JPH05291494A - Integrated circuit device - Google Patents

Abstract

PURPOSE:To reduce the number of parts and hence ensure high density packaging of a printed board by constructing a power supply noise removal bypass capacitor integrally with an integrated circuit package. CONSTITUTION:A bypass capacitor 2 is formed integrally with a package 1. Lead terminals 3-1-3-8 are inserted into corresponding through-holes 5 provided in a through-hole substrate 4, and are electrically interconnected through soldering. Hereby, the bypass capacitor 2 absorbs any power supply noise, and hence an integrated circuit is supplied with stable power for its normal operation. Accordingly, there is eliminated the need of an independent power supply noise prevention bypass capacitor to reduce the number of parts and the number of processes of assembling for improvement of reliability.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an integrated circuit device, and more particularly to the structure of an integrated circuit device requiring a bypass capacitor for removing power source noise.

[0002]

2. Description of the Related Art It is widely practiced to insert a bypass capacitor between a power supply line and a ground line in order to prevent a logic circuit portion of an integrated circuit device from malfunctioning due to power supply noise.

FIG. 4 shows a perspective view of the integrated circuit device 1 and the bypass capacitor 2 mounted on the printed circuit board 4. Further, FIG. 5 shows an equivalent circuit thereof. As shown in these drawings, a bypass capacitor 2 is connected between the integrated circuit device 1 and its power input terminal. There is a distance between the device 1 and the bypass capacitor 2.

In the figure, 3 indicates a lead terminal,
Reference numeral 5 is a through hole provided in the substrate 4.

As described above, in the conventional technique, since the bypass capacitor for preventing the power supply noise is used separately from the integrated circuit, it hinders high-density mounting and increases the number of mounting parts. The number of assembling steps increases, and even when a human visually inspects, there is a high possibility of making mistakes, and there is a problem in reliability.

[0006]

SUMMARY OF THE INVENTION Therefore, the present invention has been made to solve the above-mentioned drawbacks of the prior art. The object of the present invention is to reduce the number of parts to reduce the number of assembling steps and improve the reliability. An object is to provide an integrated circuit device that enables it.

[0007]

The integrated circuit device according to the present invention has a structure in which a bypass capacitor for removing power supply noise is integrated with the package.

[0008]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view of an embodiment of the present invention, and the same portions as those in FIG. 4 are designated by the same reference numerals. In this example, an integrated circuit package 1 having a structure attachable to a through hole substrate 4 is provided, and a bypass capacitor 2 is formed integrally with the package 1. In addition, this package 1 is 8
It is assumed that the book has lead terminals 3-1 to 3-8.

FIG. 2 is an equivalent circuit diagram of FIG. 1. The lead wire connected to the power supply is branched into two directions inside the package through the lead terminal 3-4. One end thereof leads to the integrated circuit, and the other end thereof leads to the A pole of the bypass capacitor 2. The lead wire connected to the ground (GND) branches in two directions in the package through the lead terminal 3-8. One end thereof communicates with the integrated circuit and the other end communicates with the B pole of the bypass capacitor 2.

Referring to FIG. 1, lead terminals 3-1 to 3-3
-8 are inserted correspondingly to the through holes 5 provided in the through hole substrate 4 and soldered so that electrical connection is made. As a result, the bypass capacitor 2 absorbs the noise from the power source, the stable power source is supplied to the integrated circuit, and the normal operation becomes possible.

FIG. 3 is a perspective view of another embodiment of the present invention, and the same portions as those in FIG. 1 are designated by the same reference numerals. Also in this example, the integrated circuit package 1 and the bypass capacitor 2 are integrally formed, and eight lead terminals 3-1 are provided.
~ 3-8. The equivalent circuit in this case is also the same as in FIG.

That is, the lead wire connected to the power supply is branched into two directions inside the package through the lead terminal 3-4. One end thereof leads to the integrated circuit, and the other end thereof leads to the A pole of the bypass capacitor 2. The lead wire connected to the ground branches into two directions inside the package through the lead terminal 3-8, one end of which leads to the integrated circuit and the other end of which leads to the B pole of the bypass capacitor 2.

Referring to FIG. 3, lead terminals 3-1 to 3-3
-8 is mounted on each of the pads 6 provided on the surface mount board 7, soldered, and electrically connected. As a result, the bypass capacitor 2 can absorb noise from the power source and supply a stable power source to the integrated circuit to operate the circuit normally.

Although a structure is shown in which the bypass capacitor 2 is closely attached to the lower surface of the integrated circuit package 1, the bypass capacitor 2 may be built in the package. It is good if they are integrated in structure.

[0016]

As described above, according to the present invention, since the bypass capacitor for removing the power supply noise is formed integrally with the integrated circuit package, the number of parts is reduced and the high density mounting of the printed circuit board becomes possible. In addition, there is an effect that the number of assembling steps can be reduced and the reliability can be improved.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of the present invention.

FIG. 2 is an equivalent circuit diagram of an embodiment of the present invention.

FIG. 3 is a perspective view showing another embodiment of the present invention.

FIG. 4 is a perspective view showing a mounted state of a conventional integrated circuit device.

5 is a diagram showing an equivalent circuit of the device of FIG.

[Explanation of symbols]

 1 Integrated Circuit Package 2 Bypass Capacitor 3-1 to 3-8 Lead Terminal 4 Printed Circuit Board 5 Through Hole 6 Pad

Claims (3)

[Claims] 1. An integrated circuit device in which a bypass capacitor for removing power supply noise is formed integrally with a package. 2. The integrated circuit device according to claim 1, wherein the package has a structure mountable on a through-hole substrate. 3. The integrated circuit device according to claim 1, wherein the package has a structure mountable on a surface mount substrate.