CN106317900B - A kind of dielectric resilience silica gel pad and preparation method thereof with special adhesive property - Google Patents
A kind of dielectric resilience silica gel pad and preparation method thereof with special adhesive property Download PDFInfo
- Publication number
- CN106317900B CN106317900B CN201610702604.XA CN201610702604A CN106317900B CN 106317900 B CN106317900 B CN 106317900B CN 201610702604 A CN201610702604 A CN 201610702604A CN 106317900 B CN106317900 B CN 106317900B
- Authority
- CN
- China
- Prior art keywords
- silica gel
- silicone oil
- gel pad
- mass parts
- adhesive property
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a kind of dielectric resilience silica gel pad and preparation method thereof with special adhesive property, the dielectric resilience silica gel pad are formed by ethenyl blocking phenyl silicone oil, liquid silicone, containing hydrogen silicone oil, modified filler, fire retardant and catalyst preparation.Preparation method includes the following steps: 1) prepared by base-material: kneader is added in ethenyl blocking phenyl silicone oil, liquid silicone, modified filler and fire retardant, is mediated, adds containing hydrogen silicone oil and catalyst, mediated, obtain base-material；2) deaeration: the vacuumizing and defoaming when mediating；3) vulcanize: roll squeezer is added in the base-material for carrying out deaeration processing, is pressed into certain thickness gasket, then carry out baking vulcanization.The initial bond strength of dielectric resilience silica gel pad of the invention is lower, is convenient for constructing operation, over time, bonding force can significantly increase, and good adhesion strength just can be reached after 48 hours；Preparation method of the invention is easy to operate, and production cost is low.
Description
Technical field
The present invention relates to a kind of thermal interfacial materials, and in particular to a kind of dielectric resilience silicagel pad with special adhesive property
Piece and preparation method thereof.
Background technique
Electronic product towards miniaturization, portability development be development in science and technology inexorable trend, to meet this development trend
The size for not requiring nothing more than electronic component is smaller and smaller, also requires the packaging density of electronic component higher and higher.Packaging density
Raising also bring along the sharply accumulation of heat, cause electronic product internal temperature to increase, can stability to electronic component,
Reliability and service life have an impact.High temperature can jeopardize the node of semiconductor, damage the linkage interface of circuit, increase the resistance value of conductor
With cause mechanical stress to damage.For degree of integration and packing density all higher portable electronic products (such as laptop,
Mobile phone etc.), the heat dissipation problem of electronic component how is solved, the technical bottleneck problem of entire product is had become.
The conventional thermal conductives material such as metal, inorganic material, though heating conduction is good, since brittleness is big, processing difficulties, conduction etc.
Factor limits its application in field of electronic devices.High thermal conductivity gasket is a kind of typical thermal interfacial material, can be significant
Ground reduces the thermal resistance generated by contact gap, improves heat dissipation effect, is widely applied in dissipation from electronic devices field.So
And the initial adhesive property of most of heat-conducting pads is stronger on the market at present, constructing operation difficulty is big, and its adhesive property can be with
The passage of time be remarkably decreased, service life is shorter, can leverage the stability of product.
The invention discloses a kind of dielectric resilience silica gel pad with special adhesive property, excellent thermal conductivity, absolutely
Edge performance is good, and its initial bonding force is low, is convenient for constructing operation, over time, bonding force can significantly increase, and 48 is small
When after just can reach good adhesion strength, it is firm to be bonded.
Summary of the invention
The purpose of the present invention is to provide a kind of with the dielectric resilience silica gel pad of special adhesive property and its preparation side
Method.
The technical solution used in the present invention is:
A kind of dielectric resilience silica gel pad with special adhesive property, is prepared by the raw material of following mass parts:
Ethenyl blocking phenyl silicone oil: 30~80 parts；
Liquid silicone: 10~30 parts；
Containing hydrogen silicone oil: 6~40 parts；
Modified filler: 500~1000 parts；
Fire retardant: 10~90 parts；
Catalyst: 0.1~0.8 part.
The ethenyl blocking phenyl silicone oil is ethenyl blocking methyl phenyl silicone oil, ethenyl blocking trifluoro propyl benzene
At least one of base silicone oil, ethenyl blocking diphenyl silicone oil.
The ethenyl blocking phenyl silicone oil is ethenyl blocking methyl phenyl silicone oil.
The liquid silicone is prepared by the following method to obtain:
1) by the end-capping reagent of 90~150 mass parts, the alcohol of the deionized water of 80~250 mass parts and 10~100 mass parts
Reactor is added, control pH value is 1~2,30~120 DEG C and is stirred to react 20~40min；
2) esters of silicon acis of 300~1000 mass parts is added, 30~120 DEG C are stirred to react 3~10h；
3) product of step 2 is cooled to room temperature, adds the organosilicon small-molecule substance of 200~1000 mass parts, extracted
It takes, stands, layering excludes sour water layer, obtains hydrolysate；
4) washing hydrolysis product removes moisture removal to neutrality, be then added 0.002~0.05 mass parts basic catalyst and
The deionized water of 1~10 mass parts, 50~160 DEG C of 3~6h of polymerization reaction；
The end-capping reagent is hexamethyldisiloxane, tetramethyl divinyl disiloxane, two hydrogen-based of tetramethyl, two silicon
At least one of oxygen alkane；The esters of silicon acis is methyl orthosilicate, ethyl orthosilicate, positive silicic acid propyl ester, butyl silicate, gathers
At least one of silester；The alcohol is at least one of methanol, ethyl alcohol, isopropanol, n-butanol, isobutanol；Institute
The organosilicon small-molecule substance stated is at least one of organosilicon ring body DMC, D4, vinyl ring body, linear silicone oils；Described
Basic catalyst is at least one of NaOH, KOH, tetramethylammonium hydroxide.
The viscosity of the containing hydrogen silicone oil is 100~500mPa.s, and the mass percentage of hydrogen is 0.01%~1.6%.
The modified filler be modified spherical aluminium oxide, modified oxidized magnesium, modified silicon carbide, modified nano zinc oxide,
Mixture composed by modified spherical boron nitride, at least two be modified in aluminium nitride.
The partial size of the modified spherical aluminium oxide is 2~90 μm；The average grain diameter of the modified oxidized magnesium is less than 2 μ
m；The partial size of the modification silicon carbide is 0.2~2.4 μm；The partial size of the modified nano zinc oxide is 1~100nm；Institute
The modified spherical boron nitride partial size stated is 5~20 μm；The partial size of the modification aluminium nitride is 1.2~1.6 μm.
The fire retardant is inorganic fire retardants.
The catalyst is platinum catalyst.
The preparation method of the above-mentioned dielectric resilience silica gel pad with special adhesive property, comprising the following steps:
1) prepared by base-material: ethenyl blocking phenyl silicone oil, liquid silicone, modified filler and fire retardant being added and mediated
Machine is added containing hydrogen silicone oil and catalyst after mediating uniformly, mediates 2~4h, obtain base-material；
2) deaeration: 0.5~1h is vacuumized when mediating；
3) vulcanize: roll squeezer is added in the material for carrying out deaeration processing, certain thickness gasket is pressed into, is placed in 100
10~20min is toasted in~150 DEG C of baking ovens, obtains the dielectric resilience silica gel pad with special adhesive property.
The beneficial effects of the present invention are: the dielectric resilience silica gel pad with special adhesive property of the invention is initial viscous
Knotting strength is lower, is convenient for constructing operation, over time, bonding force can significantly increase, and just can reach very after 48 hours
Good adhesion strength, it is firm to be bonded；Preparation method of the invention is easy to operate, and production cost is low.
Specific embodiment
A kind of dielectric resilience silica gel pad with special adhesive property, is prepared by the raw material of following mass parts:
Ethenyl blocking phenyl silicone oil: 30~80 parts；
Liquid silicone: 10~30 parts；
Containing hydrogen silicone oil: 6~40 parts；
Modified filler: 500~1000 parts；
Fire retardant: 10~90 parts；
Catalyst: 0.1~0.8 part.
Preferably, the ethenyl blocking phenyl silicone oil is ethenyl blocking methyl phenyl silicone oil, ethenyl blocking three
At least one of fluoropropyl phenyl silicone oil, ethenyl blocking diphenyl silicone oil.
It is further preferred that the ethenyl blocking phenyl silicone oil is ethenyl blocking methyl phenyl silicone oil.
Still further preferably, the ethenyl blocking phenyl silicone oil is 200~3000mPa.s of viscosity, vinyl
The ethenyl blocking methyl phenyl silicone oil of mass percentage 0.45%~3.0%.
Preferably, the liquid silicone is prepared by the following method to obtain:
1) by the end-capping reagent of 90~150 mass parts, the alcohol of the deionized water of 80~250 mass parts and 10~100 mass parts
Reactor is added, control pH value is 1~2,30~120 DEG C and is stirred to react 20~40min；
2) esters of silicon acis of 300~1000 mass parts is added, 30~120 DEG C are stirred to react 3~10h；
3) product of step 2 is cooled to room temperature, adds the organosilicon small-molecule substance of 200~1000 mass parts, extracted
It takes, stands, layering excludes sour water layer, obtains hydrolysate；
4) washing hydrolysis product removes moisture removal to neutrality, be then added 0.002~0.05 mass parts basic catalyst and
The deionized water of 1~10 mass parts, 50~160 DEG C of 3~6h of polymerization reaction；
Preferably, the end-capping reagent is hexamethyldisiloxane, tetramethyl divinyl disiloxane, tetramethyl dihydro
At least one of base disiloxane；The esters of silicon acis is methyl orthosilicate, ethyl orthosilicate, positive silicic acid propyl ester, positive silicic acid
At least one of butyl ester, ethyl polysilicate；The alcohol be methanol, ethyl alcohol, isopropanol, n-butanol, in isobutanol at least
It is a kind of；The organosilicon small-molecule substance is organosilicon ring body DMC, D4, vinyl ring body, at least one in linear silicone oils
Kind；The basic catalyst is at least one of NaOH, KOH, tetramethylammonium hydroxide.
Preferably, the viscosity of the containing hydrogen silicone oil is 100~500mPa.s, the mass percentage of hydrogen is 0.01%~
1.6%。
Preferably, the modified filler is modified spherical aluminium oxide, modified oxidized magnesium, modified silicon carbide, modified Nano
Zinc oxide, modified spherical boron nitride, mixture composed by least two in modified aluminium nitride.
Preferably, the partial size of the modified spherical aluminium oxide is 2~90 μm.
Preferably, the average grain diameter of the modified oxidized magnesium is less than 2 μm.
Preferably, the partial size of the modification silicon carbide is 0.2~2.4 μm.
Preferably, the partial size of the modified nano zinc oxide is 1~100nm.
Preferably, the modified spherical boron nitride partial size is 5~20 μm.
Preferably, the partial size of the modification aluminium nitride is 1.2~1.6 μm.
Preferably, the fire retardant is inorganic fire retardants.
It is further preferred that the fire retardant is zinc borate, aluminium hydroxide, magnesium hydroxide, at least one in antimony oxide
Kind.
Preferably, the catalyst is platinum catalyst.
Preferably, the concentration of the platinum catalyst is 1000~5000ppm.
The preparation method of the above-mentioned dielectric resilience silica gel pad with special adhesive property, comprising the following steps:
1) prepared by base-material: ethenyl blocking phenyl silicone oil, liquid silicone, modified filler and fire retardant being added and mediated
Machine is added containing hydrogen silicone oil and catalyst after mediating uniformly, mediates 2~4h, obtain base-material；
2) deaeration: 0.5~1h is vacuumized when mediating；
3) vulcanize: roll squeezer is added in the material for carrying out deaeration processing, certain thickness gasket is pressed into, is placed in 100
10~20min is toasted in~150 DEG C of baking ovens, obtains the dielectric resilience silica gel pad with special adhesive property.
The present invention will be further explained combined with specific embodiments below and explanation.
Embodiment 1:
A kind of dielectric resilience silica gel pad with special adhesive property, is prepared according to the following steps:
1) the ethenyl blocking methyl phenyl silicone oil by 60 mass parts viscosity for 300mPa.s, 15 mass parts liquid silicon trees
Modified spherical aluminium oxide that modified spherical aluminium oxide that rouge, 200 mass parts partial sizes are 10 μm, 200 mass parts partial sizes are 40 μm,
150 mass parts partial sizes are 90 μm of modified spherical aluminium oxide, 100 mass parts modified spherical boron nitride, 150 mass parts modified Nano oxygen
Kneader is added in the zinc borate for changing zinc and 50 mass parts, mediates and uniformly adds the Silicon Containing Hydrogen that 4 mass parts hydrogen contents are 0.3%
The platinum catalyst that the containing hydrogen silicone oil and 0.4 mass parts concentration that oil, 10 mass parts hydrogen contents are 0.06% are 2000ppm, is mediated
3h obtains base-material；
2) the vacuumizing and defoaming 1h when mediating；
3) base-material for having taken off bubble is placed between two panels release film, the gasket of 2mm thickness is pressed into roll squeezer, is placed in
15min is toasted in 120 DEG C of baking ovens, obtains the dielectric resilience silica gel pad with special adhesive property.
Cohesive force test: the dielectric resilience silica gel pad with special adhesive property that specification is 10cm × 10cm is sticked at
On plate, tensile test is carried out after 20min, measuring pulling force is 3g, carries out tensile test after 48 hours again, and measuring pulling force is 33g.
Embodiment 2:
A kind of dielectric resilience silica gel pad with special adhesive property, is prepared according to the following steps:
1) the ethenyl blocking methyl phenyl silicone oil by 30 mass parts viscosity for 300mPa.s, 10 mass parts liquid silicon trees
Modified spherical aluminium oxide that modified spherical aluminium oxide that rouge, 100 mass parts partial sizes are 10 μm, 100 mass parts partial sizes are 40 μm,
150 mass parts partial sizes are 90 μm of modified spherical aluminium oxide, 100 mass parts modified spherical boron nitride, 50 mass parts modified Nano oxygen
Kneader is added in the aluminium hydroxide for changing zinc and 10 mass parts, mediates and uniformly adds the Silicon Containing Hydrogen that 4 mass parts hydrogen contents are 0.3%
The platinum catalyst that the containing hydrogen silicone oil and 0.1 mass parts concentration that oil, 20 mass parts hydrogen contents are 0.06% are 2000ppm, is mediated
2h obtains base-material；
2) the vacuumizing and defoaming 0.5h when mediating；
3) base-material for having taken off bubble is placed between two panels release film, the gasket of 2mm thickness is pressed into roll squeezer, is placed in
20min is toasted in 100 DEG C of baking ovens, obtains the dielectric resilience silica gel pad with special adhesive property.
Cohesive force test: the dielectric resilience silica gel pad with special adhesive property that specification is 10cm × 10cm is sticked at
On plate, tensile test is carried out after 20min, measuring pulling force is 1.5g, carries out tensile test after 48 hours again, measuring pulling force is
30g。
Embodiment 3:
A kind of dielectric resilience silica gel pad with special adhesive property, is prepared according to the following steps:
1) the ethenyl blocking methyl phenyl silicone oil by 80 mass parts viscosity for 300mPa.s, 30 mass parts liquid silicon trees
Modified spherical aluminium oxide that modified spherical aluminium oxide that rouge, 300 mass parts partial sizes are 10 μm, 200 mass parts partial sizes are 40 μm,
180 mass parts partial sizes are 90 μm of modified spherical aluminium oxide, 120 mass parts modified spherical boron nitride, 200 mass parts modified Nano oxygen
Kneader is added in the magnesium hydroxide for changing zinc and 90 mass parts, mediates uniformly, add 10 mass parts hydrogen contents be 0.3% it is hydrogeneous
The platinum catalyst that the containing hydrogen silicone oil and 0.8 mass parts concentration that silicone oil, 20 mass parts hydrogen contents are 0.06% are 2000ppm is mediated
4h obtains base-material；
2) the vacuumizing and defoaming 1h when mediating；
3) base-material for having taken off bubble is placed between two panels release film, the gasket of 2mm thickness is pressed into roll squeezer, is placed in
10min is toasted in 150 DEG C of baking ovens, obtains the dielectric resilience silica gel pad with special adhesive property.
Cohesive force test: the dielectric resilience silica gel pad with special adhesive property that specification is 10cm × 10cm is sticked at
On plate, tensile test is carried out after 20min, measuring pulling force is 2g, carries out tensile test after 48 hours again, and measuring pulling force is 35g.
Embodiment 4:
A kind of dielectric resilience silica gel pad with special adhesive property, is prepared according to the following steps:
1) the ethenyl blocking methyl phenyl silicone oil by 50 mass parts viscosity for 1000mPa.s, 20 mass parts liquid silicon trees
Rouge, the modified spherical aluminium oxide that 200 mass parts partial sizes are 50 μm, 200 mass parts modified silicon carbide, 150 mass parts modified Nanos
Kneader is added in the aluminium hydroxide of zinc oxide, 150 mass parts modified spherical boron nitride and 30 mass parts, mediates uniformly, adds 5
The containing hydrogen silicone oil and 0.5 mass parts concentration that containing hydrogen silicone oil that mass parts hydrogen content is 1.5%, 5 mass parts hydrogen contents are 0.01% be
The platinum catalyst of 3000ppm mediates 2.5h, obtains base-material；
2) the vacuumizing and defoaming 1h when mediating；
3) base-material for having taken off bubble is placed between two panels release film, the gasket of 2mm thickness is pressed into roll squeezer, is placed in
15min is toasted in 150 DEG C of baking ovens, obtains the dielectric resilience silica gel pad with special adhesive property.
Cohesive force test: the dielectric resilience silica gel pad with special adhesive property that specification is 10cm × 10cm is sticked at
On plate, tensile test is carried out after 20min, measuring pulling force is 2.5g, carries out tensile test after 48 hours again, measuring pulling force is
32g。
Embodiment 5:
A kind of dielectric resilience silica gel pad with special adhesive property, is prepared according to the following steps:
1) the ethenyl blocking methyl phenyl silicone oil by 70 mass parts viscosity for 3000mPa.s, 15 mass parts liquid silicon trees
The modified carbonization of the modified spherical aluminium oxide, the modified oxidized magnesium of 200 mass parts, 200 mass parts that rouge, 350 mass parts partial sizes are 10 μm
Kneader is added in the modified aluminium nitride of silicon, 200 mass parts and the magnesium hydroxide of 30 mass parts and the zinc borate of 40 mass parts, mediates equal
It is even, add the containing hydrogen silicone oil and 0.3 that containing hydrogen silicone oil, 20 mass parts hydrogen contents that 20 mass parts hydrogen contents are 0.3% are 0.06%
Mass parts concentration is the platinum catalyst of 2000ppm, mediates 4h, obtains base-material；
2) the vacuumizing and defoaming 1h when mediating；
3) base-material for having taken off bubble is placed between two panels release film, the gasket of 2mm thickness is pressed into roll squeezer, is placed in
10min is toasted in 130 DEG C of baking ovens, obtains the dielectric resilience silica gel pad with special adhesive property.
Cohesive force test: the dielectric resilience silica gel pad with special adhesive property that specification is 10cm × 10cm is sticked at
On plate, tensile test is carried out after 20min, measuring pulling force is 1g, carries out tensile test after 48 hours again, and measuring pulling force is 30g.
Comparative example:
A kind of common silica gel pad, is prepared according to the following steps:
1) 80 mass parts viscosity are modified oxidized for the ethenyl blocking methyl phenyl silicone oil of 300mPa.s, 420 mass parts
Kneader is added in aluminium, 380 mass parts modified zinc oxides, mediates and uniformly adds the Silicon Containing Hydrogen that 10 mass parts hydrogen contents are 0.15%
The platinum catalyst that oil and 0.3 mass parts concentration are 5000ppm, mediates 3h, obtains base-material；
2) the vacuumizing and defoaming 1h when mediating；
3) base-material for having taken off bubble is placed between two panels release film, the gasket of 2mm thickness is pressed into roll squeezer, is placed in
10min is toasted in 120 DEG C of baking ovens, obtains the dielectric resilience silica gel pad with special adhesive property.
Cohesive force test: the dielectric resilience silica gel pad with special adhesive property that specification is 10cm × 10cm is sticked at
On plate, carry out tensile test after 0 hour, 12 hours, 24 hours, 48 hours, the pulling force measured be followed successively by 30g,
30g、32g、30g。
The above embodiment is a preferred embodiment of the present invention, but embodiments of the present invention are not by above-described embodiment
Limitation, other any changes, modifications, substitutions, combinations, simplifications made without departing from the spirit and principles of the present invention,
It should be equivalent substitute mode, be included within the scope of the present invention.
Claims (10)
1. a kind of dielectric resilience silica gel pad with special adhesive property, it is characterised in that: its by following mass parts raw material
It is prepared:
Ethenyl blocking phenyl silicone oil: 30~80 parts；
Liquid silicone: 10~30 parts；
Containing hydrogen silicone oil: 6~40 parts；
Modified filler: 500~1000 parts；
Fire retardant: 10~90 parts；
Catalyst: 0.1~0.8 part.
2. the dielectric resilience silica gel pad according to claim 1 with special adhesive property, it is characterised in that: described
Ethenyl blocking phenyl silicone oil is ethenyl blocking methyl phenyl silicone oil, ethenyl blocking trifluoro propyl phenyl silicone oil, vinyl
Block at least one of diphenyl silicone oil.
3. the dielectric resilience silica gel pad according to claim 2 with special adhesive property, it is characterised in that: described
Ethenyl blocking phenyl silicone oil is ethenyl blocking methyl phenyl silicone oil.
4. the dielectric resilience silica gel pad according to claim 1 with special adhesive property, it is characterised in that: described
Liquid silicone is prepared by the following method to obtain:
1) alcohol of the end-capping reagent of 90~150 mass parts, the deionized water of 80~250 mass parts and 10~100 mass parts is added
Reactor, control pH value are 1~2,30~120 DEG C and are stirred to react 20~40min；
2) esters of silicon acis of 300~1000 mass parts is added, 30~120 DEG C are stirred to react 3~10h；
3) product of step 2 is cooled to room temperature, adds the organosilicon small-molecule substance of 200~1000 mass parts, extracted,
It stands, layering excludes sour water layer, obtains hydrolysate；
4) washing hydrolysis product removes moisture removal to neutrality, be then added 0.002~0.05 mass parts basic catalyst and 1~
The deionized water of 10 mass parts, 50~160 DEG C of 3~6h of polymerization reaction；
The end-capping reagent is hexamethyldisiloxane, tetramethyl divinyl disiloxane, two hydrogen-based disiloxane of tetramethyl
At least one of；The esters of silicon acis is methyl orthosilicate, ethyl orthosilicate, positive silicic acid propyl ester, butyl silicate, polysilicon acid
At least one of ethyl ester；The alcohol is at least one of methanol, ethyl alcohol, isopropanol, n-butanol, isobutanol；Described
Organosilicon small-molecule substance is at least one of organosilicon ring body DMC, D4, vinyl ring body, linear silicone oils；The alkalinity
Catalyst is at least one of NaOH, KOH, tetramethylammonium hydroxide.
5. the dielectric resilience silica gel pad according to claim 1 with special adhesive property, it is characterised in that: described
The viscosity of containing hydrogen silicone oil is 100~500mPa.s, and the mass percentage of hydrogen is 0.01%~1.6%.
6. the dielectric resilience silica gel pad according to claim 1 with special adhesive property, it is characterised in that: described
Modified filler be modified spherical aluminium oxide, modified oxidized magnesium, modified silicon carbide, modified nano zinc oxide, modified spherical boron nitride,
It is modified mixture composed by least two in aluminium nitride.
7. the dielectric resilience silica gel pad according to claim 6 with special adhesive property, it is characterised in that: described
The partial size of modified spherical aluminium oxide is 2~90 μm；The average grain diameter of the modified oxidized magnesium is less than 2 μm；The carbon modified
The partial size of SiClx is 0.2~2.4 μm；The partial size of the modified nano zinc oxide is 1~100nm；The modified spherical nitrogen
Changing boron partial size is 5~20 μm；The partial size of the modification aluminium nitride is 1.2~1.6 μm.
8. the dielectric resilience silica gel pad according to claim 1 with special adhesive property, it is characterised in that: described
Fire retardant is inorganic fire retardants.
9. the dielectric resilience silica gel pad according to claim 1 with special adhesive property, it is characterised in that: described
Catalyst is platinum catalyst.
10. the preparation side of the dielectric resilience silica gel pad described in any one of claim 1~9 with special adhesive property
Method, it is characterised in that: the following steps are included:
1) prepared by base-material: kneader is added in ethenyl blocking phenyl silicone oil, liquid silicone, modified filler and fire retardant, is pinched
Containing hydrogen silicone oil and catalyst is added after closing uniformly, mediates 2~4h, obtains base-material；
2) deaeration: 0.5~1h is vacuumized when mediating；
3) vulcanize: roll squeezer is added in the material for carrying out deaeration processing, certain thickness gasket is pressed into, is placed in 100~150
10~20min is toasted in DEG C baking oven, obtains the dielectric resilience silica gel pad with special adhesive property.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610702604.XA CN106317900B (en) | 2016-08-22 | 2016-08-22 | A kind of dielectric resilience silica gel pad and preparation method thereof with special adhesive property |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610702604.XA CN106317900B (en) | 2016-08-22 | 2016-08-22 | A kind of dielectric resilience silica gel pad and preparation method thereof with special adhesive property |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106317900A CN106317900A (en) | 2017-01-11 |
| CN106317900B true CN106317900B (en) | 2019-04-02 |
Family
ID=57741324
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610702604.XA Active CN106317900B (en) | 2016-08-22 | 2016-08-22 | A kind of dielectric resilience silica gel pad and preparation method thereof with special adhesive property |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106317900B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108963316A (en) * | 2018-09-14 | 2018-12-07 | 扬州江淮轻型汽车有限公司 | The manufacturing method of battery pack and the battery thermostat for using battery pack |
| CN110684359A (en) * | 2019-10-28 | 2020-01-14 | 深圳市傲川科技有限公司 | Silica gel gasket and preparation method thereof |
| CN114836041B (en) * | 2022-06-15 | 2024-05-07 | 山东泰开电器绝缘有限公司 | Composite insulator rubber compound and preparation method and application thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103665882A (en) * | 2012-09-19 | 2014-03-26 | 浙江三元电子科技有限公司 | Heat conduction silicon rubber composite material, heat conduction silicon sheet and preparation method of heat conduction silicon sheet |
| CN103756327A (en) * | 2013-11-07 | 2014-04-30 | 杭州硅畅科技有限公司 | Heat-conducting silicone rubber electronic casting glue and preparation method and application thereof |
| CN104788969A (en) * | 2015-04-21 | 2015-07-22 | 深圳市安品有机硅材料有限公司 | Organosilicone heat conduction insulating composition and heat conduction insulating material |
| CN105419343A (en) * | 2015-12-18 | 2016-03-23 | 广州市白云化工实业有限公司 | Printable or dispensing heat conducting gasket and preparing method thereof |
-
2016
- 2016-08-22 CN CN201610702604.XA patent/CN106317900B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103665882A (en) * | 2012-09-19 | 2014-03-26 | 浙江三元电子科技有限公司 | Heat conduction silicon rubber composite material, heat conduction silicon sheet and preparation method of heat conduction silicon sheet |
| CN103756327A (en) * | 2013-11-07 | 2014-04-30 | 杭州硅畅科技有限公司 | Heat-conducting silicone rubber electronic casting glue and preparation method and application thereof |
| CN104788969A (en) * | 2015-04-21 | 2015-07-22 | 深圳市安品有机硅材料有限公司 | Organosilicone heat conduction insulating composition and heat conduction insulating material |
| CN105419343A (en) * | 2015-12-18 | 2016-03-23 | 广州市白云化工实业有限公司 | Printable or dispensing heat conducting gasket and preparing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106317900A (en) | 2017-01-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106751904B (en) | Heat-conducting organic silicon gel and preparation method thereof | |
| CN106317900B (en) | A kind of dielectric resilience silica gel pad and preparation method thereof with special adhesive property | |
| CN103665882B (en) | A kind of thermally conductive silicone rubber composite material, heat-conducting silica gel sheet and preparation method thereof | |
| CN103059576B (en) | High-heat-conductivity flexible silica gel gasket and preparation method thereof | |
| CN104813758B (en) | Heat-radiating structure | |
| CN103756631A (en) | Double-component self-adhesive addition type flame retardant heat conducting room temperature curing organic silicon pouring sealant | |
| CN107091392B (en) | Insulation and its manufacturing method | |
| CN103030976A (en) | Single-component heat-curing liquid silicone rubber and preparation method thereof | |
| CN106633914A (en) | Muddy heat-conducting interface shimming material and preparation method thereof | |
| CN109971415B (en) | High-thermal-conductivity organic silicon adhesive and preparation method thereof | |
| CN104015433A (en) | Thermal conductivity composite silicone rubber sheet | |
| CN106190015B (en) | A kind of no-solvent type organosilicon coating glue and preparation method thereof | |
| CN104031604A (en) | Organic silicon pouring sealant with thixotropy | |
| WO2013191116A1 (en) | Method of forming thermal interface material and heat dissipation structure | |
| CN106893563A (en) | Heat conductive silica gel composition and heat conductive silica gel material and heat-conducting silica gel sheet and preparation method thereof | |
| CN101928462A (en) | Acetone-removing silicon rubber and preparation method thereof | |
| CN108949056A (en) | A kind of preparation method of heat-conducting interface material and products thereof | |
| JP2015013927A (en) | Moisture-curable resin composition and heat conduction sheet | |
| WO2019216190A1 (en) | Heat-conductive sheet, mounting method using same and bonding method using same | |
| CN113563721A (en) | High-tear-strength heat-conducting silica gel material and preparation method thereof | |
| KR20150108346A (en) | Base material particle, conductive particle, conductive material, and connection structure | |
| CN102277128A (en) | Conductive silicone rubber adhesive moulded on-site at room temperature and application method | |
| TWI698519B (en) | Thermally conductive sheet and manufacturing method thereof | |
| CN105838077A (en) | Surface treatment method of graphene used for producing heat conducting silicon sheets | |
| JP5773160B2 (en) | Moisture or oxygen scavenging composition, cured body, and electronic device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |