JPH0530394Y2 - - Google Patents
Info
- Publication number
- JPH0530394Y2 JPH0530394Y2 JP1987129483U JP12948387U JPH0530394Y2 JP H0530394 Y2 JPH0530394 Y2 JP H0530394Y2 JP 1987129483 U JP1987129483 U JP 1987129483U JP 12948387 U JP12948387 U JP 12948387U JP H0530394 Y2 JPH0530394 Y2 JP H0530394Y2
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- cooling plate
- ring
- refrigerant
- flange portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000001816 cooling Methods 0.000 claims description 69
- 239000003507 refrigerant Substances 0.000 claims description 20
- 229920005989 resin Polymers 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 14
- 229920003002 synthetic resin Polymers 0.000 claims description 3
- 239000000057 synthetic resin Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000006056 electrooxidation reaction Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
Description
【考案の詳細な説明】
〔概要〕
冷媒が循環する冷却プレートにフランジ部付き
の冷却素子を固着し、冷却素子の頭部に密接した
電子部品を冷却する冷却構造において、
局部電池の発生を阻止して長寿命化を図ること
を目的として、
フランジ部の端面と冷却プレートの固着面との
間に介在し、冷媒がフランジ部と冷却プレートと
の当接部側に侵入するのを阻止するＯリング５
と、フランジ部側か冷却プレート側かの何れか一
方のＯリングの圧接面に固着される、合成樹脂よ
りなる樹脂リングとを、備えた構成とする。[Detailed description of the invention] [Summary] A cooling element with a flange is fixed to a cooling plate through which refrigerant circulates, and the generation of local batteries is prevented in a cooling structure that cools electronic components in close contact with the head of the cooling element. For the purpose of extending the service life of the cooling plate, an O is installed between the end face of the flange and the fixed surface of the cooling plate to prevent refrigerant from entering the contact area between the flange and the cooling plate. ring 5
and a resin ring made of synthetic resin that is fixed to the pressure contact surface of the O-ring on either the flange side or the cooling plate side.
本考案は、冷媒が循環する冷却プレートに冷却
素子を固着し、冷却素子の頭部に密接した電子部
品を冷却するという冷却構造に関する。
The present invention relates to a cooling structure in which a cooling element is fixed to a cooling plate through which a refrigerant circulates, and electronic components that are in close contact with the head of the cooling element are cooled.
プリント基板にLSI素子などの電子部品が多数
実装された電子装置では、安定した稼働をえるた
めに冷却装置による冷却が行われている。 Electronic devices, in which many electronic components such as LSI elements are mounted on printed circuit boards, are cooled by cooling devices to ensure stable operation.
このような冷却装置としては、冷却効率が高
く、しかも、経済的なことから、一般的に、冷媒
を循環する冷却プレートによる冷却が知られてい
る。 As such a cooling device, cooling using a cooling plate that circulates a refrigerant is generally known because it has high cooling efficiency and is economical.
このような冷却装置は電子装置の稼働時は、常
に、稼働されているため、長時間の稼働に対して
障害がないように信頼性を有し、長寿命であるこ
とが重要である。 Since such a cooling device is always in operation when an electronic device is in operation, it is important that it is reliable and has a long life so that there is no problem during long-term operation.
従来は第３図の従来の説明に示すように構成さ
れていた。第３図のａは斜視図、ｂは側面断面図
である。
Conventionally, the configuration was as shown in the conventional explanation in FIG. In FIG. 3, a is a perspective view, and b is a side sectional view.
第３図のａに示すように、複数の電子部品１３
が実装されたプリント基板１２に対して、良熱伝
導材の銅、アルミ、ステンレスなどの材質によつ
て形成された冷却プレート１が矢印Ｃのように重
ねられることで設けられ、また、冷却プレート１
の一面の所定個所には冷却素子１１がそれぞれの
電子部品１３の表面に合致するように設けられる
ことで構成されている。 As shown in FIG. 3a, a plurality of electronic components 13
A cooling plate 1 made of a good heat conductive material such as copper, aluminum, stainless steel, etc. is stacked on the printed circuit board 12 mounted thereon as shown by arrow C. 1
A cooling element 11 is provided at a predetermined location on one surface so as to match the surface of each electronic component 13.
そこで、冷却素子１１の先端部が電子部品１３
のそれぞれの表面に圧接され、冷媒が冷却プレー
ト１の一方の口１０より矢印Ａのように供給さ
れ、他方の口から矢印Ｂのように排出されること
で循環される。 Therefore, the tip of the cooling element 11 is connected to the electronic component 13.
The refrigerant is supplied to each surface of the cooling plate 1 as shown by arrow A from one port 10 of the cooling plate 1, and is circulated as shown by arrow B from the other port.
この冷却素子１１はｂに示すように、冷却プレ
ート１にねじ止め固着するフランジ部１１Ｂが設
けられ、頭部がプリント基板１２に実装された電
子部品１３の表面に圧接されるように形成されて
いる。 As shown in b, this cooling element 11 is provided with a flange portion 11B that is fixed to the cooling plate 1 by screws, and the head portion is formed so as to be pressed against the surface of the electronic component 13 mounted on the printed circuit board 12. There is.
したがつて、冷却プレート１の流通路１Ａを循
環する冷媒が矢印のように冷却素子１１の内部１
１Ａに流通され、電子部品１３の発熱の冷却が行
われる。 Therefore, the refrigerant circulating through the flow path 1A of the cooling plate 1 flows into the inside 1 of the cooling element 11 as shown by the arrow.
1A, and the heat generated by the electronic component 13 is cooled.
また、冷却プレート１とフランジ部１１Ｂとの
当接部から矢印Ｅのように冷媒が漏れ出すことの
ないように密封するようにフランジ部１１Ｂに溝
１１Ｃを設け、溝１１ＣにＯリング５を挿入する
ことでフランジ部１１Ｂが冷却プレート１に係止
するように形成されている。 In addition, a groove 11C is provided in the flange portion 11B so as to prevent the refrigerant from leaking from the contact portion between the cooling plate 1 and the flange portion 11B as shown by arrow E, and an O-ring 5 is inserted into the groove 11C. By doing so, the flange portion 11B is formed so as to be locked to the cooling plate 1.
しかし、このような構成では、溝１１Ｃに冷媒
が滞留されることになり、例えば、冷却プレート
１の材質がアルミであり、フランジ部１１Ｂの材
質が銅であると異種金属による電位差によつて局
部電池が発生し、その結果フランジ部か冷却プレ
ートのいずれか一方が電気化学的腐食し、寿命が
低下する。
However, in such a configuration, the refrigerant is retained in the groove 11C. For example, if the material of the cooling plate 1 is aluminum and the material of the flange portion 11B is copper, the refrigerant may be locally stored due to the potential difference between different metals. Batteries occur, resulting in electrochemical corrosion of either the flange or the cooling plate, reducing service life.
本考案の目的は、局部電池の発生を防止して、
長寿命化を図ることにある。 The purpose of this invention is to prevent the occurrence of local batteries,
The purpose is to extend the lifespan.
上記の目的を達成するために本考案は、第１図
に図示したように、冷媒４が循環する冷却プレー
ト１と、冷却プレート１の所定個所にフランジ面
を密接に固着するフランジ部付きの冷却素子２を
有し、冷媒４を冷却プレート１より冷却素子２の
内部２Ａに流通させて、冷却素子２の頭部に密接
した電子部品１３を、冷却するよう構成した冷却
構造において、
フランジ部３の端面と冷却プレート１の固着面
との間に介在し、冷媒４がフランジ部３と冷却プ
レート１との当接部７側に侵入するのを阻止する
Ｏリング５と、フランジ部３側か冷却プレート１
側かの何れかの一方のＯリング５の圧接面に固着
される、合成樹脂よりなる樹脂リング６とを、備
えた構成とする。
In order to achieve the above object, the present invention, as shown in FIG. In a cooling structure having a cooling element 2 and configured to cool an electronic component 13 in close contact with a head of the cooling element 2 by circulating a refrigerant 4 from the cooling plate 1 into the interior 2A of the cooling element 2, the flange portion 3 An O-ring 5 is interposed between the end face of the cooling plate 1 and the fixed surface of the cooling plate 1 to prevent the refrigerant 4 from entering the contact part 7 side between the flange part 3 and the cooling plate 1; cooling plate 1
A resin ring 6 made of synthetic resin is fixed to the pressure contact surface of one of the O-rings 5 on either side.
即ち、冷却プレートとフランジ部とのいづれか
に樹脂リングを固着させ、Ｏリング５を樹脂リン
グに重ねることで設けるようにしたものである。
That is, a resin ring is fixed to either the cooling plate or the flange portion, and the O-ring 5 is provided by overlapping the resin ring.
したがつて、溝に冷媒が滞留しても、異種金属
による電位差は樹脂リングによつて遮られ、極部
電池を防止することを行うことができ、長寿命化
を図ることができる。 Therefore, even if the refrigerant remains in the groove, the potential difference due to the dissimilar metals is blocked by the resin ring, and it is possible to prevent polar battery formation and extend the service life.
以下本考案を第２図を参考に詳細に説明する。
第２図は本考案による一実施例の側面断面図であ
る。全図を通じて、同一符号は同一対象物を示
す。
The present invention will be explained in detail below with reference to FIG.
FIG. 2 is a side sectional view of one embodiment of the present invention. The same reference numerals indicate the same objects throughout the figures.
第２図に示すように、冷却素子２のフランジ部
３に設けられた溝３Ａに樹脂リング６を接着材に
よつて固着することでＯリング５の挿入を行うよ
うにしたもので、その他は前述と同じ構成であ
る。 As shown in FIG. 2, an O-ring 5 is inserted by fixing a resin ring 6 to a groove 3A provided in a flange portion 3 of a cooling element 2 with an adhesive. It has the same configuration as described above.
そこで、冷却素子２を冷却プレート１に係止す
る際、先づ、フランジ部３の溝３Ａに樹脂リング
６を接着材によつて固着し、次に、Ｏリング５を
溝３Ａに挿入し、フランジ部３を冷却プレート１
にねじ止めして却素子２を冷却プレート１に固着
することで、冷媒４がフランジ部３と冷却プレー
ト１との当接部７側に侵入するのを、Ｏリング５
で阻止する。 Therefore, when locking the cooling element 2 to the cooling plate 1, first, the resin ring 6 is fixed to the groove 3A of the flange portion 3 with an adhesive, and then the O-ring 5 is inserted into the groove 3A. The flange part 3 is connected to the cooling plate 1
By fixing the cooling element 2 to the cooling plate 1 with screws, the O-ring 5 prevents the refrigerant 4 from entering the contact part 7 side between the flange part 3 and the cooling plate 1.
to prevent it.
そこで、冷却プレート１の流通路１Ａに循環さ
れる冷媒４は矢印のように冷却素子２の内部２Ａ
に流通され、プリント基板１２に実装された電子
部品１３の冷却を行う。 Therefore, the refrigerant 4 circulated in the flow path 1A of the cooling plate 1 is transferred to the inside 2A of the cooling element 2 as shown by the arrow.
The electronic components 13 mounted on the printed circuit board 12 are cooled.
このように構成すると、冷媒４が溝３Ａに滞留
しても、冷却プレート１とフランジ部３との電位
差が樹脂リング６によつて遮断されるため、局部
電池の発生を防止することができる。 With this configuration, even if the refrigerant 4 stays in the groove 3A, the potential difference between the cooling plate 1 and the flange portion 3 is blocked by the resin ring 6, so that the occurrence of local batteries can be prevented.
したがつて、前述のように、冷却プレート１が
アルミ材、フランジ部が銅材によつてそれぞれ製
作された場合でも、樹脂リング６を設けることに
より、冷却プレート１とフランジ部３との当接部
７に発生する局部電池を防止することができる。 Therefore, as described above, even if the cooling plate 1 is made of aluminum and the flange part is made of copper, the provision of the resin ring 6 prevents the contact between the cooling plate 1 and the flange part 3. Local battery occurring in the portion 7 can be prevented.
尚、本考案の説明では、樹脂リング６の固着は
フランジ部３側に行うことで説明したが、冷却プ
レート１側に行うことでも良く、この場合でも同
等の効果を得ることができる。 In the description of the present invention, the resin ring 6 is fixed to the flange portion 3 side, but it may also be fixed to the cooling plate 1 side, and the same effect can be obtained in this case as well.
以上説明したように、本考案によれば、冷却プ
レート１とフランジ部３との当接部に滞留する冷
媒における異種金属による電位差を樹脂リングに
よつて、遮断させることを行うことができる。
As explained above, according to the present invention, it is possible to block the potential difference due to dissimilar metals in the refrigerant staying at the contact portion between the cooling plate 1 and the flange portion 3 by using the resin ring.
したがつて、当接部における局部電池の発生を
防止することができ、長寿命化が図れ、実用的効
果は大である。 Therefore, it is possible to prevent the generation of local batteries in the contact portion, and the lifespan can be extended, which has a great practical effect.
第１図は本考案の原理説明図、第２図は本考案
による一実施例の側面断面図、第３図は従来の説
明図で、ａは斜視図、ｂは側面断面図を示す。
図において、１は冷却プレート、２は冷却素
子、３はフランジ部、４は冷媒、５はＯリング、
６は樹脂リング、２Ａは内部を示す。
FIG. 1 is a diagram illustrating the principle of the present invention, FIG. 2 is a side sectional view of an embodiment of the present invention, and FIG. 3 is a conventional explanatory diagram, in which a is a perspective view and b is a side sectional view. In the figure, 1 is a cooling plate, 2 is a cooling element, 3 is a flange, 4 is a refrigerant, 5 is an O-ring,
6 indicates a resin ring, and 2A indicates the inside.
Claims (1)
レート１の所定個所にフランジ面を密接に固着す
るフランジ部付きの冷却素子２を有し、該冷媒４
を該冷却プレート１より該冷却素子２の内部２Ａ
に流通させて、該冷却素子２の頭部に密接した電
子部品１３を冷却するよう構成した冷却構造にお
いて、 該フランジ部３の端面と該冷却プレート１の固
着面との間に介在し、該冷媒４が該フランジ部３
と該冷却プレート１との当接部７側に侵入するの
を阻止するＯリング５と、 該フランジ部３側か該冷却プレート１側かの何
れかの一方の、該Ｏリング５の圧接面に固着され
る合成樹脂よりなる樹脂リング６とを、備えたこ
とを特徴とする冷却構造。[Claims for Utility Model Registration] A cooling plate 1 in which a refrigerant 4 circulates, and a cooling element 2 with a flange portion whose flange surface is closely fixed to a predetermined location of the cooling plate 1, the refrigerant 4
from the cooling plate 1 to the inside 2A of the cooling element 2
In the cooling structure configured to cool the electronic component 13 in close contact with the head of the cooling element 2 by allowing the cooling element 2 to flow through the The refrigerant 4 is in the flange portion 3
an O-ring 5 that prevents the O-ring 5 from entering the contact portion 7 side between the cooling plate 1 and the cooling plate 1; and a pressure contact surface of the O-ring 5 on either the flange portion 3 side or the cooling plate 1 side. A cooling structure characterized by comprising a resin ring 6 made of synthetic resin and fixed to the resin ring 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987129483U JPH0530394Y2 (en) | 1987-08-26 | 1987-08-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987129483U JPH0530394Y2 (en) | 1987-08-26 | 1987-08-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6435794U JPS6435794U (en) | 1989-03-03 |
| JPH0530394Y2 true JPH0530394Y2 (en) | 1993-08-03 |
Family
ID=31383799
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987129483U Expired - Lifetime JPH0530394Y2 (en) | 1987-08-26 | 1987-08-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0530394Y2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5737258B2 (en) * | 1976-06-09 | 1982-08-09 | ||
| JPS6267844A (en) * | 1985-09-20 | 1987-03-27 | Fujitsu Ltd | Cooling structure |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5737258U (en) * | 1980-08-11 | 1982-02-27 |
-
1987
- 1987-08-26 JP JP1987129483U patent/JPH0530394Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5737258B2 (en) * | 1976-06-09 | 1982-08-09 | ||
| JPS6267844A (en) * | 1985-09-20 | 1987-03-27 | Fujitsu Ltd | Cooling structure |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6435794U (en) | 1989-03-03 |
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