JPH06333417A - Conductive paste - Google Patents

Conductive paste

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Publication number
JPH06333417A
JPH06333417A JP11970593A JP11970593A JPH06333417A JP H06333417 A JPH06333417 A JP H06333417A JP 11970593 A JP11970593 A JP 11970593A JP 11970593 A JP11970593 A JP 11970593A JP H06333417 A JPH06333417 A JP H06333417A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
conductive paste
powder
wiring board
conductive metal
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11970593A
Other languages
Japanese (ja)
Inventor
島秀次 ▲くわ▼
Tetsuo Kosugi
Hideji Kuwajima
哲夫 小杉
Original Assignee
Hitachi Chem Co Ltd
日立化成工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

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Abstract

PURPOSE: To provide conductive paste of high conductivity having low through hole resistance in a wiring board by composing the conductive paste for forming an electric circuit of a main component of almost spherical particles of plastic or the like and conductive metal powder.
CONSTITUTION: Almost spherical particles of plastic or other inorganic material of a grain size of 30μm or less, and powder of conductive metal such as Au, Ag, Cu, Al, etc., of an aspect ratio of 3 or more and of a grain size of a longer diameter of 40μm or less are mixed at a ratio of 5:1 to 1:5. This mixture is mixed with solvent such as terpineol, micro-powder of graphite, corrosion restricting agent such as benzothiazole, etc., as necessary, as well as organic binding material such as liquid epoxy resin, where these are blended in such a way that total quantity of the particles and the conductive metal powder is 15 to 60wt.% to solid components of conductive paste. The conductive paste of low through hole resistance in a wiring board, can thus be provided.
COPYRIGHT: (C)1994,JPO

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【産業上の利用分野】本発明は電気回路形成用の導電ペーストに関する。 The present invention relates to a conductive paste for the electrical circuit formed.

【0002】 [0002]

【従来の技術】従来、プリント配線板、電子部品等の配線導体を形成する方法として、導電性に優れた銀粉を含有するペーストを塗布又は印刷して形成する方法が一般的に知られている。 Conventionally, a printed wiring board, as a method for forming a wiring conductor, such as electronic components, a method of forming paste coating or printing to contain excellent silver powder in the conductive is generally known .

【0003】 [0003]

【発明が解決しようとする課題】銀粉を用いた導電ペーストは導電性が良好なことから印刷配線板、電子部品等の配線導体や電極として使用されているが、これらは高温多湿の雰囲気下で電界が印加されると、配線導体や電極にマイグレーションと称する銀の電析が生じ電極間又は配線間が短絡するという欠点が生じる。 [SUMMARY OF THE INVENTION The conductive paste using silver conductive printed wiring board because good, has been used as a wiring conductor and electrodes such as electronic components, it is in an atmosphere of high temperature and humidity When an electric field is applied, disadvantages occur that electrodeposition of silver called migration wiring conductors and electrodes between the electrodes or between wirings caused a short circuit. このマイグレーションを防止するための方策はいくつか行われており、導体の表面に防湿塗料を塗布するか又は導電ペーストに窒素化合物などの腐食抑制剤を添加するなどの方策が検討されているが十分な効果が得られるものではなかった。 Measures to prevent this migration has been done several, but measures such as the or a conductive paste is coated moisture proof coating on the surface of the conductor adding corrosion inhibitors such as nitrogen compounds have been studied sufficiently such effect was not obtained.

【0004】また、導通抵抗の良好な導体を得るには銀粉の配合量を多くしなければならず、銀粉が高価であることから導電ペーストも高価になるという欠点があった。 [0004] In order to obtain a good conductor of conduction resistance it is necessary to increase the amount of silver powder, has a drawback that silver powder is expensive conductive paste because it is expensive.

【0005】本発明はかかる欠点のない導電ペーストを提供するものである。 [0005] The present invention provides a no such drawbacks conductive paste.

【0006】 [0006]

【課題を解決するための手段】本発明は粒径が30μm Means for Solving the Problems The present invention is particle size 30μm
以下の略球形の微粒子及び高導電性金属紛を含む導電ペーストに関する。 It relates conductive paste containing fine particles and highly conductive metal powder of the following substantially spherical.

【0007】本発明における略球形の微粒子とはプラスチック又は無機材料からなるもので、その形状は大略球形であり少なくともその長径が30μm以下であればよく、導電性は問わない。 [0007] The fine particles of substantially spherical in the present invention made of a plastic or inorganic material, the shape generally is spherical may be at least the major diameter 30μm or less, conductivity is not limited. すなわち、非導電性微粒子であっても導電性微粒子であってもよく、銀、金等のような高い導電性を必要としない。 That is, a non-conductive fine particles may be also conductive fine particles and does not require silver, a high conductivity such as gold. なお粒径が30μmを越える略球形の微粒子を用いると印刷時にスクリーンが目詰りしたり、ペーストの伸びが悪くなり印刷性が劣るなどの欠点が生じる。 Incidentally or screen is clogged during use and printing fine particles of substantially spherical particle diameter exceeds 30 [mu] m, has drawbacks such as elongation of the paste is printed is poor poor results.

【0008】高導電性金属紛の材質は特に限定するものではないが、導電性に優れる金、銀、銅、アルミニウム又はこれらの金属の合金が単独若しくは組み合わされて使用される。 [0008] The material of the highly conductive metal powder is not particularly limited, gold excellent conductivity, silver, copper, aluminum or alloys of these metals are used alone or in combination. また高導電性金属紛は詳細にその形状を限定するものではないがフレーク状が望ましく、アスペクト比は大略3以上あることが好ましく、10以上であればさらに好ましい。 The highly conductive metal powder is desirably but not limited to the shape in detail flake, it is preferred that the aspect ratio is generally 3 or more, more preferably equal to 10 or more. また、その粒径は長径が40μm以下であれば印刷性を低下させないので好ましい。 Further, because the particle size does not reduce the printability if major axis 40μm or less preferred.

【0009】略球形の微粒子と高導電性金属粉の比率は導体の抵抗とマイグレーションの防止の点から体積比で5:1〜1:5(略球形の微粒子:高導電性金属粉)であることが好ましい。 [0009] The ratio of the substantially particulate and highly conductive metal powder Spherical by volume from the viewpoint of prevention of the resistance and the migration of the conductor 5: 1 to 1: is: 5 (highly conductive metal powder substantially spherical particles) it is preferable.

【0010】導電ペーストは上記の材料以外に液状のエポキシ樹脂、フェノール樹脂、不飽和ポリエステル樹脂等の有機質の接着剤成分及び必要に応じてテルピネオール、エチルカルビトール、カルビトールアセテート等の溶媒、微小黒鉛粉末、ベンゾチアゾール、ベンズイミダゾール等の腐食抑制剤などを含有する。 [0010] The conductive paste liquid epoxy resin other than the above materials, phenolic resins, adhesive components and terpineol as needed for organic, such as unsaturated polyester resins, ethyl carbitol, a solvent such as carbitol acetate, fine graphite powder, benzothiazole, containing corrosion inhibitor benzimidazole. 略球形の微粒子及び高導電性金属粉の含有量は導電ペーストの固形分に対して導体の抵抗と経済性から15〜60重量%であることが好ましく、30〜60重量%であることがさらに好ましい。 Preferably the content of fine particles and highly conductive metal powder substantially spherical is 15 to 60 wt% of a resistor and economics of the conductor with respect to the solid content of the conductive paste, and further to be 30 to 60 wt% preferable.

【0011】 [0011]

【実施例】以下本発明の実施例を説明する。 EXAMPLES Hereinafter will be described an embodiment of the present invention. 実施例1 ビスフェノールA型エポキシ樹脂(油化シェルエポキシ製、商品名エピコート834)60重量部及びビスフェノールA型エポキシ樹脂(油化シェルエポキシ製、商品名エピコート828)40重量部を予め加温溶解させ、 Example 1 Bisphenol A type epoxy resin was (Yuka Shell Epoxy Ltd., trade name Epikote 834) 60 parts by weight and bisphenol A type epoxy resin (Yuka Shell Epoxy Ltd., trade name Epikote 828) pre-warmed dissolving 40 parts by weight ,
次いで室温に冷却した後2エチル4メチルイミダゾール(四国化成製)5重量部、エチルカルビトール(和光純薬製、試薬)20重量部及びブチルセロソルブ(和光純薬製、試薬)20重量部を加えて均一に混合して樹脂組成物とし、この樹脂組成物145gに平均粒径が20μ Then 2-ethyl 4-methylimidazole (made by Shikoku Kasei Co.) After cooling to room temperature 5 parts by weight, ethyl carbitol (manufactured by Wako Pure Chemical Industries, Ltd., reagent) 20 parts by weight of butyl cellosolve (manufactured by Wako Pure Chemical Industries, Ltd., reagent) was added to 20 parts by weight uniformly mixed with the resin composition, the average particle size in the resin composition 145g is 20μ
mで最大径が28μmのポリスチレン製の略球形微粒子(日立化成工業製)を40g、フレーク状の銀粉(徳力化学研究所製、商品名TCG−1)を110g及び銅紛(福田金属箔粉製、商品名SPC4−8)を50g加えて撹拌らいかい機及び3本ロールで均一に分散して導電ペーストを得た。 m maximum diameter 28μm polystyrene substantially spherical particles (manufactured by Hitachi Chemical Co.) in 40 g, flaky silver powder (Tokuriki Chemical Research Co., Ltd., trade name TCG-1) to 110g and copper powder (manufactured by Fukuda Metal Foil & Powder to obtain a uniformly dispersed conductive paste tradename SPC4-8) in 50g addition stirring kneader and three-roll.

【0012】次に上記で得た導電ペーストで厚さが1. [0012] Then the thickness of a conductive paste obtained in the above 1.
6mmで直径が0.8mm(φ)のスルーホールを形成した紙フェノール銅張積層板(日立化成工業製、商品名MCL−437F)に図1に示すテストパターンを印刷すると共にこれをスルーホール1に充てんしたものを大気中で60℃30分さらに160℃30分の条件で加熱処理して配線板を得た。 Paper phenol copper clad laminate having a diameter to form a through-hole of 0.8 mm (phi) in 6 mm (manufactured by Hitachi Chemical Co., trade name MCL-437F) through holes so as to print a test pattern shown in FIG. 1 1 those packed to obtain a heat treatment to the wiring board under the condition of 60 ° C. 30 minutes further 160 ° C. 30 minutes in the air to. なお図1において2は紙フェノール銅張積層板である。 Note 2 In FIG. 1 is a paper phenol copper clad laminate. 次に得られた配線板の抵抗を測定した。 Resistance then the resulting circuit board was measured. その結果銀箔の抵抗を除いたスルーホール1の抵抗は22mΩ/穴であり、隣り合うスルーホール間の絶縁抵抗は10 8 Ω以上であった。 As a result the resistance of the through-hole 1, except for the resistance of the silver foil is 22Emuomega / well, the insulation resistance between adjacent through-holes was not less than 10 8 Omega. 該配線板の冷熱衝撃試験を実施した結果、スルーホール1の抵抗は29mΩ Wiring board results of thermal shock tests were carried out of the resistance of the through-hole 1 is 29mΩ
/穴であった。 It was / hole. また該配線板の湿中負荷試験を実施した結果、スルーホール間の絶縁抵抗は10 8 Ω以上であった。 The result of the medium load test humidity of the wiring board, the insulation resistance between the through holes was more than 10 8 Omega. なお、冷熱試験条件は125℃30分〜−65℃3 Incidentally, thermal test conditions 125 ° C. 30 minutes ~-65 ° C. 3
0分を100サイクル行い、湿中負荷試験は40℃90 0 minutes do 100 cycle, medium-load test and humidity is 40 ℃ 90
%RH中、隣あうライン間に50Vの電圧を印加して1 During RH%, 1 by applying a voltage of 50V between adjacent meet line
000時間保持した。 000 hours were held.

【0013】実施例2 実施例1で得た樹脂組成物145gに実施例1で用いた略球形の微粒子を65g、銀粉を200g及び銅粉を6 [0013] 65g of particulates of substantially spherical used in Example 1 obtained in the resin composition 145g in Example 1, the 200g and copper powder and silver powder 6
0g加えて実施例1と同様の方法で均一に混合分散して導電ペーストを得た。 To obtain a conductive paste was uniformly mixed and dispersed in the same manner as in Example 1 was added 0 g. 以下実施例1と同様の工程を経て配線板を作製してその特性を評価した。 And its characteristics were evaluated by producing a wiring board through the same process as in Example 1 below. その結果、スルーホールの抵抗は21mΩ/穴であり、スルーホール間の絶縁抵抗は10 8 Ω以上であった。 As a result, the resistance of the through-hole is 21Emuomega / well, the insulation resistance between the through holes was more than 10 8 Omega. また該配線板の冷熱衝撃試験を実施した結果、スルーホールの抵抗は29 The result of the thermal shock test of the wiring board, the resistance of the through-holes 29
mΩ/穴であり、湿中負荷試験の結果では、スルーホール間の絶縁抵抗は10 8 Ω以上であった。 a milliohms / well, the result of medium load test humidity, insulation resistance between the through holes was more than 10 8 Omega.

【0014】実施例3 実施例1で得た樹脂組成物145gに実施例1で用いた略球形の微粒子を30g、銀粉を700g及び銅粉を1 [0014] microparticles 30g of substantially spherical used in Example 3 obtained in Example 1 resin composition 145g in Example 1, the 700g and copper powder silver powder 1
00g加えて実施例1と同様の方法で均一に混合分散して導電ペーストを得た。 To obtain a conductive paste was uniformly mixed and dispersed in 00g Additionally similar manner as in Example 1. 以下実施例1と同様の工程を経て配線板を作製してその特性を評価した。 And its characteristics were evaluated by producing a wiring board through the same process as in Example 1 below. その結果、スルーホールの抵抗は19mΩ/穴であり、スルーホール間の絶縁抵抗は10 8 Ω以上であった。 As a result, the resistance of the through-hole is 19Emuomega / well, the insulation resistance between the through holes was more than 10 8 Omega. また該配線板の冷熱衝撃試験を実施した結果、スルーホールの抵抗は2 The result of the thermal shock test of the wiring board, the resistance of the through-holes 2
3mΩ/穴であり、湿中負荷試験の結果では、スルーホール間の絶縁抵抗は10 8 Ω以上であった。 A 3 milliohms / well, the result of medium load test humidity, insulation resistance between the through holes was more than 10 8 Omega.

【0015】比較例1 実施例1で得た樹脂組成物145gに実施例1で用いた銀粉を1000g加えて実施例1と同様の方法で均一に混合分散して導電ペーストを得た。 [0015] to obtain a uniformly mixed dispersed conductive paste in the same manner as in Example 1 silver powder by adding 1000g used in Comparative Example 1 obtained in Example 1 resin composition 145g in Example 1. 以下実施例1と同様の工程を経て配線板を作製してその特性を評価した。 And its characteristics were evaluated by producing a wiring board through the same process as in Example 1 below. その結果、スルーホールの抵抗は18mΩ/穴であり、スルーホール間の絶縁抵抗は10 8 Ω以上であった。 As a result, the resistance of the through-holes is 18 M [Omega / well, the insulation resistance between the through holes was more than 10 8 Omega. また該配線板の冷熱衝撃試験を実施した結果、スルーホールの抵抗は24mΩ/穴であり、湿中負荷試験の結果では、スルーホール間の絶縁抵抗は配線板5枚のうち1枚10 7 Ω台に低下しているものがあった。 The result of the thermal shock test of the wiring board, the resistance of the through hole is 24Emuomega / well, the results of the intermediate load test humidity, one insulation resistance between the through holes of the wiring board 5 sheets 10 7 Omega there was a thing that has declined to stand.

【0016】 [0016]

【発明の効果】本発明になる導電ペーストは配線板におけるスルーホールの抵抗が低い高導電性のペーストであり、また湿中負荷試験後におけるスルーホール間の絶縁抵抗の低下が小さく、さらに粒径が30μm以下の略球形の微粒子及び高導電性金属粉を使用すること、例えば銀粉と銅粉とを併用することにより銀の使用量を少なくできるなど経済的にも優れた導電ペーストである。 Conductive paste according to the present invention exhibits a low resistance high conductivity of the paste through holes in the circuit board, also reduction in the insulation resistance between the through holes after the medium load test humidity is small, further particle size There the use of fine particles and highly conductive metal powder following substantially spherical 30 [mu] m, a conductive paste having excellent economically, for example may use less silver by combined use of silver powder and copper powder.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】紙フェノール銅張積層板に導電ペーストを印刷すると共にスルーホールに充てんした状態を示す平面図である。 1 is a plan view showing a state in which filled in the through holes with printing a conductive paste on a paper phenol copper clad laminate.

【符号の説明】 DESCRIPTION OF SYMBOLS

1 スルーホール 2 紙フェノール銅張積層板 1 through-hole 2 paper phenol copper-clad laminate

Claims (1)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】 粒径が30μm以下の略球形の微粒子及び高導電性金属紛を含む導電ペースト。 1. A particle size conductive paste containing fine particles and highly conductive metal powder of the following substantially spherical 30 [mu] m.
JP11970593A 1993-05-21 1993-05-21 Conductive paste Pending JPH06333417A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11970593A JPH06333417A (en) 1993-05-21 1993-05-21 Conductive paste

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11970593A JPH06333417A (en) 1993-05-21 1993-05-21 Conductive paste

Publications (1)

Publication Number Publication Date
JPH06333417A true true JPH06333417A (en) 1994-12-02

Family

ID=14768053

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11970593A Pending JPH06333417A (en) 1993-05-21 1993-05-21 Conductive paste

Country Status (1)

Country Link
JP (1) JPH06333417A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6000129A (en) * 1996-06-28 1999-12-14 International Business Machines Corporation Process for manufacturing a circuit with filled holes
EP1400987A2 (en) * 2002-09-19 2004-03-24 Murata Manufacturing Co., Ltd. Conductive paste, method for manufacturing solar battery, and solar battery
EP1873790A1 (en) * 2005-03-29 2008-01-02 Toyo Aluminium Kabushiki Kaisha Paste composition, electrode and solar cell device comprising same
GB2551191A (en) * 2016-06-10 2017-12-13 Imperial Innovations Ltd Corrosion protection coating

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6000129A (en) * 1996-06-28 1999-12-14 International Business Machines Corporation Process for manufacturing a circuit with filled holes
EP1400987A2 (en) * 2002-09-19 2004-03-24 Murata Manufacturing Co., Ltd. Conductive paste, method for manufacturing solar battery, and solar battery
EP1400987A3 (en) * 2002-09-19 2004-04-07 Murata Manufacturing Co., Ltd. Conductive paste, method for manufacturing solar battery, and solar battery
EP1873790A1 (en) * 2005-03-29 2008-01-02 Toyo Aluminium Kabushiki Kaisha Paste composition, electrode and solar cell device comprising same
EP1873790A4 (en) * 2005-03-29 2009-06-03 Toyo Aluminium Kk Paste composition, electrode and solar cell device comprising same
GB2551191A (en) * 2016-06-10 2017-12-13 Imperial Innovations Ltd Corrosion protection coating

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