JP2719272B2 - Method and apparatus for cutting printed wiring board pattern using laser - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

(Table of Contents) Industrial Application Field Conventional Technology (FIGS. 15 and 16) Problems to be Solved by the Invention Means for Solving the Problems (FIG. 1) Function (FIG. 1) Embodiment (FIGS. 2 to 2) 14) Effects of the invention

[0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for cutting a pattern of a printed wiring board using a laser.

[0003]

2. Description of the Related Art If a design change occurs in a printed wiring board having a wiring pattern formed on its surface or an inner layer pattern for wiring covered with a resin, the design change is required. Along with this, the above-mentioned pattern and inner layer pattern are partially cut,
At present, a method of cutting a wiring pattern using a drill has been adopted as such a cutting method, but a method of cutting a pattern by using a laser has also been proposed.

That is, an outline of a method for cutting a pattern of a printed wiring board using such a laser is as follows. First, a YAG laser or an excimer laser capable of pulse oscillation is generally used as a laser, and a beam emitted from this laser is converted into a shape and size equal to the pattern, and is reduced and projected on a pattern to be cut. . The cutting is completed by intermittently irradiating the laser beam thus obtained to the pattern to be cut. In addition, for example, since it can be processed to a depth of about 0.1 μm per pulse, a copper pattern having a thickness of about 50 μm is about 5 μm.
It can be cut by 00 pulses.

When the inner layer pattern of a printed wiring board having an inner layer pattern covered with a resin is partially cut, the resin portion is first cut with a laser beam, and then the inner layer pattern is further cut with a laser beam. Cut the pattern.

[0006]

However, in the above-described conventional method of cutting a pattern of a printed wiring board using a laser, as shown by reference numeral 50 in FIG.
When the pattern 51 formed on the surface of the substrate is cut, at this time, as shown in FIG. 15B, the molten powder A of copper or resin scatters and adheres to the substrate of the printed wiring board PT. Then, there is a possibility that the attached matter affects the insulation failure between the cut patterns 51.

When the inner layer pattern covered with resin is cut, as shown in FIG. 16, scattered copper or resin is applied to the wall 61 of the recess 60 formed after the removed resin portion. Molten powder A adheres, and the adhered matter also affects the insulation powder, which may cause insulation failure between the cut patterns. The present invention has been made in view of such a problem, and it has been made possible to remove a molten powder attached at the time of pattern cutting by using a laser beam after cutting, so that insulation failure does not occur between the cut patterns. It is an object of the present invention to provide a method and a device for cutting a pattern of a printed wiring board using a laser.

[0008]

FIG. 1 is a block diagram showing the principle of the present invention. In FIG. 1, reference numeral 1 denotes a printed wiring board moving table, on which a printed wiring board PT is mounted. Then, the printed wiring board PT can be moved. 2 is a laser beam irradiation means,
The laser beam irradiating means 2 irradiates a laser beam LB to a pattern portion to be cut on the printed wiring board PT on the printed wiring board moving table 1,
For this purpose, the laser beam irradiation means 2 includes a laser oscillator and a laser beam mask means for adjusting the irradiation range of the laser beam from the laser oscillator.

Reference numeral 3 denotes a light condensing means, which condenses the laser beam LB from the laser beam irradiation means 2 on the printed wiring board PT. Reference numeral 11 denotes a table control means. The table control means 11 controls the positioning of the printed wiring board PT, and, in the case of the present invention, reduces a laser beam irradiation area when cutting a pattern and a laser beam when removing molten powder. The vertical position of the printed wiring board moving table 1 is controlled so that the beam irradiation area can be increased.

Reference numeral 23 denotes a laser oscillator control means. The laser oscillator control means 23 generally controls the laser oscillator. In the present invention, however, the output of the laser oscillator is increased when the pattern is cut, and when the molten powder is removed. Is designed to control the output of the laser oscillator so that the output of the laser oscillator can be reduced. Numeral 24 denotes a laser beam mask control means. The laser beam mask control means 24 can reduce the laser beam irradiation area at the time of cutting the pattern and increase the laser beam irradiation area at the time of removing the molten powder. Thus, the laser beam mask means is controlled.

Reference numeral 31 denotes a light condensing control means. In the present invention, the light condensing control means 31 reduces the laser beam irradiation area when cutting a pattern and increases the laser beam irradiation area when removing molten powder. The light condensing means 3 is controlled so that it can be obtained.

[0012]

According to the present invention described above, the laser beam LB is applied to the pattern portion to be cut on the printed wiring board PT on the surface of which the pattern for wiring is formed by the laser beam irradiating means 2 so that the laser beam LB is irradiated. Is partially volatilized and removed, and the laser beam LB weaker than at the time of cutting is used to irradiate the printed wiring board portion including the cut portion, thereby removing the molten powder attached near the cut portion. It is.

At this time, by increasing the area of the laser beam irradiation area, the laser output is not changed as compared with the cutting, but a laser beam LB weaker than the cutting is produced, or the laser output is reduced as compared with the cutting. , Creating a laser beam LB that is weaker than when cutting,
By irradiating the portion of the printed wiring board including the cut portion with the weak laser beam LB, the molten powder attached near the cut portion is removed.

By irradiating the printed wiring board portion including the cut portion with the weak laser beam LB in a plurality of times, the molten powder attached to the vicinity of the cut portion is divided and removed in a plurality of times. Is also good. Further, in the present invention, the laser beam LB is applied to the resin portion corresponding to the inner layer pattern portion to be cut on the printed wiring board PT having the inner layer pattern for the wiring covered with the resin by the laser beam irradiating means 2. First, the resin portion is volatilized and removed, and then the inner layer pattern portion to be cut is further irradiated with a laser beam LB to volatilize and remove the inner layer pattern portion to be cut.
Further thereafter, the laser beam LB is irradiated substantially perpendicularly to the edge of the recess formed after the removed resin portion,
By directly irradiating the laser beam LB to the wall of the recess, the molten powder attached to the wall of the recess is removed.

When the laser beam LB is directly applied to the wall of the recess, for example, the wall of the recess is irradiated with the laser beam LB obliquely, or after the printed wiring board PT is inclined, the wall of the recess is formed. Irradiation of the laser beam LB to the portion is performed. Further, according to the present invention, a printed wiring board PT having an inner layer pattern for wiring covered with resin is provided.
By irradiating the resin portion corresponding to the inner layer pattern portion to be cut with the laser beam LB, first, the resin portion is volatilized and removed, and then the inner layer pattern portion to be cut is further irradiated with the laser beam LB. When volatilizing and removing the inner layer pattern portion to be cut, the inner layer pattern portion is partially removed so that the cut inner layer pattern portion is partially exposed in a recess formed after the removed resin portion. Removed.

Further, the resin portion corresponding to the portion of the inner layer pattern to be cut in the printed wiring board PT having the inner layer pattern for the wiring covered with the resin is irradiated with the laser beam LB to first volatilize the resin portion. Then, the inner layer pattern portion to be cut is further irradiated with a laser beam LB to volatilize and remove the inner layer pattern portion to be cut, and then the resin portion is further volatilized and removed for the adjacent resin portion. After that, an operation of partially volatilizing and removing the inner layer pattern portion is performed at least once.

The removal of the resin part is as follows.
It is also possible to remove a wide area including the inner layer pattern portion to be cut. When the resin part is volatilized and removed, the resin part can be divided and removed by irradiating the laser beam LB in a plurality of times. Further, in this case, by irradiating the peripheral portion of the recess formed after the removed resin portion with a laser beam LB weaker than at the time of cutting, the molten powder adhered to this peripheral portion is removed. You can also.

[0018]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 2 is an overall configuration diagram of an embodiment of the present invention. In FIG. 2, reference numeral 1 denotes an XY stage as a printed wiring board moving table, and the XY stage 1 has a printed wiring board PT mounted thereon. The printed wiring board PT can be moved two-dimensionally (two-dimensionally). Note that this X
The Y stage 1 also has a Z stage, and can move the printed wiring board PT in the Z direction (vertical direction). Therefore, the position of the printed wiring board PT can be adjusted three-dimensionally.

The XY stage 1 is controlled by a stage controller (table control means) 11 so that the printed wiring board PT can be moved to a required position. Reference numeral 2 denotes a laser beam irradiation device (laser beam irradiation means). The laser beam irradiation device 2 irradiates a laser beam LB to a pattern portion to be cut on the printed wiring board PT on the XY stage 1. , This laser beam irradiation device 2
Is provided with a laser oscillator 21 and a laser beam masking device (laser beam masking means) 22. The laser beam irradiating device 2 further includes a laser controller 23,
A mask size controller (laser beam mask control means) 24 is connected.

Here, the laser oscillator 21 oscillates a laser beam LB, for example, YA capable of pulse oscillation.
G lasers and excimer lasers are used. The laser beam mask device 22 adjusts the irradiation range of the laser beam LB from the laser oscillator 21 by changing the opening lengths L and W. For example, as shown in FIG. The two mask plates 22-5, 2 for adjusting the opening length L of the mask by moving the screw 22-3 in the opposite direction by rotating the screw 22-3 with 1 as a driving source.
The two mask plates 22-2 for adjusting the opening length W of the mask by moving the screw 22-4 in the opposite direction by rotating the screw 22-4 with the motor 22-2 as a driving source while providing the motor 2-2. 7, 22-8.

The mask plates 22-5, 22-6; 22
-7 and 22-8 can move in opposite directions.
As shown in FIG. 3B, the screws 22-3;
A portion closer to one end from the center portion is configured as a right-handed screw, and a portion closer to the other end from the center portion is configured as a left-handed screw. The laser controller 23 controls the number of oscillations and output of the laser oscillator 21, and the mask size controller 24 adjusts and controls the opening lengths L and W of the laser beam mask device 22, and specifically, The laser beam mask device 22 is designed to reduce the laser beam irradiation area when cutting the pattern of the printed wiring board PT and increase the laser beam irradiation area when removing molten powder.
Is controlled.

Reference numeral 3 denotes a lens device (light condensing means) which condenses the laser beam from the laser beam mask device 22, and uses a convex lens or the like. The lens device 23 is configured to be able to move up and down, and the up and down state is controlled by a lens controller 31. In this case, reduction projection is performed under the following optical conditions.

1 / u + 1 / v = 1 / f (reduction ratio m = u / v) where u is the lens device 3 and the laser beam mask device 2
2, v is the distance between the lens device 3 and the printed wiring board PT, and f is the focal length of the lens device 3. The stage controller 11 and the laser controller 2
3. The mask size controller 24 and the lens controller 31 are controlled by the system controller 4. That is, in this case, it has a hierarchical control structure.

Next, a method of cutting a required pattern portion of the printed wiring board PT by changing the design using the present apparatus will be described. First, a description will be given of the cutting of a required pattern portion on the printed wiring board PT having a pattern for wiring formed on the surface. In this case, when the printed wiring board PT is set on the XY stage 1 and information to be cut (cutting position, direction, width, etc.) is input, the stage controller 11 moves the pattern 51 to be cut to the laser irradiation position. The XY stage 1 is driven to come.
Then, the mask opening length (L ×
W) is adjusted.

Thereafter, under the control of the laser controller 23, a laser beam LB having a predetermined number of pulses is irradiated from the laser oscillator 21 to a pattern portion to be cut on the printed wiring board PT, thereby obtaining a laser beam LB shown in FIG.
As shown by reference numeral 50 in (b), the pattern portion 51 is partially volatilized and removed. In this case, since the pattern of the printed wiring board PT is being cut, the mask size controller 24 controls the laser beam mask device 22 so that the laser beam irradiation area is reduced.

At this time, as shown in FIG.
In the vicinity of the cut portion, the molten powder A of copper or resin scatters and adheres to the substrate of the printed wiring board PT. Therefore, in this method, after the required pattern portion 51 is partially removed as described above, By irradiating the portion of the printed wiring board including the cut portion with a laser beam LB weaker than at the time of cutting, the molten powder A attached near the cut portion is removed.

In this case, the mask size controller 24
Control, the laser beam mask device 22 increases the mask opening length (L × L) so that the laser beam irradiation area is increased.
Adjust W). Note that the laser output does not change compared to the time of cutting. In this way, by expanding the laser beam irradiation range (see reference numeral LBRw in FIG. 4B), a laser beam LB weaker than that at the time of pattern cutting is produced without changing the laser output as compared with that at the time of cutting. By using a weak laser beam LB to intermittently irradiate the printed wiring board portion including the cut portion about ten times, for example, the molten powder A attached near the cut portion can be removed as shown in FIG. it can.

The laser beam irradiation range can also be increased by raising the lens position of the lens device 23 or moving the XY stage 1 in the Z direction (vertical direction). In this case, the lens controller 31 controls the lens device 3 so that the laser beam irradiation area can be reduced when the pattern is cut and the laser beam irradiation area can be increased when the molten powder is removed. The vertical position of the XY table 1 is controlled so that the laser beam irradiation area can be reduced when cutting, and the laser beam irradiation area can be increased when removing molten powder.

When the scattering range of the molten powder A is large, the printed wiring board portion including the cut portion 50
The weak laser beam LB is applied a plurality of times (in this case, three times; FIG. 4).
By dividing and irradiating the molten powder A, the molten powder A adhering to the vicinity of the cut portion 50 can be divided and removed a plurality of times. Since the molten powder A adhered at the time of cutting the pattern is removed by using the laser beam LB after the cutting, insulation failure does not occur between the cut patterns.

Next, cutting of a required inner layer pattern portion (for example, an inner power layer) in the printed wiring board PT having an inner layer pattern for wiring covered with a resin (glass epoxy resin) will be described. Also in this case, when the printed wiring board PT is set on the XY stage 1 and the information to be cut (cutting position, direction, width, etc.) is input, the stage controller 11 irradiates the portion corresponding to the inner layer pattern to be cut with laser. The XY stage 1 is driven to come to the position. Then, the opening length (L × W) of the mask is adjusted according to the cutting width. Assuming that this time is an initial state, the state of the printed wiring board PT at that time is as shown in FIGS. Reference numeral 53 in FIG. 5 indicates an inner power supply layer.

Thereafter, under the control of the laser controller 23, the laser beam LB having a predetermined number of pulses is output from the laser oscillator 21 as shown in FIGS. 4 (b) and 4 (B).
By irradiating the resin portion corresponding to the pattern to be cut on the printed wiring board PT, as shown in FIGS. 5C and 5C, the resin portion corresponding to the inner layer pattern portion to be cut is volatilized and removed. As a result, a recess 60 is formed, and an inner layer pattern portion 53A to be cut is exposed at the bottom of the recess 60.

Next, the inner layer pattern portion 53A to be cut
Is further irradiated with a laser beam LB, and FIG.
As shown in (D), the inner layer pattern portion 53 to be cut
A is volatilized and removed. In the above case, since the pattern of the printed wiring board PT is being cut, the mask size controller 24 controls the laser beam mask device 22 so that the laser beam irradiation area is reduced.

At this time, as shown in FIGS. 5D and 5D, the molten powder A of copper or resin scatters near the cut portion.
Since this adheres to the substrate of the printed wiring board PT, in the present method, after the required pattern portion is partially removed as described above, the printed wiring including the cut portion is used by using a laser beam LB weaker than at the time of cutting. By irradiating the plate portion, the molten powder A attached near the cut portion is removed.

That is, the mask size controller 24
Control, the laser beam mask device 22 increases the mask opening length (L × L) so that the laser beam irradiation area is increased.
Adjust W). Note that the laser output does not change compared to the time of cutting. As described above, by expanding the irradiation range of the laser beam (refer to the symbol LBRw in FIGS. 5E and 5E), the laser output is not changed as compared with the time of cutting, and the laser beam is weaker than at the time of pattern cutting. LB is produced, and the weak laser beam LB is used to intermittently irradiate the portion of the printed wiring board including the cut portion, so that the molten powder A attached near the cut portion is removed as shown in FIGS. 4 (f) and 4 (F). Can be removed.

In this case, also in this case, the lens device 2
By raising the lens position of No. 3 or moving the XY stage 1 in the Z direction (vertical direction), the irradiation area of the laser beam can be widened. When the scattering range of the molten powder A is large, the weak laser beam is applied to the printed wiring board portion including the peripheral portion of the recess 60 in a plurality of times in the same manner as described above. Alternatively, the molten powder A adhering to the peripheral portion can be removed by dividing it into plural times.

Accordingly, also in this case, since the molten powder A adhered at the time of cutting the pattern is removed by using the laser beam after cutting, no insulation failure occurs between the cut patterns. By the way, when the inner layer pattern covered with the resin is cut as in the above example, the molten powder of the scattered copper or resin is also applied to the wall portion 61 of the recess 60 formed after the removed resin portion. Since A adheres, it needs to be removed. Therefore, in this method, the molten powder A attached to the wall 61 of the recess 60 is removed by the following method.

That is, by irradiating the edge of the recess 60 formed after the removed resin portion substantially perpendicularly with the laser beam LB having a reduced area, the wall 6 of the recess 60 is irradiated.
1 is partially removed to remove the molten powder A attached to the wall portion 61 of the recess 60 (see FIGS. 6A to 6C). As still another means, the laser beam LB having a large area is directly applied to the wall portion 61 of the recess 60 formed after the removed resin portion, so that the laser beam LB adheres to the wall portion 61 of the recess 60. The molten powder A can also be removed.

In this case, the wall 61 of the recess 60 is irradiated with the laser beam LB obliquely, or the printed wiring board PT
The laser beam LB is directly applied to the wall 61 of the recess 60 by tilting the laser beam LB. First, recess 6
When the laser beam LB is obliquely applied to the wall 61 of the laser beam mask 0, as shown in FIG.
Half mirrors 7-1 and 7-2 and mirror 7-3 on the exit side
7 to 5-5 are arranged, and lenses 3-1 to 3-3 for condensing light from three directions respectively constitute a lens device 3.
Thus, when cutting the pattern, the middle lens 3-2
The mirror is adjusted so that the laser beam LB is irradiated onto the printed wiring board PT through the
To remove the molten powder A attached to the
The mirror is adjusted so that the laser beam LB is directly applied to the wall 61 of the recess 60 through -1 and 3-2. FIG. 9 schematically shows the state at this time.
(A) to (c). FIG. 9A shows a state in which the molten powder A is not removed after the pattern is cut, and FIG. 9B shows a state where the laser beam LB is applied to the wall 6 of the recess 60.
FIG. 9C shows a state in which the molten powder A attached to the wall portion 61 of the recess 60 is removed by irradiating the molten powder A obliquely to FIG. Shows the state after removing.

Next, a case will be described in which the printed wiring board PT is inclined so that the wall 61 of the recess 60 is directly irradiated with a laser beam. In this case, a jig 8 for tilting the printed wiring board PT is provided on the XY stage 1 as shown in FIG. Thereby, when cutting the pattern, the jig 8 is made horizontal so that the laser beam LB is irradiated onto the printed wiring board PT, and the molten powder A attached to the wall 61 of the recess 60 is further removed. Is to incline the jig 8 so that the laser beam LB is directly applied to the wall 61 of the recess 60. In FIG. 10, reference numeral 7 denotes a mirror device for changing the direction of the laser beam. And when this situation is schematically shown,
The results are as shown in FIGS. Note that FIG.
10A shows a state in which the molten powder A is not removed after the pattern is cut, and FIGS. 10B and 10C show a case where the laser beam LB is obliquely irradiated onto the wall 61 of the recess 60 to form a recess. Place 60
10D shows a state where the molten powder A attached to the wall 61 of the recess 60 is removed, and FIG. 10D shows a state after the molten powder A attached to the wall 61 of the recess 60 is removed. .

When the inner layer pattern covered with the resin is cut in this way, the scattered molten powder A adheres to the wall 61 of the recess 60 formed after the removed resin portion. Since the molten powder A is also removed using the laser beam LB after cutting, no insulation failure occurs between the cut inner layer patterns. In the above case, either of the operation of removing the molten powder A attached to the peripheral portion of the recess 60 of the printed wiring board PT and the operation of removing the molten powder A attached to the wall portion 61 of the recess 60, May be performed first.

Here, regarding the above example, a thickness of 50 μm,
Table 1 shows an example of laser conditions when a wiring pattern having a width of 0.12 mm is cut at a width of 0.3 mm.

[0042]

[Table 1]

Another example of cutting a required inner layer pattern portion (for example, an inner power supply layer) in a printed wiring board having an inner layer pattern for wiring covered with a resin will be described. That is, also in this case, when the printed wiring board PT is set on the XY stage 1 and information to be cut (cutting position, direction, width, etc.) is input, the stage controller 11 determines the portion corresponding to the inner layer pattern to be cut. The XY stage 1 is driven to come to the laser irradiation position. Then, the opening length of the mask (L
× W) is adjusted. Assuming that this time is an initial state, the state of the printed wiring board PT at that time is shown in FIG.
(A).

Thereafter, under the control of the laser controller 23, the laser beam LB having a predetermined pulse number from the laser oscillator 21 should be cut on the printed wiring board PT as shown in FIGS. 12 (b) and 12 (B). By irradiating the resin portion corresponding to the pattern, FIGS.
As shown in 1) and (C2), the resin portion corresponding to the inner layer pattern portion to be cut is volatilized and removed. As a result, a recess 60 is formed, and an inner layer pattern portion 53A to be cut is exposed at the bottom of the recess 60. At this time, regarding the removal of the resin portion, a wide range including the inner layer pattern portion 53A to be cut (if the size of the inner layer pattern portion 53A to be cut is L1 × W1, the removal range of the resin portion is (3 × L1) × W1) is removed. As a result, in the next inner layer pattern cutting process, the space area where the molten powder A scatters is widened, so that the amount of the molten powder A adhering to the processing hole wall surface 61 is reduced, thereby improving the insulation quality.

FIG. 13 shows a method for removing the resin portion.
As shown in FIG. 13A, there are a method in which the irradiation range is made to match the removal range, and a method in which the irradiation range is made smaller than the removal range as shown in FIG. 13B. If Figure 13
As shown in (b), if the resin portion is divided and removed, the amount of energy input to the printed wiring board PT can be reduced (in this example, it can be reduced to 1/3).
It has little thermal effect on the resin part and contributes to reduction of carbonization. FIG. 13C shows the inner layer pattern 5 after the resin portion is removed.
3A shows a state where it is exposed.

Thereafter, the inner layer pattern portion to be cut is further irradiated with a laser beam LB as shown in FIG. 12 (C2), and as shown in FIGS. The inner layer pattern portion is partially removed so that the cut inner layer pattern portion is partially exposed in the recess 60 formed after the step. In the above case, since the pattern of the printed wiring board PT is being cut, the mask size controller 24 controls the laser beam mask device 22 so that the laser beam irradiation area is reduced.

When cutting the inner layer pattern covered with the resin as described above, the cut portion of the inner layer pattern is partially exposed in the recess 60 as shown by reference numerals 53A-1 and 53A-2. In addition, since the inner layer pattern portion is partially removed, it is easy to visually check the cutting. Then, also at this time, as shown in FIGS.
In the vicinity of the cut portion, the molten powder A of copper or resin scatters and adheres to the substrate of the printed wiring board PT. Therefore, in the case of the present method, after the required pattern portion is partially removed as described above. By irradiating the portion of the printed wiring board including the cut portion with a laser beam LB weaker than at the time of cutting, the molten powder A attached near the cut portion is removed.

That is, the mask size controller 24
Control, the laser beam mask device 22 increases the mask opening length (L × L) so that the laser beam irradiation area is increased.
Adjust W). Note that the laser output does not change compared to the time of cutting. In this way, the irradiation area of the laser beam LB is increased in area (see LBRw in FIGS. 12E and 12E).
By doing so, a laser beam LB that is weaker than at the time of pattern cutting is created without changing the laser output compared with that at the time of cutting,
By using the weak laser beam LB to intermittently irradiate the printed wiring board portion including the cut portion, the molten powder A attached near the cut portion can be removed as shown in FIGS. 12 (f) and 12 (F). You can.

Also in this case, by increasing the lens position of the lens device 23 or moving the XY stage 1 in the Z direction (vertical direction), the irradiation range of the laser beam can be increased. it can. When the scattering range of the molten powder A is large, as in the case described above, the printed wiring board portion including the peripheral portion of the recess 60 is
By irradiating the weak laser beam LB in a plurality of times, the molten powder A attached to the peripheral portion can be removed in a plurality of times. Further, also in this example, the edge of the concave portion 60 formed after the removed resin portion is provided.
By irradiating the laser beam substantially vertically, the recess 60 is formed.
The wall portion 61 of the recess 60 is partially scraped to remove the molten powder A adhered to the wall portion 61 of the recess 60, the wall portion 61 of the recess 60 is irradiated with a laser beam obliquely, By inclining the PT or directly irradiating the wall 61 of the recess 60 with a laser beam, the molten powder A attached to the wall 61 of the recess 60 can be removed.

In this case, since the resin portion is removed over a wide area including the inner layer pattern portion to be cut, the space area where the molten powder A scatters is widened. 12 and the amount of the molten powder A scattered around the recess is reduced.
The cleaning operation shown in (e) and (E) can be omitted.

Here, regarding the above example, it is located at a depth of 0.2 mm from the substrate surface, and has a thickness of 50 μm and a width of 0.1 mm.
Table 2 shows an example of laser conditions when the inner layer pattern having 4 mm is cut at a width of 0.2 mm.

[0052]

[Table 2]

Next, still another example of cutting a required inner layer pattern portion (for example, an inner power layer) in a printed wiring board having an inner layer pattern for wiring covered with resin will be described. That is, also in this case, when the printed wiring board PT is set on the XY stage 1 and information to be cut (cutting position, direction, width, etc.) is input, the stage controller 11 determines the portion corresponding to the inner layer pattern to be cut. The XY stage 1 is driven to come to the laser irradiation position. Then, the opening length (L × W) of the mask is adjusted according to the cutting width. If this time is the initial state,
The state of the printed wiring board PT at that time is as shown in FIG.

Thereafter, under the control of the laser controller 23, the laser beam LB having a predetermined number of pulses from the laser oscillator 21 is applied to the printed circuit board PT, as shown in FIG. As shown in FIG. 14C, the resin portion corresponding to the inner layer pattern portion to be cut is volatilized and removed. As a result, a recess 60 is formed, and an inner layer pattern portion 53A to be cut is formed at the bottom of the recess 60.
Is exposed.

Next, a laser beam is further applied to the inner layer pattern portion to be cut, and as shown in FIG. 14D, a recess formed after the resin portion from which the cut inner layer pattern portion has been removed. The inner layer pattern portion 5 is so exposed as to be partially exposed inside 60 (see reference numerals 53A-1 and 53A-2).
3A is partially removed. Thereafter, for the adjacent resin portion, an operation of volatilizing and removing the resin portion and then partially volatilizing and removing the inner layer pattern portion is performed at least once (in this case, twice) (FIG. 14E). ~
(J)).

In the above case, since the pattern of the printed wiring board PT is being cut, the mask size controller 24 controls the laser beam mask device 22 so that the laser beam irradiation area is reduced. When the inner layer pattern covered with the resin is cut in this way, at least twice the operation of volatilizing and removing the resin portion of the adjacent resin portion and then partially volatilizing and removing the inner layer pattern portion is performed. Therefore, the influence of the scattered molten powder can be reduced.

Also in this case, as a method of removing the resin portion, a method of performing the irradiation range so as to match the removal range as shown in FIG. 13A and a method of removing the irradiation range as shown in FIG. There is a method in which the size is made smaller than the removal range.
Also, at this time, after the required pattern portion is partially removed as described above, the printed wiring board portion including the cut portion is irradiated by using a laser beam weaker than at the time of cutting, so that the portion near the cut portion is adhered. The removed molten powder A is removed.

That is, the mask size controller 24
Control, the laser beam mask device 22 increases the mask opening length (L × L) so that the laser beam irradiation area is increased.
Adjust W). Note that the laser output does not change compared to the time of cutting. As described above, by expanding the irradiation range of the laser beam, a laser beam that is weaker than that at the time of pattern cutting is produced without changing the laser output as compared with that at the time of cutting, and the cut portion is included using the weak laser beam LB. By intermittently irradiating the printed wiring board portion, the molten powder A adhered to the vicinity of the cut portion can be removed. Note that, in this case, the laser beam whose irradiation range is widened is assumed to be sequentially irradiated for each of the three recesses 60,
It is also possible to irradiate three recesses at a time.
Conversely, by irradiating the weak laser beam LB in a plurality of times with respect to one recess 60, it is of course possible to divide and remove the molten powder A attached near the recess 60 in a plurality of times. .

Also in this case, the irradiation area of the laser beam can be widened by raising the raise position of the lens device 23 or moving the XY stage 1 in the Z direction (vertical direction). it can. Further, also in this example, the recess 6 formed after the removed resin portion is used.
By irradiating the laser beam LB substantially perpendicularly to the edge of the recess 0, the wall 61 of the recess 60 is partially scraped to remove the molten powder A attached to the wall 61 of the recess 60. By irradiating the laser beam LB obliquely to the wall portion 61 of the recess 60 or inclining the printed wiring board PT,
By irradiating the laser beam LB directly to the wall 61 of the recess 60, the molten powder A attached to the wall 61 of the recess 60 may be removed.

In this case as well, the removal of the resin portion is performed over a wide area including the inner layer pattern portion to be cut, so that the space area where the molten powder A scatters is widened, whereby the wall surface of the processed hole is removed. Since the amount of the molten powder A scattered around 61 and the vicinity of the recess is reduced, the cleaning operation performed by expanding the irradiation range of the laser beam can be omitted as necessary.

In each of the above examples, the laser controller 23 lowers the laser output compared with the time of pattern cutting, thereby producing a laser beam weaker than that at the time of pattern cutting. By irradiating the printed wiring board portion including the molten powder, the molten powder attached to the vicinity of the cut portion may be removed.

[0062]

As described above, according to the method and apparatus for cutting a printed wiring board using a laser of the present invention, the following effects and advantages can be obtained. (1) Since the molten powder adhering at the time of pattern cutting is removed using a laser beam after cutting, insulation failure does not occur between the cut patterns. (2) When cutting the inner layer pattern covered with the resin, the scattered molten powder adheres to the wall of the recess formed after the removed resin portion. Since removal is performed using a beam, insulation failure does not occur between the cut inner layer patterns. (3) When cutting the inner layer pattern covered with the resin, the resin portion is removed over a wide area including the inner layer pattern portion to be cut. The scattered space area becomes large, whereby the amount of the molten powder adhering to the wall surface of the processing hole is reduced, and the insulation quality is improved. (4) When cutting the inner layer pattern covered with resin,
Since the portion of the inner layer pattern is partially removed so that the portion of the inner layer pattern after cutting is partially exposed in the recess formed after the removed resin portion, the cutting check by visual inspection becomes easy. (5) When cutting the inner layer pattern covered with resin,
Since the operation of volatilizing and removing the resin portion of the adjacent resin portion and then partially volatilizing and removing the inner layer pattern portion is performed at least twice, the influence of the scattered molten powder can be reduced. (6) Since the resin portion is divided and removed, the amount of energy input to the printed wiring board can be reduced, thereby reducing the thermal effect on the resin portion and contributing to the reduction of carbonization.

[Brief description of the drawings]

FIG. 1 is a principle block diagram of the present invention.

FIG. 2 is an overall configuration diagram showing one embodiment of the present invention.

3A and 3B are views showing a laser beam mask apparatus, in which FIG. 3A is a schematic view showing the overall configuration, and FIG. 3B is a partial view of a screw for driving a mask plate (an IIIb partial enlarged view of FIG. 3A). is there.

FIG. 4 is a diagram illustrating the present method.

FIG. 5 is a diagram illustrating the present method.

FIG. 6 is a diagram illustrating the present method.

FIG. 7 is a diagram illustrating the present method.

FIG. 8 is a schematic view of an apparatus for performing the method.

FIG. 9 is a diagram illustrating the present method.

FIG. 10 is a schematic diagram of an apparatus for performing the method.

FIG. 11 is a diagram illustrating the present method.

FIG. 12 is a diagram illustrating the present method.

FIG. 13 is a diagram illustrating the present method.

FIG. 14 is a diagram illustrating the present method.

FIG. 15 is a diagram illustrating a conventional problem.

FIG. 16 is a diagram illustrating a conventional problem.

[Explanation of symbols]

Reference Signs List 1 XY stage (printed wiring board moving table) 2 Laser beam irradiation device (laser beam irradiation unit) 3 Lens device (condensing unit) 3-1 to 3-3 Lens 4 System controller 7 Mirror device 7-1, 7-2 Barf mirror 7-3 to 7-5 Barf mirror 8 Jig 11 Stage controller (table control means) 21 Laser oscillator 22 Laser beam mask device (Laser beam mask means) 22-1, 22-2 Motor 22-3, 22-4 Screw 22-5 to 22-8 Mask Plate 23 Laser Controller (Laser Oscillator Control Means) 24 Mask Size Controller (Laser Beam Mask Control Means) 31 Lens Controller (Condensing Control Means) 50 Pattern Cutting Unit 51 Wiring Pattern 53 Inner Power Supply Layer ( Inner layer pattern) 53A Inner layer pattern cutting Part 60 recess 61 wall part A molten powder LB laser beam PT printed wiring board

Claims (17)

(57) [Claims] 1. A pattern portion to be cut on a printed wiring board (PT) having a pattern for wiring formed on its surface is irradiated with a laser beam (LB) to volatilize the pattern portion to be cut. Irradiating a portion of the printed wiring board including the cut portion with a laser beam (LB) that is weaker than at the time of cutting to remove molten powder attached near the cut portion; A method for cutting a pattern of a printed wiring board using the method. 2. A laser beam (LB) weaker than at the time of cutting is produced without increasing a laser output at the time of cutting by increasing the irradiation area of the laser beam (LB). 2. A printed wiring board using a laser according to claim 1, wherein a portion of the printed wiring board including the cut portion is irradiated by using (LB) to remove molten powder attached near the cut portion. Pattern cutting method. 3. A laser beam (LB) weaker than at the time of cutting is produced by lowering the laser output as compared with the time of cutting, and a portion of the printed wiring board including a cut portion is irradiated using the weak laser beam (LB). 2. A method for cutting a pattern of a printed wiring board using a laser according to claim 1, wherein the molten powder attached to the vicinity of the cut portion is removed. 4. A printed circuit board portion including the cut portion is irradiated with the weak laser beam (LB) a plurality of times to divide the molten powder attached to the vicinity of the cut portion into a plurality of times. 2. The method according to claim 1, wherein the removing is performed.
A method for cutting a pattern of a printed wiring board using the laser according to claim 3. 5. A laser beam (LB) is first irradiated on a resin portion corresponding to an inner layer pattern portion to be cut in a printed wiring board (PT) having an inner layer pattern for wiring covered with resin. The resin portion is volatilized and removed, and then the inner layer pattern portion to be cut is further irradiated with a laser beam (LB) to volatilize and remove the inner layer pattern portion to be cut. Irradiating a laser beam (LB) substantially perpendicularly to the edge of the recess formed in the recess to remove molten powder adhering to the wall of the recess, the printed wiring using a laser. How to cut the pattern of the board. 6. A laser beam (LB) is first applied to a resin portion corresponding to an inner layer pattern portion to be cut in a printed wiring board (PT) having an inner layer pattern for wiring covered with resin. The resin portion is volatilized and removed, and then the inner layer pattern portion to be cut is further irradiated with a laser beam to volatilize and remove the inner layer pattern portion to be cut, and formed after the removed resin portion. Irradiating a laser beam (LB) to a wall of the recess to remove molten powder adhering to the wall of the recess, using a laser to cut a pattern of a printed wiring board. 7. The laser according to claim 6, wherein the laser beam (LB) is obliquely applied to the wall of the recess to remove molten powder attached to the wall of the recess. A method for cutting a pattern of a printed wiring board using the method. 8. After the printed wiring board (PT) is tilted, a laser beam (LB) is applied to the wall of the recess to remove the molten powder attached to the wall of the recess. 7. The method for cutting a pattern of a printed wiring board using a laser according to claim 6, wherein: 9. A laser beam (LB) is first irradiated on a resin portion corresponding to an inner layer pattern portion to be cut in a printed wiring board (PT) having an inner layer pattern for wiring covered with resin. When the resin portion is volatilized and removed, and then the inner layer pattern portion to be cut is irradiated with a laser beam to volatilize and remove the inner layer pattern portion to be cut, it is formed after the removed resin portion. A pattern cutting method for a printed wiring board using a laser, wherein the inner layer pattern portion is partially removed so that the cut portion of the inner layer pattern portion is partially exposed in the recess. 10. A laser beam (LB) is first irradiated on a resin portion corresponding to an inner layer pattern portion to be cut in a printed wiring board (PT) having an inner layer pattern for wiring covered with a resin. After volatilizing and removing the resin portion, and then irradiating the inner layer pattern portion to be cut with a laser beam (LB) to volatilize and remove the inner layer pattern portion to be cut, for the adjacent resin portion, A method of cutting a pattern of a printed wiring board using a laser, comprising performing at least once an operation of volatilizing and removing a resin portion and then partially volatilizing and removing an inner layer pattern portion. 11. The pattern of a printed wiring board using a laser according to claim 10, wherein the resin portion is removed over a wide range including an inner layer pattern portion to be cut. Cutting method. 12. When volatilizing and removing the resin portion,
The laser according to any one of claims 5, 6, 9, and 10, wherein the resin portion is divided and removed by irradiating the laser beam (LB) a plurality of times. A method for cutting the pattern of printed wiring boards. 13. A laser beam (L) weaker than at the time of cutting.
6. The method according to claim 5, further comprising: irradiating a peripheral portion of the recess formed after the removed resin portion by using B) to remove molten powder attached to the peripheral portion.
A method for cutting a pattern of a printed wiring board using the laser according to any one of 6, 9, and 10. 14. A printed wiring board moving table (1) on which a printed wiring board (PT) can be placed and on which the printed wiring board (PT) can be moved, and the print on the printed wiring board moving table (1). Laser beam irradiating means (2) for irradiating a laser beam (LB) to a pattern portion to be cut on a wiring board (PT)
The laser beam irradiating means (2) comprises a laser oscillator and a laser beam masking means for adjusting a laser beam irradiating range from the laser oscillator. A laser beam mask control means (24) for controlling the laser beam mask means so as to reduce the irradiation area and increase the laser beam irradiation area when removing the molten powder is provided. Pattern cutting equipment for printed wiring boards. 15. A printed wiring board moving table (1) on which a printed wiring board (PT) can be placed and on which the printed wiring board (PT) can be moved, and the print on the printed wiring board moving table (1). Laser beam irradiating means (2) for irradiating a laser beam (LB) to a pattern portion to be cut on a wiring board (PT)
And a table control means for controlling the vertical position of the printed wiring board moving table (1) so that the laser beam irradiation area can be reduced when the pattern is cut and the laser beam irradiation area can be increased when the molten powder is removed. 11) A pattern cutting apparatus for a printed circuit board using a laser, wherein the apparatus is provided with 11). 16. A printed wiring board moving table (1) on which a printed wiring board (PT) can be placed and on which the printed wiring board (PT) can be moved, and the print on the printed wiring board moving table (1). Laser beam irradiating means (2) for irradiating a laser beam (LB) to a pattern portion to be cut on a wiring board (PT)
And a laser beam (L) from the laser beam irradiation means (2).
A light condensing means (3) for condensing B) on the printed wiring board (PT), so that the laser beam irradiation area can be reduced when the pattern is cut and the laser beam irradiation area can be increased when the molten powder is removed. A pattern cutting device for a printed wiring board using a laser, wherein a light collecting control means (31) for controlling the light collecting means (3) is provided. 17. A printed wiring board moving table (1) on which a printed wiring board (PT) can be placed to move the printed wiring board (PT) in a plane, and on the printed wiring board moving table (1). A laser beam irradiating means (2) for irradiating a laser beam (LB) to a pattern portion to be cut on said printed wiring board (PT)
The laser beam irradiating means (2) is provided with a laser oscillator whose output can be adjusted. The output of the laser oscillator is increased when cutting the pattern, and the output of the laser oscillator is used when removing the molten powder. Laser oscillator control means (2) for controlling the output of the laser oscillator so that
3. A pattern cutting device for printed wiring boards using a laser, wherein 3) is provided.