JPH05327153A - Wiring substrate and inspecting method thereof - Google Patents
Wiring substrate and inspecting method thereofInfo
- Publication number
- JPH05327153A JPH05327153A JP13102792A JP13102792A JPH05327153A JP H05327153 A JPH05327153 A JP H05327153A JP 13102792 A JP13102792 A JP 13102792A JP 13102792 A JP13102792 A JP 13102792A JP H05327153 A JPH05327153 A JP H05327153A
- Authority
- JP
- Japan
- Prior art keywords
- conductive paste
- conductive
- wiring board
- glass substrate
- mixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Landscapes
- Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は液晶表示板など基板に配
線され、その端子部に導電性ペーストが塗布されて外部
リードが接続される配線基板に関する。さらに詳しく
は、前記端子部に塗布される導電性ペーストの塗布状態
を検査し易くした配線基板およびその検査法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board in which wiring is provided on a substrate such as a liquid crystal display panel and a terminal portion thereof is coated with a conductive paste to connect external leads. More specifically, the present invention relates to a wiring board that makes it easier to inspect the application state of a conductive paste applied to the terminal portion, and an inspection method therefor.
【0002】[0002]
【従来の技術】従来、たとえば液晶表示素子のガラス基
板には各セグメント電極およびその引出配線が透明導電
膜で形成され、ガラス基板の側縁部に端子部が形成さ
れ、リードピンを介して外部リードと電気的接続され
る。そのため、リードピンと導電膜との電気的接触を良
好にするため、端子部に導電性ペースト(カーボンペー
スト)がピン転写などにより塗布される。2. Description of the Related Art Conventionally, for example, on a glass substrate of a liquid crystal display element, each segment electrode and its lead wiring are formed of a transparent conductive film, a terminal portion is formed on a side edge portion of the glass substrate, and an external lead is provided via a lead pin. Electrically connected to. Therefore, in order to improve electrical contact between the lead pin and the conductive film, a conductive paste (carbon paste) is applied to the terminal portion by pin transfer or the like.
【0003】この導電性ペーストの塗布状態が充分でな
いとリードピンとの電気的接続の信頼性が低下するた
め、塗布後CCDカメラなどで塗布状態をチェックし、
良品のものだけリードピンが挿入されて導電性ペースト
が乾燥される。ついでリードピンの先端部に紫外線硬化
樹脂などの補強材を塗布して硬化させ、リードピンが各
電極端子部の導電膜と充分に電気的接続されると共に固
着される。この導電性ペーストの塗布状態のチェック
は、前述のようにたとえばCCDカメラで反射光による
認識パターンにより、認識されたパターンの形状、位置
により良否が判定される。この認識パターンは、たとえ
ば図5の(a)、(b)に示されるように、導電性ペー
ストが塗布された場所だけ、光が吸収されて反射しない
ため、導電性ペーストの形状と同じ形状のパターン14が
認識される。すなわち、図5(a)はガラス基板11に形
成されたITOなどの導電膜12の端部に導電性ペースト
13が塗布された状態を示し、図5(b)はカメラにより
認識された認識パターン14を示している。If the applied state of this conductive paste is not sufficient, the reliability of the electrical connection with the lead pin will be reduced, so the applied state is checked with a CCD camera or the like after application.
Only the good ones are inserted with lead pins and the conductive paste is dried. Then, a reinforcing material such as an ultraviolet curable resin is applied to the tip end portion of the lead pin and hardened, so that the lead pin is sufficiently electrically connected and fixed to the conductive film of each electrode terminal portion. As to the check of the application state of the conductive paste, as described above, the quality is judged by the shape and position of the recognized pattern by the recognition pattern by the reflected light by the CCD camera, for example. For example, as shown in FIGS. 5A and 5B, this recognition pattern has the same shape as the shape of the conductive paste because light is not absorbed and reflected only in the place where the conductive paste is applied. Pattern 14 is recognized. That is, FIG. 5A shows that a conductive paste is formed on the end of the conductive film 12 such as ITO formed on the glass substrate 11.
13 shows the applied state, and FIG. 5B shows the recognition pattern 14 recognized by the camera.
【0004】[0004]
【発明が解決しようとする課題】従来の導電性ペースト
の塗布状態の検査法では、たとえば図5(a)のように
ガラス基板の表面が平滑で異物のないときはCCDカメ
ラにより導電性ペーストのみが認識され、図5(b)に
示すような導電性ペーストのパターンがえられる。しか
し、ガラス基板の表面に図5(c)のように、きず、欠
けなどの欠陥15があったり、異物16が付着していると、
CCDカメラによる認識パターンは図5(d)に示すよ
うにガラス基板の欠陥や異物のパターン17、18も含んだ
認識となり、誤判定を生じる。According to the conventional method for inspecting the applied state of the conductive paste, when the surface of the glass substrate is smooth and there is no foreign matter as shown in FIG. Is recognized, and a pattern of the conductive paste as shown in FIG. 5B is obtained. However, if the surface of the glass substrate has a defect 15 such as a flaw or a chip as shown in FIG.
As shown in FIG. 5D, the recognition pattern by the CCD camera is a recognition including the patterns 17 and 18 of defects and foreign substances on the glass substrate, resulting in erroneous determination.
【0005】ガラス基板に目視によって確認できないよ
うな、きずなどの欠陥は実用上問題ないが、CCDカメ
ラによる検査では、これらの有無を事前にチェックする
ことは容易でないうえに、良品を不良と判定するなどの
認識能力を低下させ、導電性ペーストの塗布状況の判定
を誤判定に至らしめるという問題が生じる。Defects such as flaws which cannot be visually confirmed on the glass substrate are practically no problem. However, it is not easy to check the presence or absence of these in advance by a CCD camera, and a good product is determined to be defective. However, there is a problem in that the recognition ability such as that of the conductive paste is deteriorated, and the determination of the application status of the conductive paste is erroneously determined.
【0006】本発明の目的は叙上の問題を解消し、ガラ
ス基板など配線基板の微妙な欠陥の有無にかかわらず、
容易にかつ良好に導電性ペーストの塗布状態の認識を可
能にする配線基板およびその検査法を提供することであ
る。The object of the present invention is to solve the above problems and to solve the above problems regardless of the presence or absence of subtle defects in a wiring substrate such as a glass substrate.
It is an object of the present invention to provide a wiring board and a method of inspecting the wiring board, which enables easy and good recognition of the coating state of the conductive paste.
【0007】[0007]
【課題を解決するための手段】本発明による配線基板
は、表面に導電電極膜が形成され、該導電電極膜の端子
部に導電性ペーストが塗布されて外部リードと接続し易
くする配線基板であって、前記導電性ペーストに紫外線
により発光する発光体が混入されていることを特徴とす
るものである。A wiring board according to the present invention is a wiring board in which a conductive electrode film is formed on a surface, and a conductive paste is applied to a terminal portion of the conductive electrode film to facilitate connection with an external lead. It is characterized in that a light emitting body which emits light by ultraviolet rays is mixed in the conductive paste.
【0008】また、本発明による液晶表示素子は、ガラ
ス基板に液晶表示素子の各セグメント電極およびそれら
の電極配線が透明導電膜で形成され、該透明導電膜の端
子部に導電性ペーストが塗布されるガラス基板を有する
液晶表示素子であって、前記導電性ペーストに紫外線に
より発光する発光体が混入されていることを特徴とする
ものである。Further, in the liquid crystal display device according to the present invention, each segment electrode of the liquid crystal display device and their electrode wiring are formed of a transparent conductive film on a glass substrate, and a conductive paste is applied to the terminal portion of the transparent conductive film. A liquid crystal display element having a glass substrate according to claim 1, wherein the conductive paste is mixed with a luminous body that emits light by ultraviolet rays.
【0009】さらに、本発明による配線基板の検査法
は、配線基板の表面に導電電極膜が形成され、該導電電
極膜の端子部に塗布された導電性ペーストの塗布状態を
検査する配線基板の検査法であって、前記導電性ペース
トに紫外線で発光する発光体が混入され、該発光体に適
した波長の紫外線を照射しながらCCDカメラで検査す
ることを特徴とするものである。Further, in the method for inspecting a wiring board according to the present invention, a conductive electrode film is formed on the surface of the wiring board, and a wiring board for inspecting the application state of the conductive paste applied to the terminal portion of the conductive electrode film is inspected. An inspection method is characterized in that a light emitting body that emits ultraviolet rays is mixed into the conductive paste, and the conductive paste is inspected by a CCD camera while irradiating ultraviolet rays having a wavelength suitable for the light emitting body.
【0010】[0010]
【作用】本発明によれば、端子部に塗布する導電性ペー
ストに蛍光体など紫外線により発光する発光体が混入さ
れているため、カメラから紫外線が照射されることによ
り、導電性ペーストのみから光が発射され、他のガラス
基板などのきずや異物など配線基板の表面の状態に影響
されることなく導電性ペーストの塗布状態のみを検査で
きる。その結果、正確にしかも簡単に導電性ペーストの
塗布状態を判定でき、誤判定を防止できる。また発光体
の混入割合を調整することにより導電性が低下すること
はない。According to the present invention, since the conductive paste applied to the terminal portion is mixed with the luminous body such as a fluorescent body that emits light by ultraviolet rays, when the ultraviolet rays are radiated from the camera, the light is emitted from only the conductive paste. Is emitted, and only the applied state of the conductive paste can be inspected without being affected by the state of the surface of the wiring substrate such as scratches and foreign substances on other glass substrates. As a result, the applied state of the conductive paste can be accurately and easily determined, and erroneous determination can be prevented. In addition, the conductivity is not lowered by adjusting the mixing ratio of the light emitting body.
【0011】[0011]
【実施例】つぎに、図面を参照しながら本発明の配線基
板を説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, a wiring board of the present invention will be described with reference to the drawings.
【0012】図1は本発明の一実施例である液晶表示素
子のガラス基板にリードピンが固着された状態を示す斜
視図、図2は図1の装置の一部省略断面図、図3は本発
明の液晶表示素子の基板を形成する組立工程の説明図、
図4は本発明の一実施例の導電性ペーストの認識パター
ンを示す説明図である。FIG. 1 is a perspective view showing a state in which lead pins are fixed to a glass substrate of a liquid crystal display device according to an embodiment of the present invention, FIG. 2 is a sectional view of the device of FIG. 1 with a part thereof omitted, and FIG. Explanatory drawing of an assembly process for forming a substrate of a liquid crystal display device of the invention,
FIG. 4 is an explanatory view showing a recognition pattern of the conductive paste according to the embodiment of the present invention.
【0013】図1および図2に示す液晶表示素子の基板
はガラス基板1上に液晶表示素子の各セグメント電極お
よびその配線の透明導電電極膜3が形成され、その上面
には対向する第2のガラス基板2が配置される。各透明
導電電極膜3はガラス基板1の側縁部に導出され、その
端子部3aにリードピン5を電気的接続するため、導電
性ペースト4が塗布される。本発明ではこの導電性ペー
スト4に特徴があるが、この液晶表示素子の基板の組立
について図3を参照しながら説明する。In the substrate of the liquid crystal display element shown in FIGS. 1 and 2, each segment electrode of the liquid crystal display element and the transparent conductive electrode film 3 of its wiring are formed on a glass substrate 1, and a second opposing electrode is formed on the upper surface thereof. The glass substrate 2 is arranged. Each transparent conductive electrode film 3 is led out to the side edge portion of the glass substrate 1, and a conductive paste 4 is applied to electrically connect the lead pin 5 to the terminal portion 3a. Although the present invention is characterized by the conductive paste 4, the assembly of the substrate of the liquid crystal display element will be described with reference to FIG.
【0014】最初にガラス基板1上にセグメント電極な
ど各電極膜およびその配線膜がITOなどの透明導電電
極膜3で蒸着法、パターニングにより形成され、その端
子部3aがガラス基板1の側縁部に導出され、ガラス基
板1の上部に対向する第2のガラス基板2が配置され
る。この端子部3aにカーボンをブチルセロソルブなど
の溶剤でペースト状にしたカーボンペーストなどの導電
材にZnS:Cu(ZnSにCuをドープしたものを表
わす、以下同じ)などの紫外線励起型の蛍光体を重量比
で20%以内混入した導電性ペースト4を塗布する(図3
(a))。この塗布はスクリーン印刷法などによりなさ
れる。つぎにCCDカメラにより導電性ペースト4の塗
布状態を検査する(図3(b))。この検査法に特徴が
あり、あとで詳細に説明する。つぎに所望の塗布状態が
えられているとき、導電性ペースト4を塗布した場所に
リードフレームで形成された概略C字状の断面形状を有
するリードピン5が挟着され、導電性ペーストが乾燥さ
れる(図3(c))。なお、リードピン5はリード部5
aに連結され、複数個の各々のリード部5aはタイバー
8により連結されている(図3(d))。つぎにリード
ピン5によって挟まれた箇所に紫外線硬化樹脂などの補
強材9が塗布され、補強材9を硬化したのちタイバー8
とリード部5aとを切り離し、電気的特性が検査される
(図3(e))。First, each electrode film such as a segment electrode and its wiring film are formed on the glass substrate 1 by a vapor deposition method and patterning with a transparent conductive electrode film 3 such as ITO, and its terminal portion 3a is a side edge portion of the glass substrate 1. The second glass substrate 2 which is led out to the upper side of the glass substrate 1 and is opposed to the glass substrate 1 is arranged. An ultraviolet excitation type phosphor such as ZnS: Cu (representing ZnS doped with Cu, the same applies hereinafter) is used as a conductive material such as carbon paste in which carbon is pasted with a solvent such as butyl cellosolve for the terminal portion 3a. Apply the conductive paste 4 mixed within 20% (Fig. 3)
(A)). This application is performed by a screen printing method or the like. Next, the coated state of the conductive paste 4 is inspected by the CCD camera (FIG. 3 (b)). This inspection method is characterized and will be described in detail later. Next, when the desired coating state is obtained, the lead pin 5 having a substantially C-shaped cross section formed by the lead frame is sandwiched at the place where the conductive paste 4 is coated, and the conductive paste is dried. (FIG. 3 (c)). The lead pin 5 is the lead portion 5
The lead portions 5a are connected to each other by a tie bar 8 (FIG. 3 (d)). Next, a reinforcing material 9 such as an ultraviolet curable resin is applied to the portion sandwiched by the lead pins 5 to cure the reinforcing material 9 and then the tie bar 8
And the lead portion 5a are separated, and the electrical characteristics are inspected (FIG. 3 (e)).
【0015】本実施例の導電性ペーストの塗布状態の検
査法では、導電性ペーストに重量比で20%以内の紫外線
励起型の蛍光体が混入されているので、暗室内で導電性
ペースト塗布部に紫外線を照射しながらCCDカメラで
導電性ペースト塗布部を撮影すると、図4(a)に示す
ように、ガラス基板の表面上に、欠けや傷などの欠陥15
があるばあいまたは、ガラス基板上に異物16が付着して
いるばあいでも基板の欠陥15や異物16は認識されない
で、導電性ペーストのみを認識することができる。その
結果、図4(b)に示すように、導電性ペーストの塗布
状態のみを正確にパターン認識することができ、実用上
差し支えない傷や異物により、工程の流れが止まること
がない。In the method for inspecting the applied state of the conductive paste according to the present embodiment, since the ultraviolet-excitable phosphor within 20% by weight is mixed in the conductive paste, the conductive paste application section is kept in a dark room. When an image of the conductive paste application part is taken with a CCD camera while irradiating the surface with ultraviolet rays, as shown in FIG. 4A, defects such as chips and scratches are formed on the surface of the glass substrate.
If there is, or even if the foreign matter 16 adheres to the glass substrate, the substrate defect 15 and the foreign matter 16 are not recognized, and only the conductive paste can be recognized. As a result, as shown in FIG. 4B, only the applied state of the conductive paste can be accurately recognized as a pattern, and the flow of the process does not stop due to scratches and foreign matter that do not hinder practical use.
【0016】蛍光体として、たとえばZnS:Cu、Z
nO:Znなどを用いることができ、紫外線によって励
起されて発光しCCDカメラにより認識することができ
る。また、ZnS:Cuのような特定の色(たとえば、
緑)に発光する蛍光体を使用することもできる。このば
あい、カメラ側に発光色に対応するフィルター(たとえ
ば、発光色が赤のばあい青フィルター)を用いて、導電
ペーストを認識することができる。このばあい認識の精
度はさらに向上する。As the phosphor, for example, ZnS: Cu, Z
nO: Zn or the like can be used, which is excited by ultraviolet rays to emit light and can be recognized by a CCD camera. In addition, a specific color such as ZnS: Cu (for example,
It is also possible to use a phosphor that emits green light. In this case, the conductive paste can be recognized by using a filter corresponding to the emission color on the camera side (for example, a blue filter when the emission color is red). In this case, the accuracy of recognition is further improved.
【0017】前述の説明では、紫外線の照射による蛍光
体で説明したが、紫外線以外の通常の光で発光しカメラ
で認識できるものであればよい。さらに前述の例では液
晶表示素子のガラス基板に形成された導電膜の端子部に
形成される導電性ペーストについて説明したが、液晶表
示素子に限らず、プリント基板などで導電性ペーストを
塗布するものにも本発明を同様に適用できる。In the above description, the fluorescent substance by irradiation of ultraviolet rays has been described, but any fluorescent substance that emits normal light other than ultraviolet rays and can be recognized by the camera may be used. Further, in the above example, the conductive paste formed on the terminal portion of the conductive film formed on the glass substrate of the liquid crystal display element has been described, but not limited to the liquid crystal display element, the conductive paste is applied on a printed circuit board or the like. The present invention can be similarly applied to the above.
【0018】[0018]
【発明の効果】以上のように本発明によれば、導電性ペ
ーストに発光体を混入しているため、配線基板表面の欠
けや傷などの微少な欠陥、異物の付着などは認識され
ず、発光体を混入した導電性ペースト塗布部のみが認識
される。その結果、配線基板の導電性ペースト塗布部の
検査を正確かつ迅速にでき、実用上問題のない微少欠陥
などで歩留を低下させることがなく、電子機器全体とし
ての製造コストを下げる効果がある。As described above, according to the present invention, since the luminous body is mixed in the conductive paste, minute defects such as chips and scratches on the surface of the wiring board and adhesion of foreign matter are not recognized. Only the conductive paste application part in which the luminous body is mixed is recognized. As a result, the conductive paste application portion of the wiring board can be accurately and quickly inspected, and the yield is not reduced due to minute defects that are practically problem-free, and the manufacturing cost of the electronic device as a whole can be reduced. ..
【図1】本発明の一実施例である液晶表示素子のガラス
基板にリードピンが固着された状態の斜視図である。FIG. 1 is a perspective view showing a state in which lead pins are fixed to a glass substrate of a liquid crystal display element that is an embodiment of the present invention.
【図2】図1の装置の一部省略断面図である。2 is a partially omitted cross-sectional view of the apparatus of FIG.
【図3】図1の基板部の製造工程の説明図である。FIG. 3 is an explanatory diagram of a manufacturing process of the substrate unit in FIG. 1.
【図4】本発明の一実施例である導電性ペーストの認識
パターンを示す説明図である。FIG. 4 is an explanatory diagram showing a recognition pattern of a conductive paste which is an embodiment of the present invention.
【図5】従来の導電性ペーストの認識パターンを示す説
明図である。FIG. 5 is an explanatory diagram showing a recognition pattern of a conventional conductive paste.
1 ガラス基板 3 導電電極膜 3a 端子部 4 導電性ペースト 5 リードピン 1 Glass substrate 3 Conductive electrode film 3a Terminal part 4 Conductive paste 5 Lead pin
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 FI 技術表示箇所 H05K 3/32 B 9154−4E ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Office reference number FI technical display location H05K 3/32 B 9154-4E
Claims (3)
極膜の端子部に導電性ペーストが塗布されて外部リード
と接続し易くする配線基板であって、前記導電性ペース
トに紫外線により発光する発光体が混入されていること
を特徴とする配線基板。1. A wiring board having a conductive electrode film formed on a surface thereof, wherein a terminal portion of the conductive electrode film is coated with a conductive paste to facilitate connection with an external lead, the conductive paste emitting light by ultraviolet rays. A wiring board comprising a luminous body mixed therein.
ト電極およびそれらの電極配線が透明導電膜で形成さ
れ、該透明導電膜の端子部に導電性ペーストが塗布され
るガラス基板を有する液晶表示素子であって、前記導電
性ペーストに紫外線により発光する発光体が混入されて
いることを特徴とする液晶表示素子。2. A liquid crystal display device having a glass substrate on which a segment electrode of the liquid crystal display device and electrode wirings thereof are formed of a transparent conductive film on a glass substrate, and a conductive paste is applied to a terminal portion of the transparent conductive film. A liquid crystal display element, wherein a light-emitting body that emits ultraviolet light is mixed in the conductive paste.
れ、該導電電極膜の端子部に塗布された導電性ペースト
の塗布状態を検査する配線基板の検査法であって、前記
導電性ペーストに紫外線で発光する発光体が混入され、
該発光体に適した波長の紫外線を照射しながらCCDカ
メラで検査することを特徴とする配線基板の検査法。3. A method of inspecting a wiring board, wherein a conductive electrode film is formed on a surface of the wiring board, and a coating state of the conductive paste applied to a terminal portion of the conductive electrode film is inspected. Is mixed with a luminous body that emits ultraviolet light,
A method for inspecting a wiring board, which comprises inspecting with a CCD camera while irradiating an ultraviolet ray having a wavelength suitable for the light emitter.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13102792A JPH05327153A (en) | 1992-05-22 | 1992-05-22 | Wiring substrate and inspecting method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13102792A JPH05327153A (en) | 1992-05-22 | 1992-05-22 | Wiring substrate and inspecting method thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH05327153A true JPH05327153A (en) | 1993-12-10 |
Family
ID=15048305
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13102792A Pending JPH05327153A (en) | 1992-05-22 | 1992-05-22 | Wiring substrate and inspecting method thereof |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH05327153A (en) |
-
1992
- 1992-05-22 JP JP13102792A patent/JPH05327153A/en active Pending
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