JPH05315140A - Surface mounting balun - Google Patents

Surface mounting balun

Info

Publication number
JPH05315140A
JPH05315140A JP11570092A JP11570092A JPH05315140A JP H05315140 A JPH05315140 A JP H05315140A JP 11570092 A JP11570092 A JP 11570092A JP 11570092 A JP11570092 A JP 11570092A JP H05315140 A JPH05315140 A JP H05315140A
Authority
JP
Japan
Prior art keywords
core
hole
terminals
balun
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11570092A
Other languages
Japanese (ja)
Other versions
JP3313138B2 (en
Inventor
Kameyoshi Ishimoto
亀喜 石本
Akira Mishima
昭 三島
Hiroshi Nagai
弘 永井
Akio Iwase
彰男 岩瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP11570092A priority Critical patent/JP3313138B2/en
Publication of JPH05315140A publication Critical patent/JPH05315140A/en
Application granted granted Critical
Publication of JP3313138B2 publication Critical patent/JP3313138B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Coils Or Transformers For Communication (AREA)

Abstract

PURPOSE:To realize easy mounting onto a printed circuit board of a balun for surface mounting to be used for a distributing circuit and mixing circuit or the like of a high frequency RF unit. CONSTITUTION:End portions of lead wires 18 to 21 are led out to the outside of a through hole 15 and a film is removed to form terminals 7a to 11a. The terminals 7a to 11a are beng along a lead position indication mark 22 or lead positioning groove formed at the external wall surface of a core 14 and can be surface mounted on a land of the printed circuit board. With such structure, since connection can be realized through direct abutment on the land of the printed circuit board, automatic mounting can be done easily at a low cost.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明はUHF,VHF電子チュ
ーナ,BSチューナ等の高周波RFユニットの分配回
路,混合回路等に使用するフェライト等のコアを使用し
た面実装用バランに関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mounting balun using a core of ferrite or the like used in a distribution circuit of a high frequency RF unit such as a UHF, VHF electronic tuner, a BS tuner or the like, a mixed circuit or the like.

【0002】[0002]

【従来の技術】従来は図6に示すように、貫通孔1を2
個備えたコア2に回路図の図7に示すように4本のリー
ド線3,4,5,6を図6に示すとおり巻きつけてい
た。そして貫通孔1外に引き出した端部の被膜を除去し
て端子7,8,9,10,11を各種入出力端子とし
た。
2. Description of the Related Art Conventionally, as shown in FIG.
As shown in FIG. 7 of the circuit diagram, four lead wires 3, 4, 5 and 6 were wound around the provided core 2 as shown in FIG. Then, the coating on the end portion drawn out of the through hole 1 was removed and the terminals 7, 8, 9, 10, 11 were used as various input / output terminals.

【0003】[0003]

【発明が解決しようとする課題】このように構成された
挿入用バランは、図8に示すごとくプリント基板12に
実装される。すなわち端子7〜11がプリント基板12
に備えた貫通孔13に貫通して実装され、ランド14と
半田15により接続されているのである。しかしなが
ら、この場合図8からも明らかなように端子7〜11を
それぞれ貫通孔13に挿入する作業が必要であり、これ
は手作業にたよらざるを得ず、作業性の悪いものであっ
た。そこで本発明はこの実装作業をきわめて簡略化出来
る面実装用バランを提供するものである。
The insertion balun configured as described above is mounted on the printed circuit board 12 as shown in FIG. That is, the terminals 7 to 11 are the printed circuit board 12
It is mounted by penetrating through the through hole 13 provided in the above, and is connected to the land 14 by the solder 15. However, in this case, as is apparent from FIG. 8, it is necessary to insert the terminals 7 to 11 into the through-holes 13, respectively. Therefore, the present invention provides a surface mounting balun that can greatly simplify this mounting work.

【0004】[0004]

【課題を解決するための手段】この目的を達成するため
に本発明は、貫通孔を有するコアと、このコアの貫通孔
に貫通させられた1本以上のリード線とを備え、前記リ
ード線の端部を貫通孔外に引き出すとともに、被膜を除
去して端子とし、この端子はコアの外壁面にそって折り
曲げたものである。
In order to achieve this object, the present invention comprises a core having a through hole, and one or more lead wires penetrating the through hole of the core. The terminal is formed by pulling the end portion of the core out of the through hole and removing the coating to form a terminal, and the terminal is bent along the outer wall surface of the core.

【0005】[0005]

【作用】以上の構成にすることにより、端子はコアの外
側に沿って折り曲げられており、プリント基板のランド
状に直接当接させて接続をすることが出来るので、実装
作業を極めて簡略化させるものである。
With the above structure, the terminals are bent along the outer side of the core, and the terminals can be directly brought into contact with the land shape of the printed circuit board for connection, so that the mounting work is greatly simplified. It is a thing.

【0006】[0006]

【実施例】【Example】

(実施例1)以下本発明の一実施例について図面を参照
にしながら説明する。
(Embodiment 1) An embodiment of the present invention will be described below with reference to the drawings.

【0007】図1において、14はフェライトにより作
られたコアで、2個の貫通孔15が横方向に並べられ、
上,下面16,17は平面となった方形状になってい
る。これらの貫通孔15には図7に示す回路構成を形成
するために、同様に4本のリード線18,19,20,
21が巻きつけられている。そして貫通孔15外に引き
出された端部は被膜が除去されて端子7a〜11aとな
り、これらの端子7a〜11aは図1に示すごとく貫通
孔15から引き出された後、コア14の外壁に沿って、
リード位置表示マーク22に沿って下面17に折り曲げ
られる。実装は図2に示すごとくコア14の下面17側
をプリント基板23側にして実装される。すなわちプリ
ント基板23の上面にはランド24が備えつけられてお
り、このランド24にそれぞれの端子7a〜11aが対
応して当接させられ、この状態で半田付けが行われる。
ここで記述しておきたいのは、端子7a,9aは他の端
子8a,10a,11aのごとく複数本を捩ったものと
は異なり、1本のみ折り曲げるので、それらと高さを合
わせて半田付けが適切に行われるように、コア14の下
面17との間に隙間25を備えている。また図3に示す
ように、リード線の端子7a〜11aが確実に位置決め
出来るように、コア14の下面17側にそれぞれの端子
に合わせリード位置決め溝26を形成することも可能で
ある。
In FIG. 1, 14 is a core made of ferrite, and two through holes 15 are arranged side by side.
The upper and lower surfaces 16 and 17 are flat and square. In order to form the circuit configuration shown in FIG. 7 in these through holes 15, four lead wires 18, 19, 20,
21 is wrapped around. Then, the coating is removed from the end portions drawn out of the through hole 15 to form terminals 7a to 11a. These terminals 7a to 11a are drawn from the through hole 15 as shown in FIG. hand,
The lower surface 17 is bent along the lead position display mark 22. As shown in FIG. 2, the mounting is performed with the lower surface 17 side of the core 14 on the printed circuit board 23 side. That is, the land 24 is provided on the upper surface of the printed circuit board 23, and the terminals 7a to 11a are brought into contact with the land 24 correspondingly, and soldering is performed in this state.
It should be noted here that the terminals 7a and 9a are bent only one unlike the other terminals 8a, 10a and 11a, which are twisted from a plurality of terminals. A gap 25 is provided between the lower surface 17 of the core 14 and the core 14 so that the attachment is properly performed. Further, as shown in FIG. 3, it is possible to form lead positioning grooves 26 on the lower surface 17 side of the core 14 in accordance with the respective terminals so that the terminals 7a to 11a of the lead wires can be positioned reliably.

【0008】(実施例2)図4,図5は他の実施例を示
し、この実施例では3本のリード線27,28,29を
備えたものである。そして、2本の端子30,31はコ
ア14の下面17側に、他の2本の32,33は上面1
6側に折り曲げ2本より合わせた端子34は貫通孔15
方向に突出させたものである。これら図5に示すごとく
端子34だけがプリント基板23の貫通孔23aに貫通
されて、下面側のランド23bと半田付けされ他の端子
30〜33は上面側のランドに半田付けされるものであ
る。これはプリント基板23の貫通孔23aへの、貫通
作業が必要であるが、わずか1本だけの貫通なのでその
作業は容易に行える。
(Embodiment 2) FIGS. 4 and 5 show another embodiment. In this embodiment, three lead wires 27, 28 and 29 are provided. The two terminals 30 and 31 are on the lower surface 17 side of the core 14, and the other two terminals 32 and 33 are on the upper surface 1.
The terminal 34, which is bent from the 6 side and combined from the two, has a through hole 15
It is projected in the direction. As shown in FIG. 5, only the terminal 34 is penetrated through the through hole 23a of the printed board 23 and soldered to the land 23b on the lower surface side, and the other terminals 30 to 33 are soldered to the land on the upper surface side. .. This requires a penetrating work into the through hole 23a of the printed circuit board 23, but since only one penetrating work is required, the work can be easily carried out.

【0009】[0009]

【発明の効果】以上の実施例に示すように端子はコアの
外側に沿って折り曲げられており、プリント基板のラン
ド状に直接当接させて接続をすることが出来るので、低
コストで実装作業を極めて簡略化させるものである。
As shown in the above embodiments, the terminals are bent along the outside of the core and can be directly brought into contact with the lands of the printed circuit board for connection. Is extremely simplified.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の第1の実施例の面実装用バランの斜視
FIG. 1 is a perspective view of a surface mounting balun according to a first embodiment of the present invention.

【図2】本発明の第1の実施例の面実装用バランを実装
した側面図
FIG. 2 is a side view in which the surface mounting balun according to the first embodiment of the present invention is mounted.

【図3】本発明の第1の実施例に端子位置決め溝追加の
面実装用バランの斜視図
FIG. 3 is a perspective view of a surface mounting balun with a terminal positioning groove added to the first embodiment of the present invention.

【図4】本発明の第2の実施例の面実装用バランの斜視
FIG. 4 is a perspective view of a surface mounting balun according to a second embodiment of the present invention.

【図5】本発明の第2の実施例の面実装用バランの断面
FIG. 5 is a sectional view of a surface mounting balun according to a second embodiment of the present invention.

【図6】従来の挿入用バランの斜視図FIG. 6 is a perspective view of a conventional insertion balun.

【図7】従来の挿入用バランの回路図FIG. 7 is a circuit diagram of a conventional insertion balun.

【図8】従来の挿入用バランの側面図FIG. 8 is a side view of a conventional insertion balun.

【符号の説明】[Explanation of symbols]

7a 端子 8a 端子 9a 端子 10a 端子 11a 端子 14 コア 15 貫通孔 16 上面 17 下面 18 リード線 19 リード線 20 リード線 21 リード線 22 リード位置表示マーク 23 プリント基板 24 ランド 25 隙間 26 リード位置決め溝 7a terminal 8a terminal 9a terminal 10a terminal 11a terminal 14 core 15 through hole 16 upper surface 17 lower surface 18 lead wire 19 lead wire 20 lead wire 21 lead wire 22 lead position indication mark 23 printed circuit board 24 land 25 gap 26 lead positioning groove

───────────────────────────────────────────────────── フロントページの続き (72)発明者 岩瀬 彰男 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Akio Iwase 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】貫通孔を有するコアと、このコアの貫通孔
に貫通させられた1本以上のリード線とを備え、前記リ
ード線の端部を貫通孔外に引き出し、被膜を除去して端
子とし、この端子はコアの外壁面にそって折り曲げられ
た面実装用バラン。
1. A core having a through hole, and at least one lead wire penetrating the through hole of the core, wherein an end of the lead wire is pulled out of the through hole to remove a coating film. This is a terminal, and this terminal is a surface-mount balun that is bent along the outer wall of the core.
【請求項2】コアは複数個の貫通孔を横方向に並べ、貫
通孔の上,下面に平坦部を有する方形状とし、上,下面
に端子を折り曲げた請求項1に記載の面実装用バラン。
2. The surface mounting according to claim 1, wherein the core has a plurality of through holes arranged in a lateral direction, has a rectangular shape having flat portions on the upper and lower surfaces of the through holes, and has terminals bent on the upper and lower surfaces. Balun.
【請求項3】貫通孔を有するコアと、このコアの貫通孔
に貫通させられた2本以上のリード線とを備え、前記リ
ード線の端部を貫通孔外に引き出すとともに被膜を除去
して端子とし、この端子はコアの外壁面にそって、コア
のリード位置表示のマークに合わせて折り曲げるととも
に、これらの端子のうち、1本だけを折り曲げているも
のはコアの外壁面との間に隙間を設けた面実装用バラ
ン。
3. A core having a through hole, and two or more lead wires penetrating the through hole of the core, wherein the ends of the lead wires are pulled out of the through hole and the coating film is removed. This terminal is bent along the outer wall surface of the core according to the mark of the lead position indication on the core, and only one of these terminals is bent between it and the outer wall surface of the core. Balun for surface mounting with a gap.
【請求項4】貫通孔を有するコアと、このコアの貫通孔
に貫通させられた2本以上のリード線とを備え、前記リ
ード線の端部を貫通孔外に引き出すとともに被膜を除去
して端子とし、この端子はコアの外壁面にそって、コア
のリード位置決め溝に合わせて折り曲げた面実装用バラ
ン。
4. A core having a through hole, and two or more lead wires penetrating the through hole of the core, wherein the end portions of the lead wires are pulled out of the through hole and the coating film is removed. This is a surface-mount balun that is bent along the outer wall of the core according to the lead positioning groove of the core.
【請求項5】貫通孔を有するコアと、このコアの貫通孔
に貫通させられた2本以上のリード線とを備え、前記リ
ード線の端部を貫通孔外に引き出すとともに被膜を除去
して端子とし、この端子のうち、少なくとも2本はよじ
って貫通孔方向に突出させ、他の端子は貫通孔から外方
向に折り曲げた面実装用バラン。
5. A core having a through hole, and two or more lead wires penetrating the through hole of the core, wherein the end portions of the lead wires are pulled out of the through hole and the coating film is removed. A surface mounting balun in which at least two of the terminals are twisted and protruded toward the through hole, and the other terminals are bent outward from the through hole.
JP11570092A 1992-05-08 1992-05-08 Balun for surface mounting Expired - Fee Related JP3313138B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11570092A JP3313138B2 (en) 1992-05-08 1992-05-08 Balun for surface mounting

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11570092A JP3313138B2 (en) 1992-05-08 1992-05-08 Balun for surface mounting

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2000264997A Division JP2001093738A (en) 2000-09-01 2000-09-01 Surface mount balun

Publications (2)

Publication Number Publication Date
JPH05315140A true JPH05315140A (en) 1993-11-26
JP3313138B2 JP3313138B2 (en) 2002-08-12

Family

ID=14669068

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11570092A Expired - Fee Related JP3313138B2 (en) 1992-05-08 1992-05-08 Balun for surface mounting

Country Status (1)

Country Link
JP (1) JP3313138B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6111465A (en) * 1996-10-09 2000-08-29 Nec Corporation Amplifying unit comprising an input transformer capable of contributing to a wider frequency band of a broadband amplifier
WO2005069317A1 (en) * 2004-01-19 2005-07-28 Young-Suk Park Method for assembling and fabricating balun transformer
JP2005236042A (en) * 2004-02-19 2005-09-02 Matsushita Electric Works Ltd Branching transformer for high-frequency signal, and tv outlet used for the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6111465A (en) * 1996-10-09 2000-08-29 Nec Corporation Amplifying unit comprising an input transformer capable of contributing to a wider frequency band of a broadband amplifier
WO2005069317A1 (en) * 2004-01-19 2005-07-28 Young-Suk Park Method for assembling and fabricating balun transformer
JP2005236042A (en) * 2004-02-19 2005-09-02 Matsushita Electric Works Ltd Branching transformer for high-frequency signal, and tv outlet used for the same

Also Published As

Publication number Publication date
JP3313138B2 (en) 2002-08-12

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