直交方向の両端から一対の下電極26A及び26Bが延出している。
【0021】
そして、下基板24の右側面に下電極26Aに接続された下導出部29Aが、銀やカーボン等のペーストを印刷形成して設けられると共に、下電極26Bは左側面から下面を経由して右側面に延出され、この右側面に下導出部29Bが設けられている。
【0022】
さらに、この下基板24右側面には一端に上導出部27B,28B、他端に接続部27A,28Aが設けられた接続電極27,28が形成されている。
【0023】
従って、従来上下基板に設けられていた導出部が下基板24の側面に配置されたことになり、上基板20の下面と下基板24の上面の上電極22A,22Bと下電極26A,26B以外の箇所は、全面が押圧操作及びその位置検出が可能な動作有効エリアとなっている。
【0024】
また、下導電層25上面には、上導電層21と所定の間隙を保つための複数のドットスペーサ(図示せず)が、エポキシやシリコン等の絶縁樹脂によって所定の間隔で形成され、上基板20と下基板24は、図1に示すように、上下面に粘着剤が塗布された額縁状のスペーサ9によって、上導電層21と下導電層25が所定の間隙を空けて対向するように外周が貼り合わされる。
【0025】
そして、図3(a)に示すように、上基板20の接合部23A,23Bは下方へ直角に折り曲げられ、図3(b)に示すように、クロロプレンゴムやポリエステル、エポキシ等の合成樹脂内に、金属粉または金属や樹脂粉に貴金属メッキを施した導電粉を分散した異方導電接着剤11によって接続部27A,28Aに接着接続される。
【0026】
そして、図1に示すように、配線基板30下面の配線パターンは異方導電接着剤11によって上導出部27B,28B及び下導出部29A,29Bに各々接着接続される。
【0027】
従って、上基板20の上電極22A,22Bは突出部20A,20Bの接合部23A,23Bから下基板24の接続部27A,28Aを介して上導出部27B,28Bで、また下基板24の下電極26A,26Bは下導出部29A,29Bで配線基板30下面の配線パターンに接着接続され、透明タッチパネルが構成されている。
【0028】
以上の構成において、配線基板30の各配線パターンが接続用コネクタ等によって電子機器の検出回路に接続され、上基板20の上面を指或いはペン等で押圧操作すると、上基板20が撓み、押圧された箇所の上導電層21が下導電層25に接触する。
【0029】
そして、上電極22Aと22B、及び下電極26Aと26Bの各々の間の抵抗比によって、この押圧された箇所を検出回路が検出するように構成されている。
【0030】
このように本実施の形態によれば、上基板20の透明な上導電層21の両端から延出した上電極22A,22Bの端部に接合部23A,23Bを設けると共に、この上導電層21と所定の間隙を空けて対向する下基板24の透明な下導電層25の両端から延出した下電極26A,26B端部の下導出部29A,29B、及び一端に上導出部27B,28Bが形成され他端の接続部27A,28Aに、上基板20の接合部23A,23Bを接続する接続電極27,28を下基板24の側面に設けて透明タッチパネルを構成することによって、上下基板の導出部や接続部が下基板の側面に設けられ、上基板の下面及び下基板の上面の殆ど全面に動作有効エリアを形成できるため、所定の動作有効エリアを確保しつつ全体の小型化を図れる透明タッチパネルを得ることができるものである。
【0031】
【発明の効果】
以上のように本発明は、上基板の下面側に形成された方形形状の透明な上導電層が、下基板の上面側に形成された方形形状の透明な下導電層に対して、所定間隔を保つと共に、上記上導電層の一方の対辺に設けた上電極が、上記下導電層の一方の対辺に設けた下電極に対して直交関係で位置するように上記上基板および下基板が配されて構成された透明タッチパネルであって、上記下基板は、上記下電極と平行関係となる側の一つの側面部に、上記上電極毎に対応する接続電極が個々に設けられると共に、その接続電極の各一端側と上記下電極のそれぞれからの引き回し部分に対して配線基板が装着され、上記接続電極の他端に対しての上記上電極の接続は、上記配線基板が装着される側面部側に突出形成された上記上基板の突出部の下面に上記上電極から延設された接合部を配したものとされ、その突出部が上記下基板の配線基板が装着される側面部側に折り曲げられて上記接合部を介して上記上電極が上記接続電極の他端にそれぞれ接続された透明タッチパネルとしたものである。これによれば、所定の動作有効エリアを確保しつつ全体の小型化を図れる透明タッチパネルを得ることができるという有利な効果が得られる。
【図面の簡単な説明】
【図1】本発明の一実施の形態による透明タッチパネルの外観斜視図
【図2】(a)(b)は同上下基板の外観斜視図
【図3】(a)(b)は同組立てを説明する外観斜視図
【図4】従来の透明タッチパネルの平面図
【図5】(a)(b)は同上下基板の平面図
【図6】同断面図
【符号の説明】
9 スペーサ
11 異方導電接着剤
20 上基板
21 上導電層
22A,22B 上電極
23A,23B 接合部
24 下基板
25 下導電層
26A,26B 下電極
27,28 接続電極
27A,28A 接続部
27B,28B 上導出部
29A,29B 下導出部
30 配線基板
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a transparent touch panel used for operation of various electronic devices.
[0002]
[Prior art]
In recent years, as electronic devices have become more sophisticated and diversified, a transparent touch panel is attached to the front of a display element such as an LCD, and the characters, symbols, patterns, etc. displayed on the display element can be viewed and selected through this transparent touch panel. There are an increasing number of devices that switch each function of a device by operating a transparent touch panel.
[0003]
Such a conventional transparent touch panel will be described with reference to FIGS.
[0004]
FIG. 4 is a plan view of a conventional transparent touch panel, and FIG. 5 is a plan view of the upper and lower substrates. In FIG. 1, 1 is a transparent upper substrate such as polyethylene terephthalate or polycarbonate film. A transparent upper conductive layer 2 such as tin or tin oxide is formed by vacuum sputtering or the like.
[0005]
Reference numerals 3 and 4 denote a pair of upper electrodes printed by a paste of silver, carbon, etc., as shown in FIG. 5 (a), partially above the upper conductive layer 2 by etching or laser cutting. The upper substrate 1 from which the conductive layer 2 is removed and the substrate is exposed is extended, and a pair of upper lead-out portions 3A and 4A are provided at the ends.
[0006]
Further, 5 is a lower substrate made of glass, acrylic, polycarbonate resin or the like, and on this upper surface, a transparent lower conductive layer 6 is formed in the same manner as the upper conductive layer 2, and as shown in FIG. A pair of lower electrodes 7 and 8 extend from the opposite ends of the upper conductive layer 2 on the lower substrate 5 from which the lower conductive layer 6 has been removed.
[0007]
The end portions of the lower electrodes 7 and 8 are provided with a pair of lower lead-out portions 7A and 8A, and a plurality of dot spacers for maintaining a predetermined gap from the upper conductive layer 2 on the upper surface of the lower conductive layer 6. (Not shown) are formed at predetermined intervals by an insulating resin such as epoxy or silicon.
[0008]
Further, as shown in FIG. 4, the upper substrate 1 and the lower substrate 5 have a predetermined gap between the upper conductive layer 2 and the lower conductive layer 6 by a frame-shaped spacer 9 having an adhesive applied to the upper and lower surfaces. The outer periphery is bonded so as to face each other, and a plurality of wiring patterns are sandwiched between wiring boards 10 formed on the lower surface between the lead-out portions of the upper substrate 1 and the lower substrate 5.
[0009]
Then, as shown in the cross-sectional view of FIG. 6, anisotropic conductive adhesive 11 is applied between the leading portions of the upper and lower substrates 1, 5 and the wiring pattern of the wiring substrate 10, and the upper leading portion 3 </ b> A of the upper substrate 1 4A is adhesively connected to the wiring patterns 12A and 13A on the upper surface of the wiring substrate 10 connected to the wiring patterns 12 and 13 on the lower surface by through holes filled with a conductive agent in the through holes.
[0010]
Similarly, the lower lead-out portions 7A and 8A of the lower substrate 5 are adhesively connected to the wiring patterns 14 and 15 on the lower surface of the wiring substrate 10 by the anisotropic conductive adhesive 11 to constitute a transparent touch panel.
[0011]
In the above configuration, each wiring pattern of the wiring board 10 is connected to the detection circuit of the electronic device by a connector or the like, and when the upper surface of the upper board 1 is pressed with a finger or a pen, the upper board 1 is bent and pressed. The upper conductive layer 2 is in contact with the lower conductive layer 6 and the pressed position is detected by the resistance ratio between the upper electrodes 3 and 4 and the lower electrodes 7 and 8. It was a thing.
[0012]
[Problems to be solved by the invention]
However, in the conventional transparent touch panel described above, the upper substrate 1 from which the upper electrodes 3 and 4 and the lower electrodes 7 and 8 extend, the upper conductive layer 2 and the lower conductive layer 6 on the lower substrate 5 can be removed by etching or the like. This is necessary, and the effective operation area where the pressing operation and its position can be detected is reduced by this amount, so that there is a problem that the outer dimensions are larger than the predetermined effective operation area.
[0013]
The present invention solves such a conventional problem, and an object of the present invention is to provide a transparent touch panel capable of reducing the overall size while securing a predetermined operation effective area.
[0014]
[Means for Solving the Problems]
In order to achieve the above object, the present invention has the following configuration.
[0015]
According to the first aspect of the present invention, the rectangular transparent upper conductive layer formed on the lower surface side of the upper substrate is different from the rectangular transparent lower conductive layer formed on the upper surface side of the lower substrate. The upper substrate and the upper electrode provided on one opposite side of the upper conductive layer are positioned in an orthogonal relationship with the lower electrode provided on one opposite side of the lower conductive layer. A transparent touch panel in which a lower substrate is arranged, wherein the lower substrate is individually provided with a corresponding connection electrode for each of the upper electrodes on one side surface portion in parallel with the lower electrode. In addition, a wiring board is attached to each one end side of the connection electrode and a portion extending from each of the lower electrodes, and the connection of the upper electrode to the other end of the connection electrode is attached to the wiring board. Projection of the upper substrate formed on the side surface side A joint portion extending from the upper electrode is disposed on the lower surface of the upper electrode, and the protruding portion is bent toward the side surface portion on which the wiring board of the lower substrate is mounted, and the upper electrode is interposed through the joint portion. Are transparent touch panels respectively connected to the other ends of the connection electrodes. With this configuration in which the upper and lower substrate lead-out portions and connection portions are provided on the side surfaces of the lower substrate, an operation effective area can be formed on almost the entire lower surface of the upper substrate and the upper surface of the lower substrate, so that a predetermined operation effective area is secured. However, it has an effect that a transparent touch panel capable of reducing the overall size can be obtained.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to FIGS.
[0017]
In addition, the same code | symbol is attached | subjected to the part of the structure same as the structure demonstrated in the term of the prior art, and detailed description is simplified.
[0018]
(Embodiment)
FIG. 1 is an external perspective view of a transparent touch panel according to an embodiment of the present invention. FIG. 2 is an external perspective view of the upper and lower substrates, in which 20 is a polyethylene terephthalate or polycarbonate film having a thickness of about 150 to 200 μm. The transparent upper substrate is provided with protrusions 20A and 20B at both ends, and a transparent upper conductive layer 21 such as indium tin oxide or tin oxide is formed on the entire lower surface by vacuum sputtering or the like.
[0019]
22A and 22B are a pair of upper electrodes printed and formed with a paste of silver, carbon, etc., as shown in FIG. 2A, extending from both ends of the upper conductive layer 21, and projecting portions 20A and 20B. Junction parts 23A and 23B are provided.
[0020]
Reference numeral 24 denotes a lower substrate made of glass, acrylic, polycarbonate resin, or the like. On the upper surface, a transparent lower conductive layer 25 is formed in the same manner as the upper conductive layer 21, and as shown in FIG. A pair of lower electrodes 26 </ b> A and 26 </ b> B extends from both ends in the direction orthogonal to the upper conductive layer 21.
[0021]
A lower lead-out portion 29A connected to the lower electrode 26A is provided on the right side surface of the lower substrate 24 by printing a paste such as silver or carbon, and the lower electrode 26B is connected to the right side via the lower surface from the left side surface. The lower lead-out portion 29B is provided on the right side surface.
[0022]
Further, on the right side surface of the lower substrate 24, there are formed connection electrodes 27 and 28 having upper lead portions 27B and 28B at one end and connection portions 27A and 28A at the other end.
[0023]
Accordingly, the lead-out portions conventionally provided on the upper and lower substrates are arranged on the side surfaces of the lower substrate 24, and other than the upper electrodes 22A and 22B and the lower electrodes 26A and 26B on the lower surface of the upper substrate 20 and the upper surface of the lower substrate 24. The entire area is an operation effective area in which a pressing operation and position detection are possible.
[0024]
A plurality of dot spacers (not shown) for maintaining a predetermined gap with the upper conductive layer 21 are formed on the upper surface of the lower conductive layer 25 at a predetermined interval by an insulating resin such as epoxy or silicon. As shown in FIG. 1, the upper conductive layer 21 and the lower substrate 24 are opposed to each other with a predetermined gap therebetween by a frame-like spacer 9 having an adhesive applied to the upper and lower surfaces thereof. The outer periphery is pasted together.
[0025]
Then, as shown in FIG. 3 (a), the joint portions 23A and 23B of the upper substrate 20 are bent downward at a right angle, and as shown in FIG. 3 (b), inside the synthetic resin such as chloroprene rubber, polyester, epoxy, or the like. Further, the anisotropic conductive adhesive 11 in which conductive powder obtained by applying noble metal plating to metal powder or metal or resin powder is bonded and connected to the connecting portions 27A and 28A.
[0026]
As shown in FIG. 1, the wiring pattern on the lower surface of the wiring board 30 is bonded and connected to the upper lead-out portions 27B and 28B and the lower lead-out portions 29A and 29B by the anisotropic conductive adhesive 11, respectively.
[0027]
Accordingly, the upper electrodes 22A and 22B of the upper substrate 20 are connected to the upper lead-out portions 27B and 28B from the joint portions 23A and 23B of the protruding portions 20A and 20B through the connection portions 27A and 28A of the lower substrate 24, and below the lower substrate 24. The electrodes 26A and 26B are adhesively connected to the wiring pattern on the lower surface of the wiring board 30 at the lower lead-out portions 29A and 29B, thereby forming a transparent touch panel.
[0028]
In the above configuration, each wiring pattern of the wiring board 30 is connected to a detection circuit of an electronic device by a connector or the like, and when the upper surface of the upper board 20 is pressed with a finger or a pen, the upper board 20 is bent and pressed. The upper conductive layer 21 in contact with the lower conductive layer 25 is in contact with the lower conductive layer 25.
[0029]
The detection circuit is configured to detect the pressed portion by the resistance ratio between the upper electrodes 22A and 22B and the lower electrodes 26A and 26B.
[0030]
As described above, according to the present embodiment, the joint portions 23A and 23B are provided at the ends of the upper electrodes 22A and 22B extending from both ends of the transparent upper conductive layer 21 of the upper substrate 20, and the upper conductive layer 21 is provided. And lower lead portions 29A and 29B at the ends of the lower electrodes 26A and 26B extending from both ends of the transparent lower conductive layer 25 of the lower substrate 24 facing each other with a predetermined gap therebetween, and upper lead portions 27B and 28B at one end. The upper and lower substrates are derived by providing the connection electrodes 27 and 28 connected to the joint portions 23A and 23B of the upper substrate 20 on the side surfaces of the lower substrate 24 to the formed connection portions 27A and 28A at the other end to constitute a transparent touch panel. Since the operation effective area can be formed on almost the entire lower surface of the upper substrate and the upper surface of the lower substrate, the transparent portion can be reduced in size while ensuring a predetermined effective operation area. T Panel in which can be obtained.
[0031]
【The invention's effect】
As described above, according to the present invention, the rectangular transparent upper conductive layer formed on the lower surface side of the upper substrate has a predetermined distance from the rectangular transparent lower conductive layer formed on the upper surface side of the lower substrate. And the upper substrate and the lower substrate are arranged so that the upper electrode provided on one opposite side of the upper conductive layer is positioned orthogonal to the lower electrode provided on one opposite side of the lower conductive layer. In the transparent touch panel configured as described above, the lower substrate is provided with a connection electrode corresponding to each of the upper electrodes on one side portion on a side parallel to the lower electrode, and the connection A wiring board is attached to each of one end side of the electrode and the lead-out portion from each of the lower electrodes, and the connection of the upper electrode to the other end of the connection electrode is a side part to which the wiring board is attached. On the lower surface of the protruding portion of the upper substrate formed to protrude to the side It is assumed that a joint extending from the upper electrode is provided, and the protruding portion is bent to the side surface side where the wiring board of the lower substrate is mounted, and the upper electrode is connected to the upper electrode through the joint. The transparent touch panel is connected to the other end of the electrode. According to this, the advantageous effect that the transparent touch panel which can aim at the size reduction of the whole can be obtained, ensuring a predetermined operation effective area is acquired.
[Brief description of the drawings]
FIG. 1 is an external perspective view of a transparent touch panel according to an embodiment of the present invention. FIGS. 2A and 2B are external perspective views of the upper and lower substrates. FIG. 3A and FIG. Fig. 4 is a plan view of a conventional transparent touch panel. Fig. 5 is a plan view of the upper and lower substrates. Fig. 6 is a sectional view of the same.
9 Spacer 11 Anisotropic conductive adhesive 20 Upper substrate 21 Upper conductive layers 22A and 22B Upper electrodes 23A and 23B Joint portion 24 Lower substrate 25 Lower conductive layers 26A and 26B Lower electrodes 27 and 28 Connection electrodes 27A and 28A Connection portions 27B and 28B Upper lead-out part 29A, 29B Lower lead-out part 30 Wiring board

Claims (1)

上基板の下面側に形成された方形形状の透明な上導電層が、下基板の上面側に形成された方形形状の透明な下導電層に対して、所定間隔を保つと共に、上記上導電層の一方の対辺に設けた上電極が、上記下導電層の一方の対辺に設けた下電極に対して直交関係で位置するように上記上基板および下基板が配されて構成された透明タッチパネルであって、上記下基板は、上記下電極と平行関係となる側の一つの側面部に、上記上電極毎に対応する接続電極が個々に設けられると共に、その接続電極の各一端側と上記下電極のそれぞれからの引き回し部分に対して配線基板が装着され、上記接続電極の他端に対しての上記上電極の接続は、上記配線基板が装着される側面部側に突出形成された上記上基板の突出部の下面に上記上電極から延設された接合部を配したものとされ、その突出部が上記下基板の配線基板が装着される側面部側に折り曲げられて上記接合部を介して上記上電極が上記接続電極の他端にそれぞれ接続された透明タッチパネル。 The rectangular transparent upper conductive layer formed on the lower surface side of the upper substrate maintains a predetermined distance from the rectangular transparent lower conductive layer formed on the upper surface side of the lower substrate, and the upper conductive layer A transparent touch panel in which the upper substrate and the lower substrate are arranged so that the upper electrode provided on one opposite side of the lower electrode is positioned in an orthogonal relationship with respect to the lower electrode provided on the opposite opposite side of the lower conductive layer. In the lower substrate, connection electrodes corresponding to the upper electrodes are individually provided on one side surface of the side parallel to the lower electrode, and each one end side of the connection electrode and the lower electrode are provided. A wiring board is attached to the lead-out part from each of the electrodes, and the connection of the upper electrode to the other end of the connection electrode is performed on the upper side protruding from the side surface part to which the wiring board is attached. It extends from the upper electrode on the lower surface of the protruding part of the substrate It is assumed that the joint portion is arranged, and the protruding portion is bent to the side surface portion side where the wiring board of the lower substrate is mounted, and the upper electrode is connected to the other end of the connection electrode through the joint portion. a transparent touch panel.
JP2001293799A 2001-09-26 2001-09-26 Transparent touch panel Expired - Fee Related JP4013511B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001293799A JP4013511B2 (en) 2001-09-26 2001-09-26 Transparent touch panel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001293799A JP4013511B2 (en) 2001-09-26 2001-09-26 Transparent touch panel

Publications (2)

Publication Number Publication Date
JP2003099204A JP2003099204A (en) 2003-04-04
JP4013511B2 true JP4013511B2 (en) 2007-11-28

Family

ID=19115513

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001293799A Expired - Fee Related JP4013511B2 (en) 2001-09-26 2001-09-26 Transparent touch panel

Country Status (1)

Country Link
JP (1) JP4013511B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5322622B2 (en) * 2008-12-21 2013-10-23 アルパイン株式会社 Narrow frame LCD compatible touch panel

Also Published As

Publication number Publication date
JP2003099204A (en) 2003-04-04

Similar Documents

Publication Publication Date Title
JP4779681B2 (en) Touch panel
JP5194496B2 (en) Touch panel
JP4711150B2 (en) Touch panel and display device
US8803830B2 (en) Touch panel with conductive layers formed of parallel strips
CN101533325A (en) Double-sided touch sensitive panel and flex circuit bonding
US8049127B2 (en) Touch panel
JP2006286760A (en) Wiring board, input device using the same and its manufacturing method
US7746662B2 (en) Touch panel
WO2003017081A1 (en) Transparent touch panel and method of manufacturing the touch panel
JP5531778B2 (en) Touch panel
JP4622249B2 (en) Transparent touch panel
JP4893082B2 (en) Touch panel
JP2003108302A (en) Transparent touch panel
JP2005071123A (en) Touch panel and electronic equipment using the same
US7679608B2 (en) Touch panel
JP4013511B2 (en) Transparent touch panel
KR100822187B1 (en) Touch panel and flat display panel applying the same
JP2003157150A (en) Touch panel
JP5581800B2 (en) Wiring board and touch panel using the same
JP2012059091A (en) Touch panel
KR100362291B1 (en) Touch panel
KR100573101B1 (en) Flexible printed cable and touch panel applying such
JP2012088822A (en) Touch panel
JP4830538B2 (en) Touch panel
JP2011113453A (en) Touch panel

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20040726

RD01 Notification of change of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7421

Effective date: 20050701

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20060726

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20060801

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060929

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20070821

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20070903

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100921

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100921

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110921

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120921

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130921

Year of fee payment: 6

LAPS Cancellation because of no payment of annual fees