JPH0530394Y2 - - Google Patents

Info

Publication number
JPH0530394Y2
JPH0530394Y2 JP1987129483U JP12948387U JPH0530394Y2 JP H0530394 Y2 JPH0530394 Y2 JP H0530394Y2 JP 1987129483 U JP1987129483 U JP 1987129483U JP 12948387 U JP12948387 U JP 12948387U JP H0530394 Y2 JPH0530394 Y2 JP H0530394Y2
Authority
JP
Japan
Prior art keywords
cooling
cooling plate
ring
refrigerant
flange portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987129483U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6435794U (nl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987129483U priority Critical patent/JPH0530394Y2/ja
Publication of JPS6435794U publication Critical patent/JPS6435794U/ja
Application granted granted Critical
Publication of JPH0530394Y2 publication Critical patent/JPH0530394Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1987129483U 1987-08-26 1987-08-26 Expired - Lifetime JPH0530394Y2 (nl)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987129483U JPH0530394Y2 (nl) 1987-08-26 1987-08-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987129483U JPH0530394Y2 (nl) 1987-08-26 1987-08-26

Publications (2)

Publication Number Publication Date
JPS6435794U JPS6435794U (nl) 1989-03-03
JPH0530394Y2 true JPH0530394Y2 (nl) 1993-08-03

Family

ID=31383799

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987129483U Expired - Lifetime JPH0530394Y2 (nl) 1987-08-26 1987-08-26

Country Status (1)

Country Link
JP (1) JPH0530394Y2 (nl)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5737258B2 (nl) * 1976-06-09 1982-08-09
JPS6267844A (ja) * 1985-09-20 1987-03-27 Fujitsu Ltd 冷却構造

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5737258U (nl) * 1980-08-11 1982-02-27

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5737258B2 (nl) * 1976-06-09 1982-08-09
JPS6267844A (ja) * 1985-09-20 1987-03-27 Fujitsu Ltd 冷却構造

Also Published As

Publication number Publication date
JPS6435794U (nl) 1989-03-03

Similar Documents

Publication Publication Date Title
US5457342A (en) Integrated circuit cooling apparatus
US5794454A (en) Cooling device for hard to access non-coplanar circuit chips
US7149087B2 (en) Liquid cooled heat sink with cold plate retention mechanism
US5191512A (en) Heat sink/circuit board assembly
US11903164B2 (en) Heat dissipation apparatus, device, rack, and system
KR20190124146A (ko) 전력 전자 회로의 냉각
CA2275875C (en) Component holder with circulating air cooling of electrical components
JPH0530394Y2 (nl)
US5838544A (en) Heat dissipating structure for rectifiers of car alternators
JPS5893264A (ja) デバイスの冷却装置
US4520426A (en) Cooling subrack for logic cards
US20200236811A1 (en) Thermally conductive insert element for electronic unit
JPH0539662Y2 (nl)
JPH05243771A (ja) 浸漬ｄｃ−ｄｃコンバータの冷却構造
JPS62172798A (ja) 冷却プレ−ト
JPH07307533A (ja) プリント配線基板
US11910573B2 (en) Mechanical device for cooling an electronic component
US20230397381A1 (en) Heat dissipation structure for inverter ground screws of a belt starter generator
JP2000082768A (ja) ヒートシンク実装方式
JP2551821Y2 (ja) プリント配線基板装置
JPH02301159A (ja) 集積回路の冷却構造
JP2594688B2 (ja) 浸漬ｄｃ―ｄｃコンバータ冷却器
JP2585630Y2 (ja) 電子部品の冷却構造
JPH06332572A (ja) 低温槽内の電子機器への給電装置
JPH0354894A (ja) 電源の冷却構造