CN100373565C - Movable particle adsorbing method for hybrid integrated circuit - Google Patents
Movable particle adsorbing method for hybrid integrated circuit Download PDFInfo
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- CN100373565C CN100373565C CNB2005100030559A CN200510003055A CN100373565C CN 100373565 C CN100373565 C CN 100373565C CN B2005100030559 A CNB2005100030559 A CN B2005100030559A CN 200510003055 A CN200510003055 A CN 200510003055A CN 100373565 C CN100373565 C CN 100373565C
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- silicone
- integrated circuit
- cover plate
- pipe cap
- hybrid integrated
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Abstract
The present invention discloses an adsorption method for movable particles of a hybrid integrated circuit. The method is to select adsorption agent, and the adsorption agent is covered on the inner top surface of a pipe cap of a hybrid integrated circuit or the surface of the inner side of a cover plate to absorb movable particles. The adsorption agent which is selected is silicone. The present invention has the specific technique that (1). the silicone is uniformly stirred, and is filled in a dropping machine; (2). the dropping amount of the silicone is controlled according to the area of a packing cover plate or the inner top surface of the pipe cap of the hybrid integrated circuit; (3). the silicone is uniformly dripped at the center of a definite region; (4). the cover plate or the pipe cap dropped by the silicone is placed in a clean oven, the constant temperature of the cover plate or the pipe cap is controlled for 30 minutes after temperature is raised by 50 DEG C from room temperature, and the cover plate or the pipe cap is taken out until the temperature achieves 200 DEG C for 30 minutes at constant temperature; (5). the thickness of the silicone on the surface of the cover plate or the pipe cap is controlled from 20 mu m to 60 mu m after the cover plate or the pipe cap is baked; (6). the cover plate or the pipe cap coated with the silicone is covered on a base of a sealing device to be sealed. The method is used, the movable particles can be adsorbed and fixed. The problem that the movable particles are eliminated in the production of the hybrid integrated circuit is solved, and the reliability of an integrated circuit device is greatly enhanced.
Description
Technical field
The present invention relates to integrated circuit, in the hybrid integrated circuit production process, adsorb mobile particle to improve the method for product reliability.
Background technology
In integrated circuit is produced, how to solve the mobile particle that is trapped in the encapsulation and be always the long-term difficult problem that solves of wishing, because these particles have sizable threat for the reliability of components and parts.When making hybrid integrated circuit, because it relates to the more structural material than monolithic device, technology is more complicated, and the assembling difficulty is higher, therefore gives movable or potential movable fifth wheel provides and more has chance, these fifth wheels common names " particle ".And these movable particles can cause the short circuit of device inside element to cause component failure when possessing certain condition and be subjected to displacement.In relevant requirements, do not allow chip, the Resistor-Capacitor Unit installed on the sealed hybrid inner chamber pedestal are carried out surface-coated.Therefore how to eliminate mobile particle and just become one of key subject of hybrid integrated circuit production.Technical staff's achievement in research in this respect is also few in recent years, also not comparatively reliable technique scheme appearance.In the Chinese patent application, comparatively approaching method is No. 02116760.5 " control method of adsorption state of particles adsorbed on surface of polished silicon substrate for integrated circuit ", and what this method solved is the cleaning problem of polished silicon substrate surface adsorption particle.But still there is not the report that solves the mobile particle problem in the encapsulation that is trapped in up to now.
Summary of the invention
The object of the present invention is to provide a kind of adsorption method of hybrid integrated circuit mobile particle, thereby solve a difficult problem of eliminating mobile particle in the highly reliable hybrid integrated circuit production.
The adsorption method of the hybrid integrated circuit mobile particle that the inventor provides be select for use a kind of non-conductive, have certain viscosity, can be anti-oxidant and the absorbent of thermal stability arranged, it is covered in the pipe cap inner top surface of hybrid integrated circuit or the inner surface of cover plate, the absorption mobile particle makes it stiff.
The inventor selects for use silicone (being polysiloxanes) as absorbent through research repeatedly, and its chemical structural formula is:
The silicone molecular weight is big, anti-oxidant and Heat stability is good, and surface tension is low, is difficult for bubbling, and suitable to adsorbent.Physicochemical properties according to material infer to have the material of silicon-oxygen-silicon structure, all may be used as adsorbent, for example polymethylphenyl siloxane fluid.
The concrete grammar that uses silicone to make adsorbent is:
(1) silicone is stirred, put into the dropping liquid machine;
(2) according to the area control silicone amount of splashing into of hybrid integrated circuit encapsulation cover plate or pipe cap inner top surface, its amount is seized back confiscated property at 20～60 μ m with the silicone thickness after curing and is controlled;
(3) silicone is dropped in equably the center that encapsulates the regulation zone;
(4) cover plate or the pipe cap that will splash into silicone places cleaning oven, from room temperature, and 50 ℃ of every intensifications, control constant temperature 30 minutes, until reaching 200 ℃, constant temperature took out in 30 minutes;
(5) after curing the THICKNESS CONTROL of its surperficial silicone at 20～60 μ m;
(6) cover plate of silicone-coating or pipe cap are contained on the device pedestal to be packaged seal.
In said process, should be noted that to prevent that the silicone effluent from not polluting its sealing area, when curing and soldering and sealing, consider the discharge quantity of silicone, especially will prevent its internal steam content overproof.
Use method of the present invention, the enough silicone of energy adsorb mobile particle and are fixed up, and make it stiff, have solved the problem of eliminating mobile particle during hybrid integrated circuit is produced, have greatly improved the reliability of element in the circuit.Prove the requirement that all can reach relative national standards with the inventive method through follow-up machinery, climatic environment stress test, environment is had no adverse effect.
Embodiment
Certain TO-8 (12) and TO-3 (8) package hybrid integrated circuit that embodiment Fengguangdian Factory, Zhenhua Group China produces, before using silicone absorption mobile particle, with particle encounter noise measuring (being called for short PIND detects), disqualification rate is respectively 28% and 23.5%.The use silicone is made adsorbent and is adopted following method to handle: silicone is stirred, put into the dropping liquid machine; According to the hybrid integrated circuit encapsulation pipe cap area control silicone amount of splashing into, its amount is seized back confiscated property at 20～60 μ m with the silicone thickness after curing and is controlled; Silicone is dropped in equably the center of encapsulation pipe cap inner top surface; The pipe cap that splashes into silicone is placed cleaning oven, from room temperature, 50 ℃ of every intensifications, control constant temperature 30 minutes, until reaching 200 ℃, constant temperature took out in 30 minutes; The THICKNESS CONTROL of its surperficial silicone is at 20～60 μ m after curing; The pipe cap of silicone-coating covered on the device pedestal seal.Detect with PIND more afterwards, disqualification rate drops to 0.9% and 0.8% respectively.Detect through moisture content, TO-8 (12) moisture content volume fraction is 0.1071% again, and TO-3 (8) moisture content volume fraction is 0.1509%, all meets the index of GJB548A-96 moisture content volume fraction≤0.5000%.
Claims (3)
1. the adsorption method of hybrid integrated circuit mobile particle is characterized in that this method is to select a kind of adsorbent for use, and it is covered in the pipe cap inner top surface of hybrid integrated circuit or the inner surface of cover plate, and the absorption mobile particle makes it stiff.
2. according to the adsorption method of the described hybrid integrated circuit mobile particle of claim 1, it is characterized in that selected adsorbent is a silicone.
3. according to the adsorption method of claim 1 or 2 described hybrid integrated circuit mobile particles, it is characterized in that its concrete technology comprises:
(1) silicone is stirred, put into the dropping liquid machine;
(2) according to the area control silicone amount of splashing into of hybrid integrated circuit encapsulation cover plate or pipe cap inner top surface, its amount is seized back confiscated property at 20～60 μ m with the silicone thickness after curing and is controlled;
(3) silicone is dropped in equably the center that encapsulates the regulation zone;
(4) cover plate or the pipe cap that will splash into silicone places cleaning oven, from room temperature, and 50 ℃ of every intensifications, control constant temperature 30 minutes, until reaching 200 ℃, constant temperature took out in 30 minutes;
(5) after curing the THICKNESS CONTROL of its surperficial silicone at 20～60 μ m;
(6) cover plate of silicone-coating or pipe cap are covered treating and seal on the sealing cap device pedestal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100030559A CN100373565C (en) | 2005-04-29 | 2005-04-29 | Movable particle adsorbing method for hybrid integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100030559A CN100373565C (en) | 2005-04-29 | 2005-04-29 | Movable particle adsorbing method for hybrid integrated circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1719587A CN1719587A (en) | 2006-01-11 |
| CN100373565C true CN100373565C (en) | 2008-03-05 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100030559A Expired - Fee Related CN100373565C (en) | 2005-04-29 | 2005-04-29 | Movable particle adsorbing method for hybrid integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100373565C (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05283450A (en) * | 1992-03-31 | 1993-10-29 | Nec Kyushu Ltd | Manufacture of semiconductor device |
| JPH06232108A (en) * | 1993-01-29 | 1994-08-19 | Hitachi Ltd | Removal of foreign matter |
| US5690749A (en) * | 1996-03-18 | 1997-11-25 | Motorola, Inc. | Method for removing sub-micron particles from a semiconductor wafer surface by exposing the wafer surface to clean room adhesive tape material |
| JPH10154686A (en) * | 1996-11-22 | 1998-06-09 | Toshiba Corp | Method of cleaning semiconductor substrate processing device |
| JP2004327485A (en) * | 2003-04-21 | 2004-11-18 | Canon Inc | Method for removing dust particle from exposure mask |
-
2005
- 2005-04-29 CN CNB2005100030559A patent/CN100373565C/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05283450A (en) * | 1992-03-31 | 1993-10-29 | Nec Kyushu Ltd | Manufacture of semiconductor device |
| JPH06232108A (en) * | 1993-01-29 | 1994-08-19 | Hitachi Ltd | Removal of foreign matter |
| US5690749A (en) * | 1996-03-18 | 1997-11-25 | Motorola, Inc. | Method for removing sub-micron particles from a semiconductor wafer surface by exposing the wafer surface to clean room adhesive tape material |
| JPH10154686A (en) * | 1996-11-22 | 1998-06-09 | Toshiba Corp | Method of cleaning semiconductor substrate processing device |
| JP2004327485A (en) * | 2003-04-21 | 2004-11-18 | Canon Inc | Method for removing dust particle from exposure mask |
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| Publication number | Publication date |
|---|---|
| CN1719587A (en) | 2006-01-11 |
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Granted publication date: 20080305 Termination date: 20180429 |