JPH0530862B2 - - Google Patents
Info
- Publication number
- JPH0530862B2 JPH0530862B2 JP5193586A JP5193586A JPH0530862B2 JP H0530862 B2 JPH0530862 B2 JP H0530862B2 JP 5193586 A JP5193586 A JP 5193586A JP 5193586 A JP5193586 A JP 5193586A JP H0530862 B2 JPH0530862 B2 JP H0530862B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy
- resin
- hydrogenated polybutadiene
- agent
- modified hydrogenated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5193586A JPS62209125A (ja) | 1986-03-10 | 1986-03-10 | 半導体封止用エポキシ樹脂組成物 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5193586A JPS62209125A (ja) | 1986-03-10 | 1986-03-10 | 半導体封止用エポキシ樹脂組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62209125A JPS62209125A (ja) | 1987-09-14 |
JPH0530862B2 true JPH0530862B2 (enrdf_load_html_response) | 1993-05-11 |
Family
ID=12900723
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5193586A Granted JPS62209125A (ja) | 1986-03-10 | 1986-03-10 | 半導体封止用エポキシ樹脂組成物 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62209125A (enrdf_load_html_response) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7066975B2 (ja) * | 2017-03-10 | 2022-05-16 | 味の素株式会社 | 樹脂組成物、樹脂シート、回路基板及び半導体チップパッケージ |
KR102184587B1 (ko) * | 2019-02-28 | 2020-12-01 | 주식회사 케이씨씨 | 접착제 조성물 |
-
1986
- 1986-03-10 JP JP5193586A patent/JPS62209125A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS62209125A (ja) | 1987-09-14 |
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