JPH05283450A - Manufacture of semiconductor device - Google Patents

Abstract

PURPOSE:To prevent the adhesion of fine silicon particles, dust, etc., to the surface of a semiconductor element during die bonding so as to improve the quality of a semiconductor device by sticking a heat-shrinkable protective sheet to the surface of a wafer and removing the sheet by heating after dicing and die bonding. CONSTITUTION:A semiconductor element is manufactured in such a way that a wafer 1 on which semiconductor elements are formed is diced into chips 2 and each chip 2 is die-bonded to each package. At the time of dicing the wafer 1, a heat-shrinkable protective sheet 3 is stuck to the surface of the wafer 1 and the wafer 1 is diced together with the sheet 3. Then, after die- bonding each chip with the sheet 3 to each package, the sheet 3 is removed from the surface of the chip 2 by heating the chip 2. When, for example, the chip 3 is heated for 30 minutes at 80 deg.C in dry air, the sheet 3 shrinks and curles and, finally, comes off from the surface of the chip 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a semiconductor device, and more particularly to a method for manufacturing a semiconductor device in which a protective sheet is attached to the surface of an IC and die sinking and die bonding are performed.

[0002]

2. Description of the Related Art Conventional dicing and die bonding have not been a manufacturing method in which the IC surface is protected by a cover or the like. That is, a sheet is attached to the back surface of a wafer on which semiconductor elements are formed, fixed on a stage, and diced with a blade to separate into individual chips. Thereafter, a method of manufacturing a semiconductor device by removing chips one by one from a sheet and die-bonding to a package has been adopted.

[0003]

In the conventional manufacturing method described above, since the chip surface is exposed during dicing and die bonding, silicon fine particles, dust and the like are easily attached to the chip surface. Especially CCD (charge coupled device) and EP
If the dust or the like adheres to the ROM, it has a defect that it becomes defective in the characteristic test and the yield decreases.

[0004]

According to the manufacturing method of the present invention, at the time of dicing and die bonding, a heat-shrinkable (or UV-shrinkable) protective sheet is attached to the surface of a semiconductor element with an adhesive, The manufacturing process includes heating after bonding to remove the protective sheet.

[0005]

The present invention will be described below with reference to the drawings.

FIG. 1 is a sectional view of a wafer or a chip in each manufacturing step of the manufacturing method of the present invention.

First, a sheet (not shown) is attached to the back surface of the wafer 1 on which semiconductor elements are formed through a diffusion process and the like in the conventional manner (FIG. 1A). Then, FIG.
As shown in (B), the heat-shrinkable protective sheet 3 is attached to the surface of the wafer by the connecting agent 4. The protective sheet attached to the wafer surface is transparent and has heat shrinkability,
In addition, any material may be used as long as the adhesive is attached. In this example, a sheet sold by Lintec under the trade name of D705 was used.

Thereafter, the chips are formed by dicing in the same manner as in the prior art, and each chip 2 is die-bonded to a package (not shown) as shown in FIG. 1 (C). After that, when the die-bonded chip 2 is heated together with the package (in this embodiment, heated in dry air at 80 ° C. for 30 minutes), the protective sheet 3 shrinks and turns over as shown in FIG. It rises and peels from the chip surface. Finally, the semiconductor device is completed by performing bonding and sealing the package as in the conventional case.

[0009]

As described above, according to the present invention, by sticking a protective sheet provided with an adhesive on the surface of a chip, silicon particles, dust and the like during dicing and die bonding adhere to the semiconductor element surface. This has the effect of preventing this and improving the quality. Further, since the heat-shrinkable (or UV-shrinkable) material is used for the protective sheet, the protective sheet can be easily attached and detached.

[Brief description of drawings]

FIG. 1 is a view showing a cross section of a wafer or a chip in each manufacturing step of the manufacturing method of the present invention.

[Explanation of symbols]

 1 Wafer 2 Chip 3 Protective sheet 4 Adhesive

Claims (1)

[Claims] 1. A method of manufacturing a semiconductor device by dicing a wafer on which semiconductor elements are formed by dicing, and die-bonding the chip to a package to attach a heat-shrinkable protective sheet to the surface of the wafer. , A step of dicing the protective sheet-attached wafer together with the protective sheet, a step of die-bonding a chip with a protective sheet obtained by dicing to a package, and heating the die-bonded chip to form the protective sheet. And a step of removing from the chip surface.