JPH05347320A - Conductive paste - Google Patents
Conductive pasteInfo
- Publication number
- JPH05347320A JPH05347320A JP4155078A JP15507892A JPH05347320A JP H05347320 A JPH05347320 A JP H05347320A JP 4155078 A JP4155078 A JP 4155078A JP 15507892 A JP15507892 A JP 15507892A JP H05347320 A JPH05347320 A JP H05347320A
- Authority
- JP
- Japan
- Prior art keywords
- paste
- conductive paste
- thermal conductivity
- mixing
- diamond particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Landscapes
- Die Bonding (AREA)
- Conductive Materials (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電子部品の導伝性接着
を行う場合に用いる導伝性ペーストに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive paste used for conducting conductive bonding of electronic parts.
【０００２】[0002]
【従来の技術】従来、電子部品の導伝性接着を行う場合
に用いる導伝性ペーストとして、銀粒子、金粒子、銅粒
子及びアルミ粒子をエポキシ系樹脂とその有機溶剤を混
合した導電性ペーストが用いられるのが通例であった。
尚、銀の熱伝導率は４２７Ｗ／ｍ・Ｋ、金の熱伝導率は
３１５Ｗ／ｍ・Ｋ、銅の熱伝導率は３９８Ｗ／ｍ・Ｋ及
びアルミの熱伝導率は２３７Ｗ／ｍ・Ｋである。2. Description of the Related Art Conventionally, as a conductive paste used for conducting conductive bonding of electronic parts, a conductive paste prepared by mixing silver particles, gold particles, copper particles and aluminum particles with an epoxy resin and its organic solvent. Was commonly used.
The thermal conductivity of silver is 427 W / m · K, the thermal conductivity of gold is 315 W / m · K, the thermal conductivity of copper is 398 W / m · K, and the thermal conductivity of aluminum is 237 W / m · K. is there.
【０００３】[0003]
【発明が解決しようとする課題】しかし、上記従来技術
によると、電気伝導性は取れるが、熱導伝性が充分で無
く、電子部品の発熱による特性変動が押え切れ無いと言
う課題があった。However, according to the above-mentioned prior art, there is a problem that the electric conductivity is obtained, but the thermal conductivity is not sufficient, and the characteristic fluctuation due to the heat generation of the electronic component cannot be suppressed. .
【０００４】本発明は、かかる従来技術の課題を解決
し、電子部品の導伝性接着を行う場合に用いる導伝性ペ
ーストである銀ペースト、金ペースト、銅ペースト及び
アルミペーストの熱伝導性を向上する事を目的とする。The present invention solves the problems of the prior art and improves the thermal conductivity of conductive pastes such as silver pastes, gold pastes, copper pastes and aluminum pastes used for conducting conductive bonding of electronic parts. The purpose is to improve.
【０００５】[0005]
【課題を解決するための手段】上記課題を解決し、上記
目的を達成する為に、本発明は、導伝性ペーストに関
し、（１） 銀ペースト中にダイアモンド粒子を混合す
る手段を取る事、及び、（２） 金ペースト中にダイア
モンド粒子を混合する手段を取る事、及び、（３） 銅
ペースト中にダイアモンド粒子を混合する手段を取る
事、及び、（４） アルミペースト中にダイアモンド粒
子を混合する手段を取る事、及び、（５） 半田ペース
ト中にダイアモンド粒子を混合する手段を取る事、等の
手段を取る。In order to solve the above-mentioned problems and achieve the above-mentioned objects, the present invention relates to a conductive paste, wherein (1) means for mixing diamond particles in silver paste is adopted, And (2) taking means for mixing diamond particles in the gold paste, and (3) taking means for mixing diamond particles in the copper paste, and (4) adding diamond particles in the aluminum paste. Taking means for mixing, and (5) taking means for mixing diamond particles in the solder paste.
【０００６】[0006]
【作用】銀ペースト、金ペースト、銅ペースト、アルミ
ペースト及び半田ペースト中にダイアモンド粒子を混合
する事により、電子部品の接着を該導伝性ペースト等で
行う場合に、焼成後の電気伝導性を損なう事無く、且つ
熱伝導率を向上させる事が出来る作用がある。尚、ダイ
アモンドの熱伝導率は１０００Ｗ／ｍ・Ｋ程度以上であ
る。[Function] By mixing diamond particles in silver paste, gold paste, copper paste, aluminum paste and solder paste, the electrical conductivity after firing can be improved when electronic components are bonded with the conductive paste. There is an effect that the thermal conductivity can be improved without being damaged. The thermal conductivity of diamond is about 1000 W / m · K or more.
【０００７】[0007]
【実施例】以下、実施例により、本発明を詳述する。EXAMPLES The present invention will be described in detail below with reference to examples.
【０００８】いま、１ミクロン径から１００ミクロン径
程度の銀粒子を重量比で９５パーセント程度に成るよう
にエポキシ樹脂とその有機溶剤とに混合した導伝性ペー
ストに１ミクロン径から１００ミクロン径程度のダイア
モンド粒子を重量比で１パーセントから９０パーセント
程度混合する事により、焼成後の熱伝導率を４３０Ｗ／
ｍ・Ｋ以上から１０００Ｗ／ｍ・Ｋ程度以上に向上する
事が出来る。Now, a conductive paste prepared by mixing silver particles having a diameter of about 1 micron to about 100 microns with an epoxy resin and its organic solvent in a weight ratio of about 95% has a diameter of about 1 micron to about 100 micron. By mixing the diamond particles of 1 to 90% by weight, the thermal conductivity after firing is 430 W /
It can be improved from m · K or more to about 1000 W / m · K or more.
【０００９】次に、１ミクロン径から１００ミクロン径
程度の金粒子を重量比で９５パーセント程度に成るよう
にエポキシ樹脂とその有機溶剤とに混合した導伝性ペー
ストに１ミクロン径から１００ミクロン径程度のダイア
モンド粒子を重量比で１パーセントから９０パーセント
程度混合する事により、焼成後の熱伝導率を３２０Ｗ／
ｍ・Ｋ以上から１０００Ｗ／ｍ・Ｋ程度以上に向上する
事が出来る。Next, a conductive paste prepared by mixing gold particles having a diameter of about 1 to 100 microns with an epoxy resin and its organic solvent in a weight ratio of about 95% is added to the paste of 1 to 100 microns. By mixing about 1% to 90% by weight of diamond particles, the thermal conductivity after firing is 320 W /
It can be improved from m · K or more to about 1000 W / m · K or more.
【００１０】次に、１ミクロン径から１００ミクロン径
程度の銅粒子を重量比で９５パーセント程度に成るよう
にエポキシ樹脂とその有機溶剤とに混合した導伝性ペー
ストに１ミクロン径から１００ミクロン径程度のダイア
モンド粒子を重量比で１パーセントから９０パーセント
程度混合する事により、焼成後の熱伝導率を４００Ｗ／
ｍ・Ｋ以上から１０００Ｗ／ｍ・Ｋ程度以上に向上する
事が出来る。Next, a conductive paste prepared by mixing copper particles having a diameter of about 1 to 100 microns with an epoxy resin and its organic solvent in a weight ratio of about 95% is added to the conductive paste of 1 to 100 microns. By mixing approximately 1 to 90% by weight of diamond particles, the thermal conductivity after firing is 400 W /
It can be improved from m · K or more to 1000 W / m · K or more.
【００１１】次に、１ミクロン径から１００ミクロン径
程度のアルミ粒子を重量比で９５パーセント程度に成る
ようにエポキシ樹脂とその有機溶剤とに混合した導伝性
ペーストに１ミクロン径から１００ミクロン径程度のダ
イアモンド粒子を重量比で１パーセントから９０パーセ
ント程度混合する事により、焼成後の熱伝導率を２４０
Ｗ／ｍ・Ｋ以上から１０００Ｗ／ｍ・Ｋ程度以上に向上
する事が出来る。Next, a conductive paste prepared by mixing aluminum particles having a diameter of about 1 to 100 μm with an epoxy resin and its organic solvent in a weight ratio of about 95% is added to the conductive paste of 1 to 100 μm. By mixing approximately 1 to 90% by weight of diamond particles, the thermal conductivity after firing is 240%.
It can be improved from W / m · K or more to 1000 W / m · K or more.
【００１２】次に、１ミクロン径から１００ミクロン径
程度の半田粒子を重量比で９５パーセント程度に成るよ
うにエポキシ樹脂とその有機溶剤とに混合した導伝性ペ
ーストに１ミクロン径から１００ミクロン径程度のダイ
アモンド粒子を重量比で１パーセントから９０パーセン
ト程度混合する事により、焼成後の熱伝導率を２００Ｗ
／ｍ・Ｋ以上から１０００Ｗ／ｍ・Ｋ程度以上に向上す
る事が出来る。Next, a conductive paste prepared by mixing a solder particle having a diameter of about 1 to 100 microns with an epoxy resin and its organic solvent in a weight ratio of about 95% is added to the conductive paste at a diameter of 1 to 100 microns. By mixing about 1% to 90% by weight of diamond particles, the thermal conductivity after firing is 200 W.
/ M · K or more to 1000 W / m · K or more.
【００１３】[0013]
【発明の効果】本発明により、電子部品の接着をダイア
モンド粒子を混合した導伝性ペースト等で行う事によ
り、焼成後の電気伝導性を損なう事無く、且つ熱伝導率
を向上させる事が出来る効果がある。EFFECTS OF THE INVENTION According to the present invention, by adhering electronic parts with a conductive paste or the like mixed with diamond particles, it is possible to improve the thermal conductivity without impairing the electrical conductivity after firing. effective.
Claims (5)
合されて成る事を特徴とする導伝性ペースト。1. A conductive paste comprising diamond particles mixed in a silver paste.
合されて成る事を特徴とする導伝性ペースト。2. A conductive paste comprising diamond particles mixed in a gold paste.
合されて成る事を特徴とする導伝性ペースト。3. A conductive paste comprising diamond particles mixed in a copper paste.
が混合されて成る事を特徴とする導伝性ペースト。4. A conductive paste characterized in that aluminum particles are mixed with diamond particles.
混合されて成る事を特徴とする導伝性ペースト。5. A conductive paste comprising diamond particles mixed in a solder paste.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4155078A JPH05347320A (en) | 1992-06-15 | 1992-06-15 | Conductive paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4155078A JPH05347320A (en) | 1992-06-15 | 1992-06-15 | Conductive paste |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05347320A true JPH05347320A (en) | 1993-12-27 |
Family
ID=15598177
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4155078A Pending JPH05347320A (en) | 1992-06-15 | 1992-06-15 | Conductive paste |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05347320A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6853056B2 (en) | 2001-12-25 | 2005-02-08 | Kabushiki Kaisha Toshiba | Semiconductor device having a base metal lead frame |
| JP2007138204A (en) * | 2005-11-15 | 2007-06-07 | Nakamura:Kk | Colloidal dispersion |
| CN109108524A (en) * | 2018-08-30 | 2019-01-01 | 桂林电子科技大学 | A kind of diamond-nano mattisolda Heat Conduction Material and preparation method thereof |
-
1992
- 1992-06-15 JP JP4155078A patent/JPH05347320A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6853056B2 (en) | 2001-12-25 | 2005-02-08 | Kabushiki Kaisha Toshiba | Semiconductor device having a base metal lead frame |
| JP2007138204A (en) * | 2005-11-15 | 2007-06-07 | Nakamura:Kk | Colloidal dispersion |
| CN109108524A (en) * | 2018-08-30 | 2019-01-01 | 桂林电子科技大学 | A kind of diamond-nano mattisolda Heat Conduction Material and preparation method thereof |
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