JPH0528919B2 - - Google Patents
Info
- Publication number
- JPH0528919B2 JPH0528919B2 JP61067222A JP6722286A JPH0528919B2 JP H0528919 B2 JPH0528919 B2 JP H0528919B2 JP 61067222 A JP61067222 A JP 61067222A JP 6722286 A JP6722286 A JP 6722286A JP H0528919 B2 JPH0528919 B2 JP H0528919B2
- Authority
- JP
- Japan
- Prior art keywords
- metal film
- conductive metal
- filling material
- cylinder
- photoresist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052751 metal Inorganic materials 0.000 claims description 60
- 239000002184 metal Substances 0.000 claims description 60
- 239000000758 substrate Substances 0.000 claims description 46
- 238000000034 method Methods 0.000 claims description 42
- 238000011049 filling Methods 0.000 claims description 37
- 239000000463 material Substances 0.000 claims description 34
- 229920002120 photoresistant polymer Polymers 0.000 claims description 32
- 229920005989 resin Polymers 0.000 claims description 21
- 239000011347 resin Substances 0.000 claims description 21
- 238000004519 manufacturing process Methods 0.000 claims description 16
- 229920001187 thermosetting polymer Polymers 0.000 claims description 16
- 238000007747 plating Methods 0.000 claims description 15
- 239000004020 conductor Substances 0.000 claims description 14
- 239000000945 filler Substances 0.000 claims description 14
- 239000007788 liquid Substances 0.000 claims description 9
- 238000007740 vapor deposition Methods 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 5
- 238000007650 screen-printing Methods 0.000 claims description 4
- 238000005530 etching Methods 0.000 description 15
- 239000000919 ceramic Substances 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 239000012212 insulator Substances 0.000 description 8
- 239000000470 constituent Substances 0.000 description 7
- 238000007639 printing Methods 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 239000012790 adhesive layer Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000007772 electroless plating Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- -1 for example Substances 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000003348 petrochemical agent Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007761 roller coating Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はプリント配線板およびその製造方法に
関するものであり、特に高密度な表面実装をする
のに適した両面プリント配線板とその製造方法に
関するものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a printed wiring board and a method for manufacturing the same, and more particularly to a double-sided printed wiring board suitable for high-density surface mounting and a method for manufacturing the same. It is something.
近年、電子機器の小型化、高性能化が進むなか
で、ハイブリツド・モジユールに用いられるプリ
ント配線板も、より高密度で高信頼性が要求され
ている。このような要求に対して片面から両面プ
リント配線板への移行および配線回路の高密度化
が進められている。
In recent years, as electronic devices have become smaller and more sophisticated, printed wiring boards used in hybrid modules are also required to have higher density and higher reliability. In response to such demands, progress is being made in transition from single-sided to double-sided printed wiring boards and in increasing the density of wiring circuits.
両面プリント配線板を製造する銅スルーホール
法としては、感光性ドライフイルムを用いてパタ
ーンをエツチングして回路を形成するテンテイン
グ法が一般に使用されている。テンテイング法は
スルーホール法をテンテイングしているドライフ
イルムが破れ易く、スルーホール内の銅メツキが
エツチングされることによる不良が発生しやす
い。また、前記ドライフイルムは膜厚が厚いた
め、パターンの解像度が低く実用的には最小導体
幅で75〜100μmが限界であり、最近の超高密度配
線には対応できないことが問題となつている。 As a copper through-hole method for manufacturing double-sided printed wiring boards, a tenting method is generally used in which a circuit is formed by etching a pattern using a photosensitive dry film. In the tenting method, the dry film tenting the through-hole method is easily torn, and defects are likely to occur due to etching of the copper plating inside the through-holes. Furthermore, because the dry film is thick, the resolution of the pattern is low, and the practical minimum conductor width is limited to 75 to 100 μm, making it incompatible with recent ultra-high density wiring. .
これに対して、液体フオトレジストは薄く塗布
できるので解像度が極めて高く、高密度配線に適
している利点はあるが、両面プリント配線板に対
しては両面回路を接続するスルーホールがあるた
めに液体フオトレジストを基板表面に均一に塗布
することが難しいという問題があつた。 On the other hand, liquid photoresist has the advantage of being extremely high in resolution because it can be applied thinly, making it suitable for high-density wiring; There was a problem in that it was difficult to uniformly apply photoresist to the surface of the substrate.
このような液体フオトレジストの有する欠点を
解決して、高密度な回路を形成することのできる
方法として、特開昭58−124293号公報に「絶縁体
板で作られ貫通孔を有する基板の少なくとも片面
に構成膜を形成する工程と、前記貫通孔を絶縁物
で塞ぐ工程と、前記構成膜上にホトレジスト膜を
設け、感光と現像によりホトレジスト・パターン
を形成する工程と、前記ホトレジスト・パターン
をマスクとして前記構成膜を選択除去する工程と
を含むことを特徴とする混成集積回路の製造方
法」に係る発明が開示されている。前記発明の詳
細な説明によれば、絶縁物は貫通孔を単に塞いで
おればよく、基板の表面及び裏面と同一レベルの
面にする必要はないと記載されており、図２Ａの
ごとく絶縁物は貫通孔に充填し乾燥して塞ぐと大
きく収縮して充填された絶縁物の表面が凹状の窪
みとなるため、図２Ｂのごとく基板の表面に施さ
れたフオトレジスト膜が貫通孔のコーナー部で極
端に薄くなり、構成膜がコーナー部でエツチング
されて不良となり易く、収率が悪いという欠点が
ある。また、前記発明によれば、絶縁物には後で
容易に除去できる材料を用い、構成膜を選択除去
した後に絶縁物を除去すると記載されており、し
たがつて構成膜を選択除去して回路を形成した後
のスルーホールは貫通しているので、ソルダーレ
ジストなどの印刷に注意を要するし、スルーホー
ル内の構成膜は露出しており保護されていない欠
点を有している。
As a method for solving the drawbacks of liquid photoresists and forming high-density circuits, Japanese Patent Application Laid-open No. 124293/1983 describes a method that describes a method for forming high-density circuits by solving the disadvantages of liquid photoresists. a step of forming a constituent film on one side, a step of closing the through hole with an insulator, a step of providing a photoresist film on the constituent film and forming a photoresist pattern by exposure and development, and a step of masking the photoresist pattern. The invention relates to a method for manufacturing a hybrid integrated circuit, characterized in that the method includes a step of selectively removing the constituent films. According to the detailed description of the invention, it is stated that the insulator only needs to cover the through hole and does not need to be on the same level as the front and back surfaces of the substrate. When the insulator is filled into the through-hole and dried and closed, it shrinks greatly and the surface of the filled insulator becomes a concave depression.As shown in Figure 2B, the photoresist film applied to the surface of the substrate will not penetrate into the corners of the through-hole. The disadvantage is that the film becomes extremely thin and the constituent films tend to be etched at the corners, resulting in defects, and the yield is poor. Further, according to the invention, it is described that a material that can be easily removed later is used for the insulator, and the insulator is removed after the constituent films are selectively removed. Therefore, the constituent films are selectively removed and the circuit Since the through-holes pass through after the formation of the through-holes, care must be taken when printing solder resist, etc., and the film constituting the through-holes is exposed and unprotected.
前述の如く、貫通孔が完全に充填、閉塞されて
いることによりエツチングに対して貫通孔のコー
ナー部が確実に保護され、信頼性と収率の高い高
密度の回路を形成する方法は未だ知られていな
い。 As mentioned above, there is still no known method for forming high-density circuits with high reliability and yield by ensuring that the corners of the through-holes are protected against etching by completely filling and closing the through-holes. It has not been done.
本発明は前述の如きプリント配線板およびその
製造方法が有する問題点を解消し、配線回路のエ
ツチングに対して貫通孔内とコーナー部が確実に
保護されて収率および信頼性が高く、かつソルダ
ーレジストなどの印刷が極めて容易である高密度
なプリント配線板およびその製造方法を提供する
ことを目的とするものであり、特許請求の範囲記
載のプリント配線板とその製造方法を提供するこ
とによつて前記目的を達成することができる。 The present invention solves the problems of the printed wiring board and its manufacturing method as described above, reliably protects the inside of the through hole and the corner portion from etching of the wiring circuit, and provides high yield and reliability. The object of the present invention is to provide a high-density printed wiring board on which printing of resist and the like is extremely easy, and a method for manufacturing the same. Thus, the above objective can be achieved.
本発明は、絶縁性基板に、前記基板の両面に露
出する複数個の導電性金属膜筒と前記筒内を閉塞
硬化してなるフイラーを含む熱硬化性樹脂からな
る充填材料とを有し、かつ前記基板表面には前記
金属膜筒の露出部と接続されてなる金属膜導体回
路が設けられてなるプリント配線板とその製造方
法に関するものである。
The present invention includes an insulating substrate, a plurality of conductive metal film cylinders exposed on both sides of the substrate, and a filling material made of a thermosetting resin including a filler formed by sealing and curing the inside of the cylinder, The present invention also relates to a printed wiring board in which a metal film conductor circuit connected to the exposed portion of the metal film cylinder is provided on the surface of the board, and a method for manufacturing the same.
以下、本発明を詳細に説明する。 The present invention will be explained in detail below.
本発明で使用する絶縁性基板としては、例えば
ガラス・エポキシ基板、ガラス・ポリイミド基板
などの樹脂基板、例えばアルミナ・セラミツク、
低温焼成セラミツク、窒化アルミニウム・セラミ
ツクなどのセラミツク基板および貫通孔内に絶縁
化処理が施された金属芯基板を使用できる。 Examples of insulating substrates used in the present invention include resin substrates such as glass/epoxy substrates and glass/polyimide substrates, alumina/ceramic substrates, etc.
Ceramic substrates such as low-temperature fired ceramics and aluminum nitride ceramics, and metal core substrates whose through holes are insulated can be used.
本発明は、絶縁性基板の両面に露出する複数個
の導電性金属膜筒と前記筒内を閉塞硬化してなる
フイラーを含む熱硬化性樹脂からなる充填材料と
を有し、かつ前記基板の表面には前記金属膜筒の
露出部と接続されてなる金属膜導体回路が設けら
れることが必要である。 The present invention has a plurality of conductive metal film cylinders exposed on both sides of an insulating substrate, and a filling material made of a thermosetting resin including a filler formed by sealing and hardening the inside of the cylinder, and It is necessary that a metal film conductor circuit connected to the exposed portion of the metal film cylinder be provided on the surface.
前記金属膜筒内がフイラーを含む熱硬化性樹脂
からなる充填材料により閉塞硬化されてなること
が必要である理由は、基板表面に設けられた金属
膜をエツチングして回路が形成されるに際して、
金属筒内が完全に充填材料によつて閉塞硬化され
ることにより、金属筒内とその両端部がエツチン
グに対して確実に保護され、かつ前記ドライフイ
ルムを用いたテンテイング法においてもテンテイ
ングしているドライフイルムが破れる危険が完全
に避けられるので、収率と回路の信頼性を一挙に
向上できるからである。さらに、前記充填材料は
エツチングして、回路が形成された後も除去され
ずに金属膜筒内を充填硬化した状態にあるので、
閉塞硬化された充填材料の上をソルダーレジスト
などでベタ印刷でき、かつ金属膜筒内が充填材料
で保護され露出しないなどの利点があるからであ
る。 The reason why it is necessary that the inside of the metal film cylinder is sealed and hardened with a filling material made of a thermosetting resin containing a filler is that when a circuit is formed by etching the metal film provided on the surface of the substrate,
By completely sealing and hardening the inside of the metal cylinder with the filling material, the inside of the metal cylinder and both ends thereof are reliably protected from etching, and the tenting can be maintained even in the tenting method using the dry film described above. This is because the risk of dry film tearing is completely avoided, so yield and circuit reliability can be improved all at once. Furthermore, the filling material is etched and remains in a hardened state filling the inside of the metal film cylinder without being removed even after the circuit is formed.
This is because it has advantages such as being able to print solidly with a solder resist or the like on the occlusively hardened filling material, and the inside of the metal film cylinder being protected by the filling material and not exposed.
そしてさらに、本発明の充填材料は、無機フイ
ラーを混入しているので硬化時の体積収縮が小さ
く、硬化収縮による〓間からスルーホール内壁が
不必要に侵されることがない。しかも、充填硬化
後の充填材料は、熱サイクル等による膨張収縮の
割合が減少するため、温度変化に対する耐性にも
優れるという利点があるからである。 Furthermore, since the filling material of the present invention contains an inorganic filler, the volumetric shrinkage during curing is small, and the inner wall of the through hole is not unnecessarily eroded by the gaps caused by curing shrinkage. Furthermore, the filling material after filling and hardening has the advantage of being excellent in resistance to temperature changes, since the rate of expansion and contraction due to thermal cycles and the like is reduced.
ところで、従来プリント配線板における貫通孔
は、基板の両面に設けられた回路を接続するため
の導通孔と、リード付き電子部品を実装するため
の取り付け孔としての作用を主として有していた
が、最近はチツプ部品などの発達によつて表面実
装が広く普及した結果、特に高密度な配線板にお
いては後者の取り付け孔としての必要性が極めて
少なくなつているので、本発明のように導電性金
属筒内が充填材料で完全に閉塞硬化された状態の
プリント配線板であつても使用上全く支障がなく
なつてきている。 By the way, through holes in conventional printed wiring boards mainly functioned as conductive holes for connecting circuits provided on both sides of the board and as mounting holes for mounting leaded electronic components. Recently, as a result of the widespread use of surface mounting due to the development of chip components, the need for the latter mounting holes has become extremely small, especially in high-density wiring boards. Even if the inside of the cylinder is completely sealed and hardened with the filling material, there is no problem in using the printed wiring board.
前記金属筒内を閉塞硬化したフイラーを含む熱
硬化性樹脂からなる充填材料の両端面は前記金属
円筒の露出部両端面と実質的に同一レベルである
ことが好ましい。前記同一レベルであると、基板
表面は凹凸のない平滑な板となるので、液体フオ
トレジストを均一な膜厚で塗布できるし、前記ド
ライフイルムは破れ難く完全に密着できるため、
高密度で高精度の配線回路を高収率で得ることが
でき、さらにソルダーレジストなどの印刷や部品
実装も極めて容易になるからである。 It is preferable that both end surfaces of the filling material made of a thermosetting resin including a filler that is cured by sealing the inside of the metal cylinder are substantially on the same level as both end surfaces of the exposed portion of the metal cylinder. If the substrate is at the same level, the surface of the substrate will be a smooth plate with no irregularities, so the liquid photoresist can be applied with a uniform thickness, and the dry film will not be easily torn and can be completely adhered.
This is because a high-density, high-precision wiring circuit can be obtained at a high yield, and printing of solder resist and the like and component mounting are also extremely easy.
無機フイラーを含む熱硬化性樹脂からなる充填
材料は、硬化した状態にて前記金属膜筒内を完全
に閉塞でき、かつ耐熱性に優れ、しかも前記筒内
に充填材料して乾燥硬化させる際の収率が小さ
く、筒内を完全に閉塞しやすいものを用いる。前
記熱硬化性樹脂としては、例えば、エポキシ樹
脂、フエノール樹脂、ポリイミド樹脂、トリアジ
ン樹脂などの溶剤型あるいは無溶剤型を使用する
ことができ、また前記フイラーとしては例えばシ
リカ、アルミナ、チタニア、ムライト、ガラスな
どの無機質粉末、例えば前記熱硬化性樹脂からな
る樹脂粉末、例えば銅、銀、金などの金属粉末な
どを使用することができる。 The filling material made of a thermosetting resin containing an inorganic filler can completely close the inside of the metal film cylinder in the hardened state, has excellent heat resistance, and is easy to use when the filling material is placed inside the cylinder and dried and hardened. Use a material that has a low yield and is likely to completely block the inside of the cylinder. As the thermosetting resin, for example, solvent type or non-solvent type such as epoxy resin, phenolic resin, polyimide resin, triazine resin can be used, and as the filler, for example, silica, alumina, titania, mullite, etc. can be used. Inorganic powder such as glass, resin powder made of the thermosetting resin, metal powder such as copper, silver, gold, etc. can be used.
本発明における導電性金属膜筒およびその筒の
露出部と接続されてなる金属膜導体は、前記絶縁
性基板表面とそれに設けられた貫通孔内を均一な
金属膜で被覆できるメツキ法もしくは蒸着法によ
り形成されてなることが好ましく、特にメツキ法
は生産性と被覆性に優れているので好適である。
前記メツキ法としては、例えば銅、ニツケル、ス
ズなどの無電解メツキ法および無電解メツキと電
気メツキの併用法が使用できる。また、蒸着法と
しては例えば真空蒸着法、スパツタリング法、イ
オンプレーデイング法などを用いることができ
る。 The conductive metal film cylinder and the metal film conductor connected to the exposed part of the cylinder in the present invention can be produced by a plating method or a vapor deposition method that can coat the surface of the insulating substrate and the inside of the through hole provided therein with a uniform metal film. Preferably, the plating method is particularly suitable since it is excellent in productivity and covering properties.
As the plating method, for example, electroless plating of copper, nickel, tin, etc., or a combination of electroless plating and electroplating can be used. Further, as the vapor deposition method, for example, a vacuum vapor deposition method, a sputtering method, an ion plating method, etc. can be used.
前記金属膜導体回路は、前記絶縁性基板を被覆
している導電性金属膜をフオトレジストを使用し
てエツチングすることにより形成されてなるもの
である。前記フオトレジストとしては、液体フオ
トレジストと感光性ドライフイルムを使用するこ
とができ、特に液体フオトレジストはパターンの
解像度が高く高密度配線に適しているので好適で
ある。 The metal film conductor circuit is formed by etching a conductive metal film covering the insulating substrate using a photoresist. As the photoresist, a liquid photoresist and a photosensitive dry film can be used, and a liquid photoresist is particularly suitable because it has a high pattern resolution and is suitable for high-density wiring.
次に本発明のプリント配線板の製造方法を第１
図によつて説明する。 Next, the method for manufacturing a printed wiring board of the present invention will be explained in the first step.
This will be explained using figures.
第１図Ａ〜Ｆは、複数個の貫通孔を有する絶縁
性基板の表面および少なくとも一部の貫通孔の内
側面に導電性金属膜を形成させてから、前記貫通
孔内に形成された筒状の導電性金属膜をフイラー
を含む熱硬化性樹脂からなる充填材料によつて閉
塞、硬化させ、次いでフオトレジストを用いて前
記表面に設けられた金属膜をエツチングして導体
回路を形成することを特徴とするプリント配線板
の製造方法に係る工程説明図である。 FIGS. 1A to 1F show a case in which a conductive metal film is formed on the surface of an insulating substrate having a plurality of through holes and on the inner surface of at least some of the through holes, and then a cylinder is formed in the through holes. The conductive metal film of the shape is closed and cured with a filling material made of a thermosetting resin containing a filler, and then the metal film provided on the surface is etched using a photoresist to form a conductor circuit. FIG. 3 is a process explanatory diagram relating to a method of manufacturing a printed wiring board characterized by the following.
第１図Ａは複数個の貫通孔２を有する絶縁性基
板１の断面図であり、前記樹脂基板と金属芯基板
はドリルあるいは金型打抜きによつて貫通孔が形
成され、前記セラミツク基板はグリーンシートに
金型で孔を打抜き加工あるいは例えばCO2レー
ザ、超音波、ダイヤモンドドリルなどの孔あけ加
工によつて貫通孔を形成することができる。また
前記メツキ法による導電性金属膜と前記絶縁性基
板との密着性を向上させるために、絶縁性基板に
薄い接着層を設けたり、絶縁性基板の表面を直接
粗化したりすることもできる。 FIG. 1A is a cross-sectional view of an insulating substrate 1 having a plurality of through holes 2. The resin substrate and the metal core substrate have through holes formed by drilling or die punching, and the ceramic substrate is made of green. The through holes can be formed by punching holes in the sheet with a die or by drilling with a CO 2 laser, ultrasonic, diamond drill, or the like. Furthermore, in order to improve the adhesion between the conductive metal film and the insulating substrate formed by the plating method, a thin adhesive layer may be provided on the insulating substrate, or the surface of the insulating substrate may be directly roughened.
第１図Ｂは前記絶縁性基板１の表面および少な
くとも一部の貫通孔２の内側面に導電性金属膜３
を形成した絶縁性基板の断面図である。導電性金
属膜３の形式は前記メツキ法もしくは前記蒸着法
によつて行なわれることが好ましい。前記メツキ
法は絶縁性基板１の表面および貫通孔２の内面を
活性化処理し、次いで例えば銅やニツケルなどの
無電解メツキを用いてパネルメツキを行ない、さ
らにその上に電気メツキを施すこともできる。 FIG. 1B shows a conductive metal film 3 on the surface of the insulating substrate 1 and the inner surface of at least some of the through holes 2.
FIG. 2 is a cross-sectional view of an insulating substrate on which a The conductive metal film 3 is preferably formed by the plating method or the vapor deposition method described above. In the plating method, the surface of the insulating substrate 1 and the inner surface of the through hole 2 are activated, and then panel plating is performed using electroless plating of copper, nickel, etc., and electroplating can also be applied thereon. .
第１図Ｃは、前記貫通孔内に形成された筒状の
導電性金属膜３′をフイラーを含む熱硬化性樹脂
からなる充填材料４によつて閉塞し硬化させた絶
縁性基板１の断面図である。前記充填材料を筒状
の導電性金属膜３′内に充填させる方法としては、
例えばメタルマスクなどを用いてスクリーン印刷
で圧入充填する方法、スキージやローラで直接に
圧入充填する方法、ピンを用いて充填する方法、
充填材料内に基板を浸漬させる方法などの各種の
方法が使用でき、特に前記スクリーン印刷法は確
実に充填できるので有利である。次いで前記筒状
の導電性金属膜内に充填されたフイラーを含む熱
硬化性樹脂からなる充填材料を乾燥硬化させて筒
内を閉塞させる。また、前記充填材料を乾燥もし
くは硬化させてから、絶縁性基板１の表面からは
み出した余分な充填材料を研摩除去することによ
り、前記筒状の金属膜３′内を閉塞した充填材料
４の両端面を前記筒状の金属膜内の露出両端面と
実質的に同一レベルにすることが好ましい。 FIG. 1C shows a cross section of an insulating substrate 1 in which a cylindrical conductive metal film 3' formed in the through hole is closed and hardened with a filling material 4 made of a thermosetting resin containing a filler. It is a diagram. The method for filling the cylindrical conductive metal film 3' with the filling material is as follows:
For example, a method of press-fitting with screen printing using a metal mask, a method of directly press-fitting with a squeegee or roller, a method of filling with a pin,
Various methods can be used, such as dipping the substrate into the filling material, with the screen printing method being particularly advantageous as it ensures reliable filling. Next, a filling material made of a thermosetting resin containing a filler filled in the cylindrical conductive metal film is dried and hardened to close the inside of the cylinder. Further, after drying or hardening the filling material, excess filling material protruding from the surface of the insulating substrate 1 is removed by polishing, so that both ends of the filling material 4 that has closed the interior of the cylindrical metal film 3' are removed. It is preferable that the surface be substantially on the same level as both exposed end surfaces within the cylindrical metal film.
第１図Ｄは、フイラーを含む熱硬化性樹脂から
なる充填材料によつて閉塞、硬化させた後に、フ
オトレジストを表面に塗布し乾燥してフオトレジ
スト膜５を形成した状態を示す断面図である。前
記液体フオトレジストを塗布する方法としては、
例えばローラコート法、デイツプコート法、スプ
レーコート法、スピンナーコート法、スクリーン
印刷法などの手段が適用でき、前記感光性ドライ
フイルムを使用する場合にはラミネータを使用し
てフオトレジスト膜５を形成する。 FIG. 1D is a cross-sectional view showing a state in which a photoresist is applied to the surface and dried to form a photoresist film 5 after being closed and cured with a filling material made of a thermosetting resin containing a filler. be. The method for applying the liquid photoresist is as follows:
For example, means such as a roller coating method, a dip coating method, a spray coating method, a spinner coating method, and a screen printing method can be applied. When the photosensitive dry film is used, the photoresist film 5 is formed using a laminator.
第１図Ｅは前記フオトレジスト膜５を感光し現
像して、所定パターンのフオトレジスト膜からな
るエツチングレジストを形成した状態を示す断面
図である。 FIG. 1E is a sectional view showing a state in which the photoresist film 5 is exposed and developed to form an etching resist consisting of a photoresist film having a predetermined pattern.
第１図Ｆは前記フオトレジスト膜からなるエツ
チングレジストをマスクとし、前記基板表面に設
けられた金属膜３をエツチングして導体回路を形
成してから、前記フオトレジスト膜を剥離して得
られたプリント配線板の断面図である。 FIG. 1F shows a pattern obtained by using an etching resist made of the photoresist film as a mask, etching the metal film 3 provided on the surface of the substrate to form a conductor circuit, and then peeling off the photoresist film. FIG. 2 is a cross-sectional view of a printed wiring board.
なお、本発明のプリント配線板は、両面配線板
の上に例えばレジン系ペーストを印刷したり、ポ
リイミド膜と銅メツキ配線などにより多層化する
ことができる。また、例えばパターン形成、外形
加工のためのガイド孔、配線板を電子機器に固定
するための孔などを設けることもできる。 The printed wiring board of the present invention can be multilayered by printing, for example, a resin paste on a double-sided wiring board, or by using a polyimide film and copper plating wiring. Further, for example, guide holes for pattern formation and contour processing, holes for fixing the wiring board to electronic equipment, etc. can also be provided.
次に本発明を実施例によつて説明する。 Next, the present invention will be explained with reference to examples.
実施例
下記(1)〜(6)の工程によつてセラミツク基板から
なる両面プリント配線板を製作した。Example A double-sided printed wiring board made of a ceramic substrate was manufactured through the following steps (1) to (6).
(1) グリーンシート法により所定の位置に0.4mm
〓の複数個の貫通孔を有する外形寸法82.2×
82.2mm、厚さ0.635mmの96％アルミナセラミツ
ク基板を作成した。(1) 0.4mm in place using green sheet method
External dimensions 82.2× with multiple through holes
A 96% alumina ceramic substrate with a size of 82.2 mm and a thickness of 0.635 mm was created.
(2) セラミツク基板の表面を洗浄・脱脂処理し、
シランカツプリング処理してから、ローラコー
タを使用して耐熱エポキシ樹脂とシリカ微粉末
とからなる接着剤を前記基板表面に塗布し、
180℃で１時間加熱して厚さ10μmの接着層を形
成した。次いで、接着層の表面を軽く研摩して
から、フツ素水素酸に浸漬することにより表面
に露出したシリカ微粉末を溶解して接着層の表
面を粗化した。(2) Clean and degrease the surface of the ceramic substrate,
After the silane coupling treatment, an adhesive made of heat-resistant epoxy resin and fine silica powder is applied to the surface of the substrate using a roller coater,
It was heated at 180° C. for 1 hour to form an adhesive layer with a thickness of 10 μm. Next, the surface of the adhesive layer was lightly polished, and then immersed in hydrofluoric acid to dissolve the fine silica powder exposed on the surface and roughen the surface of the adhesive layer.
(3) 接着層を形成したセラミツク基板の全表面を
パラジウム触媒（SHIPLEY社製、キヤタポジ
ツト44）を付与して活性化させ、厚付け用無電
解銅メツキ浴に３時間浸漬して、メツキ厚さ
7μmのパネルメツキを行い、セラミツク基板の
表面および貫通孔の内側面に銅メツキからなる
導電性金属膜を形成した。(3) Activate the entire surface of the ceramic substrate on which the adhesive layer has been formed by applying a palladium catalyst (Cataposit 44, manufactured by SHIPLEY), and immerse it in an electroless copper plating bath for 3 hours to determine the plating thickness.
Panel plating of 7 μm was performed to form a conductive metal film made of copper plating on the surface of the ceramic substrate and the inner surface of the through hole.
(4) 耐熱エポキシ樹脂ワニス（三井石油化学製、
TA−1850）固形分100重量部と、シランカツ
プリング処理した粒径１〜5μmのアルミナ微粉
（住友アルミニウム精錬製）を分散混合して調
整したペースト状の充填材料を、メタルマスク
を用いてスクリーン印刷機によつて前記貫通孔
内に形成された筒状の導電性金属膜筒に充填
し、120℃で10分間乾燥してからセラミツク基
板の表面からはみ出した余分な充填材料を研摩
除去した後、180℃で１時間加熱、硬化させて
第１図Ｃに示すように前記筒状の導電性金属膜
を充填材料によつて閉塞、硬化させた。(4) Heat-resistant epoxy resin varnish (manufactured by Mitsui Petrochemicals,
TA-1850) A paste-like filling material prepared by dispersing and mixing 100 parts by weight of solids and fine alumina powder with a particle size of 1 to 5 μm (manufactured by Sumitomo Aluminum Refining Co., Ltd.) treated with silane coupling was screened using a metal mask. The cylindrical conductive metal film cylinder formed in the through hole by a printing machine was filled with the material, dried at 120°C for 10 minutes, and the excess filling material protruding from the surface of the ceramic substrate was removed by polishing. The conductive metal film was heated and cured at 180° C. for 1 hour to close and cure the cylindrical conductive metal film with the filling material, as shown in FIG. 1C.
(5) 前記導電性金属膜の表面を脱脂と酸処理して
から、液体フオトレジスト（東京応化工業製
PMER Ｐ−R300）をローラコータで表面に塗
布し、80℃で20分間乾燥して厚さ4μのフオト
レジスト膜を形成した。次いで、ガラス感板を
用いて200mJ／cm2の条件で露光し専用現像液
（東京応化工業製Ｐ−２）に25℃で90秒浸漬し
て現像することにより所定のパターンのエツチ
ングレジストを形成した。(5) After the surface of the conductive metal film is degreased and treated with acid, liquid photoresist (manufactured by Tokyo Ohka Kogyo Co., Ltd.) is applied.
PMER P-R300) was applied to the surface using a roller coater and dried at 80°C for 20 minutes to form a 4μ thick photoresist film. Next, using a glass sensitive plate, it was exposed to light at 200 mJ/cm 2 and developed by immersing it in a special developer (P-2 manufactured by Tokyo Ohka Kogyo Co., Ltd.) at 25°C for 90 seconds to form an etching resist with a predetermined pattern. did.
(6) 前記フオトレジスト膜からなるエツチングレ
ジストをマスクにして、前記基板表面に設けら
れた導電性金属膜を塩化第２銅エツチング液で
30秒スプレーすることによりエツチングして導
体回路を形成してから、10％苛性ソーダ液を用
いてフオトレジスト膜を剥離した。(6) Using the etching resist made of the photoresist film as a mask, the conductive metal film provided on the surface of the substrate is etched with a cupric chloride etching solution.
After etching by spraying for 30 seconds to form a conductor circuit, the photoresist film was removed using a 10% caustic soda solution.
以上のようにして得られた両面プリント配線板
は、最小導体幅が30μmの高密度なフアインパタ
ーンであり、導電性金属膜がコーナー部でエツチ
ングされることが全くなく、98％以上の高い収率
が得られた。また、この配線板にソルダーレジス
トをスクリーン印刷したところ印刷が極めて容易
で均一であつた。 The double-sided printed wiring board obtained as described above has a high-density fine pattern with a minimum conductor width of 30 μm, the conductive metal film is not etched at the corners, and the conductor width is 98% or more. Yields were obtained. Furthermore, when a solder resist was screen printed on this wiring board, the printing was extremely easy and uniform.
以上に述べた如く、本発明のプリント配線板は
従来のプリント配線板の如く導電性金属膜が貫通
孔のコーナー部でエツチングされて不良となるこ
とが全くないので、高密度の回路を有するプリン
ト配線板を極めて高い収率と信頼性で製造するこ
とができ、かつソルダーレジストなどの印刷も著
しく容易であり、産業上極めて有用である。
As described above, unlike conventional printed wiring boards, the printed wiring board of the present invention is free from defects caused by etching of the conductive metal film at the corners of the through-holes. Wiring boards can be manufactured with extremely high yield and reliability, and printing of solder resists and the like is also extremely easy, making it extremely useful industrially.
第１図Ａ〜Ｆは本発明のプリント配線板の製造
方法にかかる各工程における基板の縦断面説明
図、第２図Ａ，Ｂ，Ｃは従来のプリント配線板の
製造方法のうち２つの工程における基板の縦断面
説明図である。
１…絶縁性基板、２…貫通孔、３…導電性金属
膜、３′…筒状の導電性金属膜、４…充填材料、
５…フオトレジスト膜、１１…絶縁体板、１２…
貫通孔、１３…構成膜、１４…絶縁物、１５…フ
オトレジスト膜。
Figures 1A to 1F are explanatory longitudinal cross-sectional views of the board in each step of the printed wiring board manufacturing method of the present invention, and Figures 2A, B, and C are two steps of the conventional printed wiring board manufacturing method. FIG. DESCRIPTION OF SYMBOLS 1... Insulating substrate, 2... Through hole, 3... Conductive metal film, 3'... Cylindrical conductive metal film, 4... Filling material,
5... Photoresist film, 11... Insulator plate, 12...
Through hole, 13... Constituent film, 14... Insulator, 15... Photoresist film.
Claims (1)
数個の導電性金属膜筒と前記筒内を閉塞硬化して
なるフイラーを含む熱硬化性樹脂からなる充填材
料とを有し、かつ前記基板表面には前記金属膜筒
の露出部と接続されてなる金属膜導体回路が設け
られてなるプリント配線板。 ２ 前記金属膜筒および前記筒の露出部と接続さ
れてなる金属膜導体は、メツキ法もしくは蒸着法
により形成されてなる特許請求の範囲第１項記載
のプリント配線板。 ３ 前記筒内を閉塞したフイラーを含む熱硬化性
樹脂からなる充填材料の両端面は、前記金属円筒
の露出両端面と実質的に同一レベルである特許請
求の範囲第１または２項記載のプリント配線板。 ４ 前記導体回路は、フオトレジストにより形成
されてなる特許請求の範囲第１〜３項のいずれか
１つに記載のプリント配線板。 ５ 複数個の貫通孔を有する絶縁性基板の表面お
よび少なくとも一部の貫通孔の内側面の導電性金
属膜を形成させてから、前記貫通孔内に形成され
た筒状の導電性金属膜をフイラーを含む熱硬化性
樹脂からなる充填材料によつて閉塞硬化させ、次
いでフオトレジストを用いて前記表面に設けられ
た金属膜をエツチングして導体回路を形成するこ
とを特徴とするプリント配線板の製造方法。 ６ 前記導電性金属膜の形成は、メツキ法もしく
は蒸着法によつて行われる特許請求の範囲第５項
記載の製造方法。 ７ 前記筒状の導電性金属膜をフイラーを含む熱
硬化性樹脂からなる充填材料によつて閉塞するこ
とが、スクリーン印刷法によつて行われる特許請
求の範囲第５または６項記載の製造方法。 ８ 前記筒状導電性金属膜を閉塞するフイラーを
含む熱硬化性樹脂からなる充填材料の両端面を前
記筒状導電性金属膜の露出両端面と実質的に同一
レベルとなすことを特徴とする特許請求の範囲第
５〜７項のいずれか１つに記載の製造方法。 ９ 前記フオトレジストは、液状フオトレジスト
である特許請求の範囲第５〜８項のいずれか１つ
に記載の製造方法。[Scope of Claims] 1. An insulating substrate is provided with a plurality of conductive metal film cylinders exposed on both surfaces of the substrate, and a filling material made of a thermosetting resin containing a filler formed by sealing and curing the inside of the cylinders. and a metal film conductor circuit connected to an exposed portion of the metal film cylinder is provided on the surface of the substrate. 2. The printed wiring board according to claim 1, wherein the metal film cylinder and the metal film conductor connected to the exposed portion of the cylinder are formed by a plating method or a vapor deposition method. 3. The print according to claim 1 or 2, wherein both end surfaces of the filling material made of a thermosetting resin including a filler that closes the inside of the cylinder are substantially at the same level as both exposed end surfaces of the metal cylinder. wiring board. 4. The printed wiring board according to any one of claims 1 to 3, wherein the conductor circuit is formed of photoresist. 5. After forming a conductive metal film on the surface of an insulating substrate having a plurality of through holes and on the inner surfaces of at least some of the through holes, a cylindrical conductive metal film formed in the through holes is formed. A printed wiring board characterized in that it is closed and hardened with a filling material made of a thermosetting resin containing a filler, and then the metal film provided on the surface is etched using a photoresist to form a conductor circuit. Production method. 6. The manufacturing method according to claim 5, wherein the conductive metal film is formed by a plating method or a vapor deposition method. 7. The manufacturing method according to claim 5 or 6, wherein closing the cylindrical conductive metal film with a filling material made of a thermosetting resin containing a filler is performed by a screen printing method. . 8. Both end surfaces of a filling material made of a thermosetting resin containing a filler that closes the cylindrical conductive metal film are substantially on the same level as both exposed end surfaces of the cylindrical conductive metal film. The manufacturing method according to any one of claims 5 to 7. 9. The manufacturing method according to any one of claims 5 to 8, wherein the photoresist is a liquid photoresist.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6722286A JPS62224996A (en) | 1986-03-27 | 1986-03-27 | Printed wiring board and manufacture of the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6722286A JPS62224996A (en) | 1986-03-27 | 1986-03-27 | Printed wiring board and manufacture of the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62224996A JPS62224996A (en) | 1987-10-02 |
| JPH0528919B2 true JPH0528919B2 (en) | 1993-04-27 |
Family
ID=13338665
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6722286A Granted JPS62224996A (en) | 1986-03-27 | 1986-03-27 | Printed wiring board and manufacture of the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62224996A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6193910B1 (en) | 1997-11-11 | 2001-02-27 | Ngk Spark Plug Co., Ltd. | Paste for through-hole filling and printed wiring board using the same |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5086675A (en) * | 1973-12-06 | 1975-07-12 | ||
| JPS5489258A (en) * | 1977-12-27 | 1979-07-16 | Fujitsu Ltd | Method of producing printed board |
| JPS5595395A (en) * | 1979-01-13 | 1980-07-19 | Sony Corp | Method of fabricating printed circuit board |
| JPS56140696A (en) * | 1980-04-04 | 1981-11-04 | Sony Corp | Method of manufacturing circuit board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60172371U (en) * | 1984-04-20 | 1985-11-15 | 大山 實 | Equipment for wiping off excess adhesion of filling hardening agent for wiring holes in printed wiring boards |
-
1986
- 1986-03-27 JP JP6722286A patent/JPS62224996A/en active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5086675A (en) * | 1973-12-06 | 1975-07-12 | ||
| JPS5489258A (en) * | 1977-12-27 | 1979-07-16 | Fujitsu Ltd | Method of producing printed board |
| JPS5595395A (en) * | 1979-01-13 | 1980-07-19 | Sony Corp | Method of fabricating printed circuit board |
| JPS56140696A (en) * | 1980-04-04 | 1981-11-04 | Sony Corp | Method of manufacturing circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62224996A (en) | 1987-10-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |