CN105419343A - Printable or dispensing heat conducting gasket and preparing method thereof - Google Patents
Printable or dispensing heat conducting gasket and preparing method thereof Download PDFInfo
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- CN105419343A CN105419343A CN201510965054.6A CN201510965054A CN105419343A CN 105419343 A CN105419343 A CN 105419343A CN 201510965054 A CN201510965054 A CN 201510965054A CN 105419343 A CN105419343 A CN 105419343A
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- heat
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- conducting pad
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- 238000000034 method Methods 0.000 title abstract description 5
- 239000000463 material Substances 0.000 claims abstract description 40
- -1 polysiloxane Polymers 0.000 claims abstract description 38
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 28
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 27
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 27
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 24
- 239000001257 hydrogen Substances 0.000 claims abstract description 24
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 23
- 229920002545 silicone oil Polymers 0.000 claims abstract description 18
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 14
- 239000003054 catalyst Substances 0.000 claims abstract description 12
- 239000003112 inhibitor Substances 0.000 claims abstract description 11
- 239000003292 glue Substances 0.000 claims description 29
- 239000002994 raw material Substances 0.000 claims description 19
- 150000002431 hydrogen Chemical class 0.000 claims description 17
- 238000002360 preparation method Methods 0.000 claims description 15
- 239000011231 conductive filler Substances 0.000 claims description 13
- 239000000203 mixture Substances 0.000 claims description 13
- 239000003795 chemical substances by application Substances 0.000 claims description 12
- 125000000217 alkyl group Chemical group 0.000 claims description 10
- 239000007822 coupling agent Substances 0.000 claims description 10
- 238000004381 surface treatment Methods 0.000 claims description 10
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 8
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 6
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 6
- 238000002156 mixing Methods 0.000 claims description 6
- 238000007711 solidification Methods 0.000 claims description 6
- 230000008023 solidification Effects 0.000 claims description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims description 5
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 5
- 238000007665 sagging Methods 0.000 claims description 5
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 4
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 4
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 4
- 239000011787 zinc oxide Substances 0.000 claims description 4
- 229910052582 BN Inorganic materials 0.000 claims description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 3
- 239000004215 Carbon black (E152) Substances 0.000 claims description 3
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 claims description 3
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 3
- 125000003118 aryl group Chemical group 0.000 claims description 3
- 125000000753 cycloalkyl group Chemical group 0.000 claims description 3
- 125000003700 epoxy group Chemical group 0.000 claims description 3
- 229930195733 hydrocarbon Natural products 0.000 claims description 3
- 238000007639 printing Methods 0.000 claims description 3
- 125000002769 thiazolinyl group Chemical group 0.000 claims description 3
- SAMJGBVVQUEMGC-UHFFFAOYSA-N 1-ethenoxy-2-(2-ethenoxyethoxy)ethane Chemical compound C=COCCOCCOC=C SAMJGBVVQUEMGC-UHFFFAOYSA-N 0.000 claims description 2
- LSWYGACWGAICNM-UHFFFAOYSA-N 2-(prop-2-enoxymethyl)oxirane Chemical compound C=CCOCC1CO1 LSWYGACWGAICNM-UHFFFAOYSA-N 0.000 claims description 2
- 229910017083 AlN Inorganic materials 0.000 claims description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 2
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 2
- 125000004183 alkoxy alkyl group Chemical group 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- 239000004411 aluminium Substances 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 239000012467 final product Substances 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 2
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 2
- 238000007649 pad printing Methods 0.000 claims 6
- 238000010438 heat treatment Methods 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000011248 coating agent Substances 0.000 abstract description 3
- 238000000576 coating method Methods 0.000 abstract description 3
- 239000002699 waste material Substances 0.000 abstract description 3
- 239000003431 cross linking reagent Substances 0.000 abstract 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 abstract 1
- 238000011056 performance test Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 5
- 230000000704 physical effect Effects 0.000 description 5
- 238000012360 testing method Methods 0.000 description 4
- 238000004026 adhesive bonding Methods 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 230000002787 reinforcement Effects 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a printable or dispensing heat conducting gasket and a preparing method thereof, wherein the printable or dispensing heat conducting gasket is prepared from a component A and a component B in a weight ratio of 1:1. The component A is prepared from base materials, a crosslinking agent containing hydrogen silicone oil and a curing inhibitor. The component B is prepared from base materials and platinum complex catalyst. The base materials are prepared from vinyl polysiloxane with a formula Vi-[(R1)(R2)SiO]n-[Via(R1)a-aSiO]m-Si(OR3)2-Vi and heating conducting padding. The heat conducting gasket can be used for coating through a screen print process and a dispensing device, not only can a cured material thickness be controlled by dispensing amount, but also site curing on a base material of a complex shape can be realized, thus greatly improving production efficiency, reducing unnecessary waste, having good compressibility and adhesion and effectively reducing a contact heat resistance of an interface.
Description
Technical field
The invention belongs to thermally conductive material technical field, particularly relate to one and can print or put glue formula heat-conducting pad and preparation method thereof.
Background technology
Along with the continuous propelling of electron trade device miniaturization and ultrathin, framework tightens and design space limits the application of large-scale thermal component, therefore it also improves day by day to the requirement of heat conducting material.Heat-conducting pad is mainly used in filling the gap between Heating element and thermal component, reduces the thermal contact resistance of interface, also has the effects such as insulation, damping, protection concurrently simultaneously.
The existing more disclosure of relevant heat-conducting pad and preparation method thereof, these heat-conducting pads or similar composition have been cured as the flaky material of series specification thickness when using, if device pitch does not meet these set gauge thickness, then need to customize, which has limited the handiness in application.
In addition, need during these materials'uses to carry out cutting, with the surface making its shape size meet corresponding base material, this not only reduces production efficiency, and the remaining scrap stock of cutting are also difficult to reclaim, and result in unnecessary waste.
In some heat-conducting pads or composition, in order to the physicals of reinforced gasket, need to use and be coated with the glasscloth of heat conducting coating or polymeric film carries out reinforcement; In other heat-conducting pads or composition, also need to use gum to carry out the adhesivity of reinforced gasket to base material; These technical schemes make the heat transfer property of heat-conducting pad or composition be very limited.
Summary of the invention
Based on this, the object of the invention is to the defect overcoming above-mentioned prior art, provide a kind of and print or the heat-conducting pad and preparation method thereof of some glue formula.
In order to realize foregoing invention object, this invention takes following technical scheme:
Print or the heat-conducting pad of some glue formula, it is that the component A of 1:1 and B component are prepared and obtained by weight ratio,
Described component A is prepared by the raw material of following weight part:
Base-material 100 parts
Containing hydrogen silicone oil linking agent 15-50 part
Curing inhibitors 0.002-0.05 part;
Described B component is prepared by the raw material of following weight part:
Base-material 100 parts
Platinum complex catalyst 0.5-2 part;
Base-material in above-mentioned component A and B component is prepared by the raw material of following weight part:
Vinyl polysiloxane 100 parts
Heat conductive filler 500-1500 part;
Described vinyl polysiloxane, has the structural formula such as formula (1)
Vi-[(R
1)(R
2)SiO]
n-[Vi
a(R
1)
2-aSiO]
m-Si(OR
3)
2-Vi(1)
Wherein, Vi is vinyl, R
1, R
2, R
3for the monovalent hydrocarbon radical be not substituted or replace, R
1, R
2, R
3identical or different; N and m is the integer of 5 to 100; A is the integer of 0-2.
Wherein in some embodiments, R
1and R
3be respectively the straight chained alkyls such as methyl, ethyl, propyl group, hexyl, octyl group or dodecyl; The branched-chain alkyls such as sec.-propyl, isobutyl-, the tertiary butyl or 2-ethylhexyl; The alkoxyalkyl such as methoxy ethyl or methoxy-propyl; R
2for straight chained alkyl, branched-chain alkyl, cycloalkyl, thiazolinyl, aryl, aralkyl, epoxy group(ing), as straight chained alkyls such as methyl, ethyl, propyl group, hexyl, octyl group or dodecyls; The branched-chain alkyls such as sec.-propyl, isobutyl-, the tertiary butyl or 2-ethylhexyl; The cycloalkyl such as cyclopentyl or cyclohexyl; The thiazolinyl such as vinyl or allyl group; The aryl such as phenyl or tolyl; The aralkyl such as 2-phenylethyl or 2-methyl-2-phenylethyl; The epoxy group(ing) such as 2,3-epoxypropoxy.
Wherein in some embodiments, R
1and R
3be respectively methyl or ethyl, R
2for methyl, octyl group or dodecyl.
Wherein in some embodiments, described heat conductive filler is the zinc oxide through coupling agent surface treatment, aluminum oxide, aluminium nitride, boron nitride, silicon carbide, one or more in silicon nitride and aluminium powder of median size 0.1-25 μm; The present invention does not limit the kind of coupling agent and surface treatment method, conventional coupling agent and surface treatment method all applicable.
Wherein in some embodiments, described containing hydrogen silicone oil linking agent be end containing hydrogen silicone oil and sagging chain containing hydrogen silicone oil in one or both, the hydrogen content of described containing hydrogen silicone oil linking agent is 0.1-1mmol/g.
Wherein in some embodiments, described curing inhibitors is 1-ethynyl-1-hexalin, 2-methyl-3-butynyl-2-alcohol, 2-methyl isophthalic acid-hexin base-3-alcohol, 3,5-dimethyl-1-hexin base-3-alcohol, 3, one or more in 7,11-trimethylammonium-1-dodecyne base-3-alcohol, toxilic acid divinyl propyl ester, glycidyl allyl ether and diethylene glycol divinyl ether.
Wherein in some embodiments, described platinum complex catalyst is the vinylsiloxane complex compound of Platinic chloride, and the platinum content of described platinum complex catalyst is 3000-5000ppm.
Present invention also offers above-mentioned printing or the preparation method of heat-conducting pad of some glue formula, take following technical scheme:
Print or the preparation method of heat-conducting pad of some glue formula, comprise the following steps:
(1), add in stirrer by vinyl polysiloxane and heat conductive filler, at 120-180 DEG C, vacuum mixing 2-4h, is made into base-material;
(2), at normal temperatures, in the base-material that step (1) is obtained, add containing hydrogen silicone oil linking agent and curing inhibitors, in stirrer, mix obtained component A;
(3), at normal temperatures, in the base-material that step (1) is obtained, add platinum complex catalyst, in stirrer, mix obtained B component;
(4), at normal temperatures, component A and the B component of the weight such as to get mix, and remove bubble in a vacuum, under room temperature or heating condition, are solidified by silk screen printing or spot gluing equipment at substrate surface, to obtain final product.
Compared with prior art, one of the present invention can be printed or put glue formula heat-conducting pad and preparation method thereof and be had the following advantages and beneficial effect:
1, heat-conducting pad of the present invention, the component A before its solidification and B component viscosity at 25 DEG C are 100-350P; After component A mixes with B component, at 25 DEG C, viscosity is 150-400P, this can be coated with by silk screen printing or spot gluing equipment before this heat-conducting pad is solidified, not only control the material thickness after solidification by resin added, can also on the base material of complicated shape cured in place, substantially increase production efficiency, decrease unnecessary waste;
2, heat-conducting pad of the present invention is owing to having the vinyl polysiloxane of special construction, the vinyl polysiloxane of this structure has certain alkoxy base, good adhesivity is had to various base material, therefore do not need to use gum, the vinyl polysiloxane of this special construction does not need to use the glasscloth that is coated with heat conducting coating or polymeric film to carry out reinforcement after hardening can obtain good physicals; Also there is good heat conductivility and compressible performance, effectively can reduce the thermal contact resistance of contact interface, can be applicable to the electronics/communication products higher to cooling requirements;
3, the preparation method of heat-conducting pad of the present invention is simple to operation, is applicable to scale operation.
Embodiment
For a better understanding of the present invention; below by embodiment, elaboration concrete is further done to the present invention; but it is unintelligible for define of the present invention; for some nonessential improvement and adjustment that those skilled in the art does according to foregoing invention content, also should be considered as dropping in protection scope of the present invention.
Except specified otherwise, the raw material used in following examples all derives from commercially available.
Embodiment 1
The present embodiment a kind of prints or the heat-conducting pad of some glue formula, and it is that the component A of 1:1 and B component are prepared and obtained by weight ratio,
Described component A is prepared by the raw material of following weight part:
Base-material 100 parts
Hydrogen content is the sagging chain containing hydrogen silicone oil linking agent 15 parts of 1mmol/g
1-ethynyl-1-hexalin (curing inhibitors) 0.002 part;
Described B component is prepared by the raw material of following weight part:
Base-material 100 parts
The vinylsiloxane complex compound catalyst (platinum content is 3000ppm) 0.5 part of Platinic chloride;
Base-material in above-mentioned component A and B component is prepared by the raw material of following weight part:
Vinyl polysiloxane 100 parts
Through 500 parts, the aluminum oxide (heat conductive filler) of coupling agent surface treatment;
Wherein, described vinyl polysiloxane, has the structural formula of general formula (2)
Vi-[(CH
3)
2SiO]
40-[(CH
3)
2SiO]
60-Si(OCH
3)
2-Vi(2)
The present embodiment a kind of prints or the preparation method of heat-conducting pad of some glue formula, comprises the following steps:
(1), by 100 weight part structures such as formula the vinyl polysiloxane of (2) and the 500 weight parts aluminum oxide (median size 5 μm through coupling agent surface treatment, heat conductive filler) add in stirrer, at 150 DEG C, vacuum mixing 3h, is made into base-material;
(2), at normal temperatures, be the sagging chain containing hydrogen silicone oil linking agent of 1mmol/g, 0.002 weight part curing inhibitors 1-ethynyl-1-hexalin and 100 weight part base-materials by 15 weight part hydrogen contents, in stirrer, mix obtained component A;
(3), at normal temperatures, be vinylsiloxane complex compound catalyst 0.5 weight part and the 100 weight part base-materials of the Platinic chloride of 3000ppm by platinum content, in stirrer, mix obtained B component;
(4), at normal temperatures, component A and the B component of the weight such as to get at room temperature are mixed by static mixing syringe, remove bubble in a vacuum, obtain can printing or some glue formula heat-conducting pad after solidification, and the performance test results is as shown in table 1.
Embodiment 2
The present embodiment a kind of prints or the heat-conducting pad of some glue formula, and it is that the component A of 1:1 and B component are prepared and obtain by weight ratio, and described component A and B component form with embodiment 1, and wherein base-material is prepared by the raw material of following weight part:
Vinyl polysiloxane 100 parts
Through 330 parts, the zinc oxide (heat conductive filler, median size 0.6 μm) of coupling agent surface treatment
Through 670 parts, the zinc oxide (heat conductive filler, median size 7.2 μm) of coupling agent surface treatment;
Wherein, described vinyl polysiloxane, has the structural formula of general formula (3)
Vi-[(CH
3)
2SiO]
50-[Vi(CH
3)SiO]
20-Si(OCH
3)
2-Vi(3)
The present embodiment a kind of print or the preparation method of heat-conducting pad of some glue formula with embodiment 1, the performance test results is as shown in table 1.
Embodiment 3
The present embodiment a kind of prints or the heat-conducting pad of some glue formula, and it is that the component A of 1:1 and B component are prepared and obtain by weight ratio, and described B component forms with embodiment 1,
Described component A is prepared by the raw material of following weight part:
Wherein base-material is prepared by the raw material of following weight part:
Wherein, described vinyl polysiloxane, has the structural formula of general formula (4)
Vi-[(CH
3)(C
8H
17)SiO]
5-[(CH
3)
2SiO]
35-Si(OCH
3)
2-Vi(4)
The present embodiment a kind of print or the preparation method of heat-conducting pad of some glue formula with embodiment 1, the performance test results is as shown in table 1.
Embodiment 4
The present embodiment a kind of prints or the heat-conducting pad of some glue formula, and it is that the component A of 1:1 and B component are prepared and obtained by weight ratio,
Described component A is prepared by the raw material of following weight part:
Base-material 100 parts
Hydrogen content is the sagging chain containing hydrogen silicone oil linking agent 15 parts of 1mmol/g
3,5-dimethyl-1-hexin base-3-alcohol (curing inhibitors) 0.005 part;
Described B component is prepared by the raw material of following weight part:
Base-material 100 parts,
The vinylsiloxane complex compound catalyst (platinum content 5000ppm) 1.5 parts of Platinic chloride;
Wherein base-material is prepared by the raw material of following weight part:
Wherein, described vinyl polysiloxane, has the structural formula of general formula (4)
Vi-[(CH
3)(C
8H
17)SiO]
5-[(CH
3)
2SiO]
35-Si(OCH
3)
2-Vi(4)
The present embodiment a kind of print or the preparation method of heat-conducting pad of some glue formula with embodiment 1, the performance test results is as shown in table 1.
Embodiment 5
The present embodiment a kind of prints or the heat-conducting pad of some glue formula, and it is that the component A of 1:1 and B component are prepared and obtain by weight ratio, and described B component forms with embodiment 1,
Wherein component A is prepared by the raw material of following weight part:
Base-material 100 parts
Hydrogen content is the end containing hydrogen silicone oil 50 parts of 0.35mmol/g
Toxilic acid divinyl propyl ester (curing inhibitors) 0.002 part;
Above-mentioned base-material is prepared by the raw material of following weight part:
Vinyl polysiloxane 100 parts
Through 200 parts, the aluminum oxide (heat conductive filler, median size 2.5 μm) of coupling agent surface treatment
Through the boron nitride (heat conductive filler, median size 12 μm) 600 parts of coupling agent surface treatment;
Wherein, described vinyl polysiloxane, has the structural formula of general formula (3)
Vi-[(CH
3)
2SiO]
50-[Vi(CH
3)SiO]
20-Si(OCH
3)
2-Vi(3)
The present embodiment a kind of print or the preparation method of heat-conducting pad of some glue formula with embodiment 1, the performance test results is as shown in table 1.
Embodiment 6
The present embodiment a kind of prints or the heat-conducting pad of some glue formula, and it is that the component A of 1:1 and B component are prepared and obtained by weight ratio,
Described component A is prepared by the raw material of following weight part:
The composition of described B component and base-material is with embodiment 4;
Unlike, the vinyl polysiloxane in described base-material, has the structural formula of general formula (5)
Vi-[(CH
3)(C
12H
25)SiO]
10-[(CH
3)
2SiO]
90-Si(OCH
3)
2-Vi(5)
The present embodiment a kind of print or the preparation method of heat-conducting pad of some glue formula with embodiment 1, the performance test results is as shown in table 1.
To embodiment 1 ~ 6 obtained print or some glue formula heat-conducting pad and two conventional heat-conducting pads solidified of existing typical case (comparative example 1 be the TP080 heat-conducting pad of Shenzhen Ao Chuan scientific & technical corporation production, comparative example 2 is the GapPadA3000 heat-conducting pad that Bei Gesi company of the U.S. produces) carry out performance test, testing method is as follows:
1, the viscosity measurement of component A and B component mixing front and back
Its viscosity of rotary viscosity design determining is used respectively when the component A obtain the step through above-described embodiment 1 ~ 6 and B component are at 25 DEG C.Component A and the B component of weight such as to get, at room temperature after mixing, reuse its viscosity 25 DEG C time of rotary viscosity design determining.
2, the performance test of heat-conducting pad
Obtained component A and B component are at room temperature mixed, is placed in vacuum and removes bubble, be then coated in smooth mould by silk screen printing or spot gluing equipment and be heating and curing, be made into sample.Sample is tested its thermal conductivity according to ASTMD5470, tests its hardness according to ASTMD2240, tests its tensile strength and elongation at break according to GB/T528-1998, is tested its tensile strength and elongation at break according to GB/T528-1998.Gained sample is vertically close on base material, tests its adhesivity, if sample after solidification 24h without landing, then explanation sample adhesion property meets service requirements.
The performance index of the heat-conducting pad of table 1 embodiment 1 ~ 6
As can be known from Table 1, although the typical thermal-conductive pad of comparative example 1 has reasonable physicals, heat conductivility is lower; The typical thermal-conductive pad thermal conductivity of comparative example 2 is higher, but physicals is poor, and glasscloth or polymeric film must be used to carry out reinforcement.The heat-conducting pad of these two comparative examples is all almost without any adhesivity.Embodiment 1-6 employs the vinyl polysiloxane of special construction, by kind and the proportioning of adjustment heat conductive filler particle, can obtain the heat-conducting pad of a series of thermal conductivity; By the adjustment structure of vinyl polysiloxane and the kind of containing hydrogen silicone oil linking agent and proportioning, the heat-conducting pad after solidification can be made to have good physicals, keep A simultaneously, B component has comparatively suitable viscosity.
The above embodiment only have expressed several embodiment of the present invention, and it describes comparatively concrete and detailed, but can not therefore be construed as limiting the scope of the patent.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (8)
1. can print or the heat-conducting pad of some glue formula, it is characterized in that, it is that the component A of 1:1 and B component are prepared and obtained by weight ratio,
Described component A is prepared by the raw material of following weight part:
Base-material 100 parts
Containing hydrogen silicone oil linking agent 15-50 part
Curing inhibitors 0.002-0.05 part;
Described B component is prepared by the raw material of following weight part:
Base-material 100 parts
Platinum complex catalyst 0.5-2 part;
Base-material in above-mentioned component A and B component is prepared by the raw material of following weight part:
Vinyl polysiloxane 100 parts
Heat conductive filler 500-1500 part;
Described vinyl polysiloxane, has the structural formula such as formula (1)
Vi-[(R
1)(R
2)SiO]
n-[Vi
a(R
1)
2-aSiO]
m-Si(OR
3)
2-Vi(1)
Wherein, Vi is vinyl, R
1, R
2, R
3for the monovalent hydrocarbon radical be not substituted or replace, R
1, R
2, R
3identical or different; N and m is the integer of 5 to 100; A is the integer of 0-2.
2. the heat-conducting pad printing or put glue formula according to claim 1, is characterized in that, described R
1and R
3be respectively straight chained alkyl, branched-chain alkyl or alkoxyalkyl; R
2for straight chained alkyl, branched-chain alkyl, cycloalkyl, thiazolinyl, aryl, aralkyl or epoxy group(ing).
3. the heat-conducting pad printing or put glue formula according to claim 2, is characterized in that, described R
1and R
3be respectively methyl or ethyl, R
2for methyl, octyl group or dodecyl.
4. the heat-conducting pad printing or put glue formula according to any one of claims 1 to 3, it is characterized in that, described heat conductive filler is the zinc oxide through coupling agent surface treatment, aluminum oxide, aluminium nitride, boron nitride, silicon carbide, one or more in silicon nitride and aluminium powder of median size 0.1-25 μm.
5. the heat-conducting pad printing or put glue formula according to any one of claims 1 to 3, it is characterized in that, described containing hydrogen silicone oil linking agent be end containing hydrogen silicone oil and sagging chain containing hydrogen silicone oil in one or both, the hydrogen content of described containing hydrogen silicone oil linking agent is 0.1-1mmol/g.
6. the heat-conducting pad printing or put glue formula according to any one of claims 1 to 3, it is characterized in that, described curing inhibitors is 1-ethynyl-1-hexalin, 2-methyl-3-butynyl-2-alcohol, 2-methyl isophthalic acid-hexin base-3-alcohol, 3,5-dimethyl-1-hexin base-3-alcohol, 3, one or more in 7,11-trimethylammonium-1-dodecyne base-3-alcohol, toxilic acid divinyl propyl ester, glycidyl allyl ether and diethylene glycol divinyl ether.
7. the heat-conducting pad printing or put glue formula according to any one of claims 1 to 3, it is characterized in that, described platinum complex catalyst is the vinylsiloxane complex compound of Platinic chloride, and the platinum content of described platinum complex catalyst is 3000-5000ppm.
8. printing or the preparation method of heat-conducting pad of some glue formula described in any one of claim 1 ~ 7, is characterized in that, comprise the following steps:
(1), add in stirrer by vinyl polysiloxane and heat conductive filler, at 120-180 DEG C, vacuum mixing 2-4h, is made into base-material;
(2), at normal temperatures, in the base-material that step (1) is obtained, add containing hydrogen silicone oil linking agent and curing inhibitors, mix obtained component A;
(3), at normal temperatures, in the base-material that step (1) is obtained, add platinum complex catalyst, mix obtained B component;
(4), at normal temperatures, component A and the B component of the weight such as to get mix, and remove bubble in a vacuum, and solidification, to obtain final product
Vinyl polysiloxane described in step (1), has the structural formula such as formula (1)
Vi-[(R
1)(R
2)SiO]
n-[Vi
a(R
1)
2-aSiO]
m-Si(OR
3)
2-Vi(1)
Wherein, Vi is vinyl, R
1, R
2, R
3for the monovalent hydrocarbon radical be not substituted or replace, R
1, R
2, R
3identical or different; N and m is the integer of 5 to 100; A is the integer of 0-2.
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| CN201510965054.6A CN105419343B (en) | 2015-12-18 | 2015-12-18 | Printable or dispensing formula heat-conducting pad and preparation method thereof |
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| CN105419343B CN105419343B (en) | 2019-02-22 |
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