JPH0542159B2 - - Google Patents
Info
- Publication number
- JPH0542159B2 JPH0542159B2 JP61089319A JP8931986A JPH0542159B2 JP H0542159 B2 JPH0542159 B2 JP H0542159B2 JP 61089319 A JP61089319 A JP 61089319A JP 8931986 A JP8931986 A JP 8931986A JP H0542159 B2 JPH0542159 B2 JP H0542159B2
- Authority
- JP
- Japan
- Prior art keywords
- dielectric
- green sheet
- insulator
- sheet
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000012212 insulator Substances 0.000 claims description 34
- 239000000919 ceramic Substances 0.000 claims description 27
- 239000002131 composite material Substances 0.000 claims description 25
- 229910052751 metal Inorganic materials 0.000 claims description 25
- 239000002184 metal Substances 0.000 claims description 25
- 239000004020 conductor Substances 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 5
- 238000010304 firing Methods 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 229910052763 palladium Inorganic materials 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 238000002788 crimping Methods 0.000 claims description 2
- 238000011049 filling Methods 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims 1
- 239000003990 capacitor Substances 0.000 description 20
- 239000000463 material Substances 0.000 description 10
- 239000003989 dielectric material Substances 0.000 description 9
- 238000007639 printing Methods 0.000 description 5
- 238000005245 sintering Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 239000011230 binding agent Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 239000004014 plasticizer Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 101100513612 Microdochium nivale MnCO gene Proteins 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- CNLWCVNCHLKFHK-UHFFFAOYSA-N aluminum;lithium;dioxido(oxo)silane Chemical compound [Li+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O CNLWCVNCHLKFHK-UHFFFAOYSA-N 0.000 description 1
- 229910052661 anorthite Inorganic materials 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 229910052878 cordierite Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- GWWPLLOVYSCJIO-UHFFFAOYSA-N dialuminum;calcium;disilicate Chemical compound [Al+3].[Al+3].[Ca+2].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-] GWWPLLOVYSCJIO-UHFFFAOYSA-N 0.000 description 1
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910000174 eucryptite Inorganic materials 0.000 description 1
- 229910052839 forsterite Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007569 slipcasting Methods 0.000 description 1
- 229910052642 spodumene Inorganic materials 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61089319A JPS62244631A (ja) | 1986-04-17 | 1986-04-17 | 複合積層セラミツク部品の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61089319A JPS62244631A (ja) | 1986-04-17 | 1986-04-17 | 複合積層セラミツク部品の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62244631A JPS62244631A (ja) | 1987-10-26 |
JPH0542159B2 true JPH0542159B2 (fr) | 1993-06-25 |
Family
ID=13967344
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61089319A Granted JPS62244631A (ja) | 1986-04-17 | 1986-04-17 | 複合積層セラミツク部品の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62244631A (fr) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62265795A (ja) * | 1986-05-14 | 1987-11-18 | 株式会社住友金属セラミックス | コンデンサ内蔵セラミツクス基板 |
US4858077A (en) * | 1987-11-25 | 1989-08-15 | Hitachi, Ltd. | Condenser-containing, ceramic multi-layer circuit board and semiconductor module and computer having the circuit board |
JPH0632384B2 (ja) * | 1987-12-22 | 1994-04-27 | 株式会社住友金属セラミックス | 積層セラミック基板の製造方法 |
JPH01312896A (ja) * | 1988-06-09 | 1989-12-18 | Murata Mfg Co Ltd | セラミック多層基板 |
JPH0797705B2 (ja) * | 1989-07-17 | 1995-10-18 | 日本電気株式会社 | 多層セラミツク基板 |
JP2882157B2 (ja) * | 1992-01-13 | 1999-04-12 | 株式会社村田製作所 | セラミック多層電子部品の製造方法 |
-
1986
- 1986-04-17 JP JP61089319A patent/JPS62244631A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS62244631A (ja) | 1987-10-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |