JPH0536300Y2 - - Google Patents
Info
- Publication number
- JPH0536300Y2 JPH0536300Y2 JP10891288U JP10891288U JPH0536300Y2 JP H0536300 Y2 JPH0536300 Y2 JP H0536300Y2 JP 10891288 U JP10891288 U JP 10891288U JP 10891288 U JP10891288 U JP 10891288U JP H0536300 Y2 JPH0536300 Y2 JP H0536300Y2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- resin
- insulating substrate
- chip electronic
- large chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 21
- 229920005989 resin Polymers 0.000 claims description 16
- 239000011347 resin Substances 0.000 claims description 16
- 238000007789 sealing Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 230000008646 thermal stress Effects 0.000 description 3
- 238000007598 dipping method Methods 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008642 heat stress Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10891288U JPH0536300Y2 (pt) | 1988-08-19 | 1988-08-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10891288U JPH0536300Y2 (pt) | 1988-08-19 | 1988-08-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0231177U JPH0231177U (pt) | 1990-02-27 |
| JPH0536300Y2 true JPH0536300Y2 (pt) | 1993-09-14 |
Family
ID=31344688
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10891288U Expired - Lifetime JPH0536300Y2 (pt) | 1988-08-19 | 1988-08-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0536300Y2 (pt) |
-
1988
- 1988-08-19 JP JP10891288U patent/JPH0536300Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0231177U (pt) | 1990-02-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3353508B2 (ja) | プリント配線板とこれを用いた電子装置 | |
| US3280378A (en) | Means for anchoring and connecting lead wires in an electrical component | |
| US6101098A (en) | Structure and method for mounting an electric part | |
| JPH0536300Y2 (pt) | ||
| JPH0210571B2 (pt) | ||
| US5470796A (en) | Electronic package with lead wire connections and method of making same | |
| JPH0536299Y2 (pt) | ||
| JP2652223B2 (ja) | 電子部品搭載用基板 | |
| JP3428075B2 (ja) | ハイブリッド集積回路装置の構造 | |
| JP2002373961A (ja) | 樹脂封止型電子装置 | |
| JPS6153852B2 (pt) | ||
| US20040119155A1 (en) | Metal wiring board and method for manufacturing the same | |
| JP2676107B2 (ja) | 電子部品搭載用基板 | |
| JPH0445253Y2 (pt) | ||
| JPH0224395B2 (pt) | ||
| JPH0458189B2 (pt) | ||
| JP2858252B2 (ja) | 表面実装用電子部品の電極構造 | |
| JPH07202453A (ja) | 回路構成体とその製造方法 | |
| JPH0331091Y2 (pt) | ||
| JPS62179794A (ja) | 電気回路配線板 | |
| JPH0445251Y2 (pt) | ||
| JPS6384096A (ja) | 回路基板 | |
| GB2172433A (en) | Decoupling capacitor and method of manufacture thereof | |
| JPH0531839B2 (pt) | ||
| JPS62208691A (ja) | 両面実装型混成集積回路 |