JPH05291126A - Semiconductor substrate coating equipment - Google Patents

Abstract

PURPOSE:To form a uniform photo resist coating film by using low exhaust pressure. CONSTITUTION:A hollow cylinder 103 whose diameter is smaller than a semiconductor substrate 102 is arranged just above the semiconductor substrate 102 and serves as a suction inlet. A skirt 105 is arranged below the semiconductor substrate 102, which skirt expands its diameter toward exhaust vents 107a, 107b, and has the diameter larger than the semiconductor substrate 102.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor substrate coating apparatus for coating a photoresist liquid on a semiconductor substrate by a spin coating method.

[0002]

2. Description of the Related Art A conventional semiconductor substrate coating apparatus is shown in FIG.
Will be described with reference to.

In the figure, reference numeral 1 denotes an opening at the top and a bottom 5
It is a cylindrical cup in which exhaust ports 6a and 6b are formed. 2 is a semiconductor substrate (hereinafter referred to as a wafer),
In the cup 1, the wafer 2 is inserted through the central portion of the bottom portion 5 and is adsorbed on the spinner 7 which is rotationally driven. A nozzle 3 for dropping the coating liquid is arranged directly above the wafer 2, and a reflection plate 4 having a diameter reduced toward the nozzle 3 is mounted around the wafer 2. Further, the exhaust ports 6a, 6b are connected to a waste liquid box 8 connected to an exhaust device (not shown) via pipes 9a, 9b, the spinner 7 is surrounded by the bottom portion 5 of the cup 1, and the coating waste liquid flows out to the outside. A cylindrical liquid stop guide 10 is provided so as to prevent the liquid from coming off.

In the semiconductor substrate coating apparatus having such a structure, the coating liquid (photoresist liquid) is dropped from the nozzle 3 onto the wafer 2, and the exhaust device is operated to suck the gas from the upper opening of the cup 1. The resist scattered from the surface of the wafer 2 by the rotation of the spinner 7 is reflected by the reflection plate 4
Is guided downward by the air flow A and the exhaust ports 6a, 6
b, and was introduced into the waste liquid box 8 through the pipes 9a and 9b in order.

[0005]

However, in the above-mentioned conventional semiconductor substrate coating apparatus, since the vortex of the air flow is generated below the wafer 2, a mist is generated, and the photoresist formed on the coating film formed on the wafer surface is covered with the photoresist. Along with the adhesion of fine particles, the photoresist is repelled, and in addition, the thickness of the photoresist coating film varies by 10% or more.
Therefore, there is a problem that it becomes difficult to form a fine pattern and the yield decreases.

Further, since the opening of the cup 1 is wide, it is necessary to increase the exhaust pressure, resulting in a high cost.

The object of the present invention is to solve the above-mentioned problems.
A semiconductor substrate coating apparatus capable of forming a uniform photoresist coating film with a low exhaust pressure.

[0008]

In order to achieve the above-mentioned object, the present invention is provided with a spinner which is rotatably driven in a cup having an open top and an exhaust port at the bottom, and a coating solution is applied onto the spinner. The semiconductor substrate to be coated is adsorbed,
In a semiconductor substrate coating apparatus in which a reflecting plate that is reduced in diameter toward the open portion of the cup and guides the excess coating liquid downward is mounted around the semiconductor substrate, the semiconductor substrate serving as an intake port is directly above the semiconductor substrate. A hollow cylinder having a small diameter is provided, and a skirt having a diameter larger than that of the semiconductor substrate and expanding toward the exhaust port is provided below the semiconductor substrate.

[0009]

According to the present invention, since the skirt having a diameter larger than that of the semiconductor substrate is provided below the semiconductor substrate toward the exhaust port, the air flow is smoothly guided by the skirt and introduced into the exhaust port. Therefore, turbulence such as generation of vortex of the air flow in the cup is eliminated.

Further, since the hollow cylinder having a diameter smaller than that of the semiconductor substrate is provided immediately above the semiconductor substrate, the intake port becomes smaller and the exhaust pressure can be reduced.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the semiconductor substrate coating apparatus of the present invention will be described below with reference to FIGS.

That is, in the semiconductor substrate coating apparatus, the central portion of the bottom portion 110 is inserted into a cylindrical cup 106 having an opening at the top and a pair of exhaust ports 107a and 107b formed at the bottom portion 110, and is driven to rotate. The spinner 101 is installed inside, and the wafer 102 is adsorbed onto the spinner 101. The side surface of the spinner 101 is surrounded by a cylindrical liquid stop guide 112 projecting from the bottom 110 of the cup 106, and there is a slight gap just above the wafer 102.
For example, a hollow cylinder 103 having a diameter smaller than that of the wafer 102 is provided in a concentric manner by providing about 4 mm. further,
A reflection plate 104 around the wafer 102 for dropping the excess coating liquid (photoresist liquid) that is reduced in diameter toward the hollow cylinder 103 and scattered is fixed to the peripheral surface of the hollow cylinder 103. In addition, a slight gap is provided below the wafer 102 with respect to the reflection plate 104, and the exhaust ports 107a, 1a
A skirt 105 having a diameter larger than that of the wafer 102, which diameter increases toward 07b, is provided around the liquid stop guide 112. Further, the pipe 1 is installed in the exhaust ports 107a and 107b.
11a, 111b and a waste liquid box 108 are connected in order, and a pipe 113 from an exhaust device (not shown) is connected to the waste liquid box 108.
Are connected. Further, directly above the hollow cylinder 103 is provided a nozzle 109 for dropping the photoresist solution onto the wafer 102.

Thus, in the semiconductor substrate coating apparatus having such a structure, the photoresist liquid is supplied from the nozzle 109 to the wafer 1
When it is dropped on 02 and spin coating is started, the exhaust device is activated, and the gas passes from the hollow cylinder 103 onto the wafer 102 and flows evenly between the reflection plate 104 and the skirt 105, and the exhaust port 107a, It is introduced into 107b. At this time, the excess photoresist liquid becomes mist or splash liquid along with the air flow A and is collected in the waste liquid box 108.

Therefore, in this embodiment, the air flow is smoothly guided by the skirt 105, and the exhaust ports 107a, 107a,
Since it is introduced into 107b, the turbulence of the air flow in the cup 106 is eliminated. Moreover, since the intake port becomes smaller, the exhaust pressure can be reduced.

[0015]

As described above, according to the present invention, the air flow is guided by the skirt in a smooth manner and introduced into the exhaust port, so that the air flow in the cup is not disturbed. Therefore,
The generation of mist is eliminated, and it is possible to prevent the photoresist fine particles from adhering to the surface of the coating film, and also to prevent the photoresist from splashing. In addition, since the variation in the film thickness of the coating film is reduced to 5% or less, a fine pattern can be easily formed and the yield can be improved.

Further, since the exhaust pressure can be lowered, it is possible to save energy and reduce costs.

[Brief description of drawings]

FIG. 1 is a sectional view of a semiconductor substrate coating apparatus of the present invention.

FIG. 2 is a plan view of a semiconductor substrate coating apparatus of the present invention.

FIG. 3 is a sectional view of a conventional semiconductor substrate coating apparatus.

[Explanation of symbols]

 101 Spinner 102 Wafer 103 Hollow Cylinder 104 Reflector 105 Skirt 106 Cup 107a, 107b Exhaust Port 108 Waste Liquid Box 109 Nozzle 110 Bottom 111a, 111b, 113 Pipe 112 Liquid Stop Guide

Claims (1)

[Claims] 1. A spinner which is rotationally driven is provided in a cup having an open top and an exhaust port formed at the bottom, and a semiconductor substrate to which a coating liquid is applied is adsorbed onto the spinner,
In a semiconductor substrate coating apparatus in which a reflecting plate that is reduced in diameter toward the open portion of the cup and guides the excess coating liquid downward is mounted around the semiconductor substrate, the semiconductor substrate serving as an intake port is directly above the semiconductor substrate. A semiconductor substrate coating apparatus, wherein a hollow cylinder having a small diameter is provided, and a skirt having a diameter larger than that of the semiconductor substrate, which is expanded toward the exhaust port, is provided below the semiconductor substrate.