JPH02301159A - Structure for cooling integrated circuit - Google Patents
Structure for cooling integrated circuitInfo
- Publication number
- JPH02301159A JPH02301159A JP12241689A JP12241689A JPH02301159A JP H02301159 A JPH02301159 A JP H02301159A JP 12241689 A JP12241689 A JP 12241689A JP 12241689 A JP12241689 A JP 12241689A JP H02301159 A JPH02301159 A JP H02301159A
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- flange
- wiring board
- printed wiring
- fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 13
- 150000001875 compounds Chemical class 0.000 claims abstract description 8
- 239000004020 conductor Substances 0.000 abstract 1
- 239000002826 coolant Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000003507 refrigerant Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002470 thermal conductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、電子計算機等に用いられる集積回路の冷却構
造に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a cooling structure for integrated circuits used in electronic computers and the like.
従来この種の集積回路の冷却構造は、集積回路ケースの
上面より熱を伝導し冷却する構造があった（例えば特許
願昭和６３年１１６６４８号。Conventionally, this type of integrated circuit cooling structure has a structure that conducts heat from the top surface of the integrated circuit case to cool it (for example, Patent Application No. 116648 of 1988).
実用新案登録願昭和６３年４０６３５号、特許願昭和６
２年２１１８６８号）。Utility model registration application No. 40635 of 1988, patent application No. 1983
2, No. 211868).
又、プリント配線板に貫通穴をあけ、集積回路ケースの
下面より伝導冷却する構造としては、特許願昭和６３年
２９８５３１に記載のものがある。Further, as a structure in which a through hole is formed in a printed wiring board and conductive cooling is performed from the bottom surface of an integrated circuit case, there is a structure described in Patent Application No. 298531 of 1988.
上述した従来の集積回路の冷却構造では、例えば集積回
路ケースの上面より冷却する構造では、多数の集積回路
ケースの取付精度が冷却性能に影響をあたえる要素が多
大であるという欠点がある。又、集積回路の故障等によ
る交換時にはコールドプレートを着脱する必要があると
いう欠点がある。一方、集積回路ケースの下面より伝導
冷却する構造では、熱伝導ブロックがプリント配線板の
貫通穴を通して集積回路ケースの底面に取付けられてい
るため、集積回路の交換に多大な時間を要するという欠
点がある。In the conventional integrated circuit cooling structure described above, for example, in a structure in which cooling is performed from the top surface of the integrated circuit case, there is a drawback in that the mounting accuracy of a large number of integrated circuit cases has a large effect on cooling performance. Another drawback is that the cold plate must be attached and detached when replacing the integrated circuit due to failure or the like. On the other hand, in a structure in which conductive cooling is performed from the bottom surface of the integrated circuit case, the heat conduction block is attached to the bottom surface of the integrated circuit case through a through hole in the printed wiring board, which has the disadvantage that it takes a lot of time to replace the integrated circuit. be.
本発明の集積回路の冷却構造は、プリント配線板と、リ
ードにより前記プリント配線板の上面に取り付けられた
集積回路ケースと、この集積回路ケースの下面と前記プ
リント配線板の上面の間に取り付けられたフランジと、
このフランジに取り付けられ前記集積回路ケースの下面
に接する熱伝導シートと、上面に設けた雄ネジが前記プ
リント配線板に設けた貫通穴を挿通し前記フランジに設
けた雌ネジに螺合し複数の溝が成形された溝部が前記プ
リント配線板の下面側に位置するとフィンと、前記プリ
ント配線板の下面側に取り付けられ前記溝部が収容され
る凹部を有するコールドプレートと、前記凹部内に充填
されたサーマルコンパウンドとを含んで構成される。The integrated circuit cooling structure of the present invention includes a printed wiring board, an integrated circuit case attached to the upper surface of the printed wiring board by a lead, and an integrated circuit case attached between the lower surface of the integrated circuit case and the upper surface of the printed wiring board. with a flange,
A thermally conductive sheet attached to this flange and in contact with the bottom surface of the integrated circuit case, and a male screw provided on the top surface inserted into a through hole provided in the printed wiring board and screwed into a female screw provided in the flange, When the groove portion in which the groove is formed is located on the lower surface side of the printed wiring board, a fin is provided, a cold plate is attached to the lower surface side of the printed wiring board and has a recessed portion in which the groove portion is accommodated, and a cold plate filled in the recessed portion is provided. It is composed of a thermal compound.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図および第２図はそれぞれ本発明の一実施例の一部
を断面とした側面図、および拡大した断面図を示す。集
積回路を実装した集積回路ケース１は、ケース１より出
されたリード９によりプリント配線板３にハンダ付等に
より取り付けられている。一方、集積回路ケース１をプ
リント配線板３に取り付ける時に弾性を有する熱伝導シ
ート５を取り付けたフランジ２を、集積回路ケース１と
プリント配線板３の間にはさみ込んでおく。FIGS. 1 and 2 respectively show a partially sectional side view and an enlarged sectional view of an embodiment of the present invention. An integrated circuit case 1 in which an integrated circuit is mounted is attached to a printed wiring board 3 by soldering or the like using leads 9 extending from the case 1. On the other hand, when attaching the integrated circuit case 1 to the printed wiring board 3, the flange 2 to which the elastic thermally conductive sheet 5 is attached is sandwiched between the integrated circuit case 1 and the printed wiring board 3.
次に、フィン６の上面に設けた雄ネジ１０を、プリント
配線板３に明けられた貫通穴８を通してフランジ２に設
けられた雌ネジ部に螺合させる。Next, the male thread 10 provided on the upper surface of the fin 6 is screwed into the female threaded portion provided on the flange 2 through the through hole 8 made in the printed wiring board 3.
さらに、冷却用の冷媒が内部に流れるコールドプレート
４に設けたフィン６の溝部１１を収容する凹部にサーマ
ルコンパウンド７を充填し、コールドプレート４をプリ
ント配線板３の下面に取り付ける。Further, a thermal compound 7 is filled in the recessed portion of the cold plate 4 into which the cooling refrigerant flows, which accommodates the groove portion 11 of the fin 6, and the cold plate 4 is attached to the lower surface of the printed wiring board 3.
集積回路より発生した熱は、集積回路ケース１より熱伝
導シート５を介してフランジ２を伝わり、フィン６に伝
導される。フィン６の溝部１１に成形された複数個の溝
と、コールドプレート４の凹部に充填されたサーマルコ
ンパウンド７が、溝部１１の溝に流入し、フィン６に伝
導された熱は、サーマルコンパウンド７を介してコール
ドプレート４に伝導される。Heat generated by the integrated circuit is transmitted from the integrated circuit case 1 to the flange 2 via the heat conductive sheet 5, and is conducted to the fins 6. The thermal compound 7 filled in the plurality of grooves formed in the grooves 11 of the fins 6 and the recesses of the cold plate 4 flows into the grooves of the grooves 11, and the heat conducted to the fins 6 flows through the thermal compound 7. It is conducted to the cold plate 4 via.
以上説明したように本発明は、フランジの集積回路と接
する面に熱伝導体シートを取り付ける事により、集積回
路ケースの取り付は時の傾きを吸収し、安定した冷却効
果を得る事が可能となる。As explained above, in the present invention, by attaching a thermally conductive sheet to the surface of the flange that comes into contact with the integrated circuit, it is possible to absorb the tilt of the integrated circuit case and obtain a stable cooling effect. Become.
又、フィンの一面にミゾを複数個用意する事により、伝
導面積を大きくできるため、コールドプレートへの熱伝
導を容易に行なう事も可能となる。一方、集積回路の交
換は、プリント配線板に取り付けた集積回路ケースのリ
ード部を取り外す事により容易に行なう事ができる。Further, by providing a plurality of grooves on one surface of the fin, the conduction area can be increased, so that heat can be easily conducted to the cold plate. On the other hand, the integrated circuit can be easily replaced by removing the lead portion of the integrated circuit case attached to the printed wiring board.
図面の簡単な説明
第１図および第２図はそれぞれ本発明の一実施例の一部
を断面にして示す側面図および一部を拡大して示す断面
図である。BRIEF DESCRIPTION OF THE DRAWINGS FIGS. 1 and 2 are a partially sectional side view and a partially enlarged sectional view of one embodiment of the present invention, respectively.
１・・・集積回路ケース、２・・・フランジ、３・・・
プリント配線板、４・・・コールドプレート、５・・・
熱伝導体シート、６・・・フィン、７・・・サーマルコ
ンパウンド、８・・・貫通穴、９・・・集積回路リード
、１ｏ・・・雄ネジ、１１・・・溝部。1... Integrated circuit case, 2... Flange, 3...
Printed wiring board, 4... Cold plate, 5...
Thermal conductor sheet, 6...Fin, 7...Thermal compound, 8...Through hole, 9...Integrated circuit lead, 1o...Male screw, 11...Groove.
Claims (1)
上面に取り付けられた集積回路ケースと、この集積回路
ケースの下面と前記プリント配線板の上面の間に取り付
けられたフランジと、このフランジに取り付けられ前記
集積回路ケースの下面に接する熱伝導シートと、上面に
設けた雄ネジが前記プリント配線板に設けた貫通穴を挿
通し前記フランジに設けた雌ネジに螺合し複数の溝が成
形された溝部が前記プリント配線板の下面側に位置する
とフィンと、前記プリント配線板の下面側に取り付けら
れ前記溝部が収容される凹部を有するコールドプレート
と、前記凹部内に充填されたサーマルコンパウンドとを
含むことを特徴とする集積回路の冷却構造。a printed wiring board; an integrated circuit case attached to the upper surface of the printed wiring board by leads; a flange attached between the lower surface of the integrated circuit case and the upper surface of the printed wiring board; A heat conductive sheet in contact with the lower surface of the integrated circuit case, and a groove portion in which a male screw provided on the upper surface is inserted through a through hole provided in the printed wiring board and screwed into a female screw provided in the flange, and a plurality of grooves are formed. is located on the lower surface side of the printed wiring board, and includes a fin, a cold plate attached to the lower surface side of the printed wiring board and having a recess in which the groove is accommodated, and a thermal compound filled in the recess. A cooling structure for integrated circuits featuring:
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12241689A JPH088327B2 (en) | 1989-05-15 | 1989-05-15 | Integrated circuit cooling structure |
| FR8915566A FR2639764B1 (en) | 1988-11-25 | 1989-11-27 | STRUCTURE FOR COOLING HEAT GENERATING COMPONENTS |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12241689A JPH088327B2 (en) | 1989-05-15 | 1989-05-15 | Integrated circuit cooling structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02301159A true JPH02301159A (en) | 1990-12-13 |
| JPH088327B2 JPH088327B2 (en) | 1996-01-29 |
Family
ID=14835281
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12241689A Expired - Lifetime JPH088327B2 (en) | 1988-11-25 | 1989-05-15 | Integrated circuit cooling structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH088327B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4218419C2 (en) * | 1992-06-04 | 2001-10-11 | Philips Corp Intellectual Pty | Printed circuit board with a plate-shaped metal core |
| US8625284B2 (en) | 2010-05-28 | 2014-01-07 | Lear Corporation | Printed circuit board system for automotive power converter |
| CN108135070A (en) * | 2017-11-28 | 2018-06-08 | 广州兴森快捷电路科技有限公司 | Bury metal derby PCB and preparation method thereof |
-
1989
- 1989-05-15 JP JP12241689A patent/JPH088327B2/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4218419C2 (en) * | 1992-06-04 | 2001-10-11 | Philips Corp Intellectual Pty | Printed circuit board with a plate-shaped metal core |
| US8625284B2 (en) | 2010-05-28 | 2014-01-07 | Lear Corporation | Printed circuit board system for automotive power converter |
| CN108135070A (en) * | 2017-11-28 | 2018-06-08 | 广州兴森快捷电路科技有限公司 | Bury metal derby PCB and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH088327B2 (en) | 1996-01-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5272599A (en) | Microprocessor heat dissipation apparatus for a printed circuit board | |
| US20050117296A1 (en) | Ball grid array package with heat sink device | |
| JPH02301159A (en) | Structure for cooling integrated circuit | |
| JPH064593Y2 (en) | Integrated circuit cooling structure | |
| JPS6214700Y2 (en) | ||
| JP2716129B2 (en) | Integrated circuit cooling structure | |
| JPS6228773Y2 (en) | ||
| CN221176209U (en) | Destressing supporting structure for chip installation | |
| JPH04130759A (en) | Heat sink | |
| JPS59155158A (en) | Cooling structure of semiconductor device | |
| JPH0521663A (en) | Cooling structure of integrated circuit | |
| JPS6175137U (en) | ||
| JP2503713B2 (en) | Integrated circuit package | |
| JP2521966B2 (en) | Integrated circuit cooling structure | |
| JPS58175641U (en) | Semiconductor component mounting equipment | |
| JPH0422022B2 (en) | ||
| JP2586100B2 (en) | Electronic equipment cooling structure | |
| JPH0543482Y2 (en) | ||
| JPH0316289Y2 (en) | ||
| JPH025578Y2 (en) | ||
| JPS62138454U (en) | ||
| JPH04133450U (en) | Fixed structure of heat sink | |
| JPS61156294U (en) | ||
| JPS6127391U (en) | Heat dissipation structure of input/output unit | |
| JP2570630Y2 (en) | Heat sink |