JPH0530542B2 - - Google Patents

Info

Publication number
JPH0530542B2
JPH0530542B2 JP59059947A JP5994784A JPH0530542B2 JP H0530542 B2 JPH0530542 B2 JP H0530542B2 JP 59059947 A JP59059947 A JP 59059947A JP 5994784 A JP5994784 A JP 5994784A JP H0530542 B2 JPH0530542 B2 JP H0530542B2
Authority
JP
Japan
Prior art keywords
silver alloy
fluid
wire
alloy wire
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59059947A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60204844A (ja
Inventor
Kazuo Sawada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP59059947A priority Critical patent/JPS60204844A/ja
Publication of JPS60204844A publication Critical patent/JPS60204844A/ja
Priority to US06/898,835 priority patent/US4702302A/en
Publication of JPH0530542B2 publication Critical patent/JPH0530542B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0115—Apparatus for manufacturing bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver

Landscapes

  • Continuous Casting (AREA)
JP59059947A 1983-02-23 1984-03-27 銀合金線の製造方法 Granted JPS60204844A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP59059947A JPS60204844A (ja) 1984-03-27 1984-03-27 銀合金線の製造方法
US06/898,835 US4702302A (en) 1983-02-23 1986-08-20 Method of making thin alloy wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59059947A JPS60204844A (ja) 1984-03-27 1984-03-27 銀合金線の製造方法

Publications (2)

Publication Number Publication Date
JPS60204844A JPS60204844A (ja) 1985-10-16
JPH0530542B2 true JPH0530542B2 (enExample) 1993-05-10

Family

ID=13127846

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59059947A Granted JPS60204844A (ja) 1983-02-23 1984-03-27 銀合金線の製造方法

Country Status (1)

Country Link
JP (1) JPS60204844A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69009814T2 (de) * 1989-03-24 1994-11-17 Mitsubishi Materials Corp Silberlegierungsblatt zur Verbindung von Sonnenzellen.
KR101678806B1 (ko) * 2014-07-10 2016-11-23 신닛테츠스미킹 마테리알즈 가부시키가이샤 반도체 장치용 본딩 와이어

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4867153A (enExample) * 1971-12-17 1973-09-13
US3845805A (en) * 1972-11-14 1974-11-05 Allied Chem Liquid quenching of free jet spun metal filaments

Also Published As

Publication number Publication date
JPS60204844A (ja) 1985-10-16

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