JP2001196800A - Method and device for inspecting wrong mounting position of electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and device by which wrong mounting positions of chip components bonded to a printed wiring board can be inspected easily. SOLUTION: At bonding of chip components 5 to the printed wiring board 1 using a luminous paste 13 containing fluorescence 14, the bond 13 is made to protrude from the components 5, when the parts 5 is mounted erroneously on the board 1, by covering the bond 13 with the parts 5 from the upside. After bonding, the mounting position of the components 5 is checked for errors by causing the bond 13 protruding from the parts 5 to emit light, when the parts 5 are erroneously mounted by irradiating the board 1 with an ultraviolet lamp from the upside in a dark room.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention belongs to the technical field of an inspection method and an inspection apparatus for inspecting a defective mounting position of an electronic component when mounting the electronic component such as a chip component on a printed wiring board. It is.

[0002]

2. Description of the Related Art Conventionally, when mounting chip components such as capacitors and resistors, which are microminiature electronic components, on a printed wiring board, first, as shown in FIG. 1, a pair of lands 2 of the wiring pattern 2
A paste paste 3 is applied in a pinpoint shape by a paste application means 4 to a substantially central portion between the areas a. Next, FIG.
As shown in (1), the chip component 5 is horizontally mounted by the chip component mounting means 6 so as to straddle between the pair of lands 2a, and the electrodes 5a at both ends of the chip component 5 are mounted on the pair of lands 2a ( Mounting) and the chip component 5
The center part between the electrodes 5a at both ends is pressed onto the glue 3 and bonded, and the chip component 5 is temporarily fixed on the printed wiring board 1. Next, as shown in FIG. 4C, the electrodes 5a at both ends of the chip component 5 are solder-dipped 7 on the pair of lands 2a by a solder dipping device.

However, conventionally, when the chip component 5 is mounted, a defective operation in the application process of the glue 3 by the glue applying means 4 and a defective operation in the mounting process of the chip component 5 by the chip component mounting means 6 are caused. 5A, the adhesive strength of the chip component 5 is poor due to the mutual displacement of the glue 3 and the chip component 5, and the chip component 5 is missing due to a mounting error as shown in FIG. 5B. The glue 3 as shown in FIG. 5 (C) is applied in an abnormally large amount and oozes out onto the land 2a, resulting in poor contact of the electrode 5a with the land 2a.
As shown in FIG. 5D, a chip component mounting defect such as a rollover due to a mounting error of the chip component 5 may occur.

Therefore, conventionally, the chip component 5 is mounted on the printed wiring board 1 as shown in FIG. 6 after the mounting step of the chip component 5 on the printed wiring board 1 and before the solder dipping step. The chip parts 5 are photographed one by one using the CCD camera 8, the height of the chip parts 5 is sequentially detected using a laser beam, and the photographing information and the height detection information are analyzed using a computer. , FIG.
The defective mounting position of the chip component 5 shown in FIG.

[0005]

However, as in the prior art, the chip components 5 mounted on the printed wiring board 1 are photographed one by one using a CCD camera 8, or the chip components 5 are 5 height detection, etc.
The photographing information and the height detection information are analyzed using a computer, and the chip components 5 shown in FIGS.
The system for detecting the position of the mounting failure is very complicated, and the cost of the entire system is 20%.
It was as expensive as 100,000 yen to 10 million yen, very expensive and uneconomical. In addition, there is another problem that a dedicated skilled technician is required to operate the system.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problem, and has been made in order to make it possible to extremely easily inspect a defective mounting position of an electronic component such as a chip component. It is an object of the present invention to provide an inspection method and an inspection apparatus.

[0007]

According to the present invention, there is provided a method for inspecting a defective mounting position of an electronic component in order to achieve the above-mentioned object. After the electronic component is glued on the printed wiring board with the luminescent glue in this way, the printed wiring board is illuminated in a night vision state, so that the light emission protruding from the electronic component due to a defective mounting of the electronic component. In this case, the state in which the glue increases in light emission or light emission intensity is inspected.

The inspection method of the present invention for inspecting the position of a defective mounting of an electronic component is carried out by visually inspecting that the luminescent glue protrudes from the electronic component and the luminescence or luminous intensity is improved. It is possible to easily inspect the mounting failure position of the electronic component.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a method and an apparatus for inspecting a defective mounting position of an electronic component to which the present invention is applied will be described below with reference to the drawings. 4 to 6 are denoted by the same reference numerals, and redundant description will be omitted.

First, as shown in FIG. 1A, a glue for mounting and gluing a chip component 5 which is an electronic component so as to straddle a pair of lands 2a of a wiring pattern 2 of a printed wiring board 1 is provided. The luminescent glue 13 is used. As the luminescent glue 13, for example, one that is mixed with a fluorescent agent 14 such as a fluorescent pigment and emits light S when irradiated with ultraviolet light U as shown in FIG. 1B is used. However, besides, it is also possible to use a luminescent paste 13 in which a material whose luminescence or luminous intensity is improved by illumination with white light or colored light is mixed.

Then, as shown in FIG. 1C, the chip component 5 is normally mounted on the upper portion between the pair of lands 2a, and the chip component 5 is placed on the printed wiring board 1 by the luminescent paste 13. When the paste is applied, the chip component 5 completely covers the light emitting paste 13 from above.

On the other hand, when a defective mounting of the chip component 5 occurs as shown in FIGS. 4A to 4D, as shown in FIGS. 2A, 2C, and 2D. And luminescent glue 1
2 protrudes laterally from underneath the chip component 5, and FIG.
(B), the entire luminescent paste 13 is completely exposed.

Therefore, as shown in FIG. 3, the printed wiring board 1 after the step of gluing a large number of chip components 5 is completed.
Is housed in the dark room section 15, and the entire upper surface of the printed wiring board 1 is illuminated from above by ultraviolet rays U emitted from an ultraviolet lamp 16 which is an illuminating means. Then, in the case of the normally glued chip component 5 shown in FIG. 1, since the luminescent paste 13 is completely covered from above with the chip component 5, the luminescent paste 13 is irradiated with the ultraviolet rays U. No light is emitted.

On the other hand, in the mounting failure state of the chip component 5 shown in FIGS. 2A to 2D, the portion of the luminescent glue 13 protruding from the chip component 5 or is completely exposed. The entire light-emitting glue 13 emits light S due to the ultraviolet light U. By visually inspecting the light emission S of the light-emitting glue 13, the light-emitting glue 13 shown in FIG.
(A)-(D) can easily inspect the defective mounting position of the chip component 5.

At this time, the entire upper surface of the printed wiring board 1 can be illuminated from above by an illuminating means such as an ultraviolet lamp 16 or the like, and can be visually inspected by photographing with a video camera and reproducing the image on a monitor television. .

However, FIG. 3 uses a digital camera 17 as the photographing means, and an image P of the printed circuit board 1 photographed by the digital video camera 17 is photographed in advance and displayed on the screen of the monitor television 18. By superimposing and displaying the image on the printed wiring board 1 using the microcomputer 18, the defective mounting position of the chip component 5 is displayed as the light emitting point SP, and the reference display 20 of the light emitting point SP is enabled. Things. Therefore, the printed wiring board 1 mounted at high density
The defective mounting position of the chip component 5 can be easily and accurately detected on the screen of the monitor television 18.

As described above, the defective mounting position of the chip component 5 can be clearly and easily inspected. At this inspection stage, since the luminescent paste 13 is still in a paste state (soft), The mounting failure of the chip component 5 can be repaired. At this time, the mounting defect can be easily and accurately repaired by the reference display 20 of the mounting defect position of the chip component 5 described above. Then, after the repair, the printed wiring board 1 is heated in an oven or the like to cure the luminescent glue 13 and the chip component 5 is completely adhered to the printed wiring board 1 to complete a series of mounting steps. Become.

Although the embodiment of the present invention has been described above, the present invention is not limited to the above-described embodiment, and various modifications can be made based on the technical idea of the present invention.

[0019]

The method and apparatus for inspecting a defective mounting position of an electronic component according to the present invention configured as described above have the following effects.

According to the first and third aspects of the present invention, there is provided a method and an apparatus for inspecting a defective mounting position of an electronic component, wherein the electronic component covers a luminous glue whose luminescence or luminous intensity is improved by illumination from above. After gluing the electronic component on the printed wiring board with glue, illuminating the printed wiring board in the night vision state, the luminescent glue that has protruded from the electronic component due to mounting failure of the electronic component emits light or emits light. The state in which the strength is improved is inspected, and it is possible to easily inspect the mounting failure position of the electronic component by performing a visual inspection. And it is a simple system that only inspects the luminescence of the luminescent glue or the improvement of the luminescence intensity,
The cost of the entire system can be significantly reduced from the conventional 2 million yen to 10 million yen to 100,000 yen to 500,000 yen. In addition, as in the past, a specialized skill for operating the system is used. It has a high economic effect without the need for workers.

According to a fourth aspect of the present invention, there is provided a device for inspecting a position of a defective electronic component mounting, the digital video camera being configured to detect the state of the luminescent glue which has protruded from the electronic component due to the defective mounting of the electronic component and has improved light emission or light emission intensity. In this case, a microcomputer is used to superimpose and display the image that has been photographed in advance and is displayed on the monitor TV screen. It is possible to accurately detect the mounting failure position of electronic components on the printed wiring board that is densely mounted,
Repair of the mounting defect can be performed easily and accurately.

According to a first or fifth aspect of the present invention, an electronic component is mounted on a printed wiring board using a luminescent paste mixed with a fluorescent agent, and ultraviolet light is illuminated by an ultraviolet lamp to cut off the electronic component. The emitted light-emitting glue can be made to emit light clearly, and the defective mounting position of the electronic component can be clearly inspected.

[Brief description of the drawings]

FIG. 1 illustrates a state in which a chip component is normally mounted on a printed wiring board using a luminescent glue in an inspection method of an electronic component mounting defect position and an inspection apparatus according to the present invention. It is a drawing.

FIG. 2 shows a state of a mounting failure of a chip component mounted on a printed wiring board using the above luminescent paste, and the chip component protrudes due to the mounting failure due to irradiation of ultraviolet rays in the inspection process of FIG. FIG. 4 is a diagram illustrating a state in which a luminescent paste is generated.

FIG. 3 is a view for explaining an inspection process of a defective mounting position of the chip component shown in FIG. 2;

FIG. 4 is a diagram illustrating a general mounting process of a chip component.

5 is a view for explaining a mounting defect occurring in a mounting process of the chip component of FIG. 4;

FIG. 6 is a diagram illustrating a conventional chip component mounting failure inspection system.

[Explanation of symbols]

1 is a printed wiring board, 2 is a wiring pattern, 2a is a land of the wiring pattern, 4 is glue applying means, 5 is a chip component,
6 is a mounting means, 13 is a luminescent glue, 14 is a fluorescent agent, 15 is a dark room part, 16 is an ultraviolet lamp as an illuminating means, 17 is a digital video camera, 18 is a monitor television, 19 is a microcomputer, and U is an ultraviolet lamp UV, S emitted from the luminous glue 13
Shows how light is emitted.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) C09J 201/00 C09J 201/00

Claims (5)

[Claims] An electronic component mounting method for gluing an electronic component onto a printed wiring board and then soldering the electronic component to a wiring pattern, the method comprising: Gluing an electronic component onto the printed wiring board with the luminescent glue so as to cover the luminescent glue from above with the electronic component; and Illuminating the electronic component with illumination means, thereby inspecting a state in which the luminescent glue that has protruded from the electronic component due to a mounting failure of the electronic component emits light or has an improved emission intensity. Inspection method for defective mounting position of electronic components. 2. The method according to claim 1, wherein a glue mixed with a fluorescent agent is used as said luminescent glue, and an ultraviolet lamp is used as said illuminating means. . 3. An electronic component mounting apparatus for soldering an electronic component to a wiring pattern after gluing the electronic component on a printed wiring board, wherein a light emitting material mixed with a material whose luminescence or luminous intensity is improved by illumination is provided. Means for using glue and gluing the electronic component on the printed circuit board with the luminescent glue so that the luminescent glue is covered from above with the electronic component; and An illuminating means for illuminating the substrate; and a means for photographing a state in which the luminous glue that has protruded from the electronic component due to a mounting failure of the electronic component is illuminated by the illuminating means, the luminous intensity or the luminous intensity is improved; A device for inspecting a mounting failure position of an electronic component, comprising: a monitor for reproducing a situation photographed by the photographing means. 4. An electronic component mounting apparatus for soldering an electronic component to a wiring pattern after gluing the electronic component on a printed wiring board, wherein a light emitting material mixed with a material whose luminescence or luminous intensity is improved by illumination is provided. Means for using glue and gluing the electronic component on the printed circuit board with the luminescent glue so that the luminescent glue is covered from above with the electronic component; and An illuminating means for illuminating the substrate with an illuminating means; and a digital camera for photographing a state in which the luminous glue that has protruded from the electronic component due to a mounting failure of the electronic component emits light or the luminous intensity is increased by the illumination by the illuminating means. A video camera and an image taken by the digital video camera are superimposed on an image of the printed wiring board taken in advance. A microcomputer for displaying the position of the mounting failure of the electronic component on a screen of a monitor television. 5. The mounting defect of an electronic component according to claim 3, wherein a glue mixed with a fluorescent agent is used as said luminescent glue, and an ultraviolet lamp is used as said illuminating means. Position inspection device.