JP2012059091A - Touch panel - Google Patents

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JP2012059091A
JP2012059091A JP2010202582A JP2010202582A JP2012059091A JP 2012059091 A JP2012059091 A JP 2012059091A JP 2010202582 A JP2010202582 A JP 2010202582A JP 2010202582 A JP2010202582 A JP 2010202582A JP 2012059091 A JP2012059091 A JP 2012059091A
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lower conductive
conductive layer
conductive layers
substrate
touch panel
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Tatsuyuki Fujii
樹之 藤井
Akira Nakanishi
朗 中西
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Panasonic Corp
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Panasonic Corp
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Abstract

PROBLEM TO BE SOLVED: To provide a touch panel mainly used in operations of various electronic apparatuses, which can be easily manufactured and can perform various operations at a low cost.SOLUTION: An upper conductive layer 12 is provided on a whole surface of a lower surface of an upper substrate 11 and multiple substantially strip-shaped lower conductive layers 14 are formed on an upper surface of a lower substrate 13 so as to be arranged at predetermined intervals, thereby there is no need to perform an etching process or the like on the upper conductive layer 12 of the lower surface of the upper substrate 11 and there is no need to form an upper electrode or the like by printing or the like. Therefore, a touch panel which can be easily manufactured and can perform various operations at a low cost can be obtained because multiple pressed positions can be detected by the multiple substantially strip-shaped lower conductive layers 14.

Description

本発明は、主に各種電子機器の操作に用いられるタッチパネルに関するものである。   The present invention relates to a touch panel used mainly for operating various electronic devices.

近年、携帯電話や電子カメラ等の各種電子機器の高機能化や多様化が進むなか、液晶表示素子等の表示素子の前面に光透過性のタッチパネルを装着し、このタッチパネルを通して背面の表示素子の表示を見ながら、指やペン等でタッチパネルを押圧操作することによって、機器の様々な機能の切換えを行うものが増えており、安価で、操作の行い易いものが求められている。   In recent years, as various types of electronic devices such as mobile phones and electronic cameras have become highly functional and diversified, a light-transmissive touch panel is mounted on the front surface of a display element such as a liquid crystal display element, and the display element on the back side is attached through this touch panel. There is an increasing number of devices that switch various functions of a device by pressing a touch panel with a finger, a pen, or the like while viewing a display, and there is a demand for a device that is inexpensive and easy to operate.

このような従来のタッチパネルについて、図9及び図10を用いて説明する。   Such a conventional touch panel will be described with reference to FIGS.

なお、これらの図面は構成を判り易くするために、部分的に寸法を拡大して表している。   These drawings are partially enlarged in size for easy understanding of the configuration.

図9は従来のタッチパネルの断面図、図10は同分解斜視図であり、同図において、1はフィルム状で光透過性の上基板、2はガラス等の光透過性の下基板で、上基板1の下面には酸化インジウム錫等の光透過性の上導電層3が、下基板2の上面には同じく下導電層4が各々形成されている。   9 is a cross-sectional view of a conventional touch panel, and FIG. 10 is an exploded perspective view. In FIG. 9, 1 is a film-like upper substrate that is light-transmissive, 2 is a light-transmissive lower substrate such as glass, A light transmissive upper conductive layer 3 such as indium tin oxide is formed on the lower surface of the substrate 1, and a lower conductive layer 4 is formed on the upper surface of the lower substrate 2.

また、上導電層3の左右端には銀等の一対の上電極5Aと5Bが、下導電層4の上導電層3とは直交方向の前後端には、一対の下電極6Aと6Bが各々形成されると共に、この上電極5A、5Bや下電極6A、6Bの端部が、上基板1や下基板2の外周前端に各々延出している。   A pair of upper electrodes 5A and 5B made of silver or the like are provided at the left and right ends of the upper conductive layer 3, and a pair of lower electrodes 6A and 6B are provided at the front and rear ends in the direction orthogonal to the upper conductive layer 3 of the lower conductive layer 4. Each of the upper electrodes 5 </ b> A, 5 </ b> B and the lower electrodes 6 </ b> A, 6 </ b> B extends to the outer peripheral front ends of the upper substrate 1 and the lower substrate 2.

そして、下導電層4上面には絶縁樹脂によって、複数のドットスペーサ(図示せず)が所定間隔で形成されると共に、上基板1と下基板2間の外周内縁には略額縁状のスペーサ7が設けられ、このスペーサ7の上下面または片面に塗布形成された接着剤(図示せず)によって、上基板1と下基板2の外周が貼り合わされ、上導電層3と下導電層4が所定の間隙を空けて対向している。   A plurality of dot spacers (not shown) are formed on the upper surface of the lower conductive layer 4 by an insulating resin at predetermined intervals, and a substantially frame-like spacer 7 is formed on the inner peripheral edge between the upper substrate 1 and the lower substrate 2. The outer peripheries of the upper substrate 1 and the lower substrate 2 are bonded together by an adhesive (not shown) applied and formed on the upper and lower surfaces or one surface of the spacer 7 so that the upper conductive layer 3 and the lower conductive layer 4 are predetermined. Facing each other with a gap.

さらに、8はフィルム状の配線基板で、片面または上下面には複数の配線パターン(図示せず)が形成されると共に、この配線基板8の後端が、上基板1と下基板2の外周前端に挟持され、合成樹脂内に導電粒子を分散した異方導電接着剤(図示せず)等によって、各配線パターン後端が上電極5A、5Bや下電極6A、6B前端に各々接着接続されている。   Further, 8 is a film-like wiring board, and a plurality of wiring patterns (not shown) are formed on one side or upper and lower sides, and the rear ends of the wiring board 8 are the outer peripheries of the upper board 1 and the lower board 2. The rear end of each wiring pattern is adhesively connected to the front ends of the upper electrodes 5A and 5B and the lower electrodes 6A and 6B by an anisotropic conductive adhesive (not shown) sandwiched between the front ends and having conductive particles dispersed in a synthetic resin. ing.

また、9はフィルム状で光透過性の表示シートで、中央部には透光部9Aが形成されると共に、下面の外周内縁には黒色や灰色等の暗色に塗装された略額縁状の加飾部9Bが設けられ、この表示シート9が下面全面に形成された接着層9Cによって、上基板1上面に貼付されてタッチパネルが構成されている。   Reference numeral 9 denotes a film-like and light-transmitting display sheet. A light-transmitting portion 9A is formed in the center portion, and a substantially frame-shaped additional coating painted in a dark color such as black or gray on the outer peripheral inner edge of the lower surface. A decorative portion 9B is provided, and the display sheet 9 is adhered to the upper surface of the upper substrate 1 by an adhesive layer 9C formed on the entire lower surface to constitute a touch panel.

そして、このように構成されたタッチパネルが、液晶表示素子等の表示素子の前面に配置されて電子機器に装着されると共に、配線基板8の複数の配線パターンの前端が、半田付けやコネクタ(図示せず)等によって機器の電子回路(図示せず)に電気的に接続される。   The touch panel thus configured is placed on the front surface of a display element such as a liquid crystal display element and attached to an electronic device, and the front ends of a plurality of wiring patterns on the wiring board 8 are soldered or connected to a connector (FIG. (Not shown) or the like is electrically connected to an electronic circuit (not shown) of the device.

以上の構成において、表示シート9の透光部9Aを通してタッチパネル背面の表示素子の表示を見ながら、所望の表示上の表示シート9上面を指或いはペン等で押圧操作すると、この下方の上基板1が撓み、押圧された箇所の上導電層3が下導電層4に接触する。   In the above configuration, when the upper surface of the display sheet 9 on the desired display is pressed with a finger or a pen while viewing the display on the display element on the back of the touch panel through the light transmitting portion 9A of the display sheet 9, the upper substrate 1 below this Is bent and the upper conductive layer 3 of the pressed portion comes into contact with the lower conductive layer 4.

そして、電子回路から配線基板8の複数の配線パターンを介して、一対の上電極5A、5Bや下電極6A、6Bへ順次電圧が印加され、上導電層3両端、及びこれと直交方向の下導電層4両端の電圧比によって、押圧された箇所を電子回路が検出し、機器の様々な機能の切換えが行なわれる。   Then, a voltage is sequentially applied from the electronic circuit to the pair of upper electrodes 5A, 5B and the lower electrodes 6A, 6B through a plurality of wiring patterns on the wiring board 8, and both ends of the upper conductive layer 3 and the lower direction in the direction orthogonal thereto. The electronic circuit detects the pressed location based on the voltage ratio across the conductive layer 4, and various functions of the device are switched.

つまり、タッチパネル背面の表示素子に、例えば複数のメニュー等が表示された状態で、所望のメニュー上の表示シート9上面を押圧操作すると、上電極5A、5Bや下電極6A、6Bの電圧比によって、この操作した位置を電子回路が検出し、複数のメニューの中から所望のメニューの選択等が行えるように構成されている。   That is, when the upper surface of the display sheet 9 on a desired menu is pressed in a state where a plurality of menus are displayed on the display element on the back surface of the touch panel, for example, depending on the voltage ratio of the upper electrodes 5A and 5B and the lower electrodes 6A and 6B. The operated position is detected by an electronic circuit, and a desired menu can be selected from a plurality of menus.

なお、以上のようなタッチパネルを製作するには、一般に先ず、下面全面に酸化インジウム錫等の薄膜が形成された上基板1や、上面全面に同じく薄膜が形成された下基板2の、中央部をマスキングして所定のエッチング溶液に浸漬し、外周内縁の不要な箇所の薄膜を除去して、上導電層3や下導電層4を形成する。   In order to manufacture the touch panel as described above, first, in general, the central portion of the upper substrate 1 having a thin film such as indium tin oxide formed on the entire lower surface or the lower substrate 2 having the same thin film formed on the entire upper surface. Is masked and dipped in a predetermined etching solution, and the thin film at unnecessary portions on the inner periphery of the outer periphery is removed to form the upper conductive layer 3 and the lower conductive layer 4.

そして、次に上基板1下面や下基板2上面に印刷等によって、上電極5A、5Bや下電極6A、6Bを形成した後、スペーサ7によって上基板1と下基板2を貼り合わせると共に、異方導電接着剤を塗布した配線基板8の後端を、上基板1と下基板2の外周前端に挟み、これを加熱加圧して、配線基板8の配線パターンを上電極5A、5Bや下電極6A、6Bに接着接続する。   Then, after the upper electrodes 5A and 5B and the lower electrodes 6A and 6B are formed on the lower surface of the upper substrate 1 and the upper surface of the lower substrate 2 by printing or the like, the upper substrate 1 and the lower substrate 2 are bonded together by the spacer 7 The rear end of the wiring substrate 8 coated with the conductive adhesive is sandwiched between the outer peripheral front ends of the upper substrate 1 and the lower substrate 2, and this is heated and pressurized to change the wiring pattern of the wiring substrate 8 to the upper electrodes 5A, 5B and the lower electrodes. Adhesive connection to 6A and 6B.

さらに、この後、透光部9Aや加飾部9Bが形成された表示シート9を、下面の接着層9Cによって上基板1上面に貼付して、タッチパネルが完成するものであった。   Furthermore, after that, the display sheet 9 on which the translucent part 9A and the decoration part 9B are formed is pasted on the upper surface of the upper substrate 1 with the adhesive layer 9C on the lower surface, thereby completing the touch panel.

なお、この出願の発明に関連する先行技術文献情報としては、例えば、特許文献1が知られている。   As prior art document information related to the invention of this application, for example, Patent Document 1 is known.

特開2009−277121号公報JP 2009-277121 A

しかしながら、上記従来のタッチパネルにおいては、下面や上面の全面に上導電層3や下導電層4が形成された上基板1や下基板2を、所定のエッチング溶液に浸漬し、外周内縁の不要な箇所の上導電層3や下導電層4を除去した後、さらに上基板1下面と下基板2上面の両方に、印刷等によって上電極5A、5Bや下電極6A、6Bを形成しているため、製作に手間がかかり、高価なものになってしまうという課題があった。   However, in the above-described conventional touch panel, the upper substrate 1 and the lower substrate 2 having the upper conductive layer 3 and the lower conductive layer 4 formed on the entire lower surface and upper surface are immersed in a predetermined etching solution so that the outer peripheral edge is unnecessary. After the upper conductive layer 3 and the lower conductive layer 4 are removed, the upper electrodes 5A and 5B and the lower electrodes 6A and 6B are formed on both the lower surface of the upper substrate 1 and the upper surface of the lower substrate 2 by printing or the like. There is a problem that it takes time and effort to produce, and it becomes expensive.

本発明は、このような従来の課題を解決するものであり、製作が容易に行え、安価で多様な操作が可能なタッチパネルを提供することを目的とする。   The present invention solves such a conventional problem, and an object of the present invention is to provide a touch panel that can be easily manufactured and that can be operated at low cost and variously.

上記目的を達成するために本発明は、以下の構成を有するものである。   In order to achieve the above object, the present invention has the following configuration.

本発明の請求項1に記載の発明は、上導電層を上基板下面の全面に設けると共に、略帯状で複数の下導電層を、下基板上面に所定間隔で配列してタッチパネルを構成したものであり、上基板下面の上導電層にはエッチング加工等を行う必要がなく、また印刷等によって上電極等を形成する必要もないため、容易に製作が行えると共に、略帯状で複数の下導電層によって複数の押圧位置の検出も行えるため、安価で多様な操作が可能なタッチパネルを得ることができるという作用を有する。   According to the first aspect of the present invention, the upper conductive layer is provided on the entire lower surface of the upper substrate, and a plurality of lower conductive layers having a substantially strip shape are arranged on the upper surface of the lower substrate at predetermined intervals to constitute a touch panel. The upper conductive layer on the lower surface of the upper substrate does not need to be etched, and it is not necessary to form the upper electrode by printing or the like. Since a plurality of pressing positions can be detected by the layer, it is possible to obtain a touch panel that is inexpensive and capable of various operations.

請求項2に記載の発明は、請求項1記載の発明において、複数の下導電層を異なる幅または間隔で形成したものであり、幅や間隔の異なる複数の下導電層を、一組にして押圧位置の検出が行えるため、短時間で操作位置の検出を行うことができるという作用を有する。   The invention according to claim 2 is the invention according to claim 1, wherein a plurality of lower conductive layers are formed with different widths or intervals, and a plurality of lower conductive layers with different widths or intervals are combined into one set. Since the pressing position can be detected, the operation position can be detected in a short time.

請求項3に記載の発明は、請求項1記載の発明において、下導電層端部に抵抗体を設けたものであり、一組の複数の下導電層端部に、各々異なる抵抗値の抵抗体を設けることによって、直交する二方向の操作位置を同時に検出できるため、操作位置の検出を短時間で行うことが可能となるという作用を有する。   According to a third aspect of the present invention, in the first aspect of the present invention, a resistor is provided at an end of the lower conductive layer, and resistors having different resistance values are provided at a pair of lower conductive layer ends. By providing the body, the operation positions in two orthogonal directions can be detected at the same time, so that the operation position can be detected in a short time.

以上のように本発明によれば、製作が容易に行え、安価で多様な操作が可能なタッチパネルを実現することができるという有利な効果が得られる。   As described above, according to the present invention, it is possible to obtain an advantageous effect that it is possible to realize a touch panel that can be easily manufactured and can be operated at low cost and variously.

本発明の第1の実施の形態によるタッチパネルの断面図Sectional drawing of the touchscreen by the 1st Embodiment of this invention 同分解斜視図Exploded perspective view 同部分斜視図Partial perspective view 本発明の第2の実施の形態によるタッチパネルの平面図The top view of the touchscreen by the 2nd Embodiment of this invention 同他の実施の形態による平面図Plan view according to another embodiment 同平面図Plan view 本発明の第3の実施の形態によるタッチパネルの断面図Sectional drawing of the touchscreen by the 3rd Embodiment of this invention 同平面図Plan view 従来のタッチパネルの断面図Cross-sectional view of a conventional touch panel 同分解斜視図Exploded perspective view

以下、本発明の実施の形態について、図1〜図8を用いて説明する。   Hereinafter, embodiments of the present invention will be described with reference to FIGS.

なお、これらの図面は構成を判り易くするために、部分的に寸法を拡大して表している。   These drawings are partially enlarged in size for easy understanding of the configuration.

(実施の形態1)
実施の形態1を用いて、本発明の特に請求項1記載の発明について説明する。
(Embodiment 1)
The first aspect of the present invention will be described with reference to the first embodiment.

図1は本発明の第1の実施の形態によるタッチパネルの断面図、図2は同分解斜視図であり、同図において、11はポリエチレンテレフタレートやポリエーテルサルホン、ポリカーボネート等のフィルム状で光透過性の上基板で、この上基板11下面の全面には、酸化インジウム錫や酸化錫等の光透過性の上導電層12が、スパッタ法等によって形成されている。   FIG. 1 is a cross-sectional view of a touch panel according to a first embodiment of the present invention, FIG. 2 is an exploded perspective view thereof, in which 11 is a film of polyethylene terephthalate, polyethersulfone, polycarbonate or the like and transmits light A light transmissive upper conductive layer 12 such as indium tin oxide or tin oxide is formed on the entire lower surface of the upper substrate 11 by sputtering or the like.

そして、上基板11の中央部には透光部11Aが形成されると共に、下面の外周内縁には、ポリエステルやエポキシ等の絶縁樹脂内に顔料等を分散し、黒色や灰色等の暗色に塗装された略額縁状の加飾部11Bが設けられている。   A transparent portion 11A is formed in the central portion of the upper substrate 11, and a pigment or the like is dispersed in an insulating resin such as polyester or epoxy at the outer peripheral edge of the lower surface, and painted in a dark color such as black or gray. The substantially frame-shaped decoration part 11B made is provided.

また、13はフィルム状またはガラス等の薄板状で光透過性の下基板で、この上面には酸化インジウム錫や酸化錫等の、略帯状で光透過性の複数の下導電層14が同じ幅、例えば1〜2mm前後の幅で、所定の間隔、例えば0.2mm前後の間隔で、スパッタ法等によって配列形成されている。   Reference numeral 13 denotes a light-transmitting lower substrate made of a thin plate such as a film or glass, and a plurality of lower light-transmitting lower conductive layers 14 such as indium tin oxide and tin oxide having the same width on the upper surface. For example, a width of about 1 to 2 mm and a predetermined interval, for example, an interval of about 0.2 mm, are arranged by sputtering.

さらに、下導電層14上面にはエポキシやシリコーン等の絶縁樹脂によって、複数のドットスペーサ(図示せず)が所定間隔で形成されると共に、上基板11と下基板13間の外周内縁には、略帯状または略額縁状でポリエステルやエポキシ、不織布等のスペーサ15が設けられ、このスペーサ15の上下面または片面に塗布形成されたアクリルやゴム等の接着剤(図示せず)によって、上基板11と下基板13の外周が貼り合わされ、上導電層12と複数の下導電層14が所定の間隙を空けて対向している。   Further, a plurality of dot spacers (not shown) are formed on the upper surface of the lower conductive layer 14 by an insulating resin such as epoxy or silicone at a predetermined interval, and at the outer peripheral inner edge between the upper substrate 11 and the lower substrate 13, A spacer 15 made of polyester, epoxy, non-woven fabric or the like is provided in a substantially band shape or a frame shape, and the upper substrate 11 is coated with an adhesive (not shown) such as acrylic or rubber applied and formed on the upper and lower surfaces or one surface of the spacer 15. And the lower substrate 13 are bonded together, and the upper conductive layer 12 and the plurality of lower conductive layers 14 face each other with a predetermined gap therebetween.

また、16はポリイミドやポリエチレンテレフタレート等のフィルム状の配線基板で、下面または上下面には銅箔や銀、カーボン等の複数の配線パターン(図示せず)が形成されている。   Reference numeral 16 denotes a film-like wiring substrate such as polyimide or polyethylene terephthalate, and a plurality of wiring patterns (not shown) such as copper foil, silver, and carbon are formed on the lower surface or the upper and lower surfaces.

そして、この複数の配線基板16の一端が、上基板11と下基板13の外周前端と後端に挟持され、エポキシやアクリル、ポリエステル等の合成樹脂内に、ニッケルや樹脂等に金メッキを施した複数の導電粒子を分散した異方導電接着剤(図示せず)等によって、各配線パターンが複数の下導電層14前端と後端に各々接着接続されている。   One end of each of the plurality of wiring boards 16 is sandwiched between the front and rear outer peripheries of the upper board 11 and the lower board 13, and nickel or resin is gold-plated in a synthetic resin such as epoxy, acrylic, or polyester. Each wiring pattern is adhesively connected to the front end and the rear end of the plurality of lower conductive layers 14 by an anisotropic conductive adhesive (not shown) in which a plurality of conductive particles are dispersed.

さらに、上基板11の外形寸法は、外周が下基板13外周よりも外方へ、例えば0.5〜5mm前後突出するように形成されると共に、略額縁状の加飾部11B内周がスペーサ15内周よりも内方へ、例えば0.1〜1mm前後突出するように形成されて、タッチパネルが構成されている。   Further, the outer dimension of the upper substrate 11 is formed such that the outer periphery protrudes outward from the outer periphery of the lower substrate 13 by, for example, about 0.5 to 5 mm, and the inner periphery of the substantially frame-shaped decorative portion 11B is a spacer. The touch panel is formed so as to protrude inward from the inner periphery of 15, for example, about 0.1 to 1 mm.

なお、以上のようなタッチパネルを製作するには、先ず、下面全面に酸化インジウム錫等の薄膜が形成されたシート(図示せず)を所定寸法に切断して、下面全面に上導電層12が設けられた上基板11を製作し、この上基板11下面の外周内縁に印刷等によって、略額縁状で黒色や灰色等の暗色の加飾部11Bを形成する。   In order to manufacture the touch panel as described above, first, a sheet (not shown) in which a thin film such as indium tin oxide is formed on the entire lower surface is cut into a predetermined dimension, and the upper conductive layer 12 is formed on the entire lower surface. The provided upper substrate 11 is manufactured, and a dark color decorative portion 11B such as black or gray is formed in a substantially frame shape by printing or the like on the outer peripheral inner edge of the lower surface of the upper substrate 11.

また、上面全面に酸化インジウム錫等の薄膜が形成された下基板13の、複数の下導電層14を設ける箇所をマスキングして、所定のエッチング溶液に浸漬し、不要な箇所の薄膜を除去して、下基板13上面に複数の下導電層14を形成する。   Further, a portion of the lower substrate 13 having a thin film such as indium tin oxide formed on the entire upper surface is masked where a plurality of lower conductive layers 14 are provided, and immersed in a predetermined etching solution to remove unnecessary thin films. Then, a plurality of lower conductive layers 14 are formed on the upper surface of the lower substrate 13.

さらに、この後、スペーサ15によって上基板11と下基板13を貼り合わせると共に、下面に異方導電接着剤を塗布した配線基板16の端部を、上基板11と下基板13の外周前端と後端に挟み、これを加熱加圧して複数の配線基板16の配線パターンを、複数の下導電層14の前端と後端に接着接続して、タッチパネルが完成する。   Thereafter, the upper substrate 11 and the lower substrate 13 are bonded together by the spacer 15, and the end portion of the wiring substrate 16 coated with the anisotropic conductive adhesive on the lower surface is connected to the outer peripheral front end of the upper substrate 11 and the lower substrate 13. The touch panel is completed by sandwiching it between the ends and heat-pressing it to bond and connect the wiring patterns of the plurality of wiring boards 16 to the front ends and rear ends of the plurality of lower conductive layers 14.

つまり、本発明においては、上導電層12が上基板11下面の全面に設けられているため、上基板11にはエッチング加工等を行う必要がなく、また印刷等によって上電極等を形成する必要もないため、容易に製作が行えると共に、安価にタッチパネルを構成できるようになっている。   That is, in the present invention, since the upper conductive layer 12 is provided on the entire lower surface of the upper substrate 11, it is not necessary to perform etching or the like on the upper substrate 11, and it is necessary to form an upper electrode or the like by printing or the like. Therefore, it can be easily manufactured and a touch panel can be constructed at low cost.

そして、このように構成されたタッチパネルが、液晶表示素子等の表示素子の前面に配置されて電子機器に装着されると共に、配線基板16の複数の配線パターンの前端と後端が、接続用コネクタや半田付け等によって、機器の電子回路のマイコン(図示せず)等に電気的に接続されて入力装置が構成される。   The touch panel configured as described above is disposed on the front surface of a display element such as a liquid crystal display element and attached to an electronic device, and the front and rear ends of a plurality of wiring patterns on the wiring board 16 are connected connectors. The input device is configured by being electrically connected to a microcomputer (not shown) of an electronic circuit of the device by soldering or the like.

以上の構成において、上基板11の透光部11Aを通してタッチパネル背面の表示素子の表示を見ながら、所望の表示上の上基板11上面の、例えば図3の部分斜視図に示すように、矢印Aの箇所を指やペン等で押圧操作すると、上基板11が撓み、押圧された箇所の上導電層12が複数の下導電層14のうち、例えば下導電層14Aと14B後方に接触する。   In the above configuration, while viewing the display of the display element on the back surface of the touch panel through the light transmitting portion 11A of the upper substrate 11, as shown in, for example, the partial perspective view of FIG. When the part is pressed with a finger or a pen, the upper substrate 11 bends, and the upper conductive layer 12 at the pressed part contacts, for example, the lower conductive layers 14A and 14B behind the plurality of lower conductive layers 14.

そして、この時、電子回路が配線基板16の配線パターンを介して、先ず、複数の下導電層14の隣接する二本ずつの間の抵抗値を、例えば下導電層14Aと14Bの間、下導電層14Bと14Cの間というように、各々の抵抗値を順次検出し、下導電層14Aと14Bの間から所定の抵抗値が検出された場合には、これによって押圧操作が行われ、下導電層14Aと14Bの間が上導電層12によって接続されたことを、すなわち矢印Aの左右方向の操作位置を電子回路が検出する。   At this time, the electronic circuit first sets the resistance value between two adjacent lower conductive layers 14 via the wiring pattern of the wiring board 16, for example, between the lower conductive layers 14 A and 14 B. Each resistance value is detected sequentially, such as between the conductive layers 14B and 14C, and when a predetermined resistance value is detected between the lower conductive layers 14A and 14B, a pressing operation is performed thereby, The electronic circuit detects that the conductive layers 14A and 14B are connected by the upper conductive layer 12, that is, the operation position of the arrow A in the left-right direction.

また、この後、電子回路が所定の抵抗値が検出された箇所の一方に所定の電圧を印加、例えば下導電層14Aの前後端に5Vの電圧を印加し、隣接する他方から検出された電圧、例えば下導電層14Bから検出された4Vの電圧によって、下導電層14Aと14B間の後方が押圧操作されたことを、すなわち矢印Aの前後方向の操作位置を電子回路が検出する。   Thereafter, the electronic circuit applies a predetermined voltage to one of the places where the predetermined resistance value is detected, for example, a voltage of 5 V is applied to the front and rear ends of the lower conductive layer 14A, and the voltage detected from the other adjacent one. For example, the electronic circuit detects that the rear side between the lower conductive layers 14A and 14B has been pressed by the voltage of 4V detected from the lower conductive layer 14B, that is, the operation position in the front-rear direction of the arrow A.

つまり、タッチパネル背面の表示素子に、例えば複数のメニュー等が表示された状態で、所望のメニュー上の上基板11上面、例えば矢印Aの箇所を押圧操作すると、上記のように、先ず複数の下導電層14間の抵抗値によって左右方向の操作位置を、次に一方に電圧を印加した場合に他方から出力された電圧によって前後方向の操作位置を、電子回路が各々検出し、複数のメニューの中から所望のメニューの選択等が行えるように構成されている。   That is, when, for example, a plurality of menus and the like are displayed on the display element on the back surface of the touch panel, when the upper surface of the upper substrate 11 on the desired menu, for example, the position indicated by the arrow A is pressed, first a plurality of lower The electronic circuit detects the operation position in the left-right direction based on the resistance value between the conductive layers 14, and then the operation position in the front-rear direction based on the voltage output from the other when a voltage is applied to one side. A desired menu can be selected from the inside.

さらに、このように矢印Aの箇所を押圧したままで、図3に示すように、他の例えば矢印Bの箇所を押圧操作すると、この箇所の上基板11も撓み、下面の上導電層12が複数の下導電層14のうち、例えば下導電層14Dと14E前方に接触する。   Further, when the location indicated by the arrow A is pressed as described above and another location indicated by the arrow B, for example, is pressed as shown in FIG. Of the plurality of lower conductive layers 14, for example, the lower conductive layers 14D and 14E are in contact with the front.

そして、この場合にも、下導電層14Dと14Eの間から検出された所定の抵抗値によって、電子回路が矢印Bの左右方向の操作位置を検出すると共に、下導電層14Dの前後端に5Vの電圧を印加し、隣接する下導電層14Eから検出された2Vの電圧によって、下導電層14Dと14E間の前方、すなわち矢印Bの前後方向の操作位置を電子回路が検出する。   In this case as well, the electronic circuit detects the operation position in the left-right direction of the arrow B based on a predetermined resistance value detected between the lower conductive layers 14D and 14E, and 5 V at the front and rear ends of the lower conductive layer 14D. The electronic circuit detects the operation position in front of the lower conductive layers 14D and 14E, that is, in the front-rear direction of the arrow B, based on the voltage of 2 V detected from the adjacent lower conductive layer 14E.

つまり、複数の略帯状の下導電層14間の抵抗値と、一方に電圧を印加した場合に他方から出力される電圧によって、左右方向と前後方向の操作位置の検出を行うことで、矢印AやBといった一箇所ずつの押圧操作に加え、矢印AもBも同時に押圧操作された場合のような、複数の押圧位置の検出も行うことが可能なように構成されている。   That is, by detecting the operation position in the left-right direction and the front-rear direction based on the resistance value between the plurality of substantially strip-shaped lower conductive layers 14 and the voltage output from the other when a voltage is applied to one, the arrow A In addition to the pressing operation for each location such as A and B, a plurality of pressing positions can be detected as in the case where the arrows A and B are simultaneously pressed.

すなわち、上導電層12を上基板11下面の全面に設けることによって、上基板11にはエッチング加工等を行う必要がなく、容易に製作が行え、安価にタッチパネルを形成できると共に、略帯状で複数の下導電層14を、下基板13上面に所定間隔で配列形成することによって、一箇所ずつの押圧操作に加え、複数の押圧位置の検出といった多様な操作が行えるようになっている。   That is, by providing the upper conductive layer 12 on the entire lower surface of the upper substrate 11, it is not necessary to perform etching processing or the like on the upper substrate 11, it can be easily manufactured, a touch panel can be formed at low cost, and a plurality of strips can be formed. By arranging the lower conductive layer 14 on the upper surface of the lower substrate 13 at a predetermined interval, various operations such as detection of a plurality of pressing positions can be performed in addition to the pressing operation for each location.

なお、上記のような操作位置の検出を行う際、先ず複数の下導電層14の間の抵抗値を検出し、これによって左右方向の操作位置を検出した後は、抵抗値が検出されなかった他の下導電層14には電圧を印加せず、抵抗値が検出された下導電層14Aや14Dにのみ電圧を印加して、下導電層14Bや14Eからの電圧のみを検出して前後方向の操作位置を検出することで、検出時間を短くし、電子回路による位置検出を簡易に行うことができる。   When detecting the operation position as described above, first, the resistance value between the plurality of lower conductive layers 14 was detected, and after detecting the operation position in the left-right direction, the resistance value was not detected. A voltage is not applied to the other lower conductive layer 14, but a voltage is applied only to the lower conductive layers 14A and 14D in which the resistance values are detected, and only the voltage from the lower conductive layers 14B and 14E is detected to detect the front-rear direction. By detecting the operation position, the detection time can be shortened and the position detection by the electronic circuit can be easily performed.

また、下基板13の製作にやや手間はかかるが、複数の下導電層14両端に印刷等によって、銀やカーボン等の一対の下電極を形成し、この下電極と異方導電接着剤を介して、複数の下導電層14と配線基板16の配線パターンの接着接続を行うことによって、下導電層14と配線パターンをより確実に接続することができる。   In addition, although it takes a little time to manufacture the lower substrate 13, a pair of lower electrodes such as silver and carbon is formed on both ends of the plurality of lower conductive layers 14 by printing or the like, and the lower electrode and an anisotropic conductive adhesive are interposed therebetween. Thus, the adhesive connection between the plurality of lower conductive layers 14 and the wiring pattern of the wiring substrate 16 makes it possible to more reliably connect the lower conductive layer 14 and the wiring patterns.

そして、本発明においては、上基板11下面の外周内縁に、略額縁状で暗色の加飾部11Bが一体に形成され、この上基板11と下基板13を貼り合わせるだけで、加飾部11Bを設けたタッチパネルを形成できるため、表示シート等の別部品が不要になり構成部品数が少なくなると共に、このような表示シート等を上基板11上面に貼付する手間もかからず、組み立ても容易に行え、タッチパネルを安価に構成できるようになっている。   In the present invention, a dark decorative portion 11B having a substantially frame shape is integrally formed on the inner peripheral edge of the lower surface of the upper substrate 11, and the decorative portion 11B is simply bonded to the upper substrate 11 and the lower substrate 13. Since a touch panel provided with a touch panel can be formed, there is no need for separate parts such as a display sheet, the number of components is reduced, and there is no need to affix such a display sheet to the upper surface of the upper substrate 11, and assembly is easy. The touch panel can be configured at low cost.

また、上基板11の外形寸法を下基板13外周よりもやや大きくし、外周が下基板13よりも外方へ突出するように形成することによって、この上基板11の突出した下面を電子機器の筐体(図示せず)に貼付して、タッチパネルを機器の表面に平坦な状態で装着することも可能となる。   Further, by forming the outer dimension of the upper substrate 11 slightly larger than the outer periphery of the lower substrate 13 and forming the outer periphery to protrude outward from the lower substrate 13, the protruding lower surface of the upper substrate 11 is formed on the electronic device. It is also possible to attach the touch panel to the surface of the device in a flat state by attaching it to a housing (not shown).

さらに、略額縁状の加飾部11B内周を、スペーサ15内周よりも内方へ突出するように形成することで、上基板11上方から透光部11Aを通してタッチパネル背面の表示素子を目視した際、下導電層14に接続された配線基板16の端部等が見えづらくなるため、背面の表示素子の表示が見易くなり、より操作を行い易くすることができる。   Furthermore, the display element on the back of the touch panel was visually observed from above the upper substrate 11 through the translucent part 11A by forming the inner periphery of the substantially frame-shaped decoration part 11B so as to protrude inward from the inner periphery of the spacer 15. At this time, the end of the wiring substrate 16 connected to the lower conductive layer 14 becomes difficult to see, so that the display on the display element on the back surface is easy to see and the operation can be made easier.

このように本実施の形態によれば、上導電層12を上基板11下面の全面に設けると共に、略帯状で複数の下導電層14を、下基板13上面に所定間隔で配列形成することによって、上基板11下面の上導電層12にはエッチング加工等を行う必要がなく、また印刷等によって上電極等を形成する必要もないため、容易に製作が行えると共に、略帯状で複数の下導電層14によって複数の押圧位置の検出も行えるため、安価で多様な操作が可能なタッチパネルを得ることができるものである。   As described above, according to the present embodiment, the upper conductive layer 12 is provided on the entire lower surface of the upper substrate 11 and a plurality of lower conductive layers 14 having a substantially band shape are arranged on the upper surface of the lower substrate 13 at predetermined intervals. The upper conductive layer 12 on the lower surface of the upper substrate 11 does not need to be etched, and it is not necessary to form an upper electrode or the like by printing. Since a plurality of pressed positions can be detected by the layer 14, a touch panel that can be operated in various ways at low cost can be obtained.

(実施の形態2)
実施の形態2を用いて、本発明の特に請求項2記載の発明について説明する。
(Embodiment 2)
A second embodiment of the present invention, particularly the invention according to claim 2 will be described.

なお、実施の形態1の構成と同一構成の部分には同一符号を付して、詳細な説明を省略する。   In addition, the same code | symbol is attached | subjected to the part of the structure same as the structure of Embodiment 1, and detailed description is abbreviate | omitted.

図4は本発明の第2の実施の形態によるタッチパネルの平面図であり、同図において、光透過性の下基板13上面に酸化インジウム錫や酸化錫等の、略帯状で光透過性の複数の下導電層14がスパッタ法等によって、例えば1〜2mm前後の幅で設けられていることは実施の形態1の場合と同様であるが、これらの下導電層14Aや14B、14C等は各々異なる間隔で配列形成されている。   FIG. 4 is a plan view of the touch panel according to the second embodiment of the present invention. In FIG. 4, a plurality of substantially band-like and light-transmitting materials such as indium tin oxide and tin oxide on the upper surface of the light-transmitting lower substrate 13 are shown. The lower conductive layer 14 is provided by a sputtering method or the like with a width of, for example, about 1 to 2 mm, as in the first embodiment, but the lower conductive layers 14A, 14B, 14C, etc. Arranged at different intervals.

つまり、例えば下導電層14Aと14B間の間隔に比べ、下導電層14Bと14C間の間隔は大きく、下導電層14Cと14D間の間隔はさらに大きく形成されている。   That is, for example, the distance between the lower conductive layers 14B and 14C is larger than the distance between the lower conductive layers 14A and 14B, and the distance between the lower conductive layers 14C and 14D is larger.

そして、所定本数の、例えば四本ずつの下導電層14A〜14Dが一組に形成されると共に、これらは配線基板16の配線パターン、あるいは下基板13上面に形成された下電極によって一本置きに、例えば下導電層14Aと14C前後端が配線パターン17Aと17Bによって、下導電層14Bと14D前後端が配線パターン17Cと17Dによって各々接続されている。   Then, a predetermined number, for example, four lower conductive layers 14A to 14D are formed as a set, and these are placed one by one by the wiring pattern of the wiring board 16 or the lower electrode formed on the upper surface of the lower board 13. For example, the front and rear ends of the lower conductive layers 14A and 14C are connected by the wiring patterns 17A and 17B, and the front and rear ends of the lower conductive layers 14B and 14D are connected by the wiring patterns 17C and 17D, respectively.

なお、このような下基板13上方に、図1や図2に示したように、下面全面に酸化インジウム錫等の光透過性の上導電層12が形成された上基板11が、スペーサ15によって貼り合わされ、上導電層12と複数の下導電層14が所定の間隙を空けて対向すると共に、複数の配線基板16が前後端に接着接続されて、タッチパネルが構成されることは実施の形態1の場合と同様である。   An upper substrate 11 having a light transmissive upper conductive layer 12 made of indium tin oxide or the like formed on the entire bottom surface thereof is formed above the lower substrate 13 by spacers 15 as shown in FIGS. Embodiment 1 The upper conductive layer 12 and the plurality of lower conductive layers 14 are opposed to each other with a predetermined gap therebetween, and a plurality of wiring boards 16 are adhesively connected to the front and rear ends to form a touch panel. It is the same as the case of.

また、このように構成されたタッチパネルが、液晶表示素子等の表示素子の前面に配置されて電子機器に装着されると共に、配線基板16の複数の配線パターンを介して、複数の下導電層14の前後端が機器の電子回路のマイコン(図示せず)等に電気的に接続されて、入力装置が構成されることも実施の形態1の場合と同様である。   Further, the touch panel configured as described above is disposed on the front surface of a display element such as a liquid crystal display element and attached to an electronic device, and a plurality of lower conductive layers 14 are provided via a plurality of wiring patterns of the wiring board 16. As in the case of the first embodiment, the input device is configured by electrically connecting the front and rear ends of the device to a microcomputer (not shown) of an electronic circuit of the device.

以上の構成において、上基板11上面の、例えばAの箇所を指やペン等で押圧操作すると、上基板11が撓み、押圧された箇所の上導電層12が複数の下導電層14のうち、例えば下導電層14Aと14B後方に接触し、これによって下導電層14Aと14Bが接続される。   In the above configuration, when, for example, a portion A on the upper surface of the upper substrate 11 is pressed with a finger or a pen, the upper substrate 11 is bent, and the upper conductive layer 12 in the pressed portion is a plurality of lower conductive layers 14. For example, the lower conductive layers 14A and 14B are in contact with the rear, and thereby the lower conductive layers 14A and 14B are connected.

そして、この時、電子回路が先ず、複数の下導電層14を一本置きに接続した配線パターン間の抵抗値を、例えば下導電層14Aと14Cを接続した配線パターン17Aと、下導電層14Bと14Dを接続した配線パターン17Cの間の抵抗値、及び下導電層14E等を接続した配線パターン(図示せず)間の抵抗値を順次検出する。   At this time, the electronic circuit first determines the resistance value between the wiring patterns in which the plurality of lower conductive layers 14 are alternately connected, for example, the wiring pattern 17A in which the lower conductive layers 14A and 14C are connected, and the lower conductive layer 14B. And a resistance value between wiring patterns 17C connected to 14D and a resistance value between wiring patterns (not shown) connected to the lower conductive layer 14E and the like are sequentially detected.

次に、この検出した抵抗値によって、四本ずつが一組となった下導電層14のどの箇所が押圧操作されたかを検出すると共に、その抵抗値の大小によって、例えば抵抗値が所定の値以下であることによって、間隔の小さな下導電層14Aと14Bの間が押圧操作されたことを、すなわち押圧箇所Aの左右方向の操作位置を電子回路が検出する。   Next, the detected resistance value is used to detect which part of the lower conductive layer 14 in which each set of four is pressed, and the resistance value is, for example, a predetermined value depending on the magnitude of the resistance value. By the following, the electronic circuit detects that the pressing operation has been performed between the lower conductive layers 14A and 14B having a small interval, that is, the operation position in the left-right direction of the pressing portion A.

つまり、例えばBの箇所が押圧操作され、下導電層14Cと14Dの間が上導電層12によって接続された場合には、下導電層14Cと14D間の間隔は大きいため、配線パターン17Aと17C間の抵抗値は大きなものとなるが、Aの箇所が押圧操作され、間隔の小さな下導電層14Aと14Bの間が接続された場合には、配線パターン17Aと17C間の抵抗値は小さくなるため、この抵抗値の大小によって、押圧箇所がAであるかBであるかを電子回路が検出する。   That is, for example, when the portion B is pressed and the lower conductive layers 14C and 14D are connected by the upper conductive layer 12, the interval between the lower conductive layers 14C and 14D is large, so the wiring patterns 17A and 17C The resistance value between the wiring patterns 17A and 17C becomes small when the portion A is pressed and the lower conductive layers 14A and 14B having a small interval are connected. Therefore, the electronic circuit detects whether the pressed location is A or B based on the magnitude of the resistance value.

さらに、この後、抵抗値が検出された配線パターンの一方に電子回路が所定の電圧を印加、例えば配線パターン17Aと17Bを介して、下導電層14Aの前後端に5Vの電圧を印加し、隣接する他方から検出された電圧、例えば配線パターン17Cを介して、下導電層14Bから検出された4Vの電圧によって、下導電層14Aと14B間の後方が押圧操作されたことを、すなわち押圧箇所Aの前後方向の操作位置を電子回路が検出する。   Further, after that, the electronic circuit applies a predetermined voltage to one of the wiring patterns in which the resistance value is detected, for example, a voltage of 5 V is applied to the front and rear ends of the lower conductive layer 14A via the wiring patterns 17A and 17B. The fact that the back of the lower conductive layers 14A and 14B has been pressed by the voltage detected from the other adjacent one, for example, the voltage of 4V detected from the lower conductive layer 14B via the wiring pattern 17C, that is, the pressed location The electronic circuit detects the operation position of A in the front-rear direction.

つまり、左右方向の操作位置の検出を行う際、すべての下導電層14の隣接する二本ずつの間の抵抗値を、順次検出する実施の形態1の場合に比べ、所定本数の、例えば四本ずつの下導電層14A〜14Dが、配線パターン17Aや17C等によって一組に形成され、これらの抵抗値によって検出が行われるようになっているため、電子回路が短時間で左右方向の操作位置の検出を行うことができるように構成されている。   That is, when detecting the operation position in the left-right direction, a predetermined number of, for example, four, is compared to the case of the first embodiment in which the resistance values between two adjacent lower conductive layers 14 are sequentially detected. Each lower conductive layer 14A-14D is formed as a set by wiring patterns 17A, 17C, etc., and detection is performed by these resistance values, so that the electronic circuit can be operated in the horizontal direction in a short time. The position can be detected.

すなわち、上導電層12を上基板11下面の全面に設けることで、容易に製作が行え、安価にタッチパネルを形成できると共に、複数の下導電層14を異なる間隔で配列形成することによって、例えば下導電層14A〜14Dを一組にして押圧位置の検出が行えるため、短時間で操作位置の検出を行うことが可能なようになっている。   That is, by providing the upper conductive layer 12 on the entire lower surface of the upper substrate 11, it can be easily manufactured and a touch panel can be formed at a low cost, and by arranging a plurality of lower conductive layers 14 at different intervals, for example Since the pressing position can be detected by making the conductive layers 14A to 14D as a set, the operation position can be detected in a short time.

なお、以上の説明では、複数の下導電層14、例えば下導電層14A〜14Dを異なる間隔で配列形成した構成について説明したが、図5の平面図に示すように、複数の下導電層14を異なる幅で形成した構成としても、本発明の実施は可能である。   In the above description, a configuration has been described in which a plurality of lower conductive layers 14, for example, lower conductive layers 14A to 14D are arranged at different intervals. However, as shown in the plan view of FIG. It is possible to implement the present invention even if the components are formed with different widths.

つまり、同図において、下基板13上面に設けられた複数の下導電層14は、各々の間隔は同一であるが、幅寸法は各々異なる幅に、例えば下導電層14Fが最も大きな幅に形成され、下導電層14G、14H、14Jの順に小さな幅となるように配列形成されている。   In other words, in the same figure, the plurality of lower conductive layers 14 provided on the upper surface of the lower substrate 13 have the same interval, but have different width dimensions, for example, the lower conductive layer 14F is formed to have the largest width. The lower conductive layers 14G, 14H, and 14J are arranged in order of decreasing width.

さらに、所定本数の、例えば四本ずつの下導電層14F〜14Jが一組に形成されると共に、これらが配線基板16の配線パターンや下電極によって一本置きに、例えば下導電層14Fと14H前後端が配線パターン17Eと17Fによって、下導電層14Gと14J前後端が配線パターン17Gと17Hによって各々接続されている。   Further, a predetermined number of, for example, four lower conductive layers 14F to 14J are formed as a set, and these are alternately formed by the wiring pattern of the wiring board 16 and the lower electrode, for example, lower conductive layers 14F and 14H. The front and rear ends are connected by wiring patterns 17E and 17F, and the lower conductive layers 14G and 14J are connected by front and rear ends by wiring patterns 17G and 17H, respectively.

以上の構成において、上基板11上面の、例えばAの箇所を指やペン等で押圧操作すると、上基板11が撓み、押圧された箇所の上導電層12が複数の下導電層14のうち、例えば下導電層14Fと14G後方に接触し、これによって下導電層14Fと14Gが接続される。   In the above configuration, when, for example, a portion A on the upper surface of the upper substrate 11 is pressed with a finger or a pen, the upper substrate 11 is bent, and the upper conductive layer 12 in the pressed portion is a plurality of lower conductive layers 14. For example, the lower conductive layers 14F and 14G are contacted behind, and thereby the lower conductive layers 14F and 14G are connected.

そして、電子回路が先ず、複数の下導電層14を一本置きに接続した配線パターン間の抵抗値を、例えば下導電層14Fと14H前端を接続した配線パターン17Eと、下導電層14Gと14J後端を接続した配線パターン17Hの間の抵抗値、及び下導電層14K等を接続した配線パターン(図示せず)間の抵抗値を順次検出する。   The electronic circuit first determines the resistance value between the wiring patterns in which the plurality of lower conductive layers 14 are connected every other line, for example, the wiring pattern 17E in which the lower conductive layers 14F and 14H are connected at the front ends, and the lower conductive layers 14G and 14J. The resistance value between the wiring patterns 17H to which the rear ends are connected and the resistance value between wiring patterns (not shown) to which the lower conductive layer 14K and the like are connected are sequentially detected.

なお、この時、下導電層14Fと14H後端を接続した配線パターン17Fと、下導電層14Gと14J前端を接続した配線パターン17Gの間の抵抗値を、電子回路が検出するようにしてもよい。   At this time, the electronic circuit may detect the resistance value between the wiring pattern 17F connecting the rear ends of the lower conductive layers 14F and 14H and the wiring pattern 17G connecting the front ends of the lower conductive layers 14G and 14J. Good.

次に、この検出した抵抗値によって、四本ずつが一組となった下導電層14のどの箇所が押圧操作されたかを検出すると共に、その抵抗値の大小によって、例えば抵抗値が所定の値以下であることによって、下導電層14Fと14Gの間が押圧操作されたことを、すなわち押圧箇所Aの左右方向の操作位置を電子回路が検出する。   Next, the detected resistance value is used to detect which part of the lower conductive layer 14 in which each set of four is pressed, and the resistance value is, for example, a predetermined value depending on the magnitude of the resistance value. By the following, the electronic circuit detects that the lower conductive layers 14F and 14G have been pressed, that is, the operation position in the left-right direction of the pressed location A.

つまり、例えばBの箇所が押圧操作され、下導電層14Hと14Jの間が上導電層12によって接続された場合には、下導電層14Hや14Jの幅は小さいため、配線パターン17Eと17H間の抵抗値は大きなものとなるが、Aの箇所が押圧操作され、幅の大きな下導電層14Fと14Gの間が接続された場合には、配線パターン17Eと17H間の抵抗値は小さくなるため、この抵抗値の大小によって、押圧箇所がAであるかBであるかを電子回路が検出する。   That is, for example, when the portion B is pressed and the lower conductive layers 14H and 14J are connected by the upper conductive layer 12, the widths of the lower conductive layers 14H and 14J are small, and therefore, between the wiring patterns 17E and 17H. However, if the portion A is pressed and the lower conductive layers 14F and 14G having a large width are connected, the resistance value between the wiring patterns 17E and 17H becomes small. The electronic circuit detects whether the pressed portion is A or B based on the magnitude of the resistance value.

さらに、この後、抵抗値が検出された配線パターンの一方に電子回路が所定の電圧を印加、例えば配線パターン17Eと17Fを介して、下導電層14Fの前後端に5Vの電圧を印加し、隣接する他方から検出された電圧、例えば配線パターン17Hを介して、下導電層14Gから検出された4Vの電圧によって、下導電層14Fと14G間の後方が押圧操作されたことを、すなわち押圧箇所Aの前後方向の操作位置を電子回路が検出する。   Further, after that, the electronic circuit applies a predetermined voltage to one of the wiring patterns in which the resistance value is detected, for example, a voltage of 5 V is applied to the front and rear ends of the lower conductive layer 14F via the wiring patterns 17E and 17F. The fact that the back of the lower conductive layers 14F and 14G has been pressed by the voltage detected from the other adjacent one, for example, the voltage of 4V detected from the lower conductive layer 14G via the wiring pattern 17H, that is, the pressed location The electronic circuit detects the operation position of A in the front-rear direction.

なお、この時、操作位置の検出を上記のように配線パターン17Eと17H間ではなく、例えば配線パターン17Eと17G間の抵抗値で行った場合には、Aの箇所が押圧され、幅の大きな下導電層14Fと14G後方が接続された場合の抵抗値と、Bの箇所が押圧され、幅の小さな下導電層14Hや14J前方が接続された場合の抵抗値が近似したものとなるため、押圧箇所がAであるかBであるかを検出することが困難となる。   At this time, when the operation position is detected not with the wiring patterns 17E and 17H but with the resistance value between the wiring patterns 17E and 17G as described above, the position A is pressed and the width is large. Since the resistance value when the lower conductive layers 14F and 14G rear are connected and the resistance value when the portion B is pressed and the lower conductive layers 14H and 14J having a small width are connected are approximated, It becomes difficult to detect whether the pressed location is A or B.

したがって、このように幅の異なる複数の下導電層14F〜14J等を同じ間隔で配列形成した場合には、前端の配線パターン17Eと17G間や、後端の17Fと17H間ではなく、前後端の配線パターン17Eと17H間、あるいは配線パターン17Gと17F間で検出を行うことで、上記のように確実な操作位置の検出を行うことが可能となる。   Therefore, when the plurality of lower conductive layers 14F to 14J having different widths are formed at the same interval in this way, the front and rear ends are not the front end wiring patterns 17E and 17G or the rear end 17F and 17H. By performing detection between the wiring patterns 17E and 17H or between the wiring patterns 17G and 17F, it is possible to detect the operation position with reliability as described above.

つまり、上記のように幅の異なる複数の下導電層14を同じ間隔で配列形成することによっても、上述した同じ幅の複数の下導電層14を異なる間隔で配列形成した場合と同様に、所定本数の、例えば四本ずつの下導電層14F〜14Jを一組にして押圧位置の検出が行えるため、短時間で左右方向の操作位置の検出を行うことができる。   That is, even when the plurality of lower conductive layers 14 having different widths are arranged at the same interval as described above, the same as the case where the plurality of lower conductive layers 14 having the same width are arranged at different intervals as described above. Since the number of, for example, four lower conductive layers 14F to 14J can be detected as a set and the pressed position can be detected, the operation position in the left-right direction can be detected in a short time.

このように本実施の形態によれば、上導電層12を上基板11下面の全面に設けることによって、容易に製作が行え、安価にタッチパネルを形成できると共に、下基板13上面の複数の下導電層14を異なる幅または間隔で形成することによって、幅や間隔の異なる複数の下導電層14F〜14Jや14A〜14Dを、一組にして押圧位置の検出が行えるため、短時間で操作位置の検出を行うことができるものである。   As described above, according to the present embodiment, by providing the upper conductive layer 12 on the entire lower surface of the upper substrate 11, the touch panel can be easily formed at a low cost, and a plurality of lower conductive layers on the upper surface of the lower substrate 13 can be formed. By forming the layer 14 with different widths or intervals, it is possible to detect the pressing position of a plurality of lower conductive layers 14F to 14J and 14A to 14D having different widths and intervals as a set. Detection can be performed.

なお、以上の説明では、下基板13上面に直線状の複数の下導電層14を配列形成した構成について説明したが、図6(a)の平面図に示すような、略波形状の複数の下導電層18Aや、図6(b)に示すような、略矩形状が連結されたような下導電層18B、あるいは図6(c)に示すような、略帯状と略矩形状を組み合わせたような下導電層18C等、様々な形状を略帯状に形成した構成としても、本発明の実施は可能である。   In the above description, a configuration in which a plurality of linear lower conductive layers 14 are arranged on the upper surface of the lower substrate 13 has been described. However, as shown in the plan view of FIG. The lower conductive layer 18A, the lower conductive layer 18B in which a substantially rectangular shape is connected as shown in FIG. 6B, or a combination of a substantially strip shape and a substantially rectangular shape as shown in FIG. 6C. The present invention can be implemented even with a configuration in which various shapes such as the lower conductive layer 18C are formed in a substantially band shape.

(実施の形態3)
実施の形態3を用いて、本発明の特に請求項3記載の発明について説明する。
(Embodiment 3)
The third embodiment of the present invention will be described in particular.

なお、実施の形態1や2の構成と同一構成の部分には同一符号を付して、詳細な説明を省略する。   In addition, the same code | symbol is attached | subjected to the part of the structure same as the structure of Embodiment 1 and 2, and detailed description is abbreviate | omitted.

図7は本発明の第3の実施の形態によるタッチパネルの断面図、図8は同平面図であり、同図において、光透過性の下基板13上面に酸化インジウム錫や酸化錫等の、略帯状で光透過性の複数の下導電層19が同じ幅、例えば1〜2mm前後の幅で、所定の間隔、例えば0.2mm前後の間隔で、スパッタ法等によって配列形成されていることは、実施の形態1の場合と同様であるが、これらの前後方向の抵抗値が所定の値、例えば15kΩ前後の抵抗値に形成された下導電層19Aや19B、19C等の端部には、酸化インジウム錫やカーボン等によって所定の抵抗値の抵抗体20が設けられている。   FIG. 7 is a cross-sectional view of a touch panel according to a third embodiment of the present invention, and FIG. 8 is a plan view of the touch panel. In FIG. 7, the upper surface of the light-transmitting lower substrate 13 is made of indium tin oxide, tin oxide or the like. The plurality of lower conductive layers 19 that are band-like and light-transmissive are arranged in the same width, for example, about 1 to 2 mm, and arranged at a predetermined interval, for example, about 0.2 mm, by sputtering or the like. Although the same as in the case of the first embodiment, the end portions of the lower conductive layers 19A, 19B, 19C, etc., in which the resistance value in the front-rear direction is set to a predetermined value, for example, a resistance value around 15 kΩ, are oxidized. A resistor 20 having a predetermined resistance value is provided by indium tin, carbon, or the like.

つまり、例えば下導電層19Aの前端には抵抗値が45kΩ前後の抵抗体20Aが、下導電層19Bの前端には30kΩ前後の抵抗体20B、後端には15kΩ前後の抵抗体20Cが、下導電層19Cの前端には15kΩ前後の抵抗体20Cが、後端には30kΩ前後の抵抗体20Bが、下導電層19Dの後端には45kΩ前後の抵抗体20Aが各々形成されている。   That is, for example, a resistor 20A having a resistance value of about 45 kΩ is provided at the front end of the lower conductive layer 19A, a resistor 20B of about 30 kΩ is provided at the front end of the lower conductive layer 19B, and a resistor 20C of about 15 kΩ is provided at the rear end. A resistor 20C of about 15 kΩ is formed at the front end of the conductive layer 19C, a resistor 20B of about 30 kΩ is formed at the rear end, and a resistor 20A of about 45 kΩ is formed at the rear end of the lower conductive layer 19D.

なお、このような抵抗体20は、下導電層19端部の酸化インジウム錫等の幅を細くして所定の抵抗値が得られるように形成しても、下導電層19端部にカーボン等を印刷して形成しても、あるいは配線基板16の配線パターン等にチップ状の固定抵抗器を実装して形成してもよい。   Even if such a resistor 20 is formed so that a predetermined resistance value can be obtained by narrowing the width of indium tin oxide or the like at the end of the lower conductive layer 19, carbon or the like is formed at the end of the lower conductive layer 19. Or a chip-shaped fixed resistor mounted on the wiring pattern of the wiring board 16 or the like.

そして、所定本数の、例えば四本ずつの下導電層19A〜19Dが一組に形成されると共に、これらは配線基板16の配線パターン、あるいは下基板13上面に形成された下電極によって一本置きに、例えば下導電層19Aと19C前後端が配線パターン17Jと17Kによって、下導電層19Bと19D前後端が配線パターン17Lと17Mによって各々接続されている。   Then, a predetermined number of, for example, four lower conductive layers 19A to 19D are formed in one set, and these are placed one by one by the wiring pattern of the wiring substrate 16 or the lower electrode formed on the upper surface of the lower substrate 13. For example, the front and rear ends of the lower conductive layers 19A and 19C are connected by the wiring patterns 17J and 17K, and the front and rear ends of the lower conductive layers 19B and 19D are connected by the wiring patterns 17L and 17M, respectively.

なお、このような下基板13上方に、下面全面に酸化インジウム錫等の光透過性の上導電層12が形成され、外周内縁に略額縁状の加飾部11Bが設けられた上基板11が、スペーサ15によって貼り合わされ、上導電層12と複数の下導電層19が所定の間隙を空けて対向すると共に、複数の配線基板16が前後端に接着接続されて、タッチパネルが構成されることは実施の形態1や2の場合と同様である。   Note that the upper substrate 11 having a light transmissive upper conductive layer 12 such as indium tin oxide formed on the entire lower surface above the lower substrate 13 and a substantially frame-shaped decorative portion 11B provided on the inner periphery of the outer periphery. The upper conductive layer 12 and the plurality of lower conductive layers 19 face each other with a predetermined gap, and the plurality of wiring boards 16 are bonded and connected to the front and rear ends to constitute a touch panel. This is the same as in the first and second embodiments.

また、このように構成されたタッチパネルが、液晶表示素子等の表示素子の前面に配置されて電子機器に装着されると共に、配線基板16の複数の配線パターンを介して、複数の下導電層19の前後端が機器の電子回路のマイコン(図示せず)等に電気的に接続されて、入力装置が構成されることも実施の形態1や2の場合と同様である。   In addition, the touch panel configured as described above is disposed on the front surface of a display element such as a liquid crystal display element and attached to an electronic device, and a plurality of lower conductive layers 19 are provided via a plurality of wiring patterns of the wiring substrate 16. As in the case of the first and second embodiments, the front and rear ends are electrically connected to a microcomputer (not shown) of the electronic circuit of the device and the like to constitute the input device.

以上の構成において、上基板11上面の、例えばAの箇所を指やペン等で押圧操作すると、上基板11が撓み、押圧された箇所の上導電層12が複数の下導電層19のうち、例えば下導電層19Aと19B後方に接触し、これによって下導電層19Aと19Bが接続される。   In the above configuration, when, for example, a portion A on the upper surface of the upper substrate 11 is pressed with a finger or a pen, the upper substrate 11 bends, and the upper conductive layer 12 of the pressed portion is a plurality of lower conductive layers 19. For example, the lower conductive layers 19A and 19B are in contact with the rear, and thereby the lower conductive layers 19A and 19B are connected.

そして、この時、電子回路が先ず、複数の下導電層19を一本置きに接続した配線パターン間の抵抗値を、例えば下導電層19Aと19C前端を接続した配線パターン17Jと、下導電層19Bと19D前端を接続した配線パターン17Lの間の抵抗値、及び下導電層19E等を接続した配線パターン(図示せず)間の抵抗値を順次検出し、この抵抗値によって、四本ずつが一組となった下導電層19のどの箇所の組が押圧操作されたかを検出する。   At this time, the electronic circuit first determines the resistance value between the wiring patterns in which a plurality of lower conductive layers 19 are connected every other line, for example, the wiring pattern 17J in which the front ends of the lower conductive layers 19A and 19C are connected, and the lower conductive layer The resistance value between the wiring pattern 17L connecting the front ends of 19B and 19D and the resistance value between the wiring patterns (not shown) connecting the lower conductive layer 19E and the like are sequentially detected. It is detected which set of the lower conductive layer 19 as a set is pressed.

また、この後、抵抗値が検出された配線パターンの一方に電子回路が所定の電圧を印加、例えば配線パターン17Jと17Kを介して、下導電層19Aの前後端に5Vの電圧を印加し、隣接する他方から検出された電圧、例えば配線パターン17Lを介して、下導電層19Bから検出された電圧によって、下導電層19Aと19B間の後方が押圧操作されたことを、すなわち押圧箇所Aの左右方向と前後方向の操作位置を電子回路が同時に検出する。   Thereafter, the electronic circuit applies a predetermined voltage to one of the wiring patterns in which the resistance value is detected, for example, a voltage of 5 V is applied to the front and rear ends of the lower conductive layer 19A via the wiring patterns 17J and 17K. That the back of the lower conductive layers 19A and 19B has been pressed by the voltage detected from the other adjacent one, for example, the voltage detected from the lower conductive layer 19B via the wiring pattern 17L, that is, the pressing point A The electronic circuit simultaneously detects the operation positions in the left-right direction and the front-rear direction.

つまり、例えばBの箇所が押圧操作され、下導電層19Cと19Dの間が上導電層12によって接続された場合には、配線パターン17Lからは、下導電層19Cとこの前後端の抵抗体20Cと20Bの抵抗値の和に対する、前端の抵抗体20Cの抵抗比が電圧として出力される。   That is, for example, when the portion B is pressed and the lower conductive layers 19C and 19D are connected by the upper conductive layer 12, the lower conductive layer 19C and the resistor 20C at the front and rear ends are connected from the wiring pattern 17L. And the resistance ratio of the front end resistor 20C with respect to the sum of the resistance values of 20B is output as a voltage.

これに対し、Aの箇所が押圧操作された場合には、下導電層19A全体とこの前端の抵抗体20Aの抵抗値の和に対する、Aの箇所までの下導電層19Aの抵抗値と前端の抵抗体20Aの和の抵抗比が、電圧として配線パターン17Lから出力されるため、この電圧値の違いによって、押圧箇所がAであるかBであるかを、すなわち左右方向の操作位置を電子回路が検出する。   On the other hand, when the position A is pressed, the resistance value of the lower conductive layer 19A up to the position A and the front end of the lower conductive layer 19A and the sum of the resistance values of the front end resistor 20A are reduced. Since the resistance ratio of the sum of the resistors 20A is output as a voltage from the wiring pattern 17L, depending on the difference in voltage value, whether the pressed location is A or B, that is, the operation position in the left-right direction is set as an electronic circuit. Will detect.

また、例えばCの箇所が押圧操作された場合には、配線パターン17Lからは、下導電層19A全体とこの前端の抵抗体20Aの抵抗値の和に対する、前端の抵抗体20Aの抵抗比が電圧として出力されるため、この電圧差によって押圧箇所がAであるかCであるかを、すなわち前後方向の操作位置を電子回路が検出する。   For example, when the portion C is pressed, the resistance ratio of the front end resistor 20A to the sum of the resistance values of the entire lower conductive layer 19A and the front end resistor 20A is a voltage from the wiring pattern 17L. As a result, the electronic circuit detects whether the pressed position is A or C, that is, the operation position in the front-rear direction.

つまり、所定本数の、例えば四本ずつの下導電層19A〜19Dを、配線パターン17Jや17L等によって一組に形成し、これらの抵抗値によって電子回路が、どの組かの概略の検出を行った後、所定の下導電層19に電圧を印加し、各下導電層19自体の抵抗や、前端や後端に設けられた各抵抗体20の抵抗比から出力される電圧によって、左右方向と前後方向の操作位置を電子回路が、同時に検出するように構成されている。   That is, a predetermined number of, for example, four lower conductive layers 19A to 19D are formed in one set by the wiring patterns 17J and 17L, and the electronic circuit roughly detects which set by these resistance values. Then, a voltage is applied to a predetermined lower conductive layer 19, and the left and right directions are determined by the voltage output from the resistance of each lower conductive layer 19 itself and the resistance ratio of each resistor 20 provided at the front end and rear end. The electronic circuit is configured to detect the operation position in the front-rear direction at the same time.

すなわち、上導電層12を上基板11下面の全面に設けることで、容易に製作が行え、安価にタッチパネルを形成できると共に、一組の複数の下導電層19A〜19D端部に、各々異なる抵抗値の抵抗体20A〜20Cを設けることによって、直交する左右方向と前後方向の二方向の操作位置を同時に検出できるため、電子回路が短時間で操作位置の検出を行うことが可能なようになっている。   That is, by providing the upper conductive layer 12 on the entire lower surface of the upper substrate 11, it can be easily manufactured and a touch panel can be formed at a low cost, and different resistances are provided at the ends of the plurality of lower conductive layers 19A to 19D. By providing the value resistors 20A to 20C, it is possible to simultaneously detect the operation positions in the two directions of the right and left directions orthogonal to each other, and the electronic circuit can detect the operation position in a short time. ing.

なお、以上の説明では、上基板11下面の全面にスパッタ法等によって、酸化インジウム錫や酸化錫等の上導電層12を形成した構成について説明したが、ポリチオフェンやポリアニリン等の導電性樹脂、あるいはアクリル等の紫外線硬化樹脂内に銀等の複数の導電金属細線を分散したものを用い、これらを上基板11下面に印刷や塗布して、光透過性の上導電層12を形成した構成とすれば、より安価にタッチパネルを形成することができる。   In the above description, the structure in which the upper conductive layer 12 such as indium tin oxide or tin oxide is formed on the entire lower surface of the upper substrate 11 by sputtering or the like has been described. However, a conductive resin such as polythiophene or polyaniline, or A structure in which a plurality of thin conductive metal wires such as silver are dispersed in an ultraviolet curable resin such as acrylic and these are printed or coated on the lower surface of the upper substrate 11 to form a light transmissive upper conductive layer 12 is used. Thus, the touch panel can be formed at a lower cost.

このように本実施の形態によれば、上導電層12を上基板11下面の全面に設けることによって、容易に製作が行え、安価にタッチパネルを形成できると共に、複数の下導電層19A〜19D端部に、抵抗体20A〜20Cを設けることによって、直交する左右方向と前後方向の二方向の操作位置を同時に検出できるため、短時間で操作位置の検出を行うことができるものである。   As described above, according to the present embodiment, the upper conductive layer 12 is provided on the entire lower surface of the upper substrate 11 so that it can be easily manufactured, a touch panel can be formed at a low cost, and a plurality of lower conductive layers 19A to 19D ends. By providing the resistors 20 </ b> A to 20 </ b> C in the part, it is possible to detect the operation position in the two directions of the right and left direction and the front and rear direction orthogonal to each other, so that the operation position can be detected in a short time.

本発明によるタッチパネルは、製作が容易に行え、安価で多様な操作が可能なものを得ることができるという有利な効果を有し、主に各種電子機器の操作用として有用である。   The touch panel according to the present invention has an advantageous effect that it can be easily manufactured, can be obtained at low cost and can be operated in various ways, and is mainly useful for operation of various electronic devices.

11 上基板
11A 透光部
11B 加飾部
12 上導電層
13 下基板
14、14A〜14K 下導電層
15 スペーサ
16 配線基板
17A〜17M 配線パターン
18A〜18C 下導電層
19、19A〜19E 下導電層
20、20A〜20C 抵抗体
DESCRIPTION OF SYMBOLS 11 Upper substrate 11A Translucent part 11B Decorating part 12 Upper conductive layer 13 Lower substrate 14, 14A-14K Lower conductive layer 15 Spacer 16 Wiring board 17A-17M Wiring pattern 18A-18C Lower conductive layer 19, 19A-19E Lower conductive layer 20, 20A-20C resistor

Claims (3)

下面に上導電層が形成された上基板と、上面に上記上導電層と所定の間隙を空けて対向する下導電層が形成された下基板からなり、上記上導電層を上記上基板下面の全面に設けると共に、略帯状で複数の上記下導電層を、上記下基板上面に所定間隔で配列したタッチパネル。 An upper substrate having an upper conductive layer formed on the lower surface, and a lower substrate having an upper conductive layer formed on the upper surface and facing the upper conductive layer with a predetermined gap therebetween. The upper conductive layer is formed on the lower surface of the upper substrate. A touch panel provided on the entire surface and having a plurality of lower conductive layers arranged in a substantially band shape on the upper surface of the lower substrate at predetermined intervals. 複数の下導電層を異なる幅または間隔で形成した請求項1記載のタッチパネル。 The touch panel according to claim 1, wherein a plurality of lower conductive layers are formed with different widths or intervals. 下導電層端部に抵抗体を設けた請求項1記載のタッチパネル。 The touch panel according to claim 1, wherein a resistor is provided at an end of the lower conductive layer.
JP2010202582A 2010-09-10 2010-09-10 Touch panel Pending JP2012059091A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016519836A (en) * 2013-03-22 2016-07-07 エルジー・ケム・リミテッド CONDUCTIVE PATTERN LAMINATE AND ELECTRONIC DEVICE CONTAINING THE SAME {CONDUCTIVEPATETERNLAMINATE ANDELECTRONIC APPARATUSCOMPRESSINGTHEMES}
JP2016126362A (en) * 2014-12-26 2016-07-11 Nltテクノロジー株式会社 Resistance film touch panel, composite touch panel, driving method of touch panel, and display device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016519836A (en) * 2013-03-22 2016-07-07 エルジー・ケム・リミテッド CONDUCTIVE PATTERN LAMINATE AND ELECTRONIC DEVICE CONTAINING THE SAME {CONDUCTIVEPATETERNLAMINATE ANDELECTRONIC APPARATUSCOMPRESSINGTHEMES}
US9841857B2 (en) 2013-03-22 2017-12-12 Lg Chem, Ltd. Conductive pattern laminate and electronic device comprising same
JP2016126362A (en) * 2014-12-26 2016-07-11 Nltテクノロジー株式会社 Resistance film touch panel, composite touch panel, driving method of touch panel, and display device
US10642439B2 (en) 2014-12-26 2020-05-05 Tianma Microelectronics Co., Ltd. Resistive touch panel detecting touch based on variation of transmission path, composite touch panel, method of driving touch panel, and display apparatus

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