JPH05343832A - Method and apparatus for cutting of pattern on printed circuit board by using laser - Google Patents

Abstract

PURPOSE:To prevent that an insulation defect is caused between cut patterns by a method wherein a molten powder which has adhered in the cutting operation of the patterns is removed by using a laser beam after the patterns have been cut. CONSTITUTION:By means of a control operation from a laser controller 23, pattern parts which are to be cut on a printer wiring board PT are irradiated with a laser beam LB having the prescribed number of pulses from a laser oscillator 21. The pattern parts are volatilized and removed. In this case, a mask-size controller 24 controls a laser-beam mask device so as to narrow a laser-beam irradiation area. Required pattern parts are removed partly; after that, parts on the printed wiring part including the cut parts are irradiated with a laser beam LB which is weaker than that in the cutting operation; a molten powder which has adhered to parts near the cut parts is removed. Thereby, an insulation defect is not caused between the cut patterns.

Description

Detailed Description of the Invention

(Table of Contents) Field of Industrial Application Conventional Technology (FIGS. 15 and 16) Problem to be Solved by the Invention Means for Solving the Problem (FIG. 1) Action (FIG. 1) Embodiment (FIGS. 2 to 2) 14) Effect of the invention

[0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pattern cutting method and a pattern cutting apparatus for a printed wiring board using a laser.

[0003]

2. Description of the Related Art A printed wiring board having a wiring pattern formed on its surface or a printed wiring board having an inner layer pattern for wiring covered with a resin is designed to be changed when the design is changed. Accordingly, the above pattern and inner layer pattern are partially cut,
As such a cutting method, a method of cutting a wiring pattern with a drill is currently used, but a method of cutting a pattern with a laser has been proposed.

That is, the outline of a method for cutting a pattern on a printed wiring board using such a laser is as follows. First, as a laser, a YAG laser or an excimer laser capable of pulse oscillation is generally used. The beam emitted from this laser is converted into a shape and size equal to the pattern, and reduced and projected onto the pattern to be cut. .. Cutting is completed by intermittently irradiating the pattern to be cut with the laser beam thus obtained. For example, since each pulse can be processed to a depth of about 0.1 μm, a copper pattern having a thickness of about 50 μm can be processed with about 5 μm.
It can be cut with 00 pulses.

When the inner layer pattern in the printed wiring board having the inner layer pattern covered with the resin is partially cut, the resin portion is first cut with the laser beam and then the inner layer pattern is further cut with the laser beam. Cut the pattern.

[0006]

However, in the conventional method of cutting a pattern of a printed wiring board using a laser as described above, as indicated by reference numeral 50 in FIG.
When the pattern 51 formed on the surface of the substrate is cut, at this time, as shown in FIG. 15B, molten powder A of copper or resin scatters and adheres to the substrate of the printed wiring board PT. Then, there is a possibility that the attached matter may affect the insulation failure between the cut patterns 51.

When cutting the resin-coated inner layer pattern, as shown in FIG. 16, scattered copper or resin is scattered on the wall portion 61 of the recess 60 formed after the removed resin portion. The melted powder A of No. 1 adheres, and the adhered matter also influences, so that insulation failure may occur between the cut patterns. The present invention was devised in view of such a problem, and made it possible to remove the molten powder attached at the time of pattern cutting by using a laser beam after cutting so that no insulation failure occurs between the cut patterns. An object of the present invention is to provide a pattern cutting method and a pattern cutting device for a printed wiring board using a laser.

[0008]

FIG. 1 is a block diagram of the principle of the present invention. In FIG. 1, reference numeral 1 is a printed wiring board moving table, and the printed wiring board moving table 1 mounts a printed wiring board PT. Then, the printed wiring board PT can be moved. 2 is a laser beam irradiation means,
The laser beam irradiating means 2 irradiates the laser beam LB on the pattern portion to be cut on the printed wiring board PT on the printed wiring board moving table 1.
For this purpose, the laser beam irradiation means 2 comprises a laser oscillator and a laser beam mask means for adjusting the irradiation range of the laser beam from the laser oscillator.

Reference numeral 3 denotes a light condensing means, which condenses the laser beam LB from the laser beam irradiation means 2 on the printed wiring board PT. Reference numeral 11 denotes a table control means. In addition to the positioning control of the printed wiring board PT, the table control means 11 narrows the laser beam irradiation area at the time of pattern cutting and the laser beam at the time of removing the molten powder, in terms of the present invention. The vertical position of the printed wiring board moving table 1 is controlled so that the beam irradiation area can be increased.

Reference numeral 23 denotes a laser oscillator control means. The laser oscillator control means 23 generally controls the laser oscillator. Regarding the portion of the present invention, the output of the laser oscillator is increased at the time of cutting the pattern and the molten powder is removed. Controls the output of the laser oscillator so that the output of the laser oscillator can be lowered. Reference numeral 24 denotes a laser beam mask control means. As far as the present invention is concerned, this laser beam mask control means 24 can narrow the laser beam irradiation area when cutting the pattern and widen the laser beam irradiation area when removing the molten powder. Thus, the laser beam mask means is controlled.

In the present invention, the light condensing control means 31 narrows the laser beam irradiation area when cutting the pattern and widens the laser beam irradiation area when the molten powder is removed. The light condensing means 3 is controlled so that it can be obtained.

[0012]

In the present invention described above, the laser beam irradiating means 2 irradiates the laser beam LB to the pattern portion to be cut on the printed wiring board PT having the pattern for wiring formed on the surface thereof, and thereby the pattern portion is cut. Is partially volatilized and removed, and then the laser beam LB weaker than that at the time of cutting is applied to irradiate the printed wiring board portion including the cut portion, thereby removing the molten powder attached near the cut portion. Be done.

At this time, by widening the laser beam irradiation area, the laser output is not changed as compared with that at the time of cutting, a laser beam LB weaker than that at the time of cutting is produced, or the laser output is made lower than that at the time of cutting. , Creating a weaker laser beam LB than when cutting,
By irradiating the printed wiring board portion including the cut portion with this weak laser beam LB, the molten powder attached near the cut portion is removed.

By irradiating the printed wiring board portion including the cut portion with the weak laser beam LB a plurality of times, the molten powder adhering to the vicinity of the cut portion is removed a plurality of times. Good. Further, in the present invention, the laser beam irradiating means 2 irradiates the laser beam LB to the resin portion corresponding to the inner layer pattern portion to be cut in the printed wiring board PT having the inner layer pattern for the wiring covered with the resin. Thus, the resin portion is first volatilized and removed, and then the inner layer pattern portion to be cut is further irradiated with the laser beam LB to volatilize and remove the inner layer pattern portion to be cut.
After that, the edge of the recess formed after the removed resin portion is irradiated with the laser beam LB substantially vertically,
By directly irradiating the wall of the recess with the laser beam LB, the molten powder attached to the wall of the recess is removed.

When the laser beam LB is directly applied to the wall of the recess, for example, the laser beam LB is obliquely applied to the wall of the recess or the printed wiring board PT is tilted, and then the wall of the recess is irradiated. The part is irradiated with the laser beam LB. Further, in the present invention, a printed wiring board PT having an inner layer pattern for wiring covered with a resin is provided.
By irradiating the resin portion corresponding to the inner layer pattern portion to be cut with the laser beam LB, the resin portion is first volatilized and removed, and then the inner layer pattern portion to be cut is further irradiated with the laser beam LB. When volatilizing and removing the inner layer pattern part to be cut, the inner layer pattern part is partially exposed so that the inner layer pattern part after cutting is partially exposed in the recess formed after the removed resin part. To be removed.

Further, the resin portion corresponding to the inner layer pattern portion to be cut in the printed wiring board PT having the inner layer pattern for the wiring covered with the resin is irradiated with the laser beam LB to volatilize the resin portion first. Then, after irradiating the inner layer pattern portion to be cut with the laser beam LB to volatilize and remove the inner layer pattern portion to be cut, the resin portion of the adjacent resin portion is volatilized and removed. After that, an operation of partially volatilizing and removing the inner layer pattern portion is performed at least once.

Regarding the removal of the above resin portion,
It is also possible to remove a wide area including the inner layer pattern portion to be cut. When the resin portion is volatilized and removed, the resin portion can be divided and removed by irradiating the laser beam LB in plural times. Further, in this case, the laser beam LB weaker than that at the time of cutting is used to irradiate the peripheral portion of the recess formed after the removed resin portion, thereby removing the molten powder attached to the peripheral portion. You can also do it.

[0018]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 2 is an overall configuration diagram of an embodiment of the present invention. In FIG. 2, reference numeral 1 is an XY stage as a printed wiring board moving table, and the XY stage 1 has a printed wiring board PT mounted thereon. This printed wiring board PT can be moved two-dimensionally (two-dimensionally). In addition, this X
The Y stage 1 also includes a Z stage, and the printed wiring board PT can be moved also in the Z direction (vertical direction). Therefore, the position of the printed wiring board PT can be adjusted three-dimensionally.

The XY stage 1 can move the printed wiring board PT to a desired position by being controlled by a stage controller (table control means) 11. Reference numeral 2 is a laser beam irradiation device (laser beam irradiation means), and this laser beam irradiation device 2 irradiates the laser beam LB to a pattern portion to be cut on the printed wiring board PT on the XY stage 1. , This laser beam irradiation device 2
Includes a laser oscillator 21 and a laser beam mask device (laser beam mask means) 22. The laser beam irradiation device 2 further includes a laser controller 23,
A mask size controller (laser beam mask control means) 24 is connected.

Here, the laser oscillator 21 oscillates the laser beam LB, and for example, YA capable of pulse oscillation.
A G laser or an excimer laser is used. The laser beam mask device 22 adjusts the irradiation range of the laser beam LB from the laser oscillator 21 by changing the opening lengths L and W. For example, as shown in FIG. Two mask plates 22-5, 2 for adjusting the opening length L of the mask by rotating the screw 22-3 using 1 as a drive source to move in opposite directions.
2-6, and two mask plates 22- for adjusting the opening length W of the mask by rotating the screw 22-4 by using the motor 22-2 as a driving source to rotate the screws 22-4 in opposite directions. 7, 22-8.

The mask plates 22-5, 22-6; 22
So that -7 and 22-8 can move in opposite directions,
As shown in FIG. 3B, the screws 22-3 and 22-4 are
The part closer to one end from the central part is configured as a right-hand thread, and the part closer to the other end from the central part is configured as a left-hand thread. By the way, the laser controller 23 controls the number of oscillations and output of the laser oscillator 21, and the mask size controller 24 adjusts and controls the aperture lengths L and W of the laser beam mask device 22, and specifically, A laser beam mask device 22 is provided so that the laser beam irradiation area can be narrowed when cutting the pattern of the printed wiring board PT and widened when the molten powder was removed.
Is to control.

Reference numeral 3 denotes a lens device (light collecting means) which collects the laser beam from the laser beam mask device 22 and uses a convex lens or the like. The lens device 23 is configured to be movable up and down, and the lens controller 31 controls the lifted state. In this case, reduction projection is performed under the following optical conditions.

1 / u + 1 / v = 1 / f (reduction ratio m = u / v) where u is the lens device 3 and the laser beam mask device 2
2, v is the distance between the lens device 3 and the printed wiring board PT, and f is the focal length of the lens device 3. In addition, the stage controller 11 and the laser controller 2
The mask size controller 24 and the lens controller 31 are controlled by the system controller 4. That is, in this case, it has a hierarchical control structure.

Next, a method of cutting a required pattern portion of the printed wiring board PT by using this apparatus by design change or the like will be described. First, a description will be given of cutting of a required pattern portion in the printed wiring board PT having a pattern for wiring formed on the surface. In this case, when the printed wiring board PT is set on the XY stage 1 and information to be cut (cutting position, direction, width, etc.) is input, the stage controller 11 causes the pattern 51 to be cut to be the laser irradiation position. The XY stage 1 is driven so as to come.
Then, the mask opening length (L ×
W) is adjusted.

After that, by controlling the laser controller 23, the laser oscillator 21 irradiates the laser beam LB with a prescribed number of pulses onto the pattern portion to be cut on the printed wiring board PT, so that the pattern shown in FIG.
As indicated by reference numeral 50 in FIG. 5B, the pattern portion 51 is partially volatilized and removed. In this case, since the pattern of the printed wiring board PT is being cut, the mask size controller 24 controls the laser beam mask device 22 so that the laser beam irradiation area is narrowed.

At this time, as shown in FIG.
The molten powder A of copper or resin scatters near the cut portion and adheres to the substrate of the printed wiring board PT. Therefore, in this method, after the required pattern portion 51 is partially removed as described above. By irradiating the printed wiring board portion including the cut portion with the laser beam LB which is weaker than that at the time of cutting, the molten powder A attached near the cut portion is removed.

In this case, the mask size controller 24
The laser beam mask device 22 controls the opening length of the mask (L ×
Adjust W). The laser output is not changed as compared with the time of cutting. In this way, by widening the laser beam irradiation range [see reference numeral LBRw in FIG. 4 (b)], the laser output is not changed as compared with that at the time of cutting, and the laser beam LB weaker than that at the time of pattern cutting is created. By using the weak laser beam LB to intermittently irradiate the printed wiring board portion including the cut portion 10 times before and after, for example, the molten powder A adhering to the cut portion can be removed as shown in FIG. 4 (d). it can.

The laser beam irradiation range can be widened by raising the lens position of the lens device 23 or moving the XY stage 1 in the Z direction (vertical direction). In this case, the lens controller 31 controls the lens device 3 so that the laser beam irradiation area can be narrowed when the pattern is cut, and can be widened when the molten powder is removed, and the table controller 11 can change the pattern. The vertical position of the XY table 1 is controlled so that the laser beam irradiation area can be narrowed during cutting and the laser beam irradiation area can be widened during molten powder removal.

If the range of the molten powder A scattered is large, the printed wiring board portion including the cut portion 50 is
Weak laser beam LB is repeated a plurality of times (in this case, three times;
It is also possible to remove the molten powder A adhering to the vicinity of the cutting location 50 by dividing it into a plurality of times by irradiating the molten powder in each of (c) to (see). In this way, since the melted powder A adhering at the time of cutting the pattern is removed by using the laser beam LB after cutting, insulation failure does not occur between the cut patterns.

Next, cutting of a required inner layer pattern portion (for example, inner layer power supply layer) in the printed wiring board PT having an inner layer pattern for wiring covered with resin (glass / epoxy resin) will be described. Also in this case, when the printed wiring board PT is set on the XY stage 1 and information to be cut (cutting position, direction, width, etc.) is input, the stage controller 11 irradiates the portion corresponding to the inner layer pattern to be cut with laser. The XY stage 1 is driven so as to come to the position. Then, the opening length (L × W) of the mask is adjusted according to the cutting width. When this time is taken as the initial state, the appearance of the printed wiring board PT at that time is as shown in FIGS. 5 (a) and 5 (A). Note that reference numeral 53 in FIG. 5 indicates an inner power supply layer.

After that, under the control of the laser controller 23, a laser beam LB having a prescribed number of pulses is emitted from the laser oscillator 21, as shown in FIGS. 4 (b) and 4 (B).
By irradiating the pattern-corresponding resin portion of the printed wiring board PT to be cut, the resin portion corresponding to the inner-layer pattern portion to be cut is volatilized and removed, as shown in FIGS. As a result, the recess 60 is formed, and the inner layer pattern portion 53A to be cut is exposed at the bottom of the recess 60.

Then, the inner layer pattern portion 53A to be cut
Further, the laser beam LB is radiated on FIG.
As shown in (D), the inner layer pattern portion 53 to be cut
A is volatilized and removed. In the above case, since the pattern is being cut on the printed wiring board PT, the mask size controller 24 controls the laser beam mask device 22 so that the laser beam irradiation area is narrowed.

At this time, as shown in FIGS. 5 (d) and 5 (D), the molten powder A of copper or resin is scattered near the cutting point,
Since this adheres to the substrate of the printed wiring board PT, in the present method, after partially removing the required pattern portion as described above, the printed wiring including the cut portion is used by using the laser beam LB weaker than that at the time of cutting. By irradiating the plate portion, the molten powder A attached near the cut portion is removed.

That is, the mask size controller 24
The laser beam mask device 22 controls the opening length of the mask (L ×
Adjust W). The laser output is not changed as compared with the time of cutting. In this way, the irradiation area of the laser beam is widened [see reference numeral LBRw in FIGS. 5 (e) and 5 (E)], so that the laser output is not changed as compared with that in the cutting, and the laser beam is weaker than that in the pattern cutting. LB is generated and the weak laser beam LB is used to intermittently irradiate the printed wiring board portion including the cut portion, so that the molten powder A adhering to the cut portion is changed as shown in FIGS. 4 (f) and 4 (F). It can be removed.

Even in this case, the lens device 2
By increasing the lens position of 3 or moving the XY stage 1 in the Z direction (vertical direction), the irradiation range of the laser beam can be widened. In addition, when the range of dispersion of the molten powder A is large, by applying a weak laser beam to the printed wiring board portion including the peripheral portion of the recess 60 in a plurality of times in a manner substantially similar to the above case. The molten powder A adhered to the peripheral portion can be removed by dividing it into plural times.

Therefore, also in this case, since the molten powder A adhered at the time of cutting the pattern is removed by using the laser beam after cutting, insulation failure is not caused between the cut patterns. By the way, when the inner layer pattern coated with the resin is cut as in the above example, the scattered copper or resin molten powder is also formed on the wall portion 61 of the recess 60 formed after the removed resin portion. Since A adheres, it needs to be removed. Therefore, in this method, the molten powder A attached to the wall portion 61 of the recess 60 is removed by the following method.

That is, by irradiating the edge of the recess 60 formed after the removed resin portion with the laser beam LB having a reduced area substantially vertically, the wall 6 of the recess 60 is irradiated.
1 is partially shaved to remove the molten powder A adhering to the wall portion 61 of the recess 60 [see (a) to (c) in FIGS. 6 and 7]. As still another means, the wall portion 61 of the recess 60 formed after the removed resin portion is directly irradiated with the laser beam LB having a large area, so that the wall portion 61 of the recess 60 is attached. The molten powder A can also be removed.

In this case, the wall 61 of the recess 60 is obliquely irradiated with the laser beam LB, or the printed wiring board PT
The wall portion 61 of the recess 60 is directly irradiated with the laser beam LB by tilting. First, the recess 6
When the laser beam LB is obliquely applied to the wall portion 61 of 0, as shown in FIG.
Half mirrors 7-1 and 7-2 and mirror 7-3 on the exit side of
7-5 are arranged, and lenses 3-1 to 3-3 for converging light from three directions respectively form the lens device 3.
As a result, when the pattern is cut, the middle lens 3-2
The mirror is adjusted so that the laser beam LB is irradiated onto the printed wiring board PT through the wall portion 61 of the recess 60.
When removing the molten powder A adhered to the
The mirror is adjusted so that the wall 61 of the recess 60 is directly irradiated with the laser beam LB through -1, 3-2. The state at this time is schematically shown in FIG.
It becomes like (a)-(c). Note that FIG. 9A shows a state where the molten powder A is not removed after the pattern cutting, and FIG. 9B shows the laser beam LB for the wall portion 6 of the recess 60.
FIG. 9 (c) shows a state in which the molten powder A adhering to the wall portion 61 of the recess 60 is removed by irradiating it obliquely to No. 1 and FIG. It shows the state after the removal.

Next, the case where the printed wiring board PT is tilted and the wall portion 61 of the recess 60 is directly irradiated with the laser beam will be described. In this case, as shown in FIG. 10, a jig 8 for inclining the printed wiring board PT is provided on the XY stage 1. Thus, when the pattern is cut, the jig 8 is made horizontal so that the laser beam LB is irradiated onto the printed wiring board PT, and the molten powder A adhering to the wall 61 of the recess 60 is removed. Is to tilt the jig 8 so that the laser beam LB is directly applied to the wall portion 61 of the recess 60. In FIG. 10, reference numeral 7 indicates a mirror device that changes the direction of the laser beam. And when the state at this time is schematically shown,
It becomes like Fig.10 (a)-(d). Note that FIG.
FIG. 10A shows a state where the molten powder A is not removed after the pattern is cut, and FIGS. 10B and 10C show that the laser beam LB is obliquely applied to the wall portion 61 of the recess 60 to form a recess. Place 60
10D shows the state when the molten powder A adhering to the wall portion 61 is removed, and FIG. 10D shows the state after the molten powder A attached to the wall portion 61 of the recess 60 is removed. ..

When the resin-coated inner layer pattern is cut in this way, the scattered molten powder A adheres to the wall portion 61 of the recess 60 formed after the removed resin portion. Since the melted powder A is also removed by using the laser beam LB after cutting, insulation failure does not occur between the cut inner layer patterns. In the above case, regarding the removal work of the molten powder A adhering to the peripheral portion of the recess 60 of the printed wiring board PT and the removal work of the fusion powder A adhering to the wall portion 61 of the recess 60, The work of may be performed first.

In the above example, the thickness is 50 μm,
Table 1 shows an example of laser conditions for cutting a wiring pattern having a width of 0.12 mm into a width of 0.3 mm.

[0042]

[Table 1]

Further, another example of cutting a required inner layer pattern portion (for example, inner layer power supply layer) in a printed wiring board having an inner layer pattern for wiring covered with resin will be described. That is, also in this case, when the printed wiring board PT is set on the XY stage 1 and information to be cut (cutting position, direction, width, etc.) is input, the stage controller 11 determines the portion corresponding to the inner layer pattern to be cut. The XY stage 1 is driven so as to come to the laser irradiation position. The opening length of the mask (L
XW) is adjusted. Assuming that this time is the initial state, the appearance of the printed wiring board PT at that time is as shown in FIG.
It looks like (A).

Thereafter, under the control of the laser controller 23, the laser beam LB having a prescribed number of pulses from the laser oscillator 21 should be cut on the printed wiring board PT as shown in FIGS. 12 (b) and 12 (B). By irradiating the pattern-corresponding resin portion, as shown in FIGS.
As shown in 1) and (C2), the resin portion corresponding to the inner layer pattern portion to be cut is volatilized and removed. As a result, the recess 60 is formed, and the inner layer pattern portion 53A to be cut is exposed at the bottom of the recess 60. At this time, with respect to the removal of the resin portion, a wide range including the inner layer pattern portion 53A to be cut (when the dimension of the inner layer pattern portion 53A to be cut is L1 × W1, the resin portion removal range is (3 × L1) × W1) is removed. As a result, in the subsequent inner layer pattern cutting process, the space area in which the molten powder A is scattered becomes wider, so that the amount of the molten powder A adhering to the processed hole wall surface 61 is reduced, thereby improving the insulation quality.

As a method of removing the resin portion, FIG.
As shown in FIG. 13A, there is a method of making the irradiation range coincide with the removal range, and a method of making the irradiation range smaller than the removal range as shown in FIG. 13B. If Figure 13
As shown in (b), if the resin portion is divided and removed, the amount of energy input to the printed wiring board PT can be reduced (can be reduced to 1/3 in this example).
It has little heat effect on the resin part and contributes to the reduction of carbonization. In FIG. 13C, the inner layer pattern 5 is formed by removing the resin portion.
3A shows the exposed state.

Thereafter, the inner layer pattern portion to be cut is further irradiated with a laser beam LB as shown in FIG. 12C2, and the removed resin portion is shown as shown in FIGS. 12D and 12D. The inner layer pattern portion is partially removed so that the inner layer pattern portion after the cutting is partially exposed in the recess 60 formed after. In the above case, since the pattern of the printed wiring board PT is being cut, the mask size controller 24 controls the laser beam mask device 22 so that the laser beam irradiation area becomes narrow.

When the inner layer pattern coated with the resin as described above is cut, as shown by reference numerals 53A-1 and 53A-2, the inner layer pattern portion after cutting is partially exposed in the recess 60. In addition, since the inner layer pattern portion is partially removed, it is easy to visually check the cutting. At this time, as shown in FIGS. 12D and 12D,
Since the molten powder A of copper or resin is scattered near the cut portion and adheres to the substrate of the printed wiring board PT, even in the case of this method, after the required pattern portion is partially removed as described above. The laser beam LB, which is weaker than that at the time of cutting, is used to irradiate the printed wiring board portion including the cut portion to remove the molten powder A attached near the cut portion.

That is, the mask size controller 24
The laser beam mask device 22 controls the opening length of the mask (L ×
Adjust W). The laser output is not changed as compared with the time of cutting. In this way, the irradiation range of the laser beam LB is widened [see reference numeral LBRw in FIGS. 12 (e) and 12 (E)].
As a result, the laser output is not changed as compared with that at the time of cutting, and a laser beam LB weaker than that at the time of pattern cutting is produced.
By intermittently irradiating the printed wiring board portion including the cut portion with this weak laser beam LB, the molten powder A adhered near the cut portion can be removed as shown in FIGS. 12 (f) and 12 (F). You can do it.

Also in this case, the irradiation range of the laser beam can be widened by raising the lens position of the lens device 23 or moving the XY stage 1 in the Z direction (vertical direction). it can. In addition, when the range of dispersion of the molten powder A is large, as in the case described above, regarding the printed wiring board portion including the peripheral portion of the recess 60,
By irradiating the weak laser beam LB a plurality of times, it is possible to remove the molten powder A adhering to the peripheral portion in a plurality of times. Furthermore, also in this example, at the edge of the recess 60 formed after the removed resin portion,
The recess 60 is formed by irradiating the laser beam substantially vertically.
The wall portion 61 of the recess 60 is partially shaved to remove the molten powder A adhering to the wall portion 61 of the recess 60, the wall portion 61 of the recess 60 is obliquely irradiated with a laser beam, or the printed wiring board is printed. It is also possible to remove the molten powder A adhering to the wall portion 61 of the recess 60 by inclining the PT and directly irradiating the wall portion 61 of the recess 60 with the laser beam.

In this case, since the resin portion is removed over a wide range including the inner layer pattern portion to be cut, the space area in which the molten powder A scatters is widened, and as a result, the processed hole wall surface is formed. 61 and the amount of the molten powder A scattered around the recess are reduced.
The cleaning operation shown in (e) and (E) can be omitted.

With respect to the above example, the substrate is located at a depth of 0.2 mm from the surface of the substrate, has a thickness of 50 μm and a width of 0.1.
Table 2 shows an example of laser conditions for cutting an inner layer pattern having 4 mm with a width of 0.2 mm.

[0052]

[Table 2]

Next, still another example of cutting a required inner layer pattern portion (for example, inner layer power supply layer) in a printed wiring board having an inner layer pattern for wiring covered with resin will be described. That is, also in this case, when the printed wiring board PT is set on the XY stage 1 and information to be cut (cutting position, direction, width, etc.) is input, the stage controller 11 determines the portion corresponding to the inner layer pattern to be cut. The XY stage 1 is driven so as to come to the laser irradiation position. Then, the opening length (L × W) of the mask is adjusted according to the cutting width. If this time is the initial state,
The state of the printed wiring board PT at that time is as shown in FIG.

After that, under the control of the laser controller 23, the laser beam LB having a prescribed number of pulses from the laser oscillator 21 is, as shown in FIG. 14B, the pattern-corresponding resin portion on the printed wiring board PT to be cut. 14C, the resin portion corresponding to the inner layer pattern portion to be cut is volatilized and removed as shown in FIG. As a result, the recess 60 is formed, and the inner layer pattern portion 53A to be cut at the bottom of the recess 60.
Is exposed.

Then, the inner layer pattern portion to be cut is further irradiated with a laser beam, and as shown in FIG. 14D, a recess formed after the resin portion where the inner layer pattern portion after cutting is removed. Inner layer pattern portion 5 so as to be partially exposed in 60 (see reference numerals 53A-1 and 53A-2).
3A is partially removed. Thereafter, the adjacent resin portions are volatilized and removed, and then the inner layer pattern portions are partially volatilized and removed at least once (in this case, twice) [FIG. 14 (E)]. ~
(J)].

In the above case, since the pattern of the printed wiring board PT is being cut, the mask size controller 24 controls the laser beam mask device 22 so that the laser beam irradiation area becomes narrow. When the inner layer pattern coated with the resin is cut in this way, the adjacent resin portions are volatilized and removed, and then the inner layer pattern portions are partially volatilized and removed at least twice. Therefore, the influence of the scattered molten powder can be reduced.

Also in this case, as a method of removing the resin portion, a method of matching the irradiation range with the removal range as shown in FIG. 13A and a method of removing the irradiation range as shown in FIG. 13B are used. There is a method of making it smaller than the removal range.
Also at this time, after partially removing the required pattern portion as described above, by irradiating the printed wiring board portion including the cut portion with a laser beam weaker than that at the time of cutting, it is attached to the vicinity of the cut portion. The molten powder A thus formed is removed.

That is, the mask size controller 24
The laser beam mask device 22 controls the opening length of the mask (L ×
Adjust W). The laser output is not changed as compared with the time of cutting. In this way, by widening the irradiation range of the laser beam, the laser output is not changed as compared with that at the time of cutting, a laser beam weaker than that at the time of pattern cutting is created, and the weak laser beam LB is used to include the cut portion. By intermittently irradiating the printed wiring board portion, it is possible to remove the molten powder A adhering to the vicinity of the cut portion. In this case, the laser beam whose irradiation range is widened is sequentially irradiated to each of the three recesses 60.
It is also possible to irradiate three recesses at once.
On the contrary, by irradiating one recess 60 with the weak laser beam LB a plurality of times, it is of course possible to remove the molten powder A adhering to the vicinity of the recess 60 a plurality of times. ..

Also in this case, the irradiation range of the laser beam can be widened by raising the raise position of the lens device 23 or moving the XY stage 1 in the Z direction (vertical direction). it can. Further, also in this example, the recess 6 formed after the removed resin portion
By irradiating the edge portion of 0 with the laser beam LB substantially vertically, the wall portion 61 of the recess 60 is partially scraped off, and the molten powder A attached to the wall portion 61 of the recess 60 is removed. By irradiating the wall portion 61 of the recess 60 with the laser beam LB obliquely or by inclining the printed wiring board PT,
The molten powder A adhering to the wall portion 61 of the recess 60 may be removed by directly irradiating the wall portion 61 of the recess 60 with the laser beam LB.

Also in this case, since the resin portion is removed over a wide range including the inner layer pattern portion to be cut, the space area in which the molten powder A scatters is widened, and as a result, the processed hole wall surface is formed. Since the amount of the molten powder A scattered around 61 or the recess is reduced, it is possible to omit the cleaning operation performed by widening the irradiation range of the laser beam if necessary.

In each of the above examples, the laser controller 23 lowers the laser output as compared with the time of cutting the pattern, thereby creating a laser beam weaker than that of the time of cutting the pattern, and using this weak laser beam to cut the cutting position. By irradiating the portion including the printed wiring board, the molten powder adhered in the vicinity of the cut portion may be removed.

[0062]

As described above in detail, according to the pattern cutting method and the pattern cutting apparatus for a printed wiring board using the laser of the present invention, the following effects and advantages can be obtained. (1) Since the molten powder attached at the time of pattern cutting is removed by using a laser beam after cutting, insulation failure does not occur between the cut patterns. (2) When cutting the inner layer pattern covered with resin, the scattered molten powder adheres to the wall of the recess formed after the removed resin portion. Since the removal is performed using the beam, insulation failure does not occur between the cut inner layer patterns. (3) When the inner layer pattern coated with the resin is cut, the resin portion is removed in a wide range including the inner layer pattern portion to be cut. The space area in which the particles are scattered becomes wider, which reduces the amount of the molten powder adhering to the wall surface of the processed hole and improves the insulation quality. (4) When cutting the inner layer pattern coated with resin,
Since the inner layer pattern portion is partially removed so that the inner layer pattern portion after cutting is partially exposed in the recess formed after the removed resin portion, the cutting check by visual inspection becomes easy. (5) When cutting the inner layer pattern coated with resin,
The adjacent resin portions are volatilized and removed, and then the inner layer pattern portions are partially volatilized and removed at least twice, so that the influence of the scattered molten powder can be reduced. (6) Since the resin portion is divided and removed, the amount of energy input to the printed wiring board can be reduced, which reduces thermal influence on the resin portion and contributes to reduction of carbonization.

[Brief description of drawings]

FIG. 1 is a principle block diagram of the present invention.

FIG. 2 is an overall configuration diagram showing an embodiment of the present invention.

3A and 3B are views showing a laser beam mask device, in which FIG. 3A is a schematic view showing the entire structure thereof, and FIG. 3B is a partial view of a mask plate driving screw (enlarged view IIIb in FIG. 3A). is there.

FIG. 4 is a diagram illustrating the present method.

FIG. 5 is a diagram illustrating the present method.

FIG. 6 is a diagram illustrating the present method.

FIG. 7 is a diagram illustrating the present method.

FIG. 8 is a schematic diagram of an apparatus for carrying out the present method.

FIG. 9 is a diagram illustrating the method.

FIG. 10 is a schematic diagram of an apparatus for carrying out the present method.

FIG. 11 is a diagram illustrating the present method.

FIG. 12 is a diagram illustrating the present method.

FIG. 13 is a diagram illustrating the present method.

FIG. 14 is a diagram illustrating the method.

FIG. 15 is a diagram illustrating a conventional problem.

FIG. 16 is a diagram illustrating a conventional problem.

[Explanation of symbols]

1 XY stage (printed wiring board moving table) 2 Laser beam irradiation device (laser beam irradiation means) 3 Lens device (condensing means) 3-1 to 3-3 Lens 4 System controller 7 Mirror device 7-1, 7-2 Barf mirror 7-3 to 7-5 Barf mirror 8 Jig 11 Stage controller (table control means) 21 Laser oscillator 22 Laser beam mask device (laser beam mask means) 22-1, 22-2 Motor 22-3, 22-4 Screw 22-5 to 22-8 Mask plate 23 Laser controller (laser oscillator control means) 24 Mask size controller (laser beam mask control means) 31 Lens controller (focus control means) 50 Pattern cutting part 51 Wiring pattern 53 Inner power supply layer ( Inner layer pattern) 53A Inner layer pattern cutting Part 60 Recess 61 Wall part A Molten powder LB Laser beam PT Printed wiring board

Claims (17)

[Claims] 1. A laser beam (LB) is applied to a pattern portion to be cut on a printed wiring board (PT) having a pattern for wiring formed on the surface to volatilize the pattern portion to be cut. After the removal, by irradiating the printed wiring board portion including the cut portion with a laser beam (LB) weaker than that at the time of cutting, the molten powder adhered near the cut portion is removed. A method for cutting a pattern on a printed wiring board using. 2. A weaker laser beam (LB) is created by increasing the irradiation area of the laser beam (LB) without changing the laser output as compared with that during cutting, and this weak laser beam 2. A laser-printed printed wiring board according to claim 1, wherein the molten powder adhering to the vicinity of the cut portion is removed by irradiating the printed wiring board portion including the cut portion with (LB). Pattern cutting method. 3. A laser beam weaker than that at the time of cutting is produced by making the laser output lower than that at the time of cutting, and the weak laser beam (LB) is used to irradiate the printed wiring board portion including the cut portion. 2. The method for cutting a pattern of a printed wiring board using a laser according to claim 1, wherein the molten powder adhering to the vicinity of the cut portion is removed by doing so. 4. The printed wiring board portion including the cut portion is irradiated with the weak laser beam (LB) in a plurality of times to divide the molten powder adhered in the vicinity of the cut portion into a plurality of times. It removes, The claim 1 characterized by the above-mentioned.
A method of cutting a pattern of a printed wiring board using the laser according to claim 3. 5. A laser beam (LB) is first irradiated onto a resin portion corresponding to an inner layer pattern portion to be cut in a printed wiring board (PT) having an inner layer pattern for a wiring covered with a resin, thereby first After the resin portion is volatilized and removed, the inner layer pattern portion to be cut is further irradiated with a laser beam (LB) to volatilize and remove the inner layer pattern portion to be cut, and then the removed resin portion is removed. Printed wiring using a laser, characterized in that the molten powder adhered to the wall of the recess is removed by irradiating the edge of the recess formed in the recess with a laser beam (LB) substantially vertically. Pattern cutting method for boards. 6. A resin portion corresponding to an inner layer pattern portion to be cut in a printed wiring board (PT) having an inner layer pattern for wiring covered with a resin is first irradiated with a laser beam (LB), The resin portion is volatilized and removed, and then the inner layer pattern portion to be cut is further irradiated with a laser beam to volatilize and remove the inner layer pattern portion to be cut. A method of cutting a pattern of a printed wiring board using a laser, characterized in that the molten powder adhering to the wall of the recess is removed by irradiating the wall of the recess with a laser beam (LB). 7. The laser according to claim 6, wherein the molten powder adhering to the wall of the recess is removed by obliquely irradiating the wall of the recess with a laser beam (LB). A method for cutting a pattern on a printed wiring board using. 8. A method of irradiating the wall of the recess with a laser beam (LB) after tilting the printed wiring board (PT) to remove molten powder adhering to the wall of the recess. 7. A method for cutting a pattern on a printed wiring board using a laser according to claim 6. 9. A printed wiring board (PT) having an inner layer pattern for a wiring covered with a resin is first irradiated with a laser beam (LB) to irradiate a resin portion corresponding to a portion of the inner layer pattern to be cut. Formed after the removed resin portion when the resin portion is volatilized and removed, and then the inner layer pattern portion to be cut is further irradiated with a laser beam to volatilize and remove the inner layer pattern portion to be cut. A method of cutting a pattern of a printed wiring board using a laser, wherein the inner layer pattern portion is partially removed so that the inner layer pattern portion after cutting is partially exposed in the formed recess. 10. A printed wiring board (PT) having an inner layer pattern for wiring covered with a resin is first irradiated with a laser beam (LB) to irradiate a resin portion corresponding to an inner layer pattern portion to be cut. The resin portion is volatilized and removed, and then the inner layer pattern portion to be cut is further irradiated with a laser beam (LB) to volatilize and remove the inner layer pattern portion to be cut. A method of cutting a pattern of a printed wiring board using a laser, characterized in that an operation of volatilizing and removing a resin portion and then partially volatilizing and removing an inner layer pattern portion is performed at least once. 11. The pattern of a printed wiring board using a laser according to claim 10, wherein the resin portion is removed in a wide range including an inner layer pattern portion to be cut. Cutting method. 12. When the resin portion is volatilized and removed,
11. The laser according to claim 5, wherein the resin portion is divided and removed by irradiating the laser beam (LB) a plurality of times. How to cut a pattern on a printed wiring board. 13. A laser beam (L
6. The molten powder adhering to the peripheral portion is removed by irradiating the peripheral portion of the recess formed after the removed resin portion by using B).
A method for cutting a pattern of a printed wiring board using the laser according to any one of 6, 9, and 10. 14. A printed wiring board moving table (1) on which a printed wiring board (PT) is placed and which can be moved, and the print on the printed wiring board moving table (1). Laser beam irradiating means (2) for irradiating a laser beam (LB) on a pattern portion to be cut on the wiring board (PT).
The laser beam irradiation means (2) is provided with a laser oscillator and a laser beam mask means for adjusting a laser beam irradiation range from the laser oscillator, and the laser beam irradiation means (2) is used for cutting a pattern. A laser beam mask control means (24) is provided for controlling the laser beam mask means so that the irradiation area can be narrowed and the laser beam irradiation area can be widened when the molten powder is removed. The pattern cutting device for the printed wiring board. 15. A printed wiring board moving table (1) on which a printed wiring board (PT) can be placed and which can be moved, and the print on the printed wiring board moving table (1). Laser beam irradiating means (2) for irradiating a laser beam (LB) on a pattern portion to be cut on the wiring board (PT).
Table control means for controlling the vertical position of the printed wiring board moving table (1) so that the laser beam irradiation area can be narrowed when the pattern is cut and widened when the molten powder is removed ( 11) is provided, and a pattern cutting device for a printed wiring board using a laser. 16. A printed wiring board moving table (1) on which a printed wiring board (PT) is placed and which can be moved, and the print on the printed wiring board moving table (1). Laser beam irradiating means (2) for irradiating a laser beam (LB) on a pattern portion to be cut on the wiring board (PT).
The laser beam (L) from the laser beam irradiation means (2)
B) is provided with a condensing means (3) for condensing the printed wiring board (PT) on the printed wiring board (PT), and the laser beam irradiation area can be narrowed when the pattern is cut and widened when the molten powder is removed. A pattern cutting device for a printed wiring board using a laser, which is provided with a light collecting control means (31) for controlling the light collecting means (3). 17. A printed wiring board moving table (1) on which a printed wiring board (PT) can be placed and which can be moved in a plane, and on the printed wiring board moving table (1). A laser beam irradiating means (2) for irradiating a laser beam (LB) on a pattern portion of the printed wiring board (PT) to be cut
In addition, the laser beam irradiation means (2) is configured to include a laser oscillator whose output can be adjusted, and the laser oscillator output is increased during pattern cutting and the laser oscillator output during molten powder removal. Laser oscillator control means (2) for controlling the output of the laser oscillator so that
3) The pattern cutting device for a printed wiring board using a laser, characterized in that