JPS6080235A - Method of forming thin film or thick film pattern - Google Patents

Abstract

PURPOSE:To accurately detect pin holes within a pattern by coating the substrate with a fluorescent paint prior to formation of circuit pattern and irradiating such pattern with ultraviolet ray after formation of such pattern. CONSTITUTION:A fluorescent material layer 2 is formed by coating the entire part of surface of insulated ceramic substrate 1 with a fluorescent paint. Next, a gold pattern 3 is deposited thereon. The pattern 3 is irradiated with the ultraviolet ray 4 and the light emitting condition of gold pattern 3 is observed. Existence of pin hole 5 can be recognized by detecting the light emitting part in the pattern 3 and moreover pattern is corrected by coating of the gold paste 6, etc. Thereby, the failure such as disconnection can be detected easily and accurately immediately after formation of pattern.

Description

Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a method for forming a thin film or a thick film pattern on a substrate, and particularly relates to a method for forming a thin film or a thick film pattern on a substrate, and in particular a method for forming a pin in a thick film or a thin film constituting a circuit pattern on a substrate. Concerning a method for correctly detecting holes.

[Prior art]

In recent years, due to the demand for miniaturization of devices, the integration of circuits has been significantly advanced. A thick film substrate is formed by thick film printing on the substrate, and a thin film deposited on the entire surface of the substrate by a vapor deposition method is patterned into a predetermined shape by photolithography. Thin film base a%
Integrated, road board. It is first class.

Pinhole detection in conductor layers on these substrates is usually performed using a microscope. However, it is difficult to detect pinholes when inspecting using reflected light, and they are often overlooked.In addition, an insulating layer or other conductive layer is formed on top of the pinholes to complete the desired circuit board. An electrical inspection performed later may detect a disconnection defect caused by a pinhole or the like. In this case, already
Since the insulating layer is formed on the conductor layer, it is impossible to make any corrections, and there is a problem that the circuit board itself becomes a defective product.

[Purpose of the invention]

The present invention has been made in view of the above-mentioned circumstances, and an object of the present invention is to provide a thin film or thick film circuit with high reliability by ensuring the detection of pinholes in a pattern.

[Structure of the invention]

In order to achieve the above object, the method for forming thin film and thick film patterns of the present invention involves coating the top of the substrate with a fluorescent paint prior to forming a predetermined circuit pattern, and after forming the pattern, UV rays are irradiated from the inside of the pattern.
This device is characterized in that pinholes are detected by detecting the light emitting state in the holes.

In other words, if a pinhole occurs in the circuit pattern during the process of forming a circuit pattern, i.e., during the process of forming a thin film or thick film, or the photo-etching process, the fluorescent paint that has been applied on the substrate in advance may be exposed to ultraviolet rays. This makes pinhole detection reliable and easy.

[Example] Hereinafter, a method of forming a thick film integrated circuit pattern on a substrate according to the present invention will be described based on an example with reference to the drawings.

The following is a method for forming a gold thick film circuit pattern on an insulating ceramic substrate by a thick film method.

First, as shown in FIG. 1, a phosphor layer 2 is formed by applying a fluorescent paint to the entire surface of an insulating ceramic substrate 1 by a spray method.

Thereafter, a gold pattern 3 is deposited as shown in FIG. 2 by screen printing using gold paste as ink.

Next, as shown in FIG. 3, from a light source (not shown),
The gold pattern 3 is irradiated with ultraviolet rays 4, and the gold pattern 3 is
Observe the state of light emission above.

By detecting the light-emitting portion within the gold pattern 3 in this manner, the existence of the pinhole 5 is recognized, and the pattern is further corrected by applying gold paste 6 or the like as shown in FIG. conduct.

Subsequently, by repeating the formation of an insulating layer and a conductor layer, a thick film multilayer wiring board is completed as shown in FIG.

As mentioned above, by introducing the pinhole detection process, pinholes can be detected easily and reliably, the incidence of defects such as disconnections can be significantly reduced, and a highly reliable circuit board can be obtained. .

In addition, since the occurrence of defects can be reliably detected at the time the gold pattern, which is the first Wl, is formed, defects can be overlooked and
It is not easy to form the next layer, making it difficult or impossible to modify.

In addition, in the examples, a spray method was used to apply the fluorescent paint to the substrate surface, but the method is not necessarily limited to this, and any other method may be used, such as a method of applying a fluorescent paint in the form of an adult. It is valid.

In addition, in the embodiment, the formation of a thick film integrated circuit pattern is described.
As mentioned above, the method of the present invention can be applied in exactly the same manner to the formation of all thick film and thin film circuit patterns, not only for integrated circuits, but also for element substrates such as multi-heads and printed wiring boards. Needless to say, is applicable.

〔Effect of the invention〕

As explained above, according to the method of the present invention, prior to forming a predetermined circuit pattern, there is a step of applying fluorescent paint to the surface of the substrate in advance, and after forming the pattern, irradiating ultraviolet rays from above the pattern. However, by including the step of detecting the presence or absence of pinholes by detecting the luminescent state of the fluorescent paint in the pattern whitening, detection of disconnection defects etc. can be extremely easily performed immediately after the pattern is formed. Since it is reliable, it is possible to form highly reliable thin film or thick film patterns.

[Brief explanation of the drawing]

1 to 4 are diagrams showing a part of the manufacturing process for forming a thick film multilayer wiring board by the method of the embodiment of the present invention, and FIG. FIG. 2 is a diagram showing a thick film multilayer wiring board. 1... Substrate, 2. Phosphor layer, 3... Gold pattern, 4
...Ultraviolet light, 5.Pinball, 6.Gold paste. Figure 1 Figure 2 Figure 4 Factor a5 Figure

Claims (1)

[Claims] A method for forming a thin film or thick film pattern on a substrate, which includes a step of applying fluorescent paint on the substrate before forming the pattern, and a step of forming the thin film or thick film pattern by a predetermined method, and then applying a fluorescent paint on the pattern. A method for forming a thin film or thick film pattern on a substrate, the method comprising the step of: detecting the occurrence of pinholes in the pattern by irradiating ultraviolet rays onto the surface of the pattern and detecting the state of light emitted within the pattern. .