CN114083876B - Substrate attaching method and display device - Google Patents
Substrate attaching method and display device Download PDFInfo
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- CN114083876B CN114083876B CN202111325325.3A CN202111325325A CN114083876B CN 114083876 B CN114083876 B CN 114083876B CN 202111325325 A CN202111325325 A CN 202111325325A CN 114083876 B CN114083876 B CN 114083876B
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- substrate
- colloid
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- bonding method
- glue
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1284—Application of adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
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- Fluid Mechanics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The application provides a substrate bonding method and a display device, comprising the following steps: setting a colloid structure at a preset position of a surface to be bonded of a first substrate, wherein the colloid structure is provided with a lower surface and an upper surface opposite to the lower surface, the lower surface is in contact with the first substrate, and the projection of the upper surface on the first substrate is positioned in a projection area of the lower surface on the first substrate; pressing a second substrate to the upper surface of the colloid structure; and curing the colloid structure.
Description
Technical Field
The application relates to the technical field of display, in particular to a substrate bonding method and a display device.
Background
In a display device, an optical adhesive or a conductive adhesive is generally required to fix two panels or substrates, and it is common practice to coat an optical adhesive or a conductive adhesive on one of the panels or the substrates, then press the other panel or the substrate onto the surface of the optical adhesive or the conductive adhesive, and then cure the optical adhesive or the conductive adhesive. However, during lamination, the optical adhesive or the conductive adhesive often generates an adhesive overflow phenomenon due to the fluidity, so that the adhesive range is difficult to control, and particularly the conductive adhesive is easy to generate short circuit caused by adhesive overflow.
Therefore, the prior art has defects and needs to be solved urgently.
Disclosure of Invention
The application provides a substrate attaching method, which can solve the problem of glue overflow during lamination of a substrate or a panel.
In order to solve the problems, the technical scheme provided by the application is as follows:
a substrate bonding method comprising:
setting a colloid structure at a preset position of a surface to be bonded of a first substrate, wherein the colloid structure is provided with a lower surface and an upper surface opposite to the lower surface, the lower surface is in contact with the first substrate, and the projection of the upper surface on the first substrate is positioned in a projection area of the lower surface on the first substrate;
pressing a second substrate to the upper surface of the colloid structure; and
solidifying the colloid structure.
In some implementations, the gel structure is in the shape of a terrace or a truncated cone formed by one-time coating, and a ratio of a thickness of the gel structure after lamination to a thickness of the gel structure before lamination is between three fifths and four fifths.
In some of these embodiments, the colloidal structure is formed by at least two applications.
In some of these embodiments, the colloidal structure is formed by:
forming a first colloid part on a first substrate, wherein the first colloid part is a trapezoid table or a round table, and the upper supporting surface of the first colloid part comprises a groove;
pre-curing the first colloid portion; and
printing a second colloid in the groove;
or the colloid structure is formed by the following steps:
forming a first colloid part on a first substrate, wherein the first colloid part is a column body, and an upper supporting surface of the first colloid part is a plane;
pre-curing the first colloid portion;
and printing a second colloid part on the upper supporting surface, wherein the size of the second colloid part is smaller than that of the first colloid part.
In some of these embodiments, the thickness of the second gel portion is less than or equal to the thickness of the first gel portion.
In some embodiments, the first and second gel portions are conductive gel.
In some embodiments, the material of the first colloid portion is different from the material of the second colloid portion.
In some embodiments, at least one of the first substrate and the second substrate is any one of a touch panel, a flexible circuit board, a hard circuit board, or a display panel.
In some of these embodiments, the first substrate is a glass cover plate; the second substrate is a touch film or a touch glass; or the first substrate is touch glass, and the second substrate is a liquid crystal display panel.
The invention also relates to a display device.
A display device comprising a first substrate and a second substrate bonded together using the substrate bonding method according to any one of the above.
The beneficial effects of this application are: the substrate attaching method and the display device formed by the substrate attaching method are used for fixing or conducting a colloid structure, the colloid structure is provided with a lower surface and an upper surface opposite to the lower surface, the lower surface is in contact with a first substrate, the projection of the upper surface on the first substrate is located in a projection area of the lower surface on the first substrate, another panel is pressed on the surface of a second colloid, and the colloid structure and the second colloid are solidified, so that the range of glue overflow can be reduced.
Drawings
Technical solutions and other advantageous effects of the present application will be made apparent from the following detailed description of specific embodiments of the present application with reference to the accompanying drawings.
Fig. 1 is a display device according to a first embodiment of the present application;
FIG. 2 is a cross-sectional view of one of the steps of a substrate bonding method for forming the display device of FIG. 1 according to the first embodiment of the present application;
FIG. 3 is a cross-sectional view of the display device of FIG. 1 along the direction II-II;
fig. 4 is a cross-sectional view of one of the steps of a substrate bonding method according to a second embodiment of the present disclosure;
FIG. 5 is a schematic cross-sectional view of a display device formed by the substrate bonding method of FIG. 4;
fig. 6 is a cross-sectional view of one step of a substrate bonding method for forming a display device according to a third embodiment of the present disclosure;
FIG. 7 is a schematic cross-sectional view of a display device formed by the substrate bonding method provided in FIG. 6;
fig. 8 is a cross-sectional view of a substrate bonding method for forming a display device according to a fourth embodiment of the present disclosure.
Description of the reference numerals
100. 110, 120, 130-display means;
1. 60-a first substrate; 2. 220-colloid structure; 5. 70-a second substrate;
21. 23-a first colloid portion; 22. 24-a second colloid portion; 101-a touch area; 103-binding area
203-an upper surface; 201-lower surface; 210-upper support surface; 212-groove
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.
In the description of the present application, it should be understood that the terms "longitudinal," "transverse," "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," and the like indicate an orientation or a positional relationship based on that shown in the drawings, merely for convenience of description and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
The present application may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and does not in itself indicate a relationship between the various embodiments and/or arrangements discussed. The following describes the substrate bonding method of the present application in detail with reference to specific embodiments.
The application provides a substrate bonding method, which comprises the following steps:
s1: a colloid structure 2 is disposed at a predetermined position of the surface to be bonded of the first substrate 1, the colloid structure 2 has a lower surface 201 and an upper surface 203 opposite to the lower surface 201, the lower surface 201 is in contact with the first substrate 1, and a projection of the upper surface 203 on the first substrate 1 is located in a projection area of the lower surface 201 on the first substrate 1.
S2: the second substrate 5 is pressed onto the upper surface 203 of the colloid structure 2.
S3: solidifying the colloidal structure 2.
According to the substrate attaching method provided by the application, the colloid structure 2 is provided with the lower surface 201 and the upper surface 203 opposite to the lower surface 201, the lower surface 201 is in contact with the first substrate 1, the projection of the upper surface 203 on the first substrate 1 is positioned in the projection area of the lower surface 201 on the first substrate 1, the other substrate is pressed onto the upper surface 203 of the colloid structure 2, and the colloid structure 2 is solidified, so that the range of glue overflow can be reduced.
Example 1
In this embodiment, the first substrate 1 is a mother circuit board, and the second substrate 5 is a daughter circuit board. More specifically, referring to fig. 1 and fig. 2-3, the first substrate 1 is taken as a touch panel, the second substrate 5 is a flexible circuit board, and the first substrate 1 and the second substrate 5 are bonded to form a display device 100.
The first substrate 1 (touch panel) has a touch area 101 and a bonding area 103 surrounding the touch area 101. The touch area 101 is substantially rectangular. The second substrate 5 (flexible circuit board) and the first substrate 1 are bonded to each other in the bonding area 103. In other embodiments, the first substrate 1 is not limited to a touch panel, but may be another flexible circuit board, a hard circuit board, a display panel, or the like. The specific flow of the laminating method is as follows:
s1: a first substrate 1 is provided, the first substrate 1 comprises a binding area 103, and the binding area 103 comprises at least two first conductive parts 10 which are arranged at intervals. In this embodiment, the first conductive portion 10 may be an electrode, a pad, a gold finger, or the like.
S2: a colloid structure 2 is disposed at a predetermined position of the surface to be bonded of the first substrate 1, the colloid structure 2 has a lower surface 201 and an upper surface 203 opposite to the lower surface 201, the lower surface 201 is in contact with the first conductive portion 10 included in the first substrate 1, and a projection of the upper surface 203 on the first substrate 1 is located in a projection area of the lower surface 201 on the first substrate 1. In this embodiment, the colloid structure 2 is in the shape of a terrace or a truncated cone formed by one-time coating. It will be appreciated that the gel structure 2 may be other shapes, as long as the projection area of the upper surface 203 on the first substrate 1 is within the projection area of the lower surface 201 on the first substrate 1, so that the range of glue overflow can be reduced, and the risk of short circuit between the first substrate 1 and the second substrate 5 due to glue overflow is avoided.
The colloid structure 2 is anisotropic conductive adhesive. The anisotropic conductive adhesive is composed of liquid optical transparent adhesive and a plurality of conductive particles mixed in the liquid optical transparent adhesive. The anisotropic conductive adhesive is conductive adhesive for packaging electronic components, has the functions of unidirectional conduction and gluing fixation, is vertical conduction, and is non-conductive in the horizontal direction. The liquid optically clear adhesive may be a thermosetting resin as a binder. In one embodiment, the thermosetting resin is at least one of a modified phenolic resin, an epoxy-based resin, and an unsaturated polyester. It will be appreciated that the thermosetting resin is not limited to the examples described above.
S3: the second substrate 5 is provided, and the second substrate 5 includes a second conductive portion 50 corresponding to the first conductive portion 10, and the second conductive portion 50 may be an electrode, a pad, a gold finger, or the like. The second substrate 5 is pressed onto the upper surface 203 of the alternating structure 2, so that the colloid structure 2 is located between the first conductive portion 10 and the second conductive portion 50, and the first conductive portion 10 and the second conductive portion 50 are conducted through the solidified colloid structure 2.
S4: curing the gel structure 2 completes the lamination of the substrate, and the display device 100 is finally obtained.
Referring to the following tables 1-2, table 1 is a theoretical calculation value of a glue overflow range after coating a column-shaped colloid structure on a surface of a predetermined position of a first substrate 1 and pressing a second substrate 5 in the prior art. Table 2 is a theoretical calculation value of the range of glue overflow after the second substrate 5 is pressed and coated with the terrace-shaped colloid structure 2 on the surface of the predetermined position of the first substrate 1.
For example, the coated square column structure is compared with the square (quadrangular frustum) colloid structure 2, the initial area of the preset coated square colloid is 100um, the preset coating thickness and the preset pressing amount are all 2 theoretical values, the thickness after pressing is the difference between the preset coating thickness and the preset pressing amount, the volume of the colloid structure 2 is kept unchanged before and after pressing, and if the pressure is uniform, the flowing degree of the colloid structure 2 in all directions is the same after pressing, namely square after pressing, and the calculation is performed according to the principle that the volume is kept unchanged before and after pressing.
After lamination of the colloid structure 2 with the shape of a cylinder: post-lamination length = post-lamination width = [ (initial area) preset coating thickness/post-lamination thickness] 1/2 The method comprises the steps of carrying out a first treatment on the surface of the The difference refers to the difference between the length or width after lamination and the initial length or width, and it can be obtained that the length and width after lamination are specifically as follows.
After the colloid structure 2 with the shape of a terrace is pressed together: assuming that the length of the lower bottom edge before lamination is L, the length of the upper bottom edge before lamination is L, so that L=2l, and according to the volume calculation formula of the quadrangular frustum,
wherein s1 is the area of the upper bottom of the quadrangular frustum, s2 is the area of the lower bottom of the quadrangular frustum, and s1=l is the area of the upper bottom 2 Area of lower bottom s2= (2 l) 2 . The volume is unchanged before and after lamination, so that the glue overflow amount (difference between the front side and the rear side of lamination) of the column-shaped colloid structure and the terrace-shaped colloid structure is calculated as follows.
TABLE 1
TABLE 2
Therefore, the glue coating satisfies that the projection area of the upper surface 203 on the first substrate 1 is within the projection area of the lower surface 201 on the first substrate 1, so as to reduce the glue overflow. Preferably, the ratio of the thickness after lamination to the initial thickness is between three and four fifths.
Example 2
Referring to fig. 4-5, fig. 4-5 illustrate a display device 110 formed by a substrate bonding method according to a second embodiment of the present application. The substrate bonding method provided by the second embodiment is substantially the same as the substrate bonding method provided by the first embodiment, and is different in that: in this embodiment, the colloid structure 2 is formed by two coating processes.
Specifically, the colloid structure 2 is formed by:
s21: forming a first colloid part 21 on the first substrate 1, wherein the first colloid part 21 is a trapezoid table or a round table, and the upper supporting surface of the first colloid part 21 comprises a groove 212;
s22: pre-curing the first colloid portion 21; and
s23: a second glue portion 22 is printed in the groove 212, and the second glue portion 22 and the first glue portion 21 together form the glue structure 2.
The materials of the first colloid portion 21 and the second colloid portion 22 may be the same or different. In this embodiment, the material of the first colloid portion 21 is different from the material of the second colloid portion 22. Because the conductive adhesive needs to have the functions of conduction and adhesion, the conductive adhesive needs to be ensured to have the characteristics of smaller volume resistivity and larger viscosity, and has certain difficulty in material model selection. The application is to select the first colloid portion 21 for pre-curing and then to coat the second colloid portion 22, so that the first colloid portion 21 with larger viscosity and the second colloid portion 22 with smaller volume resistivity can be selected for combined use, and the difficulty of material type selection is reduced.
The viscosity of the colloid can be realized by selecting liquid optical transparent adhesive, and the volume resistivity can be improved by parameters such as the material, the particle size, the shape, the doping density and the like of the conductive particles. The viscosity of the second colloid portion 22 is greater than that of the first colloid portion 21, so that the fluidity of the second colloid portion 22 can be reduced, and the occurrence of short circuit between adjacent conductive portions on the substrate caused by the flowing of the second colloid portion 22 during lamination is improved.
Example 3
Referring to fig. 6-7, fig. 6-7 illustrate a display device 120 formed by a substrate bonding method according to a third embodiment of the present disclosure. The substrate bonding method provided by the third embodiment is substantially the same as the substrate bonding method provided by the second embodiment, and is different in that: in this embodiment, the colloid structure 2 is formed by two coating processes.
Specifically, the colloid structure 2 is formed by:
s201: forming a first colloid portion 21 on the surface of the first conductive portion 10 of the first substrate 1, wherein the first colloid portion 21 is a column, and an upper supporting surface 210 of the first colloid portion 21 is a plane;
s202: pre-curing the first colloid portion 21;
s203: the second colloid portion 22 is printed on the upper supporting surface, and the size of the second colloid portion 22 is smaller than that of the first colloid portion 21. Preferably, the second colloid portion 22 is also cylindrical in shape.
Compare the thinner colloid of coating one deck and avoid the glue overflow, the advantage of this application is, can make the thick thicker of glue between first base plate 1 and the second base plate 5, and the pressure range of pressfitting can be relaxed some, utilizes the anisotropic realization of colloid to insulate, in addition, suitable or the thickness of thick colloid can reduce in the hot pressing process, and the circuit board deformation, especially the risk of soft circuit board deformation.
Example 4
Referring to fig. 8, fig. 8 is a schematic diagram illustrating a substrate bonding method and a display device 130 according to a fourth embodiment of the present disclosure. The substrate bonding method provided by the fourth embodiment is substantially the same as the substrate bonding method provided by the third embodiment, except that:
in this embodiment, in step S1, the first substrate 60 is provided as a glass cover plate or as a touch glass; the colloid structure 220 is an optically transparent adhesive (Optical Clear Adhesive, OCA) or an optically transparent resin glue (Optical Clear Resist, OCR).
In step S2, the second substrate 70 is provided as a touch film or a touch glass or a liquid crystal display panel. The first glue portion 21 and the second glue portion 22 are optically transparent glue or are optically transparent resin glue. In the present embodiment, the first and second colloid portions 21 and 22 forming the colloid structure 2 are used only for bonding between two substrates, and are not used for conduction.
In the present application, the first colloid portion 23 and the second colloid portion 24 are the same in material, but are applied in separate steps. And the projection of the second colloid portion 24 on the first substrate 60 is located in the projection area of the first colloid portion 23 on the first substrate 60. By using the substrate bonding method, the glue structure 220 is formed by two times of coating, so that the thickness of the glue part printed each time is easier to control, the generation of bubbles in the glue structure 220 is reduced, the glue structure 220 is formed by two times of coating, and the phenomena of glue shortage and glue overflow in the edge area during bonding can be controlled; the optical performance of the display device 130 formed by the first substrate 60 and the second substrate 70 is ensured.
In summary, the substrate bonding method and the display device 100 formed by the substrate bonding method provided by the present application have a lower surface 201 and an upper surface 203 opposite to the lower surface 201, where the lower surface 201 contacts the first substrate 1, and the projection of the upper surface 203 on the first substrate 1 is located in the projection area of the lower surface 201 on the first substrate 1, so that the adhesive structure with such a shape can ensure that the range of adhesive overflow is reduced during lamination.
In summary, although the present application has been described with reference to the preferred embodiments, the preferred embodiments are not intended to limit the application, and those skilled in the art can make various modifications and adaptations without departing from the spirit and scope of the application, and the scope of the application is therefore defined by the claims.
Claims (9)
1. A substrate bonding method comprising:
setting a colloid structure at a preset position of a surface to be bonded of a first substrate, wherein the colloid structure is provided with a lower surface and an upper surface opposite to the lower surface, the lower surface is in contact with the first substrate, and the projection of the upper surface on the first substrate is positioned in a projection area of the lower surface on the first substrate;
pressing a second substrate to the upper surface of the colloid structure; and
solidifying the colloid structure; wherein, the colloid structure is formed by the following way:
forming a first colloid part on a first substrate, wherein the first colloid part is a trapezoid table or a round table, and the upper supporting surface of the first colloid part comprises a groove;
pre-curing the first colloid portion; and
printing a second colloid part in the groove, wherein the second colloid part and the first colloid part jointly form the colloid structure;
or the colloid structure is formed by the following steps:
forming a first colloid part on a first substrate, wherein the first colloid part is a column body, and an upper supporting surface of the first colloid part is a plane;
pre-curing the first colloid portion;
and printing a second colloid part on the upper supporting surface, wherein the size of the second colloid part is smaller than that of the first colloid part.
2. The substrate bonding method according to claim 1, wherein the colloid structure is in a stepped or truncated cone shape formed by one-time coating, and a ratio of a thickness of the colloid structure after lamination to a thickness of the colloid structure before lamination is between three fifths and four fifths.
3. The method of claim 1, wherein the gel structure is formed by at least two applications.
4. The method of claim 1, wherein the thickness of the second gel portion is less than or equal to the thickness of the first gel portion.
5. The method of claim 1, wherein the first and second glue portions are conductive glue.
6. The method of claim 5, wherein the first and second glue portions are made of different materials.
7. The method of claim 1, wherein at least one of the first substrate and the second substrate is any one of a touch panel, a flexible circuit board, a rigid circuit board, or a display panel.
8. The method of claim 1, wherein the first substrate is a glass cover plate; the second substrate is a touch film or a touch glass; or the first substrate is touch glass, and the second substrate is a liquid crystal display panel.
9. A display device comprising a first substrate and a second substrate bonded together by the substrate bonding method according to any one of claims 1 to 8.
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| CN202111325325.3A CN114083876B (en) | 2021-11-10 | 2021-11-10 | Substrate attaching method and display device |
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| CN202111325325.3A CN114083876B (en) | 2021-11-10 | 2021-11-10 | Substrate attaching method and display device |
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| CN114083876A CN114083876A (en) | 2022-02-25 |
| CN114083876B true CN114083876B (en) | 2023-07-25 |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102609139A (en) * | 2012-02-08 | 2012-07-25 | 友达光电（苏州）有限公司 | Frame glue structure |
| TWM504060U (en) * | 2012-02-20 | 2015-07-01 | Liang Yee Industry Co Ltd | Panel laminating device |
| CN110571351A (en) * | 2019-08-14 | 2019-12-13 | 武汉华星光电半导体显示技术有限公司 | Flexible display panel structure and manufacturing method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201249649A (en) * | 2011-06-08 | 2012-12-16 | Metal Ind Res & Dev Ct | A hard board pasting method and a coating module thereof |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102609139A (en) * | 2012-02-08 | 2012-07-25 | 友达光电（苏州）有限公司 | Frame glue structure |
| TWM504060U (en) * | 2012-02-20 | 2015-07-01 | Liang Yee Industry Co Ltd | Panel laminating device |
| CN110571351A (en) * | 2019-08-14 | 2019-12-13 | 武汉华星光电半导体显示技术有限公司 | Flexible display panel structure and manufacturing method |
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