JPH05291740A - Terminal connecting device - Google Patents

Terminal connecting device

Info

Publication number
JPH05291740A
JPH05291740A JP12129192A JP12129192A JPH05291740A JP H05291740 A JPH05291740 A JP H05291740A JP 12129192 A JP12129192 A JP 12129192A JP 12129192 A JP12129192 A JP 12129192A JP H05291740 A JPH05291740 A JP H05291740A
Authority
JP
Japan
Prior art keywords
fpc
terminal
contact
connecting device
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12129192A
Other languages
Japanese (ja)
Inventor
Yoichiro Sakaki
陽一郎 榊
Keiji Aota
圭司 青田
Hisao Kawaguchi
久雄 川口
Yuji Matsuda
勇次 松田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP12129192A priority Critical patent/JPH05291740A/en
Publication of JPH05291740A publication Critical patent/JPH05291740A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits

Landscapes

  • Manufacturing Of Electrical Connectors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

PURPOSE:To improve reliability of connecting a terminal by bringing a pressure member having a low thermal expansion coefficient into contact with a surface in contact with a flexible printed board (FPC) to suppress elongation of the FPC, deviation of the FPC due to thermal deformation of an elastic part in heating, pressurizing connection of an electrode terminal of liquid crystal type or other flat display panel to the terminal of the FPC. CONSTITUTION:A pressurized part of a terminal connecting device uses a pressure member 3 having a low thermal expansion coefficient such as a metal foil, a ceramic sheet, etc., as a surface in contact with an FPC 9, a multilayer structure formed inside through an elastic element 2, brings the FPC 9 into contact with a hard board 8 of a flat display panel through the member 3 at the times of heating, pressure-connecting terminals of the PFC 9, and suppresses a deviation of the PFC 9 due to elongation of the PFC 9, a distortion of a buffer A.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、液晶方式その他のフラ
ットディスプレイパネルのガラス基板などの硬質基板に
形成した電極端子部とこれと対応するフレキシブル配線
基板(FPC)に形成した端子部とを接続する端子接続装
置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention connects an electrode terminal portion formed on a rigid substrate such as a glass substrate of a liquid crystal type or other flat display panel and a terminal portion formed on a corresponding flexible wiring board (FPC). The present invention relates to a terminal connecting device that does.

【0002】[0002]

【従来の技術】液晶方式その他のフラットディスプレイ
パネルの一方のガラスなど硬質基板上に形成したパネル
電極端子部と、他方のFPCの基板端子部との接続は、
該電極端子部、FPC端子部間に電極接続材料である異
方性導電膜を挟んで適正に制御された圧力・熱によって
導電粒子を圧接させ、かつバインダー用の熱可塑性また
は熱硬化性接着剤で固着する方法が用いられ、その接続
装置としては、特開平3―149785号が図3、4に
示すような端子接続装置を挙げている。該図3の端子接
続装置は硬質基板8を透過した赤外線ランプ4の照射熱
により、異方性導電膜10を硬化させて硬質基板8の第
一端子電極部8a(パネル電極端子部)と相対するFP
C9の第二端子電極部9a(FPC端子部)とを接続す
る構成である。
2. Description of the Related Art Connection between a panel electrode terminal portion formed on a hard substrate such as glass of a liquid crystal type or other flat display panel and a substrate terminal portion of another FPC is
A thermoplastic or thermosetting adhesive for a binder, in which an anisotropic conductive film as an electrode connecting material is sandwiched between the electrode terminal portion and the FPC terminal portion to bring the conductive particles into pressure contact with each other by appropriately controlled pressure and heat. As a connecting device, a terminal connecting device as shown in FIGS. 3 and 4 is cited as a connecting device. In the terminal connecting device of FIG. 3, the anisotropic conductive film 10 is cured by the irradiation heat of the infrared lamp 4 that has passed through the hard substrate 8 to face the first terminal electrode portion 8a (panel electrode terminal portion) of the hard substrate 8. FP
The configuration is such that it is connected to the second terminal electrode portion 9a (FPC terminal portion) of C9.

【0003】上記接続装置の加圧機構7は、上面に柱状
の弾性体15を設けて遮光マスク5の下面のガラス板6
との間に第一端子電極部8a、第二端子電極部9aを挟む
構造で、該弾性体15はシリコンゴムなどで作製されて
おり、該第二端子電極部9aの均等圧力を得るためのも
のである。該接続装置は、赤外線ランプ4を点灯してガ
ラス板6および第一端子電極部8aを透過して照射する
熱線によって異方性導電膜10を硬化させて該第二端子
電極部9aを接続する。
The pressing mechanism 7 of the connecting device is provided with a columnar elastic body 15 on the upper surface thereof, and the glass plate 6 on the lower surface of the light-shielding mask 5.
And the first terminal electrode portion 8a and the second terminal electrode portion 9a are sandwiched between the elastic body 15 and the elastic body 15 made of silicon rubber or the like. It is a thing. The connection device cures the anisotropic conductive film 10 by a heat ray that is emitted from the infrared lamp 4 and is transmitted through the glass plate 6 and the first terminal electrode portion 8a to irradiate the second terminal electrode portion 9a. ..

【0004】図4の接続装置は、搭載台14の上方にパ
ルスツールやコンスタントヒート(ヒーターブロック)な
どの加熱ヘッド13を設け、異方性導電膜10を挟んだ
FPC9と硬質基板8は、例えば厚さが薄く、熱伝導率
の大きいFPC9に形成されている第二端子電極部9a
を上位にして搭載台14上に載せ、所定加熱温度にした
加熱ヘッドを該FPC9に当てて加圧することで、熱伝
導によって異方性導電膜10を硬化させるものである。
この装置の加圧構造は搭載台14と加熱ヘッド13によ
り硬質基板8、FPC9の被接続部である第一、第二端
子電極部8a、9aの均等圧力を得るためシリコンゴム等
の弾性シート12を挟む構造となっている。
In the connection device of FIG. 4, a heating head 13 such as a pulse tool or a constant heat (heater block) is provided above a mounting table 14, and the FPC 9 and the hard substrate 8 sandwiching the anisotropic conductive film 10 are, for example, The second terminal electrode portion 9a formed on the FPC 9 having a small thickness and a large thermal conductivity.
Is placed on the mounting table 14 in a higher order and the heating head heated to a predetermined heating temperature is applied to the FPC 9 to apply pressure to cure the anisotropic conductive film 10 by heat conduction.
The pressurizing structure of this device has an elastic sheet 12 made of silicon rubber or the like in order to obtain the uniform pressure of the rigid substrate 8 and the first and second terminal electrode portions 8a, 9a which are the connected portions of the FPC 9 by the mounting base 14 and the heating head 13. It has a structure sandwiching.

【0005】[0005]

【発明が解決しようとする課題】上記従来技術の端子接
続装置による加熱接続では、FPC自体の熱膨張に加え
て該装置の弾性体あるいは弾性シートの熱膨張係数がF
PCの熱膨張係数よりも大きいため、加圧加熱によりF
PCが延びる方向に引っ張られることとなり、伸びが促
進される。また、FPCのフィルム厚さの違いや硬質基
板の反りなどによつて受ける圧力や熱のバランスが崩れ
るとシリコンゴムなどの弾性体や弾性シートが異常に変
形し、FPCを接続定位置からずらす原因となってい
た。このようなFPCの伸びやずれの影響はFPCの配
線ピッチが微少になり、あるいはFPCの接続部寸法が
長くなるのに伴って接続不良やショートを生じやすく接
続の信頼性に重要なる問題点を有していたことである。
In the heating connection by the above-mentioned conventional terminal connecting device, in addition to the thermal expansion of the FPC itself, the coefficient of thermal expansion of the elastic body or elastic sheet of the device is F.
Since it is larger than the thermal expansion coefficient of PC, F
The PC is pulled in the extending direction, and the extension is promoted. In addition, when the balance of pressure and heat received due to the difference in the film thickness of FPC and the warp of the hard substrate, the elastic body and elastic sheet such as silicon rubber are deformed abnormally, causing the FPC to shift from the fixed position. It was. The influence of such expansion and displacement of the FPC is apt to cause poor connection or short circuit as the wiring pitch of the FPC becomes fine or the size of the connection portion of the FPC becomes long, which is an important issue for reliability of connection. I had it.

【0006】[0006]

【課題を解決するための手段】本発明は、端子接続装置
の加圧部において 均質剛性の金属、ガラスをベースと
し、ゴムシートなどの薄い弾性材を挟んでその外側に、
金属箔やセラミックなどの熱膨張係数の小さい加圧部材
を一体的に添付して多層構造の加圧部を形成し、該加圧
部表面の金属箔やセラミックシートなど低熱膨張率の加
圧部材を介して加熱、加圧することによってFPCと硬
質基板とを熔着させるようにしてなる。
SUMMARY OF THE INVENTION The present invention is based on a homogeneously rigid metal or glass as a base in a pressurizing portion of a terminal connecting device, and sandwiches a thin elastic material such as a rubber sheet on the outside thereof.
A pressure member having a low coefficient of thermal expansion, such as a metal foil or a ceramic, is integrally attached to form a pressure member having a multilayer structure, and a pressure member having a low coefficient of thermal expansion such as a metal foil or a ceramic sheet on the surface of the pressure member. The FPC and the hard substrate are welded together by heating and pressurizing through.

【0007】[0007]

【作用】FPCと接する上記加圧部材として金属箔やセ
ラミック等の低熱膨張率の材料を用いることにより、硬
質基板の電極端子部と、FPC端子部との加圧加熱操作
時に加圧部表面の加圧部材の伸びが小さいのでFPCが
伸びる方向に引っ張られず、該加圧部材自体も熱変形や
歪みを生ずることなく、且つ内層の弾性シートによって
FPCと硬質基板のうねりや反りに追随して均一な加圧
によりFPCと接触する。
By using a material having a low coefficient of thermal expansion such as a metal foil or a ceramic as the pressing member in contact with the FPC, the electrode terminal portion of the hard substrate and the surface of the pressing portion during the pressure heating operation of the FPC terminal portion are used. Since the expansion of the pressing member is small, the FPC is not pulled in the expanding direction, the pressing member itself does not undergo thermal deformation or distortion, and the elastic sheet of the inner layer follows the undulations and warps of the FPC and the hard substrate to be uniform. Contact the FPC by applying sufficient pressure.

【0008】[0008]

【実施例】図1および図2は本発明装置の実施例を示
し、図1は、図3に示した従来技術の端子接続装置の弾
性体15を改良した加圧部Aを設けた端子接続装置で、
該加圧部Aは、加圧機構7の上面に設けた柱状の石英ガ
ラスをベース1とし、その上端にシリコンゴムで形成し
た弾性体2を付設し、該弾性体表面にテフロンコーティ
ングを施したSUS箔の低熱膨張率シートからなる加圧
部材3を一体的に添設した構造である。該テフロンコー
ティングは加熱、加圧時に異方性導電膜の樹脂が万一、
FPCからはみだしても金属箔面に付着するのを防止す
るために表面処理を施したものである。加圧部Aの上方
にガラス6、遮光マスク5、赤外線ランプ4を有する構
造は上記従来の装置と同様である。
1 and 2 show an embodiment of the device of the present invention. FIG. 1 shows a terminal connection provided with a pressurizing portion A in which the elastic body 15 of the prior art terminal connection device shown in FIG. 3 is improved. In the device
The pressing portion A has a columnar quartz glass provided on the upper surface of the pressing mechanism 7 as a base 1, an elastic body 2 made of silicon rubber is attached to the upper end thereof, and the surface of the elastic body is coated with Teflon. This is a structure in which a pressure member 3 made of a low thermal expansion coefficient sheet of SUS foil is integrally attached. When the Teflon coating is heated and pressed, the resin of the anisotropic conductive film should be
It is surface-treated in order to prevent it from adhering to the metal foil surface even if it protrudes from the FPC. The structure having the glass 6, the light-shielding mask 5, and the infrared lamp 4 above the pressing portion A is the same as that of the above-mentioned conventional device.

【0009】該加圧部Aのベース1は、上記の石英ガラ
スの他、金属のような均質剛性材であれば良い。弾性体
2のシリコンゴムも他の緩衝材であっても差し支えはな
いが、載支したFPCがゴムの座屈によってずれるのを
防止するためにはその厚さは薄いほうが良好である。該
FPCとの界面に位置する上記加圧部材3もSUS箔に
限定されないこと勿論であって、代わりの部材は熱膨張
係数が低ければ低い程有効であり、他の金属箔やセラミ
ックシートなどの材質であっても問題はないが、表面が
剛性のある材質ではFPCや基板表面の粗さや反りなど
に対応せず均一加圧が困難であるから、該FPCと基板
とのうねりや反りに追随させて均等加圧を容易にするた
め前記各部材料をシート状とし、シリコンゴムなどの弾
性材のシートを介在させることが有効である。
The base 1 of the pressing portion A may be a homogeneous rigid material such as metal other than the above quartz glass. The silicon rubber of the elastic body 2 may be another cushioning material, but the thinner the thickness, the better in order to prevent the mounted FPC from being displaced due to the buckling of the rubber. The pressing member 3 located at the interface with the FPC is not limited to the SUS foil, of course, and the lower the coefficient of thermal expansion of the alternative member is, the more effective it is. There is no problem with the material, but if the material has a rigid surface, it is difficult to apply uniform pressure because it does not correspond to the roughness or warpage of the FPC or substrate surface, so it follows the undulation or warpage between the FPC and the substrate. In order to facilitate uniform pressurization, it is effective to make each of the above materials into a sheet and interpose a sheet of an elastic material such as silicon rubber.

【0010】図2の実施例は、図4の従来技術の装置に
おけるシリコンゴム製の弾性シート12を改良した端子
接続装置で、該弾性シート12の外層にテフロンコーテ
ィングを施したSUS箔を低熱膨張率の加圧部材11と
して重ねて多層構成とした加圧シートA'を設けた構造
を特徴とする。該SUS箔の加圧部材11を表面に設け
たことにより電極端子部とFPC端子部との加熱、加圧
による接続時にFPC9との接触部にはSUS箔が位置
する構造となり、熱膨張係数の大きいシリコンゴムなど
の弾性シート12が直接FPCに接触しない。尚、実施
例中、特に説明のない符号は従来例におけるものと同じ
である。
The embodiment of FIG. 2 is a terminal connecting device in which the elastic sheet 12 made of silicone rubber in the prior art device of FIG. 4 is improved, and the outer layer of the elastic sheet 12 is made of SUS foil having a Teflon coating to have a low thermal expansion coefficient. The structure is characterized in that a pressure sheet A'having a multi-layered structure is provided as the pressure pressing member 11 having a plurality of layers. By providing the pressing member 11 of the SUS foil on the surface, the structure is such that the SUS foil is located at the contact portion with the FPC 9 when the electrode terminal portion and the FPC terminal portion are connected by heating and pressurization. The elastic sheet 12 such as a large silicone rubber does not directly contact the FPC. Incidentally, in the embodiments, reference numerals not particularly explained are the same as those in the conventional example.

【0011】[0011]

【発明の効果】上記の構成、作用を有する本発明の端子
接続装置は、加圧部において赤外線照射や加熱ヘッドに
より硬質基板上の電極端子部とFPC端子部を挟んで加
熱、加圧する場合に、低熱膨張率のシートをFPCに接
触させるようにしたので、熱膨張係数の大きい従来の弾
性体のように、これより熱膨張係数の小さいFPCが弾
性体と共に大きく伸び、あるいは該弾性体の熱変形でず
れるなどして接続不良(接続されてない)やショートを
生じて端子接続の信頼性に重大な問題となっていたのに
比べて液晶方式その他のフラットディスプレイパネルと
FPCの接続時にFPCの伸びを1/3〜1/2に押さ
えることができ、微小ピッチの接続に有効となり、液晶
パネルの歩留まりを向上させることができ、液晶方式の
みならずその他のフラットディスプレイパネルの電極端
子部とFPCの端子部の接続にも応用可能である。
The terminal connecting device of the present invention having the above-described structure and operation is used when infrared rays are radiated in the pressurizing section or the FPC terminal section is sandwiched between the electrode terminal section and the FPC terminal section on the hard substrate by heating and pressing. Since the sheet having a low coefficient of thermal expansion is brought into contact with the FPC, the FPC having a smaller coefficient of thermal expansion than the conventional elastic body having a large coefficient of thermal expansion greatly expands together with the elastic body, or the heat of the elastic body is increased. In contrast to the problem of connection failure (not connected) or short circuit caused by deformation due to deformation, which is a serious problem in reliability of terminal connection, in comparison with FPC when connecting FPC with liquid crystal type or other flat display panel The elongation can be suppressed to 1/3 to 1/2, which is effective for connection with a fine pitch, and can improve the yield of the liquid crystal panel. It is also applicable to the connection of the terminal portion of the electrode terminal, a FPC rats display panel.

【図面の簡単な説明】[Brief description of drawings]

【図1】赤外線照射方式の端子接続装置の模式図であ
る。
FIG. 1 is a schematic diagram of an infrared irradiation type terminal connection device.

【図2】加熱ヘッド方式の端子接続装置の模式図であ
る。
FIG. 2 is a schematic view of a heating head type terminal connecting device.

【図3】従来の赤外線照射方式の端子接続装置の模式図
である。
FIG. 3 is a schematic diagram of a conventional infrared irradiation type terminal connection device.

【図4】従来の加熱ヘッド方式の端子接続装置の模式図
である。
FIG. 4 is a schematic view of a conventional heating head type terminal connecting device.

【符号の説明】[Explanation of symbols]

A 加圧部 A' 加圧シート 1 ベース 2 弾性体 3、11 加圧部材 4 赤外線ランプ 5 遮光マスク 7 加圧機構 8 硬質基板 9 FPC(フレキシブル配線基板) 10 異方性導電膜 12 弾性シート 13 加熱ヘッド A pressure portion A ′ pressure sheet 1 base 2 elastic body 3, 11 pressure member 4 infrared lamp 5 light-shielding mask 7 pressure mechanism 8 hard substrate 9 FPC (flexible wiring substrate) 10 anisotropic conductive film 12 elastic sheet 13 Heating head

───────────────────────────────────────────────────── フロントページの続き (72)発明者 松田 勇次 大阪府大阪市阿倍野区長池町22番22号シャ ープ株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Yuji Matsuda 22-22 Nagaike-cho, Abeno-ku, Osaka City, Osaka Prefecture Sharp Corporation

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 互いに対向する液晶等のフラットディス
プレイパネルのガラス基板などの硬質基板に形成した電
極端子部とフレキシブル配線基板(FPC)の端子部との
間で電極接続材料を加圧熔融することによって両端子部
を接続する端子接続装置において、前記FPCに接する
加圧部材として金属箔やセラミックシートなど該FPC
に比し低熱膨張率のシートを用い、その内層にゴムシー
トなどの弾性体を添設して多層シート構造とし、前記加
圧部材を介して加熱、加圧することにより前記硬質基板
とFPCとを接着させることを特徴とする端子接続装
置。
1. An electrode connecting material is pressure-melted between an electrode terminal portion formed on a hard substrate such as a glass substrate of a flat display panel such as a liquid crystal facing each other and a terminal portion of a flexible wiring board (FPC). In a terminal connecting device for connecting both terminal parts by means of a metal foil, a ceramic sheet or the like as a pressing member contacting the FPC,
A sheet having a lower coefficient of thermal expansion than that of the above is used, and an elastic body such as a rubber sheet is added to the inner layer to form a multilayer sheet structure, and the hard substrate and the FPC are heated and pressed through the pressing member. A terminal connecting device characterized by being bonded.
JP12129192A 1992-04-14 1992-04-14 Terminal connecting device Pending JPH05291740A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12129192A JPH05291740A (en) 1992-04-14 1992-04-14 Terminal connecting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12129192A JPH05291740A (en) 1992-04-14 1992-04-14 Terminal connecting device

Publications (1)

Publication Number Publication Date
JPH05291740A true JPH05291740A (en) 1993-11-05

Family

ID=14807627

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12129192A Pending JPH05291740A (en) 1992-04-14 1992-04-14 Terminal connecting device

Country Status (1)

Country Link
JP (1) JPH05291740A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100422273B1 (en) * 2001-09-28 2004-03-11 주식회사 나래나노텍 Apparatus for joining a printed circuit for a plasma display panel
AU2012310530B2 (en) * 2011-09-22 2016-07-07 Nippon Steel Coated Sheet Corporation Wiping device and hot dip coating apparatus using the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100422273B1 (en) * 2001-09-28 2004-03-11 주식회사 나래나노텍 Apparatus for joining a printed circuit for a plasma display panel
AU2012310530B2 (en) * 2011-09-22 2016-07-07 Nippon Steel Coated Sheet Corporation Wiping device and hot dip coating apparatus using the same

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