CN102504543B - Silicon grease composition with high thermal dissipation and preparation method thereof - Google Patents
Silicon grease composition with high thermal dissipation and preparation method thereof Download PDFInfo
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- CN102504543B CN102504543B CN2011104111141A CN201110411114A CN102504543B CN 102504543 B CN102504543 B CN 102504543B CN 2011104111141 A CN2011104111141 A CN 2011104111141A CN 201110411114 A CN201110411114 A CN 201110411114A CN 102504543 B CN102504543 B CN 102504543B
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- high heat
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 29
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 29
- 239000010703 silicon Substances 0.000 title claims abstract description 29
- 238000002360 preparation method Methods 0.000 title claims abstract description 10
- 239000000203 mixture Substances 0.000 title abstract description 13
- 239000004519 grease Substances 0.000 title abstract 3
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 8
- 239000006071 cream Substances 0.000 claims description 26
- 230000005855 radiation Effects 0.000 claims description 26
- 239000002131 composite material Substances 0.000 claims description 22
- 125000000217 alkyl group Chemical group 0.000 claims description 18
- 239000011231 conductive filler Substances 0.000 claims description 10
- 125000000753 cycloalkyl group Chemical group 0.000 claims description 5
- 125000003118 aryl group Chemical group 0.000 claims description 4
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 3
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N pentanoic acid group Chemical group C(CCCC)(=O)O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000004322 Butylated hydroxytoluene Substances 0.000 claims description 2
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 claims description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 2
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims description 2
- 239000012964 benzotriazole Substances 0.000 claims description 2
- 229940095259 butylated hydroxytoluene Drugs 0.000 claims description 2
- 235000010354 butylated hydroxytoluene Nutrition 0.000 claims description 2
- -1 polysiloxane Polymers 0.000 abstract description 15
- 239000011248 coating agent Substances 0.000 abstract description 4
- 238000000576 coating method Methods 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 abstract description 2
- 230000007613 environmental effect Effects 0.000 abstract description 2
- 239000000945 filler Substances 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000003960 organic solvent Substances 0.000 abstract description 2
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 238000010422 painting Methods 0.000 abstract 1
- 229910000077 silane Inorganic materials 0.000 abstract 1
- 239000003381 stabilizer Substances 0.000 abstract 1
- 239000000843 powder Substances 0.000 description 8
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 5
- 125000002769 thiazolinyl group Chemical group 0.000 description 5
- 229910017083 AlN Inorganic materials 0.000 description 4
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 4
- 239000002199 base oil Substances 0.000 description 4
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 4
- 229920002545 silicone oil Polymers 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- 125000003700 epoxy group Chemical group 0.000 description 3
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910003849 O-Si Inorganic materials 0.000 description 2
- 229910003872 O—Si Inorganic materials 0.000 description 2
- 125000004183 alkoxy alkyl group Chemical group 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000006253 efflorescence Methods 0.000 description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 206010037844 rash Diseases 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- XMWRBQBLMFGWIX-UHFFFAOYSA-N C60 fullerene Chemical compound C12=C3C(C4=C56)=C7C8=C5C5=C9C%10=C6C6=C4C1=C1C4=C6C6=C%10C%10=C9C9=C%11C5=C8C5=C8C7=C3C3=C7C2=C1C1=C2C4=C6C4=C%10C6=C9C9=C%11C5=C5C8=C3C3=C7C1=C1C2=C4C6=C2C9=C5C3=C12 XMWRBQBLMFGWIX-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 125000002777 acetyl group Chemical group [H]C([H])([H])C(*)=O 0.000 description 1
- 125000002252 acyl group Chemical group 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 150000004702 methyl esters Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 125000002801 octanoyl group Chemical group C(CCCCCCC)(=O)* 0.000 description 1
- 150000001282 organosilanes Chemical class 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000012782 phase change material Substances 0.000 description 1
- 229920002627 poly(phosphazenes) Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a silicon grease composition with high thermal dissipation, comprising a component A that is organic polysiloxane, a component B that is alkoxy silane, a component C that is a heat conducting filler, and a component D that is a stabilizer, the ratio of the component A, B, C and D is as follows according to weight part: component A: component B: component C: component D=1: 0.001-0.1: 7-20: 0-0.05. The invention further discloses a preparation method of the silicon grease composition with high thermal dissipation. The product of the invention has high thermal dissipation and keeps proper viscosity and rheological property; the fine clearance of a radiating interface is filled completely, the contact thermal resistance of the interface is decreased, in this way, the heat radiating efficiency of a heating element is improved effectively, meanwhile, the technical requirements of coating and screen painting are satisfied, and the application range is enlarged. In the preparation method, organic solvent is not needed to be used, the production technology is simple and environmental friendly, thereby being convenient for popularization and application.
Description
Technical field
The present invention relates to the macromolecule heat conduction material technical field, relate in particular to a kind of silicon composite cream with high thermal conductivity and preparation method thereof.
Background technology
Along with electronics constantly is integrated into more powerful function in less assembly, the design space size is more and more less, thereby has limited the application of large-scale thermal component.The heat energy that produces in the components and parts use procedure is growing, and as can not in time dispelling the heat, the rising of temperature can cause the device gate delay to increase, and travelling speed slows down, and device reliability descends, the lost of life.Therefore,, in the situation that framework tightens, operating space is more and more less, how effectively to remove a large amount of heat from the element that produces higher temperature, work and service life to guarantee that device is enough, become urgent problem in electrical design.Heat interfacial material (TIM) is widely used in the various interfaces that need radiating insulating, such as unicircuit, electronic digital product, communication equipment, automobile, power supply, LED illumination etc.In order to adapt to different service requirementss, TIM includes hot phase change material, high heat radiation silicon cream and gel, soft heat conductive insulating pad, tackiness agent and sealing agent according to the difference of physical form.
At present, in the prior art heat interfacial material, the over-all properties of high heat radiation silicon cream is best, study also comparatively extensive, for example, can take by multi-hydroxy ester and Zinc oxide powder is composite forms, by aluminium nitride powder and the methyl esters silicone oil of different-grain diameter, be mixed, the aluminum nitride powder powder composition that adopts surface to process through organosilane, adopt silicone resin carrier and filler to mix, use simultaneously active silicone oil and polyphosphazene polymer siloxanes as dispersion agent etc.
Yet height heat radiation silicon cream or the similar composition of prior art all can not solve the heat dissipation problem of high performance components well.For example, in order to fill a large amount of heat conductive fillers, the low viscous non-reactive silicone oil of general employing is as base oil, but in standing storage or use procedure, base oil is easily separated out from composition, particularly under hot and humid condition, make the easily solid and efflorescence of high heat radiation silicon cream layer, thereby cause thermal contact resistance to increase, heat dispersion significantly descends.Although and use silicone resin carrier can solve the problem that silicone oil is separated out, its coating property is poor, is difficult to fully fill the fine gap of thermally-conductive interface, bondline thickness is large, and thermal contact resistance is high, and viscosity and rheological property poor, can not be used for silk screen printing, greatly limit its use range.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, a kind of height heat radiation silicon composite cream that has high thermal conductivity and keep suitable viscosity and rheological property is provided, to realize fully filling the fine voids of heat dissipation interface, reduce the thermal contact resistance at interface, thereby effectively promote the heat dissipation of heating element.Another object of the present invention is to provide the preparation method of above-mentioned high heat radiation silicon composite cream.
Purpose of the present invention is achieved by the following technical programs:
A kind of high heat radiation silicon composite cream provided by the invention, comprise component A, B component, component C, component D, in mass parts ratio component A: B component: component C: component D=1: 0.001～0.1: 7～20: 0～0.05; Preferably, component A: B component: component C: component D=1: 0.005～0.05: 8～15: 0～0.05;
Described component A is organopolysiloxane, by general formula (1), is represented:
R
1[(R
2)
2SiO]
a-Si(OR
2)
2-O-SiR
3 bR
2 (3-b) (1)
R
1, R
3For the monovalence hydrocarbyl group that is not substituted or replaces; R
3With R
1Can be identical or different;
R
2For, alkyl, alkoxyalkyl, thiazolinyl or carboxyl groups;
A is 5 to 100 integer; B is 1 to 3 integer;
Described B component is organoalkoxysilane, by general formula (2), is represented:
R
4 cR
5 dSi(OR
6)
(4-c-d) (2)
R
4, R
5For the monovalence hydrocarbyl group that is not substituted or replaces; R
5With R
4Can be identical or different;
R
6For alkyl group;
C is 1 to 3 integer; D is 0 to 2 integer; And c+d is 1 to 3 integer;
Described component C is heat conductive filler;
Described component D is stablizer.
Component A organopolysiloxane of the present invention provides carrying for a large amount of component C heat conductive fillers, and component A is base oil, both can use a kind of compound, also can be the mixture of two or more different compounds.The B component organoalkoxysilane plays the effect of wetting dispersion to component C heat conductive filler, by coating the surface of component C heat conductive filler, can improve the affinity between component A organopolysiloxane and component C heat conductive filler, help a large amount of fillings of component C heat conductive filler; Also can prevent in hot and humid situation due to the contact degraded that cause component A organopolysiloxane of water vapor with component A organopolysiloxane simultaneously.B component both can be used a kind of compound, also can be the mixture of two or more different compounds.Component D is in order to improve the stability of composition under hot and humid condition, can be nonox, Butylated Hydroxytoluene, benzotriazole, 4,4-two (2, the 2-dimethyl benzyl) a kind of or its combination in pentanoic, when it uses, shared ratio is preferred 0.001～0.05, with 0.005～0.02, is advisable.
In such scheme, the described R of the present composition
1, R
3, R
4, R
5For straight chained alkyl, branched-chain alkyl, cycloalkyl, thiazolinyl, aryl, aralkyl, epoxy group(ing).
Further, component A of the present invention kinematic viscosity in the time of 25 ℃ is 10～10000mm
2/ s, with 100～5000mm
2/ s is advisable.
Further, component C of the present invention consists of three kinds of different-grain diameters at least, can be that the different-grain diameter of same material distributes, and can be also that the different-grain diameter of multiple different substances distributes.The vary in size heat conductive filler of particle diameter of use mixes filling and can make between different-grain diameter heat conduction particle and form comparatively dense and pile up, and is in contact with one another probability and increases, and helps to improve thermal conductivity and the mobility of composition.Described component C median size is 0.1～50 μ m, preferred 1～35 μ m.
Another object of the present invention is achieved by the following technical programs:
The preparation method of above-mentioned high heat radiation silicon composite cream provided by the invention, add described component in stirrer and mix, then through three rollers, grind and be prepared into uniform paste.
The present invention has following beneficial effect:
(1) the high heat radiation of the present invention silicon composite cream has high thermal conductivity, the thermal conductivity that records in the time of 25 ℃ is greater than 3.5W/mK, viscosity in the time of 25 ℃, less than 320Pas, can keep suitable mobility and thixotropy simultaneously, can adapt to the processing requirement of coating and silk screen printing.
(2) the high heat radiation of the present invention silicon composite cream can fully be filled the fine voids of heat dissipation interface, bondline thickness thin (being not more than 65 μ m), and thermal contact resistance is little (is not more than 0.2 ℃-cm
2/ W), can be used for the heat radiation of high performance components.
(3) high heat radiation silicon composite cream of the present invention still can keep very low thermal resistance (to be not more than 0.2 ℃-cm under hot and humid condition
2/ W), base oil is difficult for separating out from composition, and high heat radiation silicon cream layer is difficult for solid and efflorescence, uses reliable and stable.
(4) preparation method of the high heat radiation of the present invention silicon composite cream need not with an organic solvent, the simple and direct environmental protection of production technique.
The present invention is described in further detail below in conjunction with embodiment.
Embodiment
R in component A of the present invention, B component
1, R
3, R
4, R
5For straight chained alkyl, branched-chain alkyl, cycloalkyl, thiazolinyl, aryl, aralkyl, epoxy group(ing).As straight chained alkyls such as methyl, ethyl, propyl group, hexyl, octyl group or dodecyls; The branched-chain alkyls such as sec.-propyl, isobutyl-, the tertiary butyl or 2-ethylhexyl; The cycloalkyl such as cyclopentyl or cyclohexyl; The thiazolinyl such as vinyl or allyl group; The aryl such as phenyl or tolyl; 2-phenylethyl or 2-methyl-aralkyl such as 2-phenylethyl; The epoxy group(ing) such as 2,3-epoxypropoxy.Be advisable with methyl, octyl group, the tertiary butyl or phenyl.
R
2For straight chained alkyls such as methyl, ethyl, propyl group, hexyl, octyl group or dodecyls; The branched-chain alkyls such as sec.-propyl, isobutyl-, the tertiary butyl or 2-ethylhexyl; The alkoxyalkyl such as methoxy ethyl or methoxy-propyl; The thiazolinyl such as vinyl or allyl group; The acyl group such as ethanoyl or capryloyl.R
6For straight chained alkyls such as methyl, ethyl, propyl group, hexyl, octyl group or dodecyls; The branched-chain alkyls such as sec.-propyl, isobutyl-, the tertiary butyl or 2-ethylhexyl.R
2, R
6Be advisable with methyl or ethyl.
Component C is a kind of or its combination in aluminium, silver, copper, nickel, zinc oxide, aluminum oxide, magnesium oxide, titanium oxide, aluminium nitride, boron nitride, silicon nitride, silicon carbide, diamond, graphite, carbon fiber, carbon nanotube, soccerballene.
That adopts in the embodiment of the present invention is composed as follows.
1, component A organopolysiloxane:
(A-1) tert-C
4H
9[(CH
3)
2SiO]
30-Si (OCH
3)
2-O-Si (CH
3)
2CH
3, kinematic viscosity is 500mm in the time of 25 ℃
2/ s.
(A-2) tert-C
4H
9[(CH
3)
2SiO]
20-Si (OCH
3)
2-O-Si (CH
3)
2CH
3, kinematic viscosity is 350mm in the time of 25 ℃
2/ s.
2, B component organoalkoxysilane:
(B1)CH
2(OCH)CH
2OC
3H
6Si(OCH
3)
3
(B2)C
10H
21(C
6H
5)Si(OCH
3)
2
3, component C heat conductive filler:
(C1) aluminium powder (median size 1.5 μ m)
(C2) copper powder (median size 6 μ m)
(C3) aluminium nitride powder (median size 16 μ m)
(C4) aluminium nitride powder (median size 32 μ m)
(C5) alumina powder (median size 0.5 μ m)
(C6) alumina powder (median size 12 μ m)
4, component D:
(D1) 4, two (2, the 2-dimethyl benzyl) pentanoic of 4-
The ratio of components of various embodiments of the present invention (in the mass parts ratio) is as shown in table 1.
The ratio of components of table 1 various embodiments of the present invention
The preparation method of the high heat radiation of embodiment of the present invention silicon composite cream is as follows:
Each component, according to proportioning shown in table 1, is added in the planetary-type mixer of 5L and is uniformly mixed, then through three roller milled processed, can be prepared into uniform paste 1～3 time.
The height heat radiation silicon composite cream that the embodiment of the present invention makes, test thermal conductivity, thermal resistance value and bondline thickness according to ASTMD5470 in the time of 25 ℃, then test thermal resistance value after placing 90 hours under the environment of 120 ℃ of temperature, humidity 85%, the performance index of each embodiment are in Table 2 again.
The performance index of table 2 various embodiments of the present invention
Claims (9)
1. one kind high heat radiation silicon composite cream, is characterized in that comprising component A, B component, component C, component D, in mass parts ratio component A: B component: component C: component D=1: 0.001～0.1: 7～20: 0～0.05;
Described component A is organopolysiloxane, by general formula (1), is represented:
R
1[(R
2)
2SiO]
a-Si(OR
2)
2-O-SiR
3 bR
2 (3-b) (1)
R
1, R
3For straight chained alkyl, branched alkyl group; R
3With R
1Can be identical or different;
R
2For alkyl group;
A is 5 to 100 integer; B is 1 to 3 integer;
Described B component is organoalkoxysilane, by general formula (2), is represented:
R
4 cR
5 dSi(OR
6)
(4-c-d) (2)
R
4, R
5For straight chained alkyl, branched-chain alkyl, cycloalkyl, aryl, aralkyl, cycloalkyl groups; R
5With R
4Can be identical or different;
R
6For alkyl group;
C is 1 to 3 integer; D is 0 to 2 integer; And c+d is 1 to 3 integer;
Described component C is heat conductive filler;
Described component D is stablizer.
2. high heat radiation silicon composite cream according to claim 1 is characterized in that: in the described component A of mass parts ratio: B component: component C: component D=1: 0.005～0.05: 8～15: 0～0.05.
3. high heat radiation silicon composite cream according to claim 1, it is characterized in that: described component D is nonox, Butylated Hydroxytoluene, benzotriazole, 4, a kind of or its combination in two (2, the 2-dimethyl benzyl) pentanoic of 4-.
4. according to claim 1 and 2 or 3 described high heat radiation silicon composite creams, it is characterized in that: the shared ratio of described component D is 0.001～0.05.
5. high heat radiation silicon composite cream according to claim 4, it is characterized in that: the shared ratio of described component D is 0.005～0.02.
6. high heat radiation silicon composite cream according to claim 1 and 2, it is characterized in that: described component A kinematic viscosity in the time of 25 ℃ is 10～10000mm
2/ s.
7. high heat radiation silicon composite cream according to claim 6, it is characterized in that: described component A kinematic viscosity in the time of 25 ℃ is 100～5000mm
2/ s.
8. high heat radiation silicon composite cream according to claim 1 and 2, it is characterized in that: described component C consists of three kinds of different-grain diameters at least, and its median size is 0.1～50 μ m.
9. the preparation method of one of one kind according to claim 1-8 described high heat radiation silicon composite cream, is characterized in that: described component is added in stirrer and mixes, then through three rollers, grind and be prepared into uniform paste.
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| CN102924923B (en) * | 2012-10-24 | 2014-12-03 | 江苏大学 | High thermal conductive magnetic metal fiber/silicon rubber composite material and preparation method thereof |
| CN104672911B (en) * | 2015-03-03 | 2017-07-28 | 矽照光电（厦门）有限公司 | A kind of preparation method based on carbon nano tube-doped weather resistant LED heat-conducting silicone greases |
| CN105348811B (en) * | 2015-11-17 | 2018-02-16 | 广州回天新材料有限公司 | A kind of Heat Conduction Material composition and its application |
| JP7001071B2 (en) * | 2019-01-10 | 2022-01-19 | 信越化学工業株式会社 | Thermally conductive silicone composition |
| CN112124250A (en) * | 2020-09-28 | 2020-12-25 | 追信数字科技有限公司 | High-cost high-efficiency heat exchange circulating system for top-spraying type vehicle-mounted deicing system |
| CN114410113B (en) * | 2021-11-08 | 2023-06-09 | 广东金戈新材料股份有限公司 | Flowing type fine heat-conducting silicone grease and preparation method thereof |
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| CN1610725A (en) * | 2001-12-27 | 2005-04-27 | 英特尔公司 | Chain extension for thermal materials |
| WO2010107516A1 (en) * | 2009-03-16 | 2010-09-23 | Dow Corning Corporation | Thermally conductive grease and methods and devices in which said grease is used |
| CN102037087A (en) * | 2008-02-29 | 2011-04-27 | 信越化学工业株式会社 | Heat conductive cured product and making method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1610725A (en) * | 2001-12-27 | 2005-04-27 | 英特尔公司 | Chain extension for thermal materials |
| CN102037087A (en) * | 2008-02-29 | 2011-04-27 | 信越化学工业株式会社 | Heat conductive cured product and making method |
| WO2010107516A1 (en) * | 2009-03-16 | 2010-09-23 | Dow Corning Corporation | Thermally conductive grease and methods and devices in which said grease is used |
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