JPH0537475Y2 - - Google Patents
Info
- Publication number
- JPH0537475Y2 JPH0537475Y2 JP2700288U JP2700288U JPH0537475Y2 JP H0537475 Y2 JPH0537475 Y2 JP H0537475Y2 JP 2700288 U JP2700288 U JP 2700288U JP 2700288 U JP2700288 U JP 2700288U JP H0537475 Y2 JPH0537475 Y2 JP H0537475Y2
- Authority
- JP
- Japan
- Prior art keywords
- pusher
- carrier
- boat
- wafers
- holder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 235000012431 wafers Nutrition 0.000 claims description 89
- 239000004065 semiconductor Substances 0.000 claims description 23
- 238000001514 detection method Methods 0.000 claims description 17
- 238000010438 heat treatment Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 230000006835 compression Effects 0.000 description 5
- 238000007906 compression Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 230000003028 elevating effect Effects 0.000 description 4
- 239000011295 pitch Substances 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000969 carrier Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2700288U JPH0537475Y2 (enEXAMPLES) | 1988-02-29 | 1988-02-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2700288U JPH0537475Y2 (enEXAMPLES) | 1988-02-29 | 1988-02-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01130536U JPH01130536U (enEXAMPLES) | 1989-09-05 |
| JPH0537475Y2 true JPH0537475Y2 (enEXAMPLES) | 1993-09-22 |
Family
ID=31249129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2700288U Expired - Lifetime JPH0537475Y2 (enEXAMPLES) | 1988-02-29 | 1988-02-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0537475Y2 (enEXAMPLES) |
-
1988
- 1988-02-29 JP JP2700288U patent/JPH0537475Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01130536U (enEXAMPLES) | 1989-09-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4923054A (en) | Wafer transfer apparatus having an improved wafer transfer portion | |
| CA1227888A (en) | Wafer transfer apparatus | |
| KR100242533B1 (ko) | 반도체 처리시스템 및 기판의 교환방법 및 처리방법 | |
| JP3245833B2 (ja) | 半導体基板アライナー装置および方法 | |
| JPS58213438A (ja) | ウエ−ハ移送装置 | |
| JP7623023B2 (ja) | ウェーハアライナー | |
| JP2889657B2 (ja) | 板状体搬送装置 | |
| KR100285081B1 (ko) | 웨이퍼보트 회전장치 | |
| JPS60258459A (ja) | 縦型熱処理装置 | |
| US5143510A (en) | Lead frame separating device | |
| JPH0537475Y2 (enEXAMPLES) | ||
| JPH0310672Y2 (enEXAMPLES) | ||
| JP3578593B2 (ja) | 基板整列装置 | |
| KR100916538B1 (ko) | 멀티 소터의 웨이퍼 핸들링장치 | |
| KR102148106B1 (ko) | 반도체 패키지 싱귤레이션 로딩장치 및 로딩방법 | |
| JP2552017B2 (ja) | 基板の位置合わせ支持装置 | |
| JPH0333065Y2 (enEXAMPLES) | ||
| JPH0211489B2 (enEXAMPLES) | ||
| JPH05343500A (ja) | ウエハ移載装置及びプローブ装置 | |
| JP2882746B2 (ja) | 基板搬送装置 | |
| CN221687505U (zh) | 一种夹持式晶圆预定位装置 | |
| JP2888370B2 (ja) | 基板の整列装置 | |
| CN223442111U (en) | Turnover device for semiconductor wafer detection | |
| JPH0249717Y2 (enEXAMPLES) | ||
| JP2856843B2 (ja) | ウェハ整列装置およびウェハ整列方法 |