JPS6435794U - - Google Patents

Info

Publication number
JPS6435794U
JPS6435794U JP1987129483U JP12948387U JPS6435794U JP S6435794 U JPS6435794 U JP S6435794U JP 1987129483 U JP1987129483 U JP 1987129483U JP 12948387 U JP12948387 U JP 12948387U JP S6435794 U JPS6435794 U JP S6435794U
Authority
JP
Japan
Prior art keywords
cooling
cooling plate
flange portion
ring
refrigerant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987129483U
Other languages
Japanese (ja)
Other versions
JPH0530394Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987129483U priority Critical patent/JPH0530394Y2/ja
Publication of JPS6435794U publication Critical patent/JPS6435794U/ja
Application granted granted Critical
Publication of JPH0530394Y2 publication Critical patent/JPH0530394Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の原理説明図、第２図は本考案
による一実施例の側面断面図、第３図は従来の説
明図で、ａは斜視図、ｂは側面断面図を示す。 図において、１は冷却プレート、２は冷却素子
、３はフランジ部、４は冷媒、５はＯリング、６
は樹脂リング、２Ａは内部を示す。 FIG. 1 is an explanatory diagram of the principle of the present invention, FIG. 2 is a side sectional view of an embodiment of the present invention, and FIG. 3 is a conventional explanatory diagram, in which a is a perspective view and b is a side sectional view. In the figure, 1 is a cooling plate, 2 is a cooling element, 3 is a flange, 4 is a refrigerant, 5 is an O-ring, and 6
2A shows the resin ring, and 2A shows the inside.

Claims (1)

【実用新案登録請求の範囲】 冷媒４が循環される冷却プレート１と、該冷却
プレート１の所定箇所にフランジ部３を係止する
ことで固着される冷却素子２とを備え、該冷媒４
が該冷却プレート１より該冷却素子２の内部２Ａ
に流通される冷却構造において、 合成樹脂材によつて形成される樹脂リング６が
前記冷却プレート１と前記フランジ部３とのいづ
れかの一方に固着されることで設けられ、かつ、
該樹脂リング６を介在することで該冷却プレート
１と該フランジ部３との当接部７を密封させるＯ
リング５が設けられて成ることを特徴とする冷却
構造。[Claims for Utility Model Registration] Comprising a cooling plate 1 through which a refrigerant 4 is circulated, and a cooling element 2 fixed by locking a flange portion 3 to a predetermined location of the cooling plate 1, the refrigerant 4
is the inside 2A of the cooling element 2 from the cooling plate 1.
In the cooling structure distributed in the cooling structure, a resin ring 6 formed of a synthetic resin material is provided by being fixed to either the cooling plate 1 or the flange portion 3, and
By interposing the resin ring 6, the contact portion 7 between the cooling plate 1 and the flange portion 3 is sealed.
A cooling structure characterized in that a ring 5 is provided.
JP1987129483U 1987-08-26 1987-08-26 Expired - Lifetime JPH0530394Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987129483U JPH0530394Y2 (en) 1987-08-26 1987-08-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987129483U JPH0530394Y2 (en) 1987-08-26 1987-08-26

Publications (2)

Publication Number Publication Date
JPS6435794U true JPS6435794U (en) 1989-03-03
JPH0530394Y2 JPH0530394Y2 (en) 1993-08-03

Family

ID=31383799

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987129483U Expired - Lifetime JPH0530394Y2 (en) 1987-08-26 1987-08-26

Country Status (1)

Country Link
JP (1) JPH0530394Y2 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5737258U (en) * 1980-08-11 1982-02-27
JPS6267844A (en) * 1985-09-20 1987-03-27 Fujitsu Ltd Cooling structure

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7606193A (en) * 1976-06-09 1977-12-13 Philips Nv INTEGRATED CIRCUIT.

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5737258U (en) * 1980-08-11 1982-02-27
JPS6267844A (en) * 1985-09-20 1987-03-27 Fujitsu Ltd Cooling structure

Also Published As

Publication number Publication date
JPH0530394Y2 (en) 1993-08-03

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