JPH05314888A - Manufacture of metallic foil fuse - Google Patents
Manufacture of metallic foil fuseInfo
- Publication number
- JPH05314888A JPH05314888A JP14325692A JP14325692A JPH05314888A JP H05314888 A JPH05314888 A JP H05314888A JP 14325692 A JP14325692 A JP 14325692A JP 14325692 A JP14325692 A JP 14325692A JP H05314888 A JPH05314888 A JP H05314888A
- Authority
- JP
- Japan
- Prior art keywords
- metal foil
- metallic foil
- film
- fuse
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Fuses (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、金属箔ヒューズの製造
法に関し、更に詳しくは、小型にして、かつ低電流で動
作する高性能ヒューズの製造法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a metal foil fuse, and more particularly to a method for manufacturing a high performance fuse which is small in size and operates at a low current.
【0002】[0002]
【従来の技術】従来、低電流で動作する金属箔を用いた
電子機器用ヒューズとしては、有機フィルム上に金属を
蒸着した構造や、極薄の金属箔を有機フィルムで挾んだ
構造のもの等が知られている。2. Description of the Related Art Conventionally, a fuse for electronic equipment using a metal foil that operates at a low current has a structure in which a metal is vapor-deposited on an organic film or a structure in which an extremely thin metal foil is sandwiched by an organic film. Etc. are known.
【0003】[0003]
【発明が解決しょうとする問題点】従来の技術で述べた
もののうち前者においては、マスキング又はエッチング
等の蒸着膜の加工に工数がかかり、又後者においても、
金属箔やフィルムの加工に工数がかかる等の問題点を有
していた。In the former one of those described in the prior art, it takes a lot of man-hours to process the vapor-deposited film such as masking or etching, and also in the latter,
There is a problem that it takes a lot of time to process the metal foil or film.
【0004】本発明は、従来の技術が有するかかる問題
点に鑑みなされたもので、その目的とするところは、熱
転写技術によって複雑なパターン形状の金属箔ヒューズ
も簡易に製造可能とすると共に、工程の簡素化を図り、
以って生産性の向上に寄与せんとするにある。The present invention has been made in view of the above problems of the prior art, and an object of the present invention is to easily manufacture a metal foil fuse having a complicated pattern shape by a thermal transfer technique and to process the same. Simplification of
This will contribute to the improvement of productivity.
【0005】[0005]
【問題点を解決するための手段】この目的のため、本発
明は、樹脂フィルム等の絶縁物の表面に金属箔を設けて
成る熱転写用フィルムを、その金属箔面を絶縁基板に接
触又は近接させて配置した後、該熱転写用フィルムをそ
の裏面側より凸状にヒューズ素子のパターンを浮き出さ
せた転写用金型で加熱圧着、好ましくは120〜160
℃で0.2〜2秒間加熱圧着してパターン形状に金属箔
を絶縁基板上に転写し、次いで、転写された金属箔素子
の両端部に端子処理を施して金属箔ヒューズを得る構成
を特徴とするものである。To this end, the present invention provides a thermal transfer film comprising a metal foil provided on the surface of an insulating material such as a resin film, the metal foil surface of which is brought into contact with or close to an insulating substrate. After that, the thermal transfer film is thermocompression-bonded by a transfer mold in which the pattern of the fuse element is raised in a convex shape from the back surface side, preferably 120 to 160.
Characterized by a structure in which a metal foil is transferred to an insulating substrate in a pattern shape by thermocompression bonding at 0.2 ° C. for 0.2 to 2 seconds, and then both ends of the transferred metal foil element are subjected to terminal treatment to obtain a metal foil fuse. It is what
【0006】[0006]
【実施例1】実施例について図面を参照して説明する
と、図2に示されているように、長尺の樹脂フィルム1
1の表面に接着剤12を介して導電性の金属箔13を一
様に接着すると共に、該金属箔13の裏面には熱硬化性
接着剤14を塗着して熱転写用フィルム10を形成し、
図1及び図3に示されているように、該熱転写用フィル
ム10をフイルム又は板状の絶縁基板15上に転写用金
型16の加熱圧着手段を介して転写する。更に説明する
と、転写用金型16は、その圧着面に凸状に浮き出させ
たヒューズ素子のパターン17を有し、内部には、特に
図示しないが加熱手段とそれの温度調整手段等を有して
いる。そして、熱転写用フィルム10における金属箔1
3の面をフイルム又は板状の絶縁基板15に接触又は近
接させて水平又は平行に配置し、該熱転写用フイルム1
0を、その裏面側より転写用金型16でフイルム又は板
状の絶縁基板15上に加熱圧着する。EXAMPLE 1 An example will be described with reference to the drawings. As shown in FIG.
A conductive metal foil 13 is evenly adhered to the surface of 1 via an adhesive 12, and a thermosetting adhesive 14 is applied to the back surface of the metal foil 13 to form a thermal transfer film 10. ,
As shown in FIGS. 1 and 3, the thermal transfer film 10 is transferred onto a film or plate-shaped insulating substrate 15 through a heating and pressing means of a transfer die 16. More specifically, the transfer die 16 has a pattern 17 of a fuse element that is raised in a convex shape on the pressure-bonding surface thereof, and has a heating means and a temperature adjusting means thereof, which are not particularly shown, inside. ing. Then, the metal foil 1 in the film 10 for thermal transfer
The surface 3 is placed in contact with or in close proximity to the film or plate-shaped insulating substrate 15 and arranged horizontally or in parallel.
0 is thermocompression-bonded from the back surface side thereof onto the film or plate-shaped insulating substrate 15 by the transfer mold 16.
【0007】転写用金型16による加熱圧着は、自動連
続的に行ない、好ましくは、120〜160℃の温度
で、0.2〜2秒間圧着する。すると、樹脂フイルム1
1と接着剤12は熱溶解し、金属箔13は熱硬化性接着
剤14を介してフイルム又は板状の絶縁基板15上に、
転写用金型16のヒューズ素子のパターン17の例えば
H形状に転写される。次いで、接着していない熱転写用
フィルム部分を剥離して図4及び図5に示されているよ
うに、ヒューズ素子としての金属箔素子18を得次い
で、図6に示されているように、金属箔素子18の両端
部(斜線部)19、20に、銀ペースト等の導電性塗料
を塗着して外部引出端子を接合するための端子処理を施
し、電極となる該両端子部19、20に連らなる部分2
1にヒューズ機能を持たせた金属箔ヒューズを得る。本
実施例により得られた金属箔ヒューズによれば、例えば
直接基板にフェイスダゥンボンディング等が可能とな
る。The thermocompression bonding by the transfer mold 16 is automatically and continuously carried out, preferably at a temperature of 120 to 160 ° C. for 0.2 to 2 seconds. Then, the resin film 1
1 and the adhesive 12 are melted by heat, and the metal foil 13 is placed on the insulating substrate 15 in the form of a film or a plate through the thermosetting adhesive 14.
The pattern 17 of the fuse element of the transfer mold 16 is transferred to, for example, an H shape. Next, the non-adhered thermal transfer film portion is peeled off to obtain a metal foil element 18 as a fuse element as shown in FIGS. 4 and 5, and then a metal foil element 18 is obtained as shown in FIG. Both ends (shaded portions) 19 and 20 of the foil element 18 are coated with a conductive paint such as silver paste and subjected to a terminal treatment for joining the external lead terminals, and both terminals 19 and 20 serving as electrodes are formed. Part 2 connected to
A metal foil fuse in which 1 has a fuse function is obtained. According to the metal foil fuse obtained in this embodiment, for example, face down bonding can be directly performed on the substrate.
【0008】[0008]
【実施例2】上記実施例は、外部引出端子を片面接続す
る場合の金属箔ヒューズの場合であるが、外部引出端子
を両面に接続する金属箔ヒューズの場合には、図7から
図12に示されている工程により製造する。[Embodiment 2] The above embodiment is a case of a metal foil fuse in which the external lead terminals are connected on one side. However, in the case of a metal foil fuse in which the external lead terminals are connected to both sides, the case shown in FIGS. Produce by the steps shown.
【0009】そこで、図1から図6との対応部分に同一
参照番号を附して示す図7から図12に基づいて更に説
明すると、フイルム又は板状の絶縁基板15上に、これ
に塗着した剥離剤22を介して熱転写用フィルム10を
接触又は近接させ、転写用金型16で加熱圧着し、ヒュ
ーズ素子のパターン17を転写して金属箔素子18を得
る(図7及び図8参照)。次いで、端子用穴24を加工
した補強用の絶縁フィルム23を熱硬化性接着剤25を
介して金属箔素子18の上面に熱圧着し(図9参照)、
次いで、絶縁フィルム23の端子用穴24内に導電性樹
脂等の導電性部剤を填装して金属箔素子18の一方の端
部19と導通する端子部26を形成する(図10参
照)。次いで、フイルム又は板状の絶縁基板15を剥離
し(図11参照)、更に必要によっては金属箔素子18
の表面を洗浄して剥離剤等を除去し、次いで、金属箔素
子18の対向面を図9及び図10に示す工程によって、
他方の端部20と導通する端子部27を形成し(図12
参照)、両面接続用の金属箔ヒューズを得る。Therefore, a further explanation will be given with reference to FIGS. 7 to 12 in which parts corresponding to those of FIGS. 1 to 6 are given the same reference numerals, and a film or plate-shaped insulating substrate 15 is coated with the same. The thermal transfer film 10 is brought into contact with or in close proximity via the released release agent 22 and is thermocompression bonded by the transfer mold 16 to transfer the fuse element pattern 17 to obtain the metal foil element 18 (see FIGS. 7 and 8). .. Then, the reinforcing insulating film 23 having the terminal holes 24 processed is thermocompression bonded to the upper surface of the metal foil element 18 via the thermosetting adhesive 25 (see FIG. 9).
Then, a conductive material such as a conductive resin is filled in the terminal hole 24 of the insulating film 23 to form the terminal portion 26 that is electrically connected to the one end 19 of the metal foil element 18 (see FIG. 10). .. Next, the film- or plate-shaped insulating substrate 15 is peeled off (see FIG. 11), and if necessary, the metal foil element 18 is removed.
The surface of the metal foil element 18 is cleaned to remove the release agent and the like, and then the facing surface of the metal foil element 18 is subjected to the steps shown in FIGS. 9 and 10.
A terminal portion 27 that is electrically connected to the other end portion 20 is formed (see FIG. 12).
See), get a metal foil fuse for double-sided connection.
【0010】[0010]
【発明の効果】しかして、本発明によれば、熱転写技術
により金属箔ヒユーズを製造するものであるから、複雑
な形状のヒューズ素子パターンも容易に形成することが
できるばかりか、金属箔の厚さ及びパターン幅を変える
ことにより任意の定格が設計でき、また、微小化できる
ため、タンタルチップコンデンサ等の小形部品への内蔵
に好適であり、線ヒューズでは得難い微小電流定格の高
性能ヒューズが簡単に量産できる。As described above, according to the present invention, since the metal foil fuse is manufactured by the thermal transfer technique, not only the fuse element pattern having a complicated shape can be easily formed, but also the thickness of the metal foil is increased. It is suitable for embedding in small parts such as tantalum chip capacitors because it is possible to design an arbitrary rating by changing the length and pattern width and it can be miniaturized. Can be mass-produced.
【図1】本発明に係る製造法の一例での熱転写工程を示
す断面的説明図である。FIG. 1 is a cross-sectional explanatory view showing a thermal transfer process in an example of a manufacturing method according to the present invention.
【図2】熱転写用フィルムを示す断面的説明図である。FIG. 2 is a cross-sectional explanatory view showing a thermal transfer film.
【図3】転写用金型を示す斜視図的説明図である。FIG. 3 is a perspective view illustrating a transfer mold.
【図4】金属箔素子の転写状態を示す断面的説明図であ
る。FIG. 4 is a cross-sectional explanatory view showing a transferred state of the metal foil element.
【図5】金属箔素子の転写状態を示す斜視図的説明図で
ある。FIG. 5 is an explanatory perspective view showing a transfer state of the metal foil element.
【図6】製造された金属箔ヒューズを示す斜視図的説明
図である。FIG. 6 is a perspective view illustrating a manufactured metal foil fuse.
【図7】本発明の他例での熱転写工程を示す断面的説明
図である。FIG. 7 is a cross-sectional explanatory view showing a thermal transfer step in another example of the present invention.
【図8】金属箔素子の転写状態を示す断面的説明図であ
る。FIG. 8 is a cross-sectional explanatory view showing a transferred state of the metal foil element.
【図9】端子用穴を加工したところの補強用絶縁フィル
ムの圧着状態を示す断面的説明図である。FIG. 9 is a cross-sectional explanatory view showing a pressure-bonded state of the reinforcing insulating film when the terminal hole is processed.
【図10】端子部の形成状態を示す断面的説明図であ
る。FIG. 10 is a cross-sectional explanatory view showing a formation state of a terminal portion.
【図11】絶縁基板の剥離状態を示す断面的説明図であ
る。FIG. 11 is a cross-sectional explanatory view showing a peeled state of the insulating substrate.
【図12】両面に接続端子部を形成した金属箔ヒューズ
の断面的説明図である。FIG. 12 is a cross-sectional explanatory view of a metal foil fuse having connection terminal portions formed on both sides.
10 熱転写用フィルム 11 樹脂フィルム 12 接着剤 13 金属箔 14 熱硬化性接着剤 15 フイルム又は板状の絶縁基板 16 転写用金型 17 ヒューズ素子パターン 18 金属箔素子 19、20 金属箔素子の両端部 10 Thermal Transfer Film 11 Resin Film 12 Adhesive 13 Metal Foil 14 Thermosetting Adhesive 15 Film or Plate Insulating Substrate 16 Transfer Mold 17 Fuse Element Pattern 18 Metal Foil Element 19, 20 Both Ends of Metal Foil Element
Claims (2)
る熱転写用フィルムを、その金属箔面を絶縁基板に接触
又は近接させて配置した後、該熱転写用フィルムをその
裏面側より凸状にヒューズ素子のパターンを浮き出させ
た転写用金型で加熱圧着してパターン形状に金属箔を絶
縁基板上に転写し、次いで、転写された金属箔素子の両
端部に端子処理を施して金属箔ヒューズを得る構成を特
徴とする金属箔ヒューズの製造法。1. A thermal transfer film having a metal foil provided on the surface of a resin film is placed with the metal foil surface in contact with or in close proximity to an insulating substrate, and then the thermal transfer film is made convex from the back side thereof. A metal foil fuse is formed by transferring the metal foil to the pattern shape by heating and pressure bonding with a transfer mold in which the pattern of the fuse element is raised, and then performing terminal treatment on both ends of the transferred metal foil element. A method of manufacturing a metal foil fuse, characterized by the construction of obtaining
熱し、かつ0.2〜2秒間圧着することを特徴とする請
求項1の金属箔ヒューズの製造法。2. The method of manufacturing a metal foil fuse according to claim 1, wherein the transfer mold is heated to 120 to 160 ° C. and pressure-bonded for 0.2 to 2 seconds.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14325692A JPH05314888A (en) | 1992-05-08 | 1992-05-08 | Manufacture of metallic foil fuse |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14325692A JPH05314888A (en) | 1992-05-08 | 1992-05-08 | Manufacture of metallic foil fuse |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH05314888A true JPH05314888A (en) | 1993-11-26 |
Family
ID=15334521
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14325692A Pending JPH05314888A (en) | 1992-05-08 | 1992-05-08 | Manufacture of metallic foil fuse |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH05314888A (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1997047019A3 (en) * | 1996-06-07 | 1998-02-26 | Littelfuse Inc | A surface-mount fuse and the manufacture thereof |
US5790008A (en) * | 1994-05-27 | 1998-08-04 | Littlefuse, Inc. | Surface-mounted fuse device with conductive terminal pad layers and groove on side surfaces |
WO1998037564A3 (en) * | 1997-02-21 | 1999-03-25 | Littelfuse Inc | A surface-mount fuse and the manufacture thereof |
US5943764A (en) * | 1994-05-27 | 1999-08-31 | Littelfuse, Inc. | Method of manufacturing a surface-mounted fuse device |
US5974661A (en) * | 1994-05-27 | 1999-11-02 | Littelfuse, Inc. | Method of manufacturing a surface-mountable device for protection against electrostatic damage to electronic components |
US6878004B2 (en) | 2002-03-04 | 2005-04-12 | Littelfuse, Inc. | Multi-element fuse array |
US20130032283A1 (en) * | 2011-08-03 | 2013-02-07 | Graphic Packaging International, Inc. | Systems and Methods for Forming Laminates with Patterned Microwave Energy Interactive Material |
US9451659B2 (en) | 2013-09-26 | 2016-09-20 | Graphic Packaging International, Inc. | Laminates, and systems and methods for laminating |
US9751288B2 (en) | 2014-12-22 | 2017-09-05 | Graphic Packaging International, Inc. | Systems and methods for forming laminates |
-
1992
- 1992-05-08 JP JP14325692A patent/JPH05314888A/en active Pending
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5790008A (en) * | 1994-05-27 | 1998-08-04 | Littlefuse, Inc. | Surface-mounted fuse device with conductive terminal pad layers and groove on side surfaces |
US5943764A (en) * | 1994-05-27 | 1999-08-31 | Littelfuse, Inc. | Method of manufacturing a surface-mounted fuse device |
US5974661A (en) * | 1994-05-27 | 1999-11-02 | Littelfuse, Inc. | Method of manufacturing a surface-mountable device for protection against electrostatic damage to electronic components |
US6023028A (en) * | 1994-05-27 | 2000-02-08 | Littelfuse, Inc. | Surface-mountable device having a voltage variable polgmeric material for protection against electrostatic damage to electronic components |
WO1997047019A3 (en) * | 1996-06-07 | 1998-02-26 | Littelfuse Inc | A surface-mount fuse and the manufacture thereof |
WO1998037564A3 (en) * | 1997-02-21 | 1999-03-25 | Littelfuse Inc | A surface-mount fuse and the manufacture thereof |
US6878004B2 (en) | 2002-03-04 | 2005-04-12 | Littelfuse, Inc. | Multi-element fuse array |
US20130032283A1 (en) * | 2011-08-03 | 2013-02-07 | Graphic Packaging International, Inc. | Systems and Methods for Forming Laminates with Patterned Microwave Energy Interactive Material |
US9216564B2 (en) * | 2011-08-03 | 2015-12-22 | Graphic Packaging International, Inc. | Systems and methods for forming laminates with patterned microwave energy interactive material |
US9701103B2 (en) | 2011-08-03 | 2017-07-11 | Graphic Packaging International, Inc. | Systems and methods for forming laminates with patterned microwave energy interactive material |
US9451659B2 (en) | 2013-09-26 | 2016-09-20 | Graphic Packaging International, Inc. | Laminates, and systems and methods for laminating |
US10306712B2 (en) | 2013-09-26 | 2019-05-28 | Graphic Packaging International, Llc | Laminates, and systems and methods for laminating |
US11310875B2 (en) | 2013-09-26 | 2022-04-19 | Graphic Packaging International, Llc | Laminates, and systems and methods for laminating |
US9751288B2 (en) | 2014-12-22 | 2017-09-05 | Graphic Packaging International, Inc. | Systems and methods for forming laminates |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
IE52529B1 (en) | Method of simultaneously manufacturing multiple electrical connections between two elements | |
JPS60206087A (en) | Method of producing small-sized electronic power source | |
JPH11163501A (en) | Method for mounting electronic part, and electronic circuit device manufactured there by | |
JPH05314888A (en) | Manufacture of metallic foil fuse | |
US5440802A (en) | Method of making wire element ceramic chip fuses | |
JP2002252318A (en) | Chip-type semiconductor device | |
US4342881A (en) | Laminated bus bar and method of manufacture | |
JP3163751B2 (en) | Method for manufacturing semiconductor device | |
JPS6389313A (en) | Molding of resin in mold for electronic component | |
JPH0878422A (en) | Forming method of ball-shaped outer electrode | |
JPS6326545B2 (en) | ||
JPS60160624A (en) | Dielectric isolation for semiconductor chip | |
JPH0521522A (en) | Semiconductor chip mounting method | |
JPH0442914A (en) | Chip-type solid electrolytic capacitor and its manufacture | |
JP3851541B2 (en) | Chip component and manufacturing method thereof | |
EP1028464B1 (en) | Semiconductor device with improved interconnections between the chip and the terminals, and process for its manufacture | |
JP3441194B2 (en) | Semiconductor device and manufacturing method thereof | |
JP3472342B2 (en) | Method of manufacturing semiconductor device package | |
JP2002124531A (en) | Semiconductor device, method for manufacturing the same and mounting structure thereof | |
JP3036484B2 (en) | Semiconductor device and manufacturing method thereof | |
WO1995010852A1 (en) | Bonding of leads directly over chip active areas | |
JPS6155247B2 (en) | ||
JPH0365651B2 (en) | ||
JPH11345822A (en) | Manufacture of semiconductor device | |
JPS6341054A (en) | Bonding method of hybrid integrated circuit |