JP2006011242A - Liquid crystal display device - Google Patents

Liquid crystal display device Download PDF

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Publication number
JP2006011242A
JP2006011242A JP2004191226A JP2004191226A JP2006011242A JP 2006011242 A JP2006011242 A JP 2006011242A JP 2004191226 A JP2004191226 A JP 2004191226A JP 2004191226 A JP2004191226 A JP 2004191226A JP 2006011242 A JP2006011242 A JP 2006011242A
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Japan
Prior art keywords
liquid crystal
insulating substrate
crystal display
substrate
light source
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Pending
Application number
JP2004191226A
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Japanese (ja)
Inventor
Hisao Kondo
久雄 近藤
Original Assignee
Kyocera Corp
京セラ株式会社
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Application filed by Kyocera Corp, 京セラ株式会社 filed Critical Kyocera Corp
Priority to JP2004191226A priority Critical patent/JP2006011242A/en
Priority claimed from TW094121818A external-priority patent/TWI366038B/en
Publication of JP2006011242A publication Critical patent/JP2006011242A/en
Application status is Pending legal-status Critical

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

【Task】
Provided is a liquid crystal display device having an LED backlight capable of suppressing a decrease in light emission efficiency of an LED, preventing damage to the LED, and performing a bright and long-life liquid crystal display.
[Solution]
The liquid crystal display device of the present invention includes a liquid crystal display panel 1 and a backlight including a light guide plate 4 and a light source body disposed on an end face of the light guide plate 4. The light source body includes an insulating substrate 8, a plurality of light emitting diode modules 7 mounted on one main surface of the insulating substrate 8 and accommodating the light emitting diode chip 7a, and a heat sink disposed on the other main surface side of the insulating substrate 8. The substrate 10 and the other main surface (back surface) of the insulating substrate 8 and the heat dissipating sheet 9 having an L-shaped cross section in contact with the lower surface perpendicular to the other main surface.
[Selection] Figure 1

Description

  The present invention relates to a liquid crystal display device including a liquid crystal display panel and a backlight, and more particularly to a liquid crystal display device using a light emitting diode (LED) as a light source of the backlight.

  2. Description of the Related Art Conventionally, among transmissive and transflective liquid crystal display devices among liquid crystal display device display methods, a liquid crystal display panel and a backlight that supplies light transmitted to the liquid crystal display panel are arranged. In general, a backlight includes a light source and a light guide plate, and a small fluorescent tube called CCFL (cold cathode tube) is used as the light source. In addition, the main surface (front surface) of the light guide plate on the side of the liquid crystal display panel is opposed to correspond to the display area of the liquid crystal display panel, and light is transmitted to the main surface (back surface) opposite to the main surface. A diffusion part that diffuses and reflects is formed on the surface side. The CCFL light source is disposed on the end face of the light guide plate, and the CCFL light incident from the end face of the light guide plate is transmitted into the light guide plate, diffused and reflected on the back side of the light guide plate, and directed from the light guide plate to the liquid crystal display panel. And is converted from a linear light source to a uniform planar light source and used as a light source for a liquid crystal display device.

  However, in this CCFL light source, Hg (mercury) is sealed in a discharge tube, and ultraviolet rays emitted from mercury excited by discharge strike the phosphor on the CCFL tube wall and convert it into visible light. For this reason, in consideration of the environment, the use of an alternative light source is required by suppressing the use of harmful mercury. Further, in order to light the CCFL, a high-voltage high-frequency lighting circuit is required, and high-frequency noise is generated. Thus, there is a problem that not only a countermeasure against noise is separately required but also low-temperature lighting is difficult.

  Meanwhile, as a new light source, a backlight using a light emitting diode module (LED light source) containing a light emitting diode chip (LED) having a feature of a point light source as a light source has been developed. Backlights using this LED light source (LED backlights) are becoming widespread as backlights for liquid crystal display panels due to lower prices, improved luminous efficiency, and environmental regulations. At the same time, with the increase in brightness and size of liquid crystal display devices (increase in display area), there is an increasing demand for a plurality of LED light sources.

 Therefore, in order to obtain an LED backlight for use in high-brightness and large-sized liquid crystal display panels, the LED light source, which is a point light source, is converted into a planar light source that emits light uniformly (converted into uniform light on the light exit surface of the light guide plate). For example, it is necessary to control the material and structure of the diffusion portion on the back surface of the light guide plate and to arrange the LED light source at an optimal position in accordance with the directivity of the LED light source.

The biggest problem here is that the LED light source and its surrounding temperature rise due to the heat generated by the LED light source, thereby reducing the light emission efficiency and life of the LED light source. Although the LED light source has been improved in luminous efficiency due to recent improvements, the luminous efficiency is about 10% at present, and the remaining 90% is released as heat. That is, in a backlight using an LED as a light source, the generated heat is stored in the LED and the substrate on which the LED is mounted, and as the temperature of the LED and its surroundings rises, the luminous efficiency of the LED itself decreases. Regarding the lifetime, for example, estimated lifetime data (luminance half-life) at a forward current IF = 20 mA of a top-view LED (NSCW455) manufactured by Nichia Chemical is shown in FIG. From the figure, it can be seen that the lifetime is about 12000 hours at an ambient temperature of 25 ° C., whereas the lifetime is only about 5500 hours at 50 ° C., and the lifetime decreases as the ambient temperature of the LED increases. Furthermore, the heat generated in the LED may cause damage to the LED and the wiring of the insulating substrate on which the LED is mounted. In addition, if the number of LEDs mounted is increased to increase the brightness of the backlight, the amount of heat generation increases, so this heat generation cannot be ignored further.

As a conventional technique related to heat generated in an LED, for example, as disclosed in Japanese Patent Application Laid-Open No. 2003-281924, a light emitting diode generally has a disadvantage that the luminous efficiency decreases when the junction temperature rises. When the junction temperature increases by 1 ° C., the luminous efficiency may decrease by about 1%. In order to suppress the temperature rise of the light emitting diode, the light emitting diode is mounted on one side of the wiring board, which is a linear light source substrate having a power supply terminal, and covers the electrode of the insulating substrate disposed in the box-shaped metal case. 2. Description of the Related Art There is known a radiation device having a heat radiation structure in which a conductive adhesive is filled in a box-shaped metal case except for a light emitting element light emitting surface on a heat radiation insulating resin layer provided.
JP2003-281924

  However, the LED backlight used in the liquid crystal display device and disposed on the back side of the liquid crystal display panel is provided with a metal wiring such as copper on one side of a flexible substrate made of polyimide or polyester or an insulating substrate made of glass epoxy, The LED light source is mounted on the wiring, and the back surface of the insulating substrate (the back surface of the surface on which the LED light source is mounted) is placed in surface contact with the housing or heat sink substrate of the liquid crystal display device, or double-sided adhesive tape is fixed. It was.

However, in the surface contact between the back surface of the insulating substrate and the housing of the liquid crystal display device or the heat sink substrate, the surface contact is insufficient due to fine irregularities on the surface, and an air layer with extremely small heat conduction is interposed. It is supposed to be. Also, in the case of fixing double-sided adhesive tape, since the thermal conductivity of double-sided adhesive tape is small, heat conduction from the insulating substrate to the heat sink substrate is insufficient, and heat is stored in the LED light source or its insulating substrate. Due to the rise, there arises a problem that the light emission efficiency of the LED light source is lowered, and further, the light emitting diode chip is damaged in a short time.

In addition, a technique for suppressing the temperature rise of the LED light source by filling the mounting substrate surface on which the LED light source is mounted with a thermally conductive resin has been disclosed. Insufficient heat conduction, heat is stored in the insulating substrate, and the LED light source temperature rises, causing a problem that the light emission efficiency of the LED light source is still reduced. There is a problem that the number of man-hours for filling and curing without biting is large and the cost is increased.

The present invention has been devised in view of the above-described problems, and an object of the present invention is to provide an insulating substrate and a liquid crystal display device on which an LED light source is mounted with a simple and inexpensive structure in a liquid crystal display device having an LED backlight. The surface contact heat conduction with the housing or heat sink substrate is improved, the heat generated by the LED light source is efficiently conducted to the heat sink substrate, and the heat sink substrate connected to the entire back surface of the liquid crystal display panel is efficiently dissipated. By reducing the heat storage of the insulating substrate on which the LED light source is mounted and reducing the temperature rise of the LED light source, the LED light source can be prevented from lowering the light emission efficiency, and the light emitting diode chip can be prevented from being damaged. An object of the present invention is to provide a liquid crystal display device having a light emitting diode element capable of liquid crystal display.

  The liquid crystal display device of the present invention includes a liquid crystal display panel in which a liquid crystal is interposed between a pair of substrates having a display electrode and an alignment film to form a display region with a plurality of pixel regions, and one substrate of the liquid crystal display panel In a liquid crystal display device comprising a light guide plate arranged outside and a light guide plate arranged so as to correspond to the display region, and a light source body arranged on an end surface of the light guide plate, the light source body is: An insulating substrate, a light emitting diode module mounted in plural on one main surface of the insulating substrate and housing a light emitting diode chip, a heat sink substrate disposed on the other main surface side of the insulating substrate, and the other main surface of the insulating substrate And a heat dissipating sheet in contact with the lower surface of the insulating substrate perpendicular to the other main surface.

  Further, the heat dissipation sheet is characterized in that it is pressed and fixed between the other main surface of the insulating substrate and the heat sink substrate.

  The heat sink substrate has an L-shaped bent section extending from the other main surface of the insulating substrate to the back surface side of the light guide plate, and is disposed on the lower surface of the insulating substrate while extending from the insulating substrate to the light guide plate. It is characterized by being in pressure contact with.

  Further, at least an upper surface and a lower surface of the insulating substrate that is perpendicular to the other main surface of the insulating substrate are polished and cut.

  In the liquid crystal display device of the present invention, a rubber elastic heat conductive sheet having a high thermal conductivity is pressed and sandwiched between an insulating substrate on which an LED light source that is a light emitting diode module is mounted and a heat sink substrate. Corresponds to minute irregularities on the back surface and heat sink substrate surface, the heat conduction sheet is familiar, and the air layer with extremely low heat conduction can be eliminated, allowing efficient heat conduction from the insulating substrate to the heat sink substrate, and liquid crystal display It is possible to efficiently dissipate and dissipate heat through a heat sink substrate or casing provided in the entire back surface area of the apparatus. Further, a heat radiation sheet is provided on the end surface (lower surface) side that is perpendicular to the back surface of the insulating substrate. Thereby, heat radiation from the back surface side of the insulating substrate and heat radiation from the lower surface side of the insulating substrate can be performed. This is, for example, a heat sink substrate formed in an L-shaped cross section corresponding to the back and bottom surfaces of the insulating substrate, or a part of the housing of the liquid crystal display device that supports and fixes the insulating substrate from the bottom surface side of the insulating substrate. The heat accumulated in the insulating substrate can be effectively transmitted from this surface to the heat sink substrate or the like through the sheet. In other words, by reducing the heat storage of the insulating substrate on which the LED light source is mounted and reducing the temperature rise of the LED light source, the LED light source can be prevented from lowering the luminous efficiency, and the LED light source can be prevented from being damaged, and the bright long-life liquid crystal display It is possible to provide a liquid crystal display device having an LED backlight that can be used.

  Hereinafter, the liquid crystal display device of the present invention will be described in detail with reference to the drawings.

1 is a schematic cross-sectional view of a liquid crystal display device of the present invention, FIG. 2 is a perspective view of an external appearance seen from the display surface of the liquid crystal display device, FIG. 3 is a cross-sectional structure of a liquid crystal display panel, and FIG. A perspective view of an insulating substrate on which an LED light source is mounted is shown, and FIG. 5 is a perspective view of an L-shaped heat radiation sheet. FIG. 6 is a schematic cross-sectional view illustrating an LED light source.

  The liquid crystal display device of the present invention mainly comprises a liquid crystal display panel 1, an LED backlight, and housings 6 and 10 of the liquid crystal display device. Note that the housing 6 in the figure is an upper housing that mainly protects the liquid crystal display panel 1, and the housing 10 mainly protects the LED backlight and includes a heat sink substrate that functions as a heat sink that releases heat to the outside. It also serves.

  The liquid crystal display panel 1 is surrounded by a seal portion 14 between a lower transparent substrate 11 which is the other substrate shown in FIG. 3, an upper transparent substrate 12 which is one substrate, and both transparent substrates 11 and 12. A liquid crystal layer 13 is disposed. Further, for example, a display electrode and an alignment film are formed on the inner surface of the lower transparent substrate 11, and a display electrode and an alignment film are also formed on the inner surface of the upper transparent substrate 12. In FIG. 3, the structure on the inner surface of the lower transparent substrate is simply indicated by reference numeral 15, and the structure of the upper transparent substrate is simply indicated by reference numeral 16.

  The display electrode constituting the internal structure of the lower transparent substrate 11 and the display electrode constituting the internal structure 16 of the upper transparent substrate 12 form a display pixel region arranged in a matrix form facing each other.

  One pixel constituting each display pixel area is a translucent liquid crystal display device in which, for example, in a transmissive liquid crystal display device, the display electrodes are all formed of transparent electrodes and serve as a light transmissive portion that can transmit the light of the backlight. In the display device, a light reflecting portion, part of which is made of a reflective metal film, and a light transmitting portion, which is partly capable of transmitting light from the backlight, are provided side by side. That is, in this transflective liquid crystal display device, external light incident from the display surface side is reflected by the light reflecting portion of the pixel area and returned to the display surface side, and the backlight light is transmitted. The light is given to the display surface side. As a result, when the external light is strong, the display is performed in the reflective mode, and when the external light is weak, the display is performed in the transmissive mode.

  Further, although not shown in the drawing, a polarizing plate, a retardation plate, and, if necessary, a scattering plate are arranged on the outer surface of the lower transparent substrate 11 and the outer surface of the upper transparent substrate 12.

  In order to achieve color display, a color filter corresponding to each pixel region of either the internal structure 15 of the lower transparent substrate 11 or the internal structure 16 of the upper transparent substrate 12 may be formed.

  Further, depending on the display driving method, switching means may be formed in each pixel region of the internal structure 15 of the lower transparent substrate 11 to control display for each pixel region.

  In addition, in one of the upper transparent substrate 12 and the lower transparent substrate 11, for example, a substrate having a large shape, for example, the outer peripheral region of the lower transparent substrate 11, display electrodes and switching among the inner surface structures 15 of the lower transparent substrate 11. A wiring pattern connected to the element may be provided and an input terminal connected to a driving circuit for supplying a predetermined signal and a predetermined voltage to the wiring pattern or an external driving circuit may be provided. Note that the substrate on the side where the wiring pattern is not formed, for example, the display electrode of the upper transparent substrate 12 is connected to the wiring pattern on the lower transparent substrate side via a conductive filler disposed in the space between the substrates 11 and 12. It doesn't matter.

  Examples of the lower transparent substrate 11 and the upper transparent substrate 12 include glass and translucent plastic. The display electrodes constituting the internal structures 15 and 16 are made of, for example, ITO or tin oxide which is a transparent conductive material, and the reflective metal film constituting the reflecting portion is made of aluminum or titanium. . The alignment film is made of a rubbed polyimide resin. In addition, when forming color filters, dyes or pigments are added to the resin to form red, green, and blue color filters for each pixel area, and between the filters and around the pixel area for light shielding purposes. A black resin may be used.

  The lower transparent substrate 11 and the upper transparent substrate 12 are bonded and pressure-bonded via the seal portion 14, and a liquid crystal material made of nematic liquid crystal or the like is injected from a part of the opening of the seal portion 14. Seal the inlet. At the time of bonding, both display electrodes arranged on the transparent substrates 11 and 12 are made to be orthogonal to each other, and the intersection of the display electrodes becomes each pixel region, and this pixel region is aggregated to become a display region.

  In this way, the liquid crystal display panel 1 is configured. An LED backlight is disposed outside the lower substrate 11 which is the other transparent substrate of the liquid crystal display panel 1.

  As shown in FIG. 1, the LED backlight includes an LED light source 7, a light guide plate 4, a lens sheet 2, a diffusion sheet 3, a reflection sheet 5, an insulating substrate 8, a heat dissipation sheet 9, and a heat sink substrate 10.

  Then, one main surface (surface from which light is emitted) of the light guide plate 4 is disposed so as to face the display area of the liquid crystal display panel 1.

  The light guide plate 4 constituting the LED backlight is made of a transparent resin substrate, and a light scattering member may be contained in the resin component. On the other main surface of the light guide plate 4, a reflection sheet 5 for diffusing and reflecting light is disposed. The reflection sheet 5 is for radiating light propagating through the light guide plate 4 to one main surface side. Instead of the reflection sheet 5, a groove for diffusing and reflecting directly may be formed on the other main surface, or a coating film having a diffusing and reflecting function may be formed on the other main surface. The reflection sheet 5 may also be formed on three end surfaces of the four end surfaces of the light guide plate 4 except for the end surface on which the LED light source 7 is disposed.

  The insulating substrate 8 is made of a glass cloth base epoxy resin substrate or a ceramic substrate, and an LED module (LED light source) 7 is mounted thereon. On the mounting surface of the LED light source 7, metal wiring for supplying a predetermined driving current to the LED light source 7 is formed. A plurality of LED light sources 7 are mounted on the metal wiring at a predetermined interval via a conductive member.

  As shown in the cross-sectional view of FIG. 6, the LED light source 7 includes an LED chip 7a having a light emitting portion made of a semiconductor material, an anode electrode, and a cathode electrode, and a container 7b made of a heat-resistant resin material or a ceramic material. Yes. A mortar-shaped cavity 7d is formed on the surface of the container 7b where light is emitted, and the LED chip 7a is disposed and accommodated at the bottom of the cavity 7d. The anode and cathode electrodes of the LED chip 7a are connected to terminal portions 7c and 7c formed on the outer surface other than the light emitting surface of the container 7b. A reflective paint is applied to the inner wall surface of the mortar-shaped cavity, and the cavity is filled with a translucent resin or a fluorescent resin so as to embed the LED chip 7a.

  Next, the heat dissipation structure will be described with reference to FIG.

First, the insulating substrate 8 on which the LED light source 7 is mounted is installed so that the end surface of the light guide plate 4 and the light emitting surface of the LED light source 7 face each other. Further, a heat radiating sheet 9 having an L-shaped cross section is installed so as to contact a surface of the insulating substrate 8 facing the surface on which the LED light source 7 is mounted and a lower surface perpendicular to the surface. The heat dissipation sheet 9 having an L-shaped section and the heat sink substrate 10 having an L-shaped section are in surface contact. Here, the width of the vertical portion of the heat dissipation sheet 9 is set to be slightly wider than the interval between the vertical portions of the insulating substrate 8 and the heat sink substrate 10. By doing so, the vertical portion of the heat dissipation sheet 9 is pressed and sandwiched between the insulating substrate 8 and the vertical portion of the heat sink substrate 10. On the other hand, the height of the horizontal portion of the heat dissipation sheet 9 is also made slightly thicker than the distance between the insulating substrate 8 and the horizontal portion of the heat sink substrate 10. By doing so, the lateral portion of the heat radiating sheet 9 is also sandwiched between the lower surface of the insulating substrate 8 and the lateral portion of the heat sink substrate 10.

  Here, since the heat radiating sheet 9 has elasticity, fine irregularities on the surfaces of the insulating substrate 8 and the heat sink substrate 10 are absorbed, and the insulating substrate 8, the heat radiating sheet 9 and the heat sink substrate 10 almost have an air layer interposed therebetween. Without any problem, it is surely brought into close contact and surface contact.

  Further, by cutting at least the upper and lower surfaces of the insulating substrate 8 that is perpendicular to the one main surface on which the LED light source 7 is mounted, the unevenness of the cut surface can be almost eliminated, and the heat radiation sheet 9 can be adhered. In addition, it is possible to prevent generation of an air heat insulating layer between the insulating substrate 8 and the heat radiation sheet 9 due to glass waste and resin waste generated from the end surface of the insulating substrate 8, and glass waste and resin waste generated from the end surface of the insulating substrate 8. It is possible to prevent light shielding due to adhering to the light emitting surface of the LED light source 7, efficiently perform heat conduction and heat dissipation, and to make maximum use of light of the LED light source 7. Further, the upper and lower surfaces of the insulating substrate 8 are polished and cut so as to be located at a predetermined dimension from the metal wiring on which the LED light source 7 is mounted, so that the thickness direction of the end surface of the light guide plate 4 on which the LED light source 7 is disposed is increased. In the central portion, an array of LED light sources 7 arranged in a straight line on the insulating substrate 8 can be easily arranged.

  Here, in order to improve the visibility of display information on the liquid crystal display panel 1, when the backlight of the liquid crystal display device is driven (the LED light source 7 is turned on), heat is generated along with the light emission. The generated heat is transmitted from the LED light source 7 to the insulating substrate 8, and the insulating substrate 8, the heat radiating sheet 9, and the heat sink substrate 10 are brought into surface contact with almost no air layer interposed therebetween. Thus, the heat sink substrate 10 is efficiently reached.

  Therefore, the heat generated in the LED light source 7 is effectively radiated to the outside, and it is difficult for the LED light source 7 and the insulating substrate 8 to store heat. it can.

  These effects are that the display area of the liquid crystal display panel 1 is enlarged, the shape of the light guide plate 4 is enlarged, and a large number of LED light sources are supplied to the insulating substrate 8 in order to supply sufficient light to the enlarged light guide plate 4. The more the 7 is installed, the greater the effect.

  A heat-dissipating sheet 9 is made of an elastic sheet having an L-shaped cross-section having a heat-dissipating property (model number No. 5509 from Sumitomo 3M Limited), aluminum having a thickness of 2 mm is used for the heat sink substrate 10, and the insulating substrate 8 and heat dissipating The sheet 9 and the heat sink substrate 10 were fixed so as to be in surface contact.

  Here, the thermal conductivity of each material used is 0.45 W / m · K for an insulating substrate made of glass epoxy, 5 W / m · K for a heat dissipation sheet, and 236 W / m · K for aluminum as a heat sink substrate.

  The heat generated by the LED light source 7 along with light emission is thermally conducted to the heat sink substrate 10 made of aluminum via the insulating substrate 8 and the heat radiating sheet 9 to be radiated. In addition, the heat transferred from the insulating substrate 8 to the heat sink substrate 10 is radiated from two systems on the back surface side of the insulating substrate 8 and the lower surface side of the insulating substrate 8.

  Here, since the thermal conductivity of the insulating substrate 8 and the heat radiating sheet 9 is very small as compared with aluminum which is a heat sink substrate, in order to improve the heat conduction, the insulating substrate 8 and the heat radiating sheet 9 are made as thin as possible. The method to do is effective. Further, the heat sink substrate 10 may be magnesium or iron. Incidentally, the thermal conductivity of magnesium is 157 W / m · K, and the thermal conductivity of iron is 83.5 W / m · K. If the heat dissipation is poor, increase the plate thickness or provide a heat dissipation fin. Good.

  Then, using the liquid crystal display panel 1 having a size of 4.7 inches as the size of the display area, 16 LED light sources 7 are arrayed and mounted on the insulating substrate 8, and a current is supplied to each LED light source 7 at room temperature (25 ° C.). A current of 20 mA was passed, and the temperature around the LED light source 7 in the backlight was measured. As a result, it was found that the ambient temperature of the LED light source 7 can be suppressed to 40 ° C., and the estimated lifetime of the LED light source can be extended to about 7500 hours. In addition, the luminous efficiency of the LED light source showed a tendency to improve although it was very small.

  On the other hand, when the heat radiating sheet was removed, it was found that the ambient temperature of the LED light source was 44 ° C., and the estimated life of the LED light source was only about 6600 hours.

  From the above experimental confirmation results, the heat radiation sheet 9 is brought into close contact with the insulating substrate 8 and the heat sink substrate 10 to improve the heat conduction, and the heat generated by the LED light source 7 is efficiently radiated to the heat sink substrate 10. By reducing the heat storage of the insulating substrate 8 and reducing the temperature rise of the LED light source 7 and its surroundings, it is possible to suppress a decrease in the lifetime of the LED light source 7 and a decrease in the light emission efficiency, thereby realizing a long-life and bright liquid crystal display device.

  Further, the heat radiation sheet 9 is formed in an L-shaped cross section and is disposed on the back surface and the bottom surface of the insulating substrate 8. Therefore, for example, the LED light source 7 and the insulating substrate 8 are sandwiched and fixed between the end face of the light guide plate 4 and the heat sink substrate 10 in the planar direction (left and right direction in the figure), and at the same time, the upper casing 6 and the heat sink substrate are fixed. When the insulating substrate 8 is sandwiched between a certain lower casing 10 from above and below, the insulating substrate 8 can be held in a very stable position, and even if an external impact is applied, the impact is prevented. The liquid crystal display device is highly reliable because it absorbs light and the LED light source 7 is unlikely to be displaced or damaged.

  In addition, although the light guide plate 4 of FIG. 1 has the thickness of the opposing end surface thinner than the thickness of the end surface on the side where the LED light source 7 is disposed, it may be a flat plate member having the same thickness on both end surfaces. Similarly, a lower casing that also serves as the heat sink substrate 10 may be a casing having the same side surface in the depth direction. Furthermore, the metal material of the heat sink substrate 10 is exposed on the back side of the liquid crystal display device by serving as the heat sink substrate 10 and the housing. In order to match the external appearance of the housing 6 on the upper surface side, the heat sink substrate 10 and the housing may be configured as separate members, or the resin may be molded only on the exposed surface of the sheet sink substrate 10. Absent.

It is a schematic sectional drawing of the liquid crystal display device of this invention. It is the surface perspective view seen from the display surface side of the liquid crystal display device of this invention. It is a cross-section figure of the liquid crystal display panel of the liquid crystal display device of this invention. It is a perspective view of the insulated substrate which mounted the LED light source on the insulated substrate of the liquid crystal display device of this invention. It is a perspective view of the L-shaped heat dissipation sheet of the liquid crystal display device of the present invention. It is a schematic sectional drawing of the LED module (LED light source) used for this invention. It is a characteristic view which shows the relationship between the ambient temperature of LED chip, and a lifetime.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Liquid crystal display panel 2 ... Lens sheet 3 ... Diffusion sheet 4 ... Light guide plate 5 ... Reflection sheet 6 ... Frame 7 ... LED module (LED light source)
8 .... Insulating substrate 9 .... Heat dissipation sheet 10 .... Heat sink substrate

Claims (4)

  1. A liquid crystal display panel in which a liquid crystal is interposed between a pair of substrates having a display electrode and an alignment film, and a display region is configured by a plurality of pixel regions;
    The liquid crystal display panel is disposed outside one substrate, and includes a light guide plate disposed so as to correspond to the display region, and a backlight including a light source body disposed on an end surface of the light guide plate. In liquid crystal display devices,
    The light source body includes an insulating substrate, a light emitting diode module that is mounted in multiple arrays on one main surface of the insulating substrate and accommodates a light emitting diode chip, a heat sink substrate disposed on the other main surface side of the insulating substrate, A liquid crystal display device comprising: the other main surface of the insulating substrate; and a heat dissipating sheet in contact with the lower surface of the insulating substrate perpendicular to the other main surface.
  2.   2. The liquid crystal display device according to claim 1, wherein the heat radiating sheet is pressed and fixed between the other main surface of the insulating substrate and the heat sink substrate.
  3. The heat sink substrate has an L-shaped cross section that extends from the other main surface of the insulating substrate to the back surface side of the light guide plate, and is disposed on the lower surface of the insulating substrate while extending from the insulating substrate to the light guide plate. The liquid crystal display device according to claim 1, wherein the liquid crystal display device is in pressure contact with the sheet.
  4. 2. The liquid crystal display device according to claim 1, wherein at least an upper surface and a lower surface of the insulating substrate perpendicular to the other main surface of the insulating substrate are polished and cut.
JP2004191226A 2004-06-29 2004-06-29 Liquid crystal display device Pending JP2006011242A (en)

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Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2004191226A JP2006011242A (en) 2004-06-29 2004-06-29 Liquid crystal display device
TW094121818A TWI366038B (en) 2004-06-29 2005-06-29 Liquid crystal display device
CN 200810174602 CN101430068B (en) 2004-06-29 2005-06-29 Liquid crystal display device
KR1020050056724A KR20060048662A (en) 2004-06-29 2005-06-29 Liquid crystal display device
CNA2008101746019A CN101430067A (en) 2004-06-29 2005-06-29 Liquid crystal display device
CN 200510081483 CN100439999C (en) 2004-06-29 2005-06-29 Liquid crystal display device
TW101106183A TW201224588A (en) 2004-06-29 2005-06-29 Light source device
KR1020110125139A KR101239722B1 (en) 2004-06-29 2011-11-28 Liquid crystal display device

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Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007129419A1 (en) * 2006-04-10 2007-11-15 Sharp Kabushiki Kaisha Liquid crystal display
JP2008108552A (en) * 2006-10-25 2008-05-08 Matsushita Electric Ind Co Ltd Linear light source device
WO2008152825A1 (en) 2007-06-12 2008-12-18 Sharp Kabushiki Kaisha Backlight unit
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CN100439999C (en) 2008-12-03

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