KR100422273B1 - Apparatus for joining a printed circuit for a plasma display panel - Google Patents

Abstract

The present invention relates to a printed circuit bonding apparatus of a plasma display panel, the body; A support member installed at a lower portion of the main body and supporting a bottom of the panel and having a plurality of first heaters for heating the contact portion of the panel to an appropriate temperature; A sensing unit installed at a predetermined position of the support member and detecting a height of a panel which is transferred to an upper end of the support member; Height adjusting means for adjusting the height of the support member by comparing the detected value detected by the sensing unit with an initial set value; A first pressing member having a plurality of first elastic members on the upper portion of the main body and a lower portion of the first pressing member so that at least one or more corresponding to the plurality of printed circuit members are installed to move up or down simultaneously or separately. A second pressing member having a plurality of second elastic members therein; A heating unit fixed to the lower portion of the second pressing member and having a plurality of second heaters to heat the film layer of the printed circuit member to an appropriate temperature; Position adjusting means for adjusting the position of the heating unit in accordance with the position of the printed circuit member installed at regular intervals on the four sides of the panel; And respectively installed in the first and second pressurizing members to move the heating part at a high speed to a pressurized standby position of the printed circuit member, and then successively advance the heating part to the printed circuit member, the film layer, and the panel. It comprises a pressing means for bonding.

Description

Apparatus for joining a printed circuit for a plasma display panel

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding apparatus for bonding a printed circuit member having a film layer to a plasma display panel. In particular, the present invention relates to a panel while following a change in position of a panel transported by a separate transport device, that is, deformation due to sagging of a panel. After supporting, by installing at least one corresponding to a plurality of printed circuit members correspondingly and thermally crimping simultaneously or individually uniformly, it is possible to prevent cracking, damage of the panel and overlapping compression of printed circuit members, thereby improving product quality. The present invention relates to a printed circuit bonding apparatus of a plasma display panel.

In general, an anisotropic conductive film layer is interposed between a glass plasma display panel consisting of upper and lower plates and a flexible printed circuit member for passing a current. The printed circuit member, the film layer, and the panel are joined by heating of the heater and pressing of the pressurizing part, and the bonding apparatus of the printed circuit member, the film layer, and the panel is as follows.

First, the panel made of the glass material of the upper and lower plates is transferred to the bonding apparatus by a separate conveying means in a state of being adsorbed by the vacuum apparatus, wherein a plurality of printed circuit members are fixed to the panel transferred to the bonding apparatus. One side of the panel is interposed with a plurality of printed circuit members in the interposed state to enter the bonding apparatus.

One side of the panel entered into the bonding apparatus is positioned between the support member installed in the lower portion and the pressurizing portion having a heater to move up and down on the upper portion, wherein one side of the panel entered into the bonding apparatus adsorbs the panel. The deflection phenomenon occurs as the quadrilateral bends downward due to its own load.

As described above, the printed circuit member, the film layer, and the panel are joined by thermocompression bonding by the interaction of the pressing unit and the supporting member in a state where one side of the panel is finely bent. The upper end portion of the printed circuit member, the film layer and the panel of the panel sequentially stacked from the top is seated, and the upper end of the printed circuit member, film layer and the printed circuit member of the panel seated on the upper end of the support member has a heater While the pressing unit moves downward while overcoming the supporting force of the supporting member, the electrodes installed in the printed circuit member and the panel are electrically conductive while melting the adhesive contained in the film layer among the printed circuit member, the film layer, and the panel by the heat transferred from the heater. Contact with the ball is conducted to complete the bonding of the printed circuit member, film layer and panel A.

However, in the conventional bonding apparatus for joining the printed circuit member, the film layer, and the panel, the pressurizing portion having the heater has two printed circuit members for a plurality of printed circuit members arranged at regular intervals on the sides of the panel. It is configured to be thermally compressed in one pair.

That is, the support member for supporting the bottom surface of the panel when the lowering in order to thermally press the printed circuit member to the panel with the two pressing parts in one set is fixedly installed to accommodate the pressing parts to lower the two in one set The printed circuit member, the film layer and the panel for bonding the printed circuit member, the film layer and the panel while maintaining a constant distance between the pressing portion and the support member for bonding, the panel interposed between the pressing portion and the support member One side of the center is curved downwards by its own load centering on the suction that absorbs the panel, and the deflection phenomenon occurs as the downward position of the pressing unit, that is, pressurization for pressing the printed circuit member, the film layer and the panel. The final point of the part is the gap between the pressing part and the supporting member due to the difference in the pressing force of the pressing part due to the gap between panels. When the printed circuit member, the film layer, and the panel are thermally compressed, the periphery of the panel is cracked and broken, and thus the productability is remarkably inferior.

In addition, when a plurality of printed circuit members are disposed in odd numbers on the side of the panel, the pressing unit for thermo-compression of the printed circuit member is moved up and down by a pair of the printed circuit member arranged on the panel As the even number of thermocompression bonding is performed, the other one of the printed circuit members arranged on the panel is thermocompressed by the pressing unit together with the printed circuit member already in the thermocompression state, so that the already thermocompressed printed circuit members are overlapped and thermocompressed.

That is, when the printed circuit member, the film layer, and the panel are thermally compressed by the pressing unit, the conductive balls in the film layer for pressing the electrodes formed on the printed circuit member and the panel, respectively, are pressed while being damaged for two times. In addition, as the adhesiveness in the film layer is lowered by heating over two times, it has a problem of causing a faulty conduction.

Accordingly, the present invention is to solve the general problems as described above, the object of the following is to support the panel while following the position change of the panel conveyed by a separate transfer device, that is, deformation caused by the deflection of the panel Plasma display that can improve productability by preventing crack, damage of panel and overlapping compression of printed circuit members by installing at least one correspondingly to a plurality of printed circuit members correspondingly and thermally crimping them simultaneously or individually. Provided is a printed circuit bonding device for a panel.

The present invention for achieving the above object is a bonding apparatus for bonding a plurality of printed circuit members having a film layer excellent in adhesion and conductivity to the quadrilateral of the plasma display panel consisting of the upper and lower plates by thermocompression bonding; A support member installed at a lower portion of the main body and supporting a bottom of the panel and having a plurality of first heaters for heating the contact portion of the panel to an appropriate temperature; A sensing unit installed at a predetermined position of the support member and detecting a height of a panel which is transferred to an upper end of the support member; Height adjusting means for adjusting the height of the support member by comparing the detected value detected by the sensing unit with an initial set value; A first pressing member having a plurality of first elastic members on the upper portion of the main body and a lower portion of the first pressing member so that at least one or more corresponding to the plurality of printed circuit members are installed to move up or down simultaneously or separately. A second pressing member having a plurality of second elastic members therein; A heating unit fixed to the lower portion of the second pressing member and having a plurality of second heaters to heat the film layer of the printed circuit member to an appropriate temperature; Position adjusting means for adjusting the position of the heating unit in accordance with the position of the printed circuit member installed at regular intervals on the four sides of the panel; And respectively installed in the first and second pressurizing members to move the heating part at a high speed to a pressurized standby position of the printed circuit member, and then successively advance the heating part to the printed circuit member, the film layer, and the panel. Pressing means for bonding; characterized in that it comprises a.

1 is a front view showing the configuration of a printed circuit bonding apparatus of a plasma display panel according to the present invention;

2 is a side view showing the configuration of a printed circuit bonding apparatus of a plasma display panel according to the present invention;

Figure 3 is an enlarged side view of the main portion of the operation of the pressing means of the printed circuit bonding apparatus of the plasma display panel according to the present invention;

Figure 4 is an exploded perspective view showing the configuration of the position adjusting means for moving the heater chip left and right to correspond to the interval between the printed circuit members according to the printed circuit bonding apparatus of the plasma display panel of the present invention,

5 is a front view showing an operating state of the position adjusting means for moving the heater chip of the printed circuit bonding apparatus of the plasma display panel according to the present invention left and right;

Figure 6a is an enlarged cross-sectional view showing the main portion before the bonding of the electrode, the film layer of the printed circuit member and the electrodes of the plasma display panel, Figure 6b is an electrode, film layer and plasma of the printed circuit member by a bonding apparatus according to the present invention An enlarged sectional view of the main part showing the state in which the electrodes of the display panel are bonded together.

Explanation of symbols on the main parts of the drawings

1 panel 2 film layer

3: printed circuit member 10: main body

20: support member 25: sensing unit

30: height adjusting means 40: moving member

50: first pressing member 60: second pressing member

70: heating part 80: position adjusting means

90: pressurizing means

Hereinafter, the configuration of an embodiment according to the present invention will be described in detail with reference to the accompanying drawings.

In the printed circuit bonding apparatus of the plasma display panel according to the present invention, as shown in FIGS. 1 to 6a and 6b, the film layer 2 having excellent adhesiveness and conductivity is formed on the quadrilateral of the panel 1 made of glass materials of upper and lower plates. A plurality of printed circuit members 3 are installed to have a predetermined interval, and the panel 1 is transferred to the main body 10 by separate transfer means in a state of being adsorbed by a vacuum apparatus.

A support member 20 having a first heater 22 is installed below the main body 10 to support the bottom of the panel 1 and to heat the contact portion of the panel 1 to an appropriate temperature. In the predetermined position of the support member 20, the quadrilateral of the panel 1 is centered around the height of the panel 1 entering the upper end of the support member 20, that is, the pressure absorbing the panel 1. The sensing unit 25 is installed to detect the height of the panel 1 according to the deflection phenomenon generated while being bent finely downward by the load.

In addition, the lower portion of the support member 20 is an electric signal to the servo motor 34 which will be described later by comparing and determining the detected value and the initial set value detected by the sensing unit 25 of the height of the panel 1 by the control unit. Transmitting the height adjustment means 30 is installed so as to properly adjust the height of the support member 20 in accordance with the entry state of the panel (1).

The height adjusting means 30 has a first guide groove 12 is installed on the bottom surface 11 of the main body 10 to have a predetermined length, and the second guide groove on the vertical surface 13 of the main body 10. 14 is installed to have a predetermined length, and the first bracket 32 is fixed to the bottom 11 of the main body 10 at a position having a proper distance from the first guide groove 12. It is installed.

On one side of the first bracket 32 is determined by the electrical signal of the controller comparing the detected value of detecting the height of the panel 1 from the upper end of the support member 20 in the detection unit 25 and the initial setting value. Servo motor 34 is installed to achieve reverse rotation, one side of the servo motor 34 is coupled to the drive shaft 36 for transmitting rotational force and the screw shaft 38 to rotate in conjunction with the drive shaft 36 have.

The moving member 40 moves forward and backward in the horizontal direction on the bottom surface 11 of the main body 10 when the driving shaft 36 and the screw shaft 38 coupled to the servo motor 34 are rotated forward and backward. Is installed, the inside of the movable member 40 is formed with a female screw portion 41 having a predetermined length so as to move forward and backward while making a screw coupling with the screw shaft 38.

In addition, a first guide protrusion 42 and a third guide groove 44 are installed on the lower and upper portions of the movable member 40 to have a predetermined length, respectively, and the third guide groove 44 is in at least one direction. It has a sloped surface so as to be upward.

The support member 20 is installed on the upper portion of the movable member 40 so as to move up and down. The inclined surface of the third guide groove 44 of the movable member 40 is provided below the support member 20. The third guide protrusion 24 is provided to slide while having the same inclined surface as the above.

In addition, a second guide protrusion 23 is installed at the rear of the support member 20 so as to be slidably inserted in the second guide groove 14 of the main body 10 in a vertical direction. When the third guide protrusion 24 installed at the lower portion of the 20 moves forward and backward along the inclined surface, the support member 20 is vertically moved up and down.

That is, the upper and lower movements of the support member 20 are caused when the slope of the panel 1 entering the upper end of the support member 20 is slightly bent due to its own load and sag occurs. The servo motor 34 is rotated forward and reverse as the electric motor is transmitted to the servo motor 34 by comparing the detected value detected by the detection unit 25 with the initial setting value by the control unit. When the servo motor 34 is rotated in the counterclockwise direction, the female screw formed inside the moving member 40 while the drive shaft 36 and the screw shaft 38 installed on one side of the servo motor 34 are rotated together. It will push the part 41.

In more detail, the drive shaft 36 and the screw shaft 38 installed on one side of the servo motor 34 is rotated by itself while being supported by the first bracket 32 and thus the screw shaft ( The female thread portion 41 in the movable member 40 screwed to 38 is pushed by the continuous rotation of the screw shaft 38, and the movable member 40 is moved, which is the bottom surface of the main body 10 ( The first guide protrusion 42 installed in the lower portion of the movable member 40 along the first guide groove 12 formed in the 11 is moved while sliding.

In addition, when the movable member 40 is moved to the front side, the third guide groove 44 installed on the upper portion of the movable member 40 is also moved together, and at this time, the support member coupled to the third guide groove 44 ( While the third guide protrusion 24 of the 20 is moved upward along the inclined surface, the second guide protrusion 23 installed at the rear of the support member 20 is formed on the vertical surface 13 of the main body 10. A vertical movement is made upward along the two guide grooves 14.

Accordingly, the first and second pressing members 50 which will be described later by following the upper and lower portions of the support member 20 with respect to the displacement generated while the quadrilateral of the panel 1 sags due to its own load with respect to the puffed portion, will be described later. By providing a height of a uniform condition suitable for the compression of the (60) to the irregular height of the panel (1) in the process of thermocompression bonding the printed circuit member (3), the film layer (2) to the panel (1) It is possible to prevent cracks and breakage caused by.

Meanwhile, at least one or more of the plurality of printed circuit members 3 installed on the four sides of the panel 1 are simultaneously supported while the bottom surface of the panel 1 is supported by moving the support member 20 up and down. Alternatively, the first and second pressing members 50 and 60 are installed on the main body 10 so as to be separately thermocompressed.

That is, the first pressing member 50 is provided with a plurality of first elastic members 52 to have an elastic force on the upper end, the lower end of the first elastic member 52 is the upper portion of the first pressing member 50 Is fixed to, the upper end is fixed to the upper end of the main body 10 to provide an elastic force.

In addition, a second pressing member 60 is installed below the first pressing member 50 to have a predetermined distance by the plurality of second elastic members 62 having elastic force. The lower end of the second elastic member 62 is fixed to the upper end of the), the upper end of the second elastic member 62 is fixed to the lower end of the first pressing member (50). Here, the elastic force of the first elastic member 52 is installed to have a force greater than the elastic force of the second elastic member 62, which is the first and the first continuously operated by the pressing means 90 to be described later By stably moving the two pressing members 50 and 60, the impact of the printed circuit member 3 installed in the panel 1 is alleviated to prevent damage to the printed circuit member 3.

In addition, a fourth guide groove 51 having a predetermined length is installed in the main body 10 so that the first and second pressing members 50 and 60 can move smoothly in the vertical direction. A fourth guide protrusion 53 is formed at the rear of the first and second pressing members 50 and 60 so as to slide into the fourth guide groove 51.

The lower portion of the second pressing member 60 is heated to a suitable temperature by heating the film layer (2) interposed in the printed circuit member 3 to a plurality of bonding circuit board 3 to the panel 1 A heating unit 70 having a second heater 72 is installed, and the heating unit 70 includes a plurality of printed circuit members 3 installed at regular intervals on four sides of the panel 1. When the difference in the spacing occurs with respect to the overall size of the, it has a position adjusting means 80 to correspond to the position of the printed circuit member (3).

That is, the position adjusting means 80 has a receiving portion 81 is formed in the lower portion of the heating portion 70 to be stepped along the longitudinal direction of the printed circuit member 3, the side wall forming the receiving portion 81 A plurality of first guide holes 83 are formed at 82 at predetermined intervals.

In addition, the heat transferred from the second heater 72 of the heating part 70 may be conducted to the accommodating part 81 to transfer heat to the film layer 2 interposed in the printed circuit member 3. The heater chip 84 is installed so that a plurality of guide pins 85 are formed at both sides of the heater chip 84 so as to be inserted into the plurality of first guide holes 83 and moved left and right. Here, the lower end portion of the heater chip 84 is formed to protrude downwardly from the lower end of the heating part 70 to transfer heat to the film layer 2 while making surface contact with the printed circuit member 3, The opposite side of the heater chip 84, which is in surface contact with the side wall 82 of the accommodating part 81, protrudes finer than the vertical surface of the heating part 70 to be fixedly installed by the pressing force of the fixing member 86 to be described later. consist of.

The fixing member 86 is formed with a plurality of second guide holes 87 so that a plurality of guide pins 85 formed on the heater chip 84 are inserted to move left and right, respectively, and one side thereof is a binding means ( The vertical surface of the heating unit 70 and the heater chip 84 are fixed by the pressing force by surface contact at the same time, which is 88. The heater chip 84 is formed to protrude finely with respect to the vertical surface of the heating unit 70. One side of the holding member 86 is pressed because the vertical surface of the will be possible.

Here, the binding means 88 may be configured in various ways, but preferably, a plurality of screw holes 70a and 86a are formed in the heating unit 70 and the fixing member 86, respectively. It is best to fix the heater chip 84 by combining the holes 70a and 86a with the fastening bolts 89.

Meanwhile, at least one heating unit 70 may be simultaneously thermally compressed or the thermal unit 70 may be individually thermally pressed against a plurality of printed circuit members 3 installed on four sides of the panel 1. Pressing means 90 is installed on the first and second pressurizing members 50 and 60, and the pressurizing means 90 includes a heating part 70 installed below the second pressurizing member 60 in the printed circuit. After moving at high speed to the pressure standby position of the member 3, the heating part 70 is continuously moved to the printed circuit member 3, the film layer 2 and the panel 1 at low speed.

That is, the pressing means 90 is the first operation so that the second bracket 91 is fixed to one side of the second pressing member 60, one end is fixed to the second bracket 91 to move up and down A first air cylinder 93 having a shaft 92 is installed, and the first air cylinder 93 has a heating unit 70 installed below the second pressing member 60 and the printed circuit member 3. Will be moved at high speed to pressurized standby position.

When the plurality of second elastic members 62 installed on the upper portion of the second pressing member 60 is extended when the second pressing member 60 moves, the first coupled to the upper end of the second elastic member 62. The pressing member 50 also moves downward while winning the elastic force of the first elastic member 52, which is installed on the upper portion of the first pressing member 50 rather than the elastic force of the second elastic member 62. Due to the high elastic force of the first elastic member 52, the first pressing member 50 has a short moving distance.

Here, the movement distance of the first pressure member 50 by the movement of the second pressure member 60 is one end of the second operating shaft 95 of the second air cylinder 94 to be described later the second pressure member (60). The second air cylinder 94 is operated with respect to the extended length of the second elastic member 62 when the second pressing member 60 is moved downward while making contact with the upper end surface of the The second working shaft 95 is pressurized while ensuring the length of the second elastic member 62 along the second pressing member 60.

Then, by the operation of the first air cylinder 93 is moved at a high speed to the pressure standby position of the printed circuit member 3, the film layer 2 and the panel 1 supported on the support member 20 The heating part 70 of the second pressure member 60 is continuously moved to the printed circuit member 3, the film layer 2, and the panel 1 at a low speed so that the printed circuit member 3 and the film layer ( 2) and the panel 1 to be pressed by a predetermined time, which is a second air cylinder 94 is installed inside the first pressure member 50, the lower portion of the second air cylinder 94 The second operating shaft which is in surface contact with the upper end of the second pressure member 60 to move downward while ensuring the length of the second elastic member 62 when the second pressure member 60 moves downward on one side. Has 95.

In addition, the second pressing member (2) to smoothly guide the up and down movement of the second pressing member 60 when the upper and lower movement of the second operating shaft 95 according to the operation of the second air cylinder (94) ( 60 is provided with a plurality of guide rods 64, the shock absorbing spring 66 is interposed on the outer periphery of the guide rods 64 to absorb the shock when the second pressing member 60 is returned have.

As such, the heating part 70 of the second pressing member 60 moved downward by the operation of the second air cylinder 94 is the printed circuit member 3, the film layer 2, and the panel 1. The printed circuit member 3, the film layer 2, and the panel 1 are connected to the heating part 70 as the pressure is applied for a predetermined time within the range of the supporting force of the supporting member 20 supporting the bottom of the panel. As the heat of the intervening second heater 72 is conducted, the adhesive layer included in the film layer 2 bonds the printed circuit member 3 to the panel 1.

Here, when the second heater 72 of the heating unit 70 conducts heat to the printed circuit member 3, the film layer 2, and the panel 1, the printed circuit member 3 and the film layer. (2) and the first heater 22 of the support member 20 supporting the panel 1 also transmits heat to the panel 1 side at an appropriate temperature, thereby thermally balancing the panel 1 with a printed circuit. It is possible to prevent cracks and breaks during thermocompression bonding of the member 3, the film layer 2, and the panel 1.

As shown in FIGS. 6A and 6B, the heater chip 84 installed in the lower portion of the heating unit 70 pressurizes the heat by the second heater 72 at the upper end of the printed circuit member 3. The printed circuit member 3 and the film layer 2 are formed on the bottom surface of the panel 1 as the upper end of the support member 20 supports the heat generated by the heating of the first heater 22 in a conductive state. And a plurality of conductive balls 2a contained in the film layer 2 of the panel 1 are engaged between the electrodes 3a of the printed circuit member 3 and the electrodes 1a of the panel 1 at the same time. The conductive balls 2a are deformed into an irregular shape while the conductive electrodes 2a and 1a of the printed circuit member 3 and the panel 1 are connected to each other so that the printed circuit member 3, the film layer 2, and the panel are turned on. The joining of (1) is completed.

As described above, the apparatus for bonding a printed circuit of the plasma display panel according to the present invention detects the position change of the panel transferred by a separate transfer means, that is, the deformation caused by the deflection of the panel, by detecting the deformation position of the panel. After supporting the supporting member following the support member, the heating unit for pressurizing the printed circuit member interposed on the four sides of the panel is cracked or broken when the pressing means is uniformly thermally compressed by bonding the printed circuit member, the film layer and the panel. It will have an effect that can be prevented in advance.

In addition, the pressurizing means moves and presses the at least one heating unit with respect to the plurality of printed circuit members installed on the side of the panel, where the plurality of printed circuit members installed on the side of the panel are arranged in an odd number. The pressing means individually heats the heating portion with respect to one printed circuit member which is finally left when the number of heating portions moved by the pressing means, for example, two as a pair, is thermally compressed by a plurality of printed circuit members. By compressing, it is possible to prevent overlapping compression of the heating unit and the printed circuit member, thereby improving the product properties.

In addition, when a plurality of printed circuit members installed at regular intervals on the sides of the panel are different from each other according to the overall size of the panel, the position of the heater chip in the heating unit may be selectively selected to correspond to the position of the printed circuit members. By controlling to be able to thermally compress the printed circuit member, the film layer and the panel.

As described above, one embodiment of the present invention has been described, but the present invention is not limited thereto and may be changed within the scope of the claims.

Claims (5)

A bonding apparatus for bonding a plurality of printed circuit members having a film layer having excellent adhesion and conductivity to quadrilateral surfaces of a plasma display panel including upper and lower panels by thermocompression bonding. main body; A support member installed at a lower portion of the main body and supporting a bottom of the panel and having a plurality of first heaters for heating the contact portion of the panel to an appropriate temperature; A sensing unit installed at a predetermined position of the support member and detecting a height of a panel which is transferred to an upper end of the support member; Height adjusting means for adjusting the height of the support member by comparing the detected value detected by the sensing unit with an initial set value; A first pressing member having a plurality of first elastic members on the upper portion of the main body and a lower portion of the first pressing member so that at least one or more corresponding to the plurality of printed circuit members are installed to move up or down simultaneously or separately. A second pressing member having a plurality of second elastic members therein; A heating unit fixed to the lower portion of the second pressing member and having a plurality of second heaters to heat the film layer of the printed circuit member to an appropriate temperature; Position adjusting means for adjusting the position of the heating unit in accordance with the position of the printed circuit member installed at regular intervals on the four sides of the panel; And Installed on the first and second pressure members, respectively, to move the heating unit at high speed to the pressure standby position of the printed circuit member, and then to continuously join the heating unit to the printed circuit member, the film layer, and the panel. And a pressing means to make a printed circuit bonding device of a plasma display panel. According to claim 1, wherein the height adjusting means First and second guide grooves respectively installed on the bottom surface and the vertical surface of the main body so as to have a predetermined length, and fixed to the bottom surface so as to have an appropriate distance from the first guide groove; It is installed on one side of the first bracket is rotated forward and reverse by the electrical signal that is determined by comparing the detected value and the initial setting value detected by the sensing unit of the height of the panel, the servo having a screw shaft to interlock with the drive shaft on one side motor; The screw shaft has a female screw portion inside to move horizontally forward and backward by forward and reverse rotation of the screw shaft, and a first guide protrusion is installed at a lower portion so as to slide into the first guide groove, and to have a predetermined inclined surface thereon. A moving member having three guide grooves formed therein; And A third guide protrusion is provided in the lower portion of the support member so as to be slidably fitted into the third guide groove of the movable member, and the second guide protrusion is inserted into the second guide groove at the rear of the support member to move up and down. The printed circuit bonding device of the plasma display panel is installed to move the support member up and down while the moving member moves forward and backward by the rotational force of the screw shaft during forward and reverse rotation of the servo motor. According to claim 1, wherein the position adjusting means A plurality of first guide holes formed at a lower portion of the heating part along the longitudinal direction of the printed circuit member and having a predetermined distance on a sidewall of the receiving part; The lower portion protrudes downward from the lower end of the heating unit so that the lower end portion transfers heat to the printed circuit member while having a plurality of guide pins inserted into the plurality of first guide holes to move left and right along the longitudinal direction of the receiving portion. A heater chip having a vertical surface protruding from the vertical surface of the heating unit; And A plurality of second guide holes are formed so that a plurality of guide pins formed in the heater chip are inserted, respectively, and fixing members fixing one side surface of the heater chip while simultaneously contacting the sides of the heating unit and the heater chip by a binding means. Printed circuit bonding apparatus of a plasma display panel, characterized in that. The method of claim 3, wherein the binding means A plurality of screw holes are formed in the fixing member and the heating unit, respectively, and each of the screw holes is coupled to each other by fastening bolts to fix the heater chip. The method of claim 1, wherein the pressing means, A first air cylinder fixed to one side of the second pressing member, the first air cylinder having a first operating shaft coupled to one side of the second bracket to move the heating part to a pressurized standby position of the printed circuit member; And The second operating shaft is installed inside the first pressing member, the second operating shaft which is in surface contact with the upper end of the second pressing member to ensure the extended length of the second elastic member when the second pressing member is moved downward And a second air cylinder for continuously advancing the second operation shaft at a low speed to press the heating unit installed under the second heating member to the printed circuit member, the film layer, and the panel for a predetermined time. Printed circuit bonding apparatus of a plasma display panel, characterized in that.