JP3313138B2 - Balun for surface mounting - Google Patents

Balun for surface mounting

Info

Publication number
JP3313138B2
JP3313138B2 JP11570092A JP11570092A JP3313138B2 JP 3313138 B2 JP3313138 B2 JP 3313138B2 JP 11570092 A JP11570092 A JP 11570092A JP 11570092 A JP11570092 A JP 11570092A JP 3313138 B2 JP3313138 B2 JP 3313138B2
Authority
JP
Japan
Prior art keywords
hole
terminals
core
balun
lead wires
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP11570092A
Other languages
Japanese (ja)
Other versions
JPH05315140A (en
Inventor
亀喜 石本
昭 三島
弘 永井
彰男 岩瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP11570092A priority Critical patent/JP3313138B2/en
Publication of JPH05315140A publication Critical patent/JPH05315140A/en
Application granted granted Critical
Publication of JP3313138B2 publication Critical patent/JP3313138B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明はUHF,VHF電子チュ
ーナ,BSチューナ等の高周波RFユニットの分配回
路,混合回路等に使用するフェライト等のコアを使用し
た面実装用バランに関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a balun for surface mounting using a core such as a ferrite used for a distribution circuit, a mixing circuit, and the like of a high-frequency RF unit such as a UHF, VHF electronic tuner, and a BS tuner.

【0002】[0002]

【従来の技術】従来は図6に示すように、貫通孔1を2
個備えたコア2に回路図の図7に示すように4本のリー
ド線3,4,5,6を図6に示すとおり巻きつけてい
た。そして貫通孔1外に引き出した端部の被膜を除去し
て端子7,8,9,10,11を各種入出力端子とし
た。
2. Description of the Related Art Conventionally, as shown in FIG.
As shown in FIG. 7 of the circuit diagram, four lead wires 3, 4, 5, and 6 were wound around the core 2 provided as shown in FIG. Then, the coating on the end drawn out of the through-hole 1 was removed, and the terminals 7, 8, 9, 10, 11 were used as various input / output terminals.

【0003】[0003]

【発明が解決しようとする課題】このように構成された
挿入用バランは、図8に示すごとくプリント基板12に
実装される。すなわち端子7〜11がプリント基板12
に備えた貫通孔13に貫通して実装され、ランド14と
半田15により接続されているのである。しかしなが
ら、この場合図8からも明らかなように端子7〜11を
それぞれ貫通孔13に挿入する作業が必要であり、これ
は手作業にたよらざるを得ず、作業性の悪いものであっ
た。そこで本発明はこの実装作業をきわめて簡略化出来
る面実装用バランを提供するものである。
The insertion balun constructed as described above is mounted on a printed circuit board 12 as shown in FIG. That is, the terminals 7 to 11 are connected to the printed circuit board 12.
And is connected to the land 14 by solder 15. However, in this case, as is apparent from FIG. 8, it is necessary to insert the terminals 7 to 11 into the through holes 13, and this has to be done manually, which is inferior in workability. Accordingly, the present invention provides a balun for surface mounting which can greatly simplify this mounting operation.

【0004】[0004]

【課題を解決するための手段】この目的を達成するため
に本発明は、貫通孔を有し、この貫通孔の貫通方向と平
行に設けられるとともに、前記貫通孔を挟んでその上面
と下面とに形成される平面部を有する方形状のコアと、
このコアの貫通孔に貫通された2本以上のリード線とを
備え、前記下面に位置表示マークを設けるとともに、前
記リード線の全ての端部を貫通孔外に引き出し、夫々被
膜を除去して端子とし、これら全ての端子は前記下面に
導出され、前記位置表示マーク上に折り曲げられたもの
である。
In order to achieve the above object, the present invention has a through-hole, and the through-hole extends in the same direction as the through-hole.
Row, and the upper surface of the
And a square core having a flat portion formed on the lower surface ,
The core is provided with two or more lead wires penetrating through holes, and a position indication mark is provided on the lower surface, and all ends of the lead wires are drawn out of the through holes, and the coating is removed respectively. All the terminals are led out to the lower surface and bent on the position indicating mark.

【0005】[0005]

【作用】以上の構成にすることにより、全ての端子はコ
アの下面の外壁の位置表示マークに向かって折り曲げら
れており、プリント基板のランドに直接当接させて接続
することができるので、実装作業を極めて簡略化するこ
とができる。
With the above construction, all the terminals are bent toward the position indication marks on the outer wall on the lower surface of the core, and are connected by directly abutting the lands on the printed circuit board.
It is possible to extremely simplify child the mounting work
Can be.

【0006】[0006]

【実施例】【Example】

(実施例1)以下本発明の一実施例について図面を参照
にしながら説明する。
(Embodiment 1) An embodiment of the present invention will be described below with reference to the drawings.

【0007】図1において、14はフェライトにより作
られたコアで、2個の貫通孔15が横方向に並べられ、
上,下面16,17は平面となった方形状になってい
る。これらの貫通孔15には図7に示す回路構成を形成
するために、同様に4本のリード線18,19,20,
21が巻きつけられている。そして貫通孔15外に引き
出された端部は被膜が除去されて端子7a〜11aとな
り、これらの端子7a〜11aは図1に示すごとく貫通
孔15から引き出された後、コア14の外壁に沿って、
リード位置表示マーク22に沿って下面17に折り曲げ
られる。実装は図2に示すごとくコア14の下面17側
をプリント基板23側にして実装される。すなわちプリ
ント基板23の上面にはランド24が備えつけられてお
り、このランド24にそれぞれの端子7a〜11aが対
応して当接させられ、この状態で半田付けが行われる。
ここで記述しておきたいのは、端子7a,9aは他の端
子8a,10a,11aのごとく複数本を捩ったものと
は異なり、1本のみ折り曲げるので、それらと高さを合
わせて半田付けが適切に行われるように、コア14の下
面17との間に隙間25を備えている。また図3に示す
ように、リード線の端子7a〜11aが確実に位置決め
出来るように、コア14の下面17側にそれぞれの端子
に合わせリード位置決め溝26を形成することも可能で
ある。
In FIG. 1, reference numeral 14 denotes a core made of ferrite, and two through holes 15 are arranged in a horizontal direction.
The upper and lower surfaces 16 and 17 have a square shape that is flat. In order to form the circuit configuration shown in FIG. 7 in these through holes 15, four lead wires 18, 19, 20,
21 are wound. The ends drawn out of the through holes 15 are stripped of the coating to become the terminals 7a to 11a. After the terminals 7a to 11a are drawn out of the through holes 15 as shown in FIG. hand,
It is bent to the lower surface 17 along the lead position display mark 22. The mounting is performed with the lower surface 17 of the core 14 facing the printed circuit board 23 as shown in FIG. That is, a land 24 is provided on the upper surface of the printed circuit board 23, and the terminals 7a to 11a are brought into contact with the land 24, and soldering is performed in this state.
What should be noted here is that the terminals 7a and 9a are bent only one, unlike the twisted plural terminals like the other terminals 8a, 10a and 11a. A gap 25 is provided between the core 14 and the lower surface 17 so that the attachment is properly performed. As shown in FIG. 3, it is also possible to form a lead positioning groove 26 on the lower surface 17 side of the core 14 in accordance with each terminal so that the terminals 7a to 11a of the lead wires can be reliably positioned.

【0008】(実施例2)図4,図5は他の実施例を示
し、この実施例では3本のリード線27,28,29を
備えたものである。そして、2本の端子30,31はコ
ア14の下面17側に、他の2本の32,33は上面1
6側に折り曲げ2本より合わせた端子34は貫通孔15
方向に突出させたものである。これら図5に示すごとく
端子34だけがプリント基板23の貫通孔23aに貫通
されて、下面側のランド23bと半田付けされ他の端子
30〜33は上面側のランドに半田付けされるものであ
る。これはプリント基板23の貫通孔23aへの、貫通
作業が必要であるが、わずか1本だけの貫通なのでその
作業は容易に行える。
(Embodiment 2) FIGS. 4 and 5 show another embodiment. In this embodiment, three lead wires 27, 28 and 29 are provided. The two terminals 30 and 31 are on the lower surface 17 side of the core 14, and the other two 32 and 33 are on the upper surface 1.
The terminal 34, which is bent to the side 6 and fitted from the two, has a through-hole 15
It is projected in the direction. As shown in FIG. 5, only the terminal 34 penetrates through the through hole 23a of the printed circuit board 23, is soldered to the land 23b on the lower surface, and the other terminals 30 to 33 are soldered to the land on the upper surface. . This requires a penetrating operation into the through hole 23a of the printed circuit board 23, but since only one penetrates, the operation can be easily performed.

【0009】[0009]

【発明の効果】以上のように本発明によれば、全ての
子はコアの下面の外壁の位置表示マークに向かって折り
曲げられており、プリント基板のランドに直接当接させ
接続することができるので、実装作業を極めて簡略化
することができる。
As described above , according to the present invention, all the terminals are bent toward the position indicating mark on the outer wall on the lower surface of the core, and the land of the printed circuit board is bent . Can be connected directly to the connection, greatly simplifying the mounting work
can do.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の第1の実施例の面実装用バランの斜視
FIG. 1 is a perspective view of a surface mount balun according to a first embodiment of the present invention.

【図2】本発明の第1の実施例の面実装用バランを実装
した側面図
FIG. 2 is a side view showing a surface mounted balun according to the first embodiment of the present invention;

【図3】本発明の第1の実施例に端子位置決め溝追加の
面実装用バランの斜視図
FIG. 3 is a perspective view of a surface mount balun having a terminal positioning groove added to the first embodiment of the present invention.

【図4】本発明の第2の実施例の面実装用バランの斜視
FIG. 4 is a perspective view of a surface mount balun according to a second embodiment of the present invention.

【図5】本発明の第2の実施例の面実装用バランの断面
FIG. 5 is a sectional view of a balun for surface mounting according to a second embodiment of the present invention.

【図6】従来の挿入用バランの斜視図FIG. 6 is a perspective view of a conventional insertion balun.

【図7】従来の挿入用バランの回路図FIG. 7 is a circuit diagram of a conventional insertion balun.

【図8】従来の挿入用バランの側面図FIG. 8 is a side view of a conventional insertion balun.

【符号の説明】[Explanation of symbols]

7a 端子 8a 端子 9a 端子 10a 端子 11a 端子 14 コア 15 貫通孔 16 上面 17 下面 18 リード線 19 リード線 20 リード線 21 リード線 22 リード位置表示マーク 23 プリント基板 24 ランド 25 隙間 26 リード位置決め溝 7a terminal 8a terminal 9a terminal 10a terminal 11a terminal 14 core 15 through hole 16 upper surface 17 lower surface 18 lead wire 19 lead wire 20 lead wire 21 lead wire 22 lead position display mark 23 printed circuit board 24 land 25 gap 26 lead positioning groove

───────────────────────────────────────────────────── フロントページの続き (72)発明者 永井 弘 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 (72)発明者 岩瀬 彰男 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 (56)参考文献 実開 昭62−158804(JP,U) 実開 昭55−124819(JP,U) 実開 昭51−142141(JP,U) 実開 昭61−104514(JP,U) ──────────────────────────────────────────────────の Continued on the front page (72) Inventor Hiroshi Nagai 1006 Kazuma Kadoma, Kadoma City, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. (72) Akio Iwase 1006 Kadoma Kadoma, Kadoma City Osaka Prefecture (56) References Japanese Utility Model Showa 62-158804 (JP, U) Japanese Utility Model Showa 55-124819 (JP, U) Japanese Utility Model Showa 51-142141 (JP, U) Japanese Utility Model Showa 61-104514 (JP, U)

Claims (2)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 貫通孔を有し、この貫通孔の貫通方向と
平行に設けられるとともに、前記貫通孔を挟んでその上
面と下面とに形成される平面部を有する方形状のコア
と、このコアの貫通孔に貫通された2本以上のリード線
とを備え、前記下面に位置表示マークを設けるととも
に、前記リード線の全ての端部を貫通孔外に引き出し、
夫々被膜を除去して端子とし、これら全ての端子は前記
下面に導出され、前記位置表示マーク上に折り曲げられ
た面実装用バラン。
1. A through hole having a through hole,
Are provided in parallel with each other with the through hole interposed therebetween.
A rectangular core having a plane portion formed on a surface and a lower surface; and two or more lead wires penetrating through a through hole of the core; Pull out all the ends of the
Each of the terminals is obtained by removing the coating, and all of these terminals are led out to the lower surface and bent over the position indicating mark.
【請求項2】 貫通孔を有し、この貫通孔の貫通方向と
平行に設けられるとともに、前記貫通孔を挟んでその上
面と下面とに形成される平面部を有する方形状のコア
と、このコアの貫通孔に貫通された2本以上のリード線
とを備え、前記下面に位置決め溝を設けるとともに、前
記リード線の全ての端部を貫通孔外に引き出し、夫々被
膜を除去して端子とし、これら全ての端子は前記下面に
導出され、前記位置決め溝内に折り曲げられた面実装用
バラン。
2. A through-hole having a through-hole,
Are provided in parallel with each other with the through hole interposed therebetween.
A rectangular core having a flat portion formed on a surface and a lower surface, and two or more lead wires penetrated through a through hole of the core, and a positioning groove is provided on the lower surface; All the ends are drawn out of the through holes, and the coatings are respectively removed to form terminals. All these terminals are led out to the lower surface and bent into the positioning grooves.
JP11570092A 1992-05-08 1992-05-08 Balun for surface mounting Expired - Fee Related JP3313138B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11570092A JP3313138B2 (en) 1992-05-08 1992-05-08 Balun for surface mounting

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11570092A JP3313138B2 (en) 1992-05-08 1992-05-08 Balun for surface mounting

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2000264997A Division JP2001093738A (en) 2000-09-01 2000-09-01 Surface mount balun

Publications (2)

Publication Number Publication Date
JPH05315140A JPH05315140A (en) 1993-11-26
JP3313138B2 true JP3313138B2 (en) 2002-08-12

Family

ID=14669068

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11570092A Expired - Fee Related JP3313138B2 (en) 1992-05-08 1992-05-08 Balun for surface mounting

Country Status (1)

Country Link
JP (1) JP3313138B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10116732A (en) * 1996-10-09 1998-05-06 Nec Corp Transmission line transformer and amplifier unit employing it
KR20040028829A (en) * 2004-01-19 2004-04-03 박영석 BALUN trans
JP2005236042A (en) * 2004-02-19 2005-09-02 Matsushita Electric Works Ltd Branching transformer for high-frequency signal, and tv outlet used for the same

Also Published As

Publication number Publication date
JPH05315140A (en) 1993-11-26

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