JPH0538627U - Back lighting device - Google Patents
Back lighting deviceInfo
- Publication number
- JPH0538627U JPH0538627U JP087877U JP8787791U JPH0538627U JP H0538627 U JPH0538627 U JP H0538627U JP 087877 U JP087877 U JP 087877U JP 8787791 U JP8787791 U JP 8787791U JP H0538627 U JPH0538627 U JP H0538627U
- Authority
- JP
- Japan
- Prior art keywords
- light guide
- guide plate
- light emitting
- light
- emitting element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
(57)【要約】
【目的】バック照明装置の大幅な薄型化を実現する。
【構成】導光性を有する樹脂封止体２４は導光板の凹部
２１fに配設されるので、発光素子組立体２０と導光板
２１との位置決めが良好に行える。また、樹脂封止体２
４は導光板２１の一部として機能すると共に発光素子２
３の外囲体としても機能するから、発光素子組立体２０
の幅長を小さくできる。結果として、薄型化したバック
照明装置を提供できる。更に、レンズ部となる複数の樹
脂封止体２４が互いに一定間隔離間してプリント基板２
２に形成されているので、プリント基板２２と樹脂封止
体２４との線膨張係数差に起因する発光素子組立体２０
の反りを防止することができる。
(57) [Abstract] [Purpose] Achieve a significant reduction in the thickness of the back lighting device. [Structure] Since the resin encapsulant 24 having a light guide property is disposed in the recess 21f of the light guide plate, the light emitting element assembly 20 and the light guide plate 21 can be properly positioned. In addition, the resin sealing body 2
4 functions as a part of the light guide plate 21 and the light emitting element 2
Since it also functions as the outer enclosure of 3, the light emitting element assembly 20
The width of can be reduced. As a result, a thin back lighting device can be provided. Further, the plurality of resin sealing bodies 24, which are lens portions, are spaced apart from each other by a predetermined distance, and the printed circuit board 2
2, the light emitting element assembly 20 is caused by a difference in linear expansion coefficient between the printed board 22 and the resin sealing body 24.
It is possible to prevent the warp.
Description
【０００１】[0001]
本考案は照明装置、特に液晶表示（ＬＣＤ）のバックライトに最適な薄型構造 のバック照明装置に関連する。 The present invention relates to a lighting device, and particularly to a back lighting device having a thin structure, which is suitable for a backlight of a liquid crystal display (LCD).
【０００２】[0002]
液晶表示に使用される従来のバック照明装置は、図８に示すように、発光ダイ オードチップ１３が固着された細長いプリント基板１１に外囲体１２を固定し、 外囲体１２の開口部１２a内に導光板の端部を装着している。この様な発光ダイ オードを発光源としたバック照明装置は高周波電源を必要とするエレクトロルミ ネッセンス（ＥＬ）を発光源とした場合に比べて駆動電源回路を簡素化できる利 点がある。 As shown in FIG. 8, a conventional back lighting device used for a liquid crystal display has an outer casing 12 fixed to an elongated printed circuit board 11 to which a light emitting diode chip 13 is fixed, and an opening 12a of the outer casing 12. The end of the light guide plate is installed inside. A back lighting device using such a light emitting diode as a light emitting source has an advantage that the driving power supply circuit can be simplified as compared with the case of using an electroluminescence (EL) requiring a high frequency power source as a light emitting source.
【０００３】[0003]
前記従来の構造では、別体の外囲体１２を使用するので、発光源の横幅が大き くなり、装置の薄型化が困難であった。その上、プリント基板１１に対して外囲 体１２と導光板を所定の位置に位置決めする作業が煩雑なものであった。 In the above-mentioned conventional structure, since the separate envelope 12 is used, the lateral width of the light emitting source becomes large and it is difficult to make the device thin. In addition, the work of positioning the outer casing 12 and the light guide plate at predetermined positions with respect to the printed circuit board 11 is complicated.
【０００４】 本考案の目的は液晶表示のバックライト等に最適な薄型のバック照明装置を提 供することを目的とする。An object of the present invention is to provide a thin back lighting device which is optimal for a backlight of a liquid crystal display or the like.
【０００５】[0005]
本考案によるバック照明装置は、プリント基板に固着された複数の発光素子を 備えた発光素子組立体と、発光素子組立体に対向する側面を有する導光板とを備 えている。複数の発光素子は互いに一定間隔離間して且つプリント基板から突出 して形成された導光性の樹脂封止体により封止されている。導光板の側面には樹 脂封止体の形状に対応する凹部が形成されている。この凹部内に樹脂封止体を配 置することにより発光素子組立体が導光板の側面に配設される。 A back lighting device according to the present invention includes a light emitting device assembly including a plurality of light emitting devices fixed to a printed circuit board, and a light guide plate having a side surface facing the light emitting device assembly. The plurality of light emitting elements are sealed with a light guide resin encapsulant formed so as to be spaced apart from each other by a predetermined distance and project from the printed circuit board. A concave portion corresponding to the shape of the resin sealing body is formed on the side surface of the light guide plate. The light emitting element assembly is arranged on the side surface of the light guide plate by disposing the resin sealing body in the recess.
【０００６】 発光素子組立体の樹脂封止体の一方の側面には、導光板の一方の主面の略全面 を被覆する光反射性フィルムが貼着されている。発光素子組立体の樹脂封止体の 他方の側面には、前記導光板の他方の主面の縁部側を被覆する帯状の光反射性フ ィルムが貼着されている。樹脂封止体はプリント基板に対して傾斜する一対の傾 斜面を備えている。導光板の側面には前記樹脂封止体の形状に対して相補的傾斜 面を有する凹部が形成されている。本考案の他の実施例では、導光板の他方の主 面に対向して液晶表示装置が配置され、液晶表示装置から導出された基板は導光 板の一方の主面に対向して配置されている。導光板の一方の主面側における基板 上には電子部品が固着されている。On one side surface of the resin encapsulant of the light emitting element assembly, a light reflecting film that covers substantially the entire one main surface of the light guide plate is attached. On the other side surface of the resin sealing body of the light emitting element assembly, a strip-shaped light reflecting film that covers the edge side of the other main surface of the light guide plate is attached. The resin encapsulant has a pair of inclined surfaces that incline with respect to the printed circuit board. A recess having an inclined surface complementary to the shape of the resin sealing body is formed on the side surface of the light guide plate. According to another embodiment of the present invention, the liquid crystal display device is arranged facing the other main surface of the light guide plate, and the substrate led out from the liquid crystal display device is arranged opposite one main surface of the light guide plate. ing. Electronic components are fixed on the substrate on one main surface side of the light guide plate.
【０００７】[0007]
導光性を有する樹脂封止体は導光板の凹部に配設されるので、発光素子組立体 と導光板との位置決めが良好に行える。また、樹脂封止体は導光板の一部として 機能すると共に発光素子の外囲体としても機能するから、発光素子組立体の幅長 を小さくできる。結果として、薄型化したバック照明装置を提供できる。更に、 レンズ部となる複数の樹脂封止体が互いに一定間隔離間してプリント基板に形成 されているので、プリント基板と樹脂封止体との線膨張係数差に起因する発光素 子組立体のソリを防止することができる。 Since the resin encapsulant having a light guiding property is disposed in the concave portion of the light guide plate, the light emitting element assembly and the light guide plate can be properly positioned. Further, since the resin sealing body functions as a part of the light guide plate and also as an outer enclosure of the light emitting element, the width of the light emitting element assembly can be reduced. As a result, a thin back lighting device can be provided. Further, since a plurality of resin encapsulants, which will be the lens portion, are formed on the printed circuit board with a certain distance from each other, it is possible to reduce the light emitting element assembly due to the difference in linear expansion coefficient between the printed circuit board and the resin encapsulant. The warp can be prevented.
【０００８】[0008]
以下、本考案の実施例を図１〜図７について説明する。 Hereinafter, an embodiment of the present invention will be described with reference to FIGS.
【０００９】 本考案によるバック照明装置は発光素子組立体２０と、アクリル樹脂又はポリ カーボネート樹脂から成る導光板２１とを備えている。発光素子組立体２０はプ リント基板２２に固着された複数の発光ダイオードチップ２３（発光素子）を備 えている。複数の発光ダイオード２３の各々は導光性のエポキシ樹脂から成る樹 脂封止体２４により封止され、各樹脂封止体２４は互いに一定間隔離間してプリ ント基板２２から突出している。各樹脂封止体２４はプリント基板２２に対して 傾斜する一対の傾斜面２４a、２４bと、一対の傾斜面２４a、２４bの間に形成さ れた平坦部２４cとを備えた略台形に形成されている。導光板２１は図２及び図 ３に示すようにシボ加工（艶消し加工）され且つ光反射性フィルム２５が全面に 貼着された一方の主面２１aと、帯状の光反射性フィルム２６が周縁部に貼着さ れ且つ鏡面仕上げされた他方の主面２１bと、発光素子組立体２０に対向する側 面２１cを備えている。導光板２１の側面２１cは樹脂封止体２４の形状に対して 相補的傾斜面２１d、２１e及び相補的傾斜面２１d、２１eの間に形成された平坦 面２１gを有する凹部２１fが形成されている。樹脂封止体２４は凹部２１f内に 配置されたとき、導光板２１の延長部分を構成する。樹脂封止体２４は接着剤が 貼着されたポリエステルから成る白色の光反射性フィルム２５、２６によりその 両側面（導光板２１の両端を延長した平面に位置する面）が被覆された状態で導 光板２１に固着される。The back lighting device according to the present invention comprises a light emitting element assembly 20 and a light guide plate 21 made of acrylic resin or polycarbonate resin. The light emitting device assembly 20 includes a plurality of light emitting diode chips 23 (light emitting devices) fixed to a print substrate 22. Each of the plurality of light emitting diodes 23 is sealed by a resin sealing body 24 made of a light-guiding epoxy resin, and the resin sealing bodies 24 are spaced from each other by a predetermined distance and protrude from the print substrate 22. Each resin sealing body 24 is formed in a substantially trapezoidal shape including a pair of inclined surfaces 24a and 24b inclined with respect to the printed circuit board 22 and a flat portion 24c formed between the pair of inclined surfaces 24a and 24b. ing. As shown in FIGS. 2 and 3, the light guide plate 21 is textured (mattized) and has one main surface 21a to which a light-reflecting film 25 is adhered on the entire surface and a strip-shaped light-reflecting film 26 at the periphery. It is provided with the other main surface 21b attached to the part and having a mirror finish, and a side surface 21c facing the light emitting element assembly 20. The side surface 21c of the light guide plate 21 has a concave portion 21f having a flat surface 21g formed between the complementary inclined surfaces 21d and 21e and the complementary inclined surfaces 21d and 21e with respect to the shape of the resin sealing body 24. .. The resin encapsulant 24 constitutes an extension of the light guide plate 21 when it is placed in the recess 21f. The resin encapsulant 24 is covered with white light-reflecting films 25 and 26 made of polyester to which an adhesive is adhered on both side surfaces (the surfaces located on the planes extending from both ends of the light guide plate 21). It is fixed to the light guide plate 21.
【００１０】 図示しないが、プリント基板２２の裏面の長手方向の両端には一対の電極（ア ノード電極とカソード電極）が形成されている。図４及び図５は複数の発光ダイ オードチップ２３の接続状態を示す。Although not shown, a pair of electrodes (anode electrode and cathode electrode) are formed on both ends of the back surface of the printed board 22 in the longitudinal direction. 4 and 5 show a connection state of a plurality of light emitting diode chips 23.
【００１１】 上記の構成によれば、樹脂封止体２４が導光板２１の凹部２１fに配設される ので、発光素子組立体２０と導光板２１との位置決めが容易に且つ正確に行える 。また、樹脂封止体２４が発光ダイオードチップ２３の外囲体として機能し、別 体の外囲体が不要となるから発光素子組立体２０が薄型化している。結果として 、厚さ約１.１mmの薄型のバック照明装置が実現されている。更に、レンズ部と なる複数の樹脂封止体２４が互いに一定間隔離間してプリント基板２２に形成さ れているので、プリント基板２２と樹脂封止体２４との線膨張係数差に起因する 発光素子組立体２０の反りを防止することができる。また、樹脂封止体２４の両 側面は光反射性のフィルム２５、２６で被覆されているので、発光ダイオードチ ップ２３から放射された光を導光板２１の中央側まで減衰量を少なくして伝達で きる。したがって、導光板２１の他方の主面２１bの中央側からも十分な光量で 光を放射することができる。According to the above configuration, since the resin sealing body 24 is disposed in the recess 21f of the light guide plate 21, the light emitting element assembly 20 and the light guide plate 21 can be positioned easily and accurately. Further, since the resin encapsulant 24 functions as an outer enclosure of the light emitting diode chip 23 and a separate outer enclosure is unnecessary, the light emitting element assembly 20 is thin. As a result, a thin back lighting device having a thickness of about 1.1 mm has been realized. Further, since the plurality of resin sealing bodies 24, which will be the lens portion, are formed on the printed circuit board 22 with a certain distance from each other, the light emission caused by the difference in the linear expansion coefficient between the printed circuit board 22 and the resin sealing body 24. The warp of the element assembly 20 can be prevented. Also, since both sides of the resin encapsulant 24 are covered with the light-reflecting films 25 and 26, the light emitted from the light-emitting diode chip 23 is attenuated to the central side of the light guide plate 21. Can be transmitted. Therefore, a sufficient amount of light can be emitted from the center side of the other main surface 21b of the light guide plate 21.
【００１２】 結果として、他方の主面２１bのほぼ全面から均一な光量で光を放射すること が可能となり、薄型化したにもかかわらずバックライトとして優れた性能を示す 。As a result, it is possible to emit light with a uniform light amount from almost the entire surface of the other main surface 21b, and an excellent performance as a backlight is exhibited despite the reduction in thickness.
【００１３】 本考案の実施態様は上記の実施例に限定されず、変更が可能である。例えば、 図５〜図７は本考案の他の実施例を示す。図５に示すように、導光板２１の側面 ２１cから複数の突出部２１hを形成し、これらの突出部２１hに合せて発光素子 組立体２０を装着することができる。敷衍すれば、導光板２１及びプリント基板 ２２の一方に切欠部又は孔部を設け、この切欠部又は孔部に嵌合する形状又は突 起を導光板２１及びプリント基板２２の他方に形成することにより、組立時の誤 装着を防止し、プリント基板２２の導光板２１に対する装着方向を決定すること ができる。The embodiment of the present invention is not limited to the above embodiment, and can be modified. For example, FIGS. 5 to 7 show another embodiment of the present invention. As shown in FIG. 5, a plurality of protrusions 21h can be formed from the side surface 21c of the light guide plate 21, and the light emitting element assembly 20 can be mounted according to these protrusions 21h. If laid out, one of the light guide plate 21 and the printed circuit board 22 should be provided with a notch or a hole, and the shape or protrusion fitted to the notch or the hole should be formed on the other of the light guide plate 21 and the printed circuit board 22. As a result, it is possible to prevent erroneous mounting during assembly and determine the mounting direction of the printed circuit board 22 with respect to the light guide plate 21.
【００１４】 また、図６及び図７に示すように、導光板２１の他方の主面２１bに対向して 液晶表示装置２７が配置され、液晶表示装置２７から導出されたフレキシブルプ リント基板２８を導光板２１の一方の主面２１aに対向して配置することができ る。導光板２１の一方の主面２１a側のフレキシブルプリント基板２８上にＩＣ 等の電子部品２９が固着されているときは導光板２１の一部又はプリント基板２ ２を導光板２１の裏面よりも突出させて一対の脚部３０とするのがよい。脚部３ ０を設けることにより導光板２１の裏面側にフレキシブルプリント基板２８を巻 き込んで、ここに電子部品２９を収容して小型化をはかることができる。Further, as shown in FIGS. 6 and 7, the liquid crystal display device 27 is arranged so as to face the other main surface 21 b of the light guide plate 21, and the flexible print substrate 28 led out from the liquid crystal display device 27 is disposed. It can be arranged so as to face one main surface 21a of the light guide plate 21. When an electronic component 29 such as an IC is fixed on the flexible printed board 28 on the one main surface 21a side of the light guide plate 21, a part of the light guide plate 21 or the printed board 22 is projected from the back surface of the light guide plate 21. It is good to make it a pair of legs 30. By providing the legs 30, the flexible printed circuit board 28 can be wound around the back surface of the light guide plate 21, and the electronic component 29 can be housed therein to reduce the size.
【００１５】 更に、封止樹脂と導光板２１の側面２１cとの間に可塑性且つ導光性の樹脂を 充填してもよい。このような樹脂を充填することにより樹脂封止体２４と導光板 ２１間の光伝達効率を一層向上することが可能となる。Furthermore, a plastic and light guiding resin may be filled between the sealing resin and the side surface 21c of the light guiding plate 21. By filling with such a resin, the light transmission efficiency between the resin sealing body 24 and the light guide plate 21 can be further improved.
【００１６】 プリント基板２２の裏面にはレジスト等から成るカソードマークを付けること ができる。A cathode mark made of resist or the like can be attached to the back surface of the printed circuit board 22.
【００１７】 また、導光板２１の他方の主面から光がより均一に放射されるように例えば中 央側で溝を深く又は密に両側で溝を浅く又は粗にしたシボ加工を導光板２１に行 ってもよい。Further, for example, the light guide plate 21 is embossed so that the grooves are deep or dense on the center side and shallow or rough on both sides so that the light is more uniformly radiated from the other main surface of the light guide plate 21. You can go to
【００１８】[0018]
本考案では、大幅な薄型化が実現されたバック照明装置が得られる。 According to the present invention, a back lighting device having a significantly reduced thickness can be obtained.
【図１】一方の発光素子組立体等を導光板から除去した
状態を示す本考案によるバック照明装置の正面図FIG. 1 is a front view of a back lighting device according to the present invention showing a state where one light emitting element assembly and the like are removed from a light guide plate.
【図２】図１の平面図FIG. 2 is a plan view of FIG.
【図３】発光素子組立体から導光板に伝達される光の光
路を示す断面図FIG. 3 is a cross-sectional view showing an optical path of light transmitted from the light emitting element assembly to the light guide plate.
【図４】発光素子の接続を示す回路図FIG. 4 is a circuit diagram showing connection of light emitting elements.
【図５】本考案の他の実施例を示すバック照明装置の正
面図FIG. 5 is a front view of a back lighting device according to another embodiment of the present invention.
【図６】本考案の更に別の実施例を示す平面図FIG. 6 is a plan view showing still another embodiment of the present invention.
【図７】図６のＩ−Ｉ線に沿う断面図FIG. 7 is a sectional view taken along line I-I of FIG.
【図８】従来のバック照明装置の一部を示す分解斜視図FIG. 8 is an exploded perspective view showing a part of a conventional back lighting device.
２０・・発光素子組立体、２１・・導光板、２１a・・
一方の主面、２１b・・他方の主面、２１c・・側面、２
２・・プリント基板、２３・・発光ダイオードチップ
（発光素子）、２４・・樹脂封止体、２４a、２４b・・
傾斜面、２４c・・平坦部、２４d・・相補的傾斜面、２
４e・・凹部、２５・・光反射性フィルム、２５a・・表
面、２６・・光反射性フィルム、20..Light emitting element assembly, 21 .. Light guide plate, 21a ..
One main surface, 21b ... the other main surface, 21c ... Side surface, 2
2 ... Printed circuit board, 23 ... Light emitting diode chip (light emitting element), 24 ... Resin encapsulation, 24a, 24b ...
Inclined surface, 24c..flat part, 24d..Complementary inclined surface, 2
4e ... Concave, 25 ... Light-reflecting film, 25a ... Surface, 26 ... Light-reflecting film,
Claims (4)
を備えた発光素子組立体と、該発光素子組立体に対向す
る側面を有する導光板とを備えたバック照明装置におい
て、 前記複数の発光素子は互いに一定間隔離間して且つ前記
プリント基板から突出して形成された導光性の樹脂封止
体により封止され、前記導光板の側面には前記樹脂封止
体の形状に対応する凹部が形成され、該凹部内に前記樹
脂封止体を配置することにより前記発光素子組立体を導
光板の側面に配設したことを特徴とするバック照明装
置。1. A back lighting device comprising: a light emitting element assembly having a plurality of light emitting elements fixed to a printed circuit board; and a light guide plate having a side surface facing the light emitting element assembly. The elements are sealed with a light guide resin encapsulant formed so as to be spaced apart from each other by a certain distance and protruding from the printed circuit board, and a concave portion corresponding to the shape of the resin encapsulant is formed on a side surface of the light guide plate. A back lighting device, wherein the light emitting element assembly is formed on the side surface of the light guide plate by arranging the resin sealing body in the recess.
側面には、前記導光板の一方の主面の略全面を被覆する
光反射性フィルムが貼着されており、前記発光素子組立
体の樹脂封止体の他方の側面には、前記導光板の他方の
主面の縁部側を被覆する帯状の光反射性フィルムが貼着
されている「請求項１」に記載のバック照明装置。2. A light-reflecting film that covers substantially the entire one main surface of the light guide plate is attached to one side surface of a resin sealing body of the light emitting element assembly. The back of claim 1, wherein a strip-shaped light-reflecting film that covers the edge side of the other main surface of the light guide plate is attached to the other side surface of the resin sealing body of the assembly. Lighting equipment.
て傾斜する一対の傾斜面を備え、前記導光板の側面には
前記樹脂封止体の形状に対して相補的傾斜面を有する凹
部が形成されている「請求項１」に記載のバック照明装
置。3. The resin encapsulant has a pair of inclined surfaces that incline with respect to the printed circuit board, and the side surface of the light guide plate has a recess having an inclined surface complementary to the shape of the resin encapsulant. The back lighting device according to claim 1, wherein the back lighting device is formed.
示装置が配置され、該液晶表示装置から導出された基板
は前記導光板の一方の主面に対向して配置され、且つ前
記導光板の一方の主面側において前記基板上に電子部品
が固着された「請求項１」に記載のバック照明装置。4. A liquid crystal display device is arranged to face the other main surface of the light guide plate, and a substrate led out from the liquid crystal display device is arranged to face one main surface of the light guide plate. The back lighting device according to claim 1, wherein an electronic component is fixed on the substrate on one main surface side of the light guide plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991087877U JP2578529Y2 (en) | 1991-10-25 | 1991-10-25 | Back lighting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991087877U JP2578529Y2 (en) | 1991-10-25 | 1991-10-25 | Back lighting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0538627U true JPH0538627U (en) | 1993-05-25 |
| JP2578529Y2 JP2578529Y2 (en) | 1998-08-13 |
Family
ID=13927096
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1991087877U Expired - Fee Related JP2578529Y2 (en) | 1991-10-25 | 1991-10-25 | Back lighting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2578529Y2 (en) |
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| JP2002169034A (en) * | 2000-12-01 | 2002-06-14 | Nippon Leiz Co Ltd | Light guide plate and planar illuminator |
| JP2002229022A (en) * | 2001-02-02 | 2002-08-14 | Sony Corp | Liquid crystal display device and backlight device for liquid crystal display element |
| JP2004221619A (en) * | 2004-04-30 | 2004-08-05 | Sanken Electric Co Ltd | Semiconductor light emitting device |
| JP2004221620A (en) * | 2004-04-30 | 2004-08-05 | Sanken Electric Co Ltd | Semiconductor light emitting device |
| JP2004221621A (en) * | 2004-04-30 | 2004-08-05 | Sanken Electric Co Ltd | Process for fabricating semiconductor light emitting device |
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| JP2009510742A (en) * | 2005-09-30 | 2009-03-12 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | LIGHTING UNIT WITH LIGHT EMITTING DIODE CHIP AND LIGHT GUIDE, LIGHTING UNIT MANUFACTURING METHOD, AND LCD DISPLAY |
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| JP2005039129A (en) * | 2003-07-17 | 2005-02-10 | Sony Corp | Light source device and its manufacturing method, surface light emitting device and image information read device |
| WO2005031883A1 (en) * | 2003-09-29 | 2005-04-07 | Matsushita Electric Industrial Co., Ltd. | Linear light source and production method therefor and surface emission device |
| CN100466308C (en) * | 2003-09-29 | 2009-03-04 | 松下电器产业株式会社 | Linear light source and production method therefor and surface emission device |
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| KR100732267B1 (en) * | 2003-09-29 | 2007-06-25 | 마츠시타 덴끼 산교 가부시키가이샤 | Linear light source and production method therefor and surface emission device |
| JP2004221620A (en) * | 2004-04-30 | 2004-08-05 | Sanken Electric Co Ltd | Semiconductor light emitting device |
| JP2004235668A (en) * | 2004-04-30 | 2004-08-19 | Sanken Electric Co Ltd | Semiconductor light emitting device |
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| JP2008053571A (en) * | 2006-08-28 | 2008-03-06 | Nichia Chem Ind Ltd | Light emitting device, and planar light emitting device using same |
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