JPH0543068B2 - - Google Patents
Info
- Publication number
- JPH0543068B2 JPH0543068B2 JP60216872A JP21687285A JPH0543068B2 JP H0543068 B2 JPH0543068 B2 JP H0543068B2 JP 60216872 A JP60216872 A JP 60216872A JP 21687285 A JP21687285 A JP 21687285A JP H0543068 B2 JPH0543068 B2 JP H0543068B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- pin
- support table
- guide
- holding member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007689 inspection Methods 0.000 claims description 18
- 238000001514 detection method Methods 0.000 claims description 17
- 239000013013 elastic material Substances 0.000 claims description 6
- 238000012360 testing method Methods 0.000 description 19
- 230000006835 compression Effects 0.000 description 9
- 238000007906 compression Methods 0.000 description 9
- 230000003139 buffering effect Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 239000000523 sample Substances 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000002441 reversible effect Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
Landscapes
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Tests Of Electronic Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60216872A JPS6275358A (ja) | 1985-09-30 | 1985-09-30 | 回路基板検査装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60216872A JPS6275358A (ja) | 1985-09-30 | 1985-09-30 | 回路基板検査装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6275358A JPS6275358A (ja) | 1987-04-07 |
| JPH0543068B2 true JPH0543068B2 (US20100268047A1-20101021-C00003.png) | 1993-06-30 |
Family
ID=16695236
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60216872A Granted JPS6275358A (ja) | 1985-09-30 | 1985-09-30 | 回路基板検査装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6275358A (US20100268047A1-20101021-C00003.png) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02179487A (ja) * | 1988-12-29 | 1990-07-12 | Seikosha Co Ltd | 両面回路基板用検査ヘッド |
| JPH0827334B2 (ja) * | 1992-11-13 | 1996-03-21 | 日東精工株式会社 | 基板検査装置 |
| KR101192209B1 (ko) * | 2008-09-05 | 2012-10-17 | 니혼덴산리드가부시키가이샤 | 기판검사용 검사치구 |
-
1985
- 1985-09-30 JP JP60216872A patent/JPS6275358A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6275358A (ja) | 1987-04-07 |
