JPH0528744B2 - - Google Patents
Info
- Publication number
- JPH0528744B2 JPH0528744B2 JP62221668A JP22166887A JPH0528744B2 JP H0528744 B2 JPH0528744 B2 JP H0528744B2 JP 62221668 A JP62221668 A JP 62221668A JP 22166887 A JP22166887 A JP 22166887A JP H0528744 B2 JPH0528744 B2 JP H0528744B2
- Authority
- JP
- Japan
- Prior art keywords
- silica
- less
- particles
- filler
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 99
- 239000000377 silicon dioxide Substances 0.000 claims description 35
- 239000002245 particle Substances 0.000 claims description 34
- 239000000945 filler Substances 0.000 claims description 31
- 229920005989 resin Polymers 0.000 claims description 20
- 239000011347 resin Substances 0.000 claims description 20
- 229920001187 thermosetting polymer Polymers 0.000 claims description 17
- 239000000203 mixture Substances 0.000 claims description 16
- 239000000843 powder Substances 0.000 claims description 14
- 239000003822 epoxy resin Substances 0.000 claims description 13
- 229920000647 polyepoxide Polymers 0.000 claims description 13
- 239000011342 resin composition Substances 0.000 claims description 10
- 239000012736 aqueous medium Substances 0.000 claims description 7
- 238000003825 pressing Methods 0.000 claims description 6
- 238000000227 grinding Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 description 19
- 239000010419 fine particle Substances 0.000 description 12
- 235000012239 silicon dioxide Nutrition 0.000 description 11
- 229910002026 crystalline silica Inorganic materials 0.000 description 10
- 239000005350 fused silica glass Substances 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 5
- 229920003002 synthetic resin Polymers 0.000 description 5
- 239000000057 synthetic resin Substances 0.000 description 5
- 239000013078 crystal Substances 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 238000000635 electron micrograph Methods 0.000 description 4
- 239000011256 inorganic filler Substances 0.000 description 4
- 229910003475 inorganic filler Inorganic materials 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000011049 filling Methods 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000010298 pulverizing process Methods 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- 229910001018 Cast iron Inorganic materials 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000010534 mechanism of action Effects 0.000 description 1
- 239000002609 medium Substances 0.000 description 1
- 239000002480 mineral oil Substances 0.000 description 1
- 235000010446 mineral oil Nutrition 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Silicon Compounds (AREA)
- Sealing Material Composition (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Pigments, Carbon Blacks, Or Wood Stains (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22166887A JPS6462362A (en) | 1987-09-03 | 1987-09-03 | Filler and polymer composition containing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22166887A JPS6462362A (en) | 1987-09-03 | 1987-09-03 | Filler and polymer composition containing same |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2416152A Division JPH062569B2 (ja) | 1990-12-31 | 1990-12-31 | シリカ微粉末 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6462362A JPS6462362A (en) | 1989-03-08 |
| JPH0528744B2 true JPH0528744B2 (zh) | 1993-04-27 |
Family
ID=16770394
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22166887A Granted JPS6462362A (en) | 1987-09-03 | 1987-09-03 | Filler and polymer composition containing same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6462362A (zh) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01294765A (ja) * | 1988-05-20 | 1989-11-28 | Nippon Retsuku Kk | エポキシ樹脂組成物 |
| JP2513529B2 (ja) * | 1990-09-19 | 1996-07-03 | 東芝セラミックス株式会社 | 電子部品封止用充填材の製造方法 |
| JPH062569B2 (ja) * | 1990-12-31 | 1994-01-12 | 住友精化株式会社 | シリカ微粉末 |
| IT1263807B (it) * | 1992-01-24 | 1996-09-03 | Mizusawa Industrial Chem | Granuli sferici di silice porosa oppure di silicato poroso, procedimento per la loro produzione e loro impiego |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5829858A (ja) * | 1981-08-13 | 1983-02-22 | Nitto Electric Ind Co Ltd | 電子部品封止用樹脂組成物 |
| JPS58138740A (ja) * | 1982-02-15 | 1983-08-17 | Denki Kagaku Kogyo Kk | 樹脂組成物 |
| JPS5922955A (ja) * | 1982-07-29 | 1984-02-06 | Toshiba Chem Corp | 半導体封止用樹脂組成物 |
| JPS6274924A (ja) * | 1985-09-30 | 1987-04-06 | Toshiba Corp | 半導体装置封止用エポキシ樹脂組成物 |
| JPS6296567A (ja) * | 1985-10-24 | 1987-05-06 | Denki Kagaku Kogyo Kk | 半導体封止用エポキシ樹脂組成物 |
-
1987
- 1987-09-03 JP JP22166887A patent/JPS6462362A/ja active Granted
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5829858A (ja) * | 1981-08-13 | 1983-02-22 | Nitto Electric Ind Co Ltd | 電子部品封止用樹脂組成物 |
| JPS58138740A (ja) * | 1982-02-15 | 1983-08-17 | Denki Kagaku Kogyo Kk | 樹脂組成物 |
| JPS5922955A (ja) * | 1982-07-29 | 1984-02-06 | Toshiba Chem Corp | 半導体封止用樹脂組成物 |
| JPS6274924A (ja) * | 1985-09-30 | 1987-04-06 | Toshiba Corp | 半導体装置封止用エポキシ樹脂組成物 |
| JPS6296567A (ja) * | 1985-10-24 | 1987-05-06 | Denki Kagaku Kogyo Kk | 半導体封止用エポキシ樹脂組成物 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6462362A (en) | 1989-03-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080427 Year of fee payment: 15 |