JPH0536302Y2 - - Google Patents
Info
- Publication number
- JPH0536302Y2 JPH0536302Y2 JP1988077605U JP7760588U JPH0536302Y2 JP H0536302 Y2 JPH0536302 Y2 JP H0536302Y2 JP 1988077605 U JP1988077605 U JP 1988077605U JP 7760588 U JP7760588 U JP 7760588U JP H0536302 Y2 JPH0536302 Y2 JP H0536302Y2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- wiring board
- main surface
- electronic component
- mask plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 claims description 95
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 14
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 238000005476 soldering Methods 0.000 description 34
- 229920005989 resin Polymers 0.000 description 14
- 239000011347 resin Substances 0.000 description 14
- 239000000758 substrate Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- 239000004020 conductor Substances 0.000 description 7
- 239000011521 glass Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 3
- 238000004382 potting Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000004840 adhesive resin Substances 0.000 description 2
- 229920006223 adhesive resin Polymers 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988077605U JPH0536302Y2 (US06521211-20030218-C00004.png) | 1988-06-11 | 1988-06-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988077605U JPH0536302Y2 (US06521211-20030218-C00004.png) | 1988-06-11 | 1988-06-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH021557U JPH021557U (US06521211-20030218-C00004.png) | 1990-01-08 |
| JPH0536302Y2 true JPH0536302Y2 (US06521211-20030218-C00004.png) | 1993-09-14 |
Family
ID=31302582
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988077605U Expired - Lifetime JPH0536302Y2 (US06521211-20030218-C00004.png) | 1988-06-11 | 1988-06-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0536302Y2 (US06521211-20030218-C00004.png) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5352264A (en) * | 1976-10-25 | 1978-05-12 | Hitachi Ltd | Soldering method |
| JPS5375476A (en) * | 1976-12-17 | 1978-07-04 | Fujitsu Ltd | Method of soldering printed board |
| JPH01290293A (ja) * | 1988-05-18 | 1989-11-22 | Matsushita Electric Ind Co Ltd | 半田付け装置 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51110021U (US06521211-20030218-C00004.png) * | 1975-03-05 | 1976-09-06 | ||
| JPS52140152U (US06521211-20030218-C00004.png) * | 1976-04-19 | 1977-10-24 |
-
1988
- 1988-06-11 JP JP1988077605U patent/JPH0536302Y2/ja not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5352264A (en) * | 1976-10-25 | 1978-05-12 | Hitachi Ltd | Soldering method |
| JPS5375476A (en) * | 1976-12-17 | 1978-07-04 | Fujitsu Ltd | Method of soldering printed board |
| JPH01290293A (ja) * | 1988-05-18 | 1989-11-22 | Matsushita Electric Ind Co Ltd | 半田付け装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH021557U (US06521211-20030218-C00004.png) | 1990-01-08 |
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