CN105348811B - A kind of Heat Conduction Material composition and its application - Google Patents
A kind of Heat Conduction Material composition and its application Download PDFInfo
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- 239000000203 mixture Substances 0.000 title claims abstract description 72
- 239000000463 material Substances 0.000 title abstract description 14
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims abstract description 42
- -1 polysiloxane Polymers 0.000 claims abstract description 36
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 33
- 239000011787 zinc oxide Substances 0.000 claims abstract description 21
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 13
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 13
- 125000003545 alkoxy group Chemical group 0.000 claims abstract description 5
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000004020 conductor Substances 0.000 claims description 30
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 24
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 19
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 14
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 13
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 12
- 229910052736 halogen Inorganic materials 0.000 claims description 11
- 150000002367 halogens Chemical class 0.000 claims description 11
- 125000001424 substituent group Chemical group 0.000 claims description 10
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 8
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 claims description 8
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 8
- 239000002245 particle Substances 0.000 claims description 7
- 125000006552 (C3-C8) cycloalkyl group Chemical group 0.000 claims description 6
- 125000000217 alkyl group Chemical group 0.000 claims description 6
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 claims description 4
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 4
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 claims description 4
- 229910052801 chlorine Inorganic materials 0.000 claims description 4
- 239000000460 chlorine Substances 0.000 claims description 4
- 125000004218 chloromethyl group Chemical group [H]C([H])(Cl)* 0.000 claims description 4
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 claims description 4
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 claims description 4
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 4
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 4
- 125000003944 tolyl group Chemical group 0.000 claims description 4
- 125000003277 amino group Chemical group 0.000 claims description 2
- 125000004202 aminomethyl group Chemical group [H]N([H])C([H])([H])* 0.000 claims description 2
- 150000002191 fatty alcohols Chemical class 0.000 claims description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 claims description 2
- 230000005684 electric field Effects 0.000 abstract description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 abstract 1
- 229910000077 silane Inorganic materials 0.000 abstract 1
- 239000003921 oil Substances 0.000 description 10
- 238000000926 separation method Methods 0.000 description 9
- 238000005406 washing Methods 0.000 description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- 238000012360 testing method Methods 0.000 description 8
- WSNMPAVSZJSIMT-UHFFFAOYSA-N COc1c(C)c2COC(=O)c2c(O)c1CC(O)C1(C)CCC(=O)O1 Chemical compound COc1c(C)c2COC(=O)c2c(O)c1CC(O)C1(C)CCC(=O)O1 WSNMPAVSZJSIMT-UHFFFAOYSA-N 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 5
- 239000004519 grease Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 125000006376 (C3-C10) cycloalkyl group Chemical group 0.000 description 4
- 239000011231 conductive filler Substances 0.000 description 4
- 230000008439 repair process Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 1
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 125000001033 ether group Chemical group 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000000518 rheometry Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000012798 spherical particle Substances 0.000 description 1
- 238000001308 synthesis method Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
- C08L83/12—Block- or graft-copolymers containing polysiloxane sequences containing polyether sequences
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/42—Block-or graft-polymers containing polysiloxane sequences
- C08G77/46—Block-or graft-polymers containing polysiloxane sequences containing polyether sequences
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The present invention provides a kind of Heat Conduction Material composition, and it includes following components in percentage by weight：A) organopolysiloxane, 2~5%；B) alkoxy end-capped vinyl polysiloxane, 5 10%；C) aluminum oxide, 50~80%；D) zinc oxide, 30~50%；And E) silane coupler, 0.1~1%；Wherein component A) to E) each percentage by weight is based on component A) to E) total restatement, and component A) to E) the summation of percentage by weight be 100%.The Heat Conduction Material composition of the present invention has the characteristics of pollution-free, easily to reprocess, be washable, can be widely applied in electric field and electronic applications.
Description
Technical Field
The invention relates to the technical field of heat conduction materials, in particular to a heat conduction material composition which is free of pollution, easy to repair and capable of being washed by water and application thereof.
Background
As electronic devices continue to integrate more powerful functions into smaller components, temperature control has become one of the key challenges in design, namely how to effectively remove more heat generated by a larger unit of power with a shrinking architecture and a smaller and smaller operating space. Thermally conductive silicone greases are the most important class of thermally conductive materials. As a commonly used heat conductive material, the heat conductive silicone grease is generally composed of a heat conductive matrix (high boiling point solvent, dimethyl polydimethylsiloxane) and various types of heat conductive fillers, which are integrated by a mechanical coupling method.
The heat-conducting silicone grease has the advantages of performance and is a very active development direction in the field of heat conduction. It has excellent heat conducting, insulating, moistureproof, corona resistant, leakage resistant and chemical medium resistant performance. The paint has no corrosion to components, excellent heat resistance, moisture resistance and cold resistance, and can prolong the service life of accessories after being applied. Can be used for a long time in the temperature range of-65 ℃ to 200 ℃. Therefore, the LED lamp is widely applied to the fields of heat dissipation modules, LED illumination, household appliances and the like.
However, since the heat conductive silicone grease uses a saturated nonpolar substance, its surface energy is low, and therefore it is difficult to clean it after coating, difficult to repair it, and it needs to be wiped off with a special solvent. In addition, mechanical coupling with various inorganic fillers cannot maintain a stable state of bonding for a long time, and tends to cause "silicon contamination".
To improve stability, the filler is usually pretreated.
EP1189278 uses a vinyl silane compound and polystyrene as a treating agent, and zinc oxide and aluminum silicate as a filler, to obtain a dry heat conductive silicone grease.
US0041918 adds 30% silicone resin to heat conductive silicone grease, and matches with hexagonal and amorphous boron nitride to obtain a high heat conductive composition.
But the heat conduction materials which are pollution-free, easy to repair and washable are only reported.
Disclosure of Invention
The invention aims to overcome the problems in the prior art and provides a heat conduction material composition which comprises the following components in percentage by weight:
A) 2-5% of organopolysiloxane with the following structural formula I;
wherein,
R1are the same or different and represent C selected from substituted or unsubstituted1-20Saturated alkyl radical, C3-10Cycloalkyl and C6-20Aryl, wherein the substituents are halogen, preferably chlorine;
R2are the same or different and represent C1-20A saturated alkyl group;
R3are the same or different and represent C1-40An alkoxy group; and
n is an integer of 0 to 50;
B) 5-10% of an alkoxy-terminated vinyl polysiloxane of the following structural formula II;
wherein,
R4are the same or different and represent C1-10A saturated alkyl group;
R5are the same or different and represent C1-10A saturated alkyl group;
R6are the same or different and represent C selected from substituted or unsubstituted1-20Saturated alkyl radical, C3-10Cycloalkyl and C6-20Aryl, wherein the substituents are halogen; and
m is an integer of 0 to 50;
C) 50-80% of aluminum oxide;
D) 30-50% of zinc oxide; and
E) 0.1-1% of a silane coupling agent;
wherein the weight percentages of each of components A) to E) are based on the total weight of components A) to E), and the sum of the weight percentages of components A) to E) is 100%.
The invention also provides application of the heat conduction material composition in the electric field and the electronic field.
The heat conduction material composition has the characteristics of no pollution, easy repair and water washing.
Detailed Description
In the present invention, unless otherwise specified, all operations are carried out under room temperature and normal pressure conditions; all parts are parts by weight, percentages are percentages by weight, and proportions are ratios by weight.
The heat conduction material composition comprises the following components in percentage by weight:
A) 2-5% of organopolysiloxane with the following structural formula I;
wherein,
R1are the same or different and represent C selected from substituted or unsubstituted1-20Saturated alkyl radical, C3-10Cycloalkyl and C6-20Aryl, wherein the substituents are halogen, preferably chlorine;
R2are the same or different and represent C1-20A saturated alkyl group;
R3are the same or different and represent C1-40An alkoxy group; and
n is an integer of 0 to 50;
B) 5-10% of an alkoxy-terminated vinyl polysiloxane of the following structural formula II;
wherein,
R4are the same or different and represent C1-10A saturated alkyl group;
R5are the same or different and represent C1-10A saturated alkyl group;
R6are the same or different and represent C selected from substituted or unsubstituted1-20Saturated alkyl radical, C3-10Cycloalkyl and C6-20Aryl, wherein the substituents are halogen, preferably chlorine; and
m is an integer of 0 to 50;
C) 50-80% of aluminum oxide;
D) 30-50% of zinc oxide; and
E) 0.1-1% of a silane coupling agent;
wherein the weight percentages of each of components A) to E) are based on the total weight of components A) to E), and the sum of the weight percentages of components A) to E) is 100%.
In one embodiment, in said component A),
R1are the same or different and represent C selected from substituted or unsubstituted1-8Saturated alkyl radical, C3-8Cycloalkyl and C6-10Aryl, wherein the substituents are halogen;
R2are the same or different and represent C1-8A saturated alkyl group;
R3are the same or different and represent C1-10An alkoxy group; and
n is an integer of 5 to 30.
The synthesis method of the organic polysiloxane has been reported (US0143490, US5877268 and US 6673359), but the application of the organic polymer in heat-conducting materials is not reported.
In a preferred embodiment, in said component A),
R1identical or different and selected from: methyl, ethyl, propyl, hexyl, octadecyl, cyclopentyl, cyclohexyl, phenyl, tolyl, benzyl, chloromethyl and 3-chloropropyl, preferably methyl or phenyl;
R2identical or different and selected from: methyl, ethyl, propyl, butyl and pentyl, preferably methyl or ethyl;
R3identical or different and selected from: polyoxyethylene groups, polyoxypropylene groups, fatty alcohol polyoxyethylene groups and polyoxypropylene ether groups, preferably polyoxyethylene groups; and
n is an integer of 5 to 30.
In one embodiment, the component A) has a viscosity of from 40 to 4000 mPas, preferably from 50 to 1000 mPas, at 25 ℃. The addition amount of the component A) is 1-20%, preferably 2-5%. If the dosage is too small, the effect of water washing can not be achieved; if the dosage is too large, the viscosity of the composition is low, the composition is easy to separate out, and the pollution is large.
In one embodiment, in said component B),
R4are the same or different and represent C1-6A saturated alkyl group;
R5are the same or different and represent C1-6A saturated alkyl group;
R6are the same or different and represent C selected from substituted or unsubstituted1-8Saturated alkyl radical, C3-8Cycloalkyl and C6-10Aryl, wherein the substituents are halogen; and
m is an integer of 5 to 30.
In a preferred embodiment, in said component B),
R4identical or different and selected from: methyl, ethyl, propyl, butyl, pentyl, and the like, preferably methyl or ethyl;
R5identical or different and selected from: methyl, ethyl, propyl, butyl, pentyl, and the like, preferably methyl or ethyl;
R6identical or different and selected from: methyl, ethyl, propyl, hexyl, octadecyl, cyclopentyl, cyclohexyl, phenyl, tolyl, benzyl, chloromethyl and 3-chloropropyl, preferably methyl or phenyl; and
m is an integer of 5 to 30.
In one embodiment, the component B) has a viscosity of from 40 to 4000 mPas, preferably from 50 to 1000 mPas, at 25 ℃. The addition amount of the component B) is 1-20%, preferably 5-10%. If the dosage is too small, the composition is too thick and cannot be used; if the dosage is too large, the viscosity of the composition is low, the composition is easy to separate out, and the pollution is large.
The component C), alumina, is the thermally conductive filler of the present composition. In one embodiment, the component C) alumina is spherical alumina. The substantially spherical alumina preferably has an average particle diameter in the range of 1 to 100 μm, more preferably 5 to 30 μm. The addition amount is 50-90%, preferably 50-80%. If the dosage is too small, the viscosity of the composition is low, and the heat conduction effect is influenced; if the amount is too large, the composition is too thick to be used.
The component D), zinc oxide, is the thermally conductive filler of the present composition. In one embodiment, the component D) zinc oxide is a zinc oxide in flake form. The substantially flaky zinc oxide preferably has an average particle diameter in the range of 0.1 to 50 μm, more preferably 0.5 to 10 μm (for non-spherical particles, there are generally three methods for defining the particle diameter, i.e., projected diameter, geometric equivalent diameter and physical equivalent diameter, which are defined herein as geometric equivalent diameter). The addition amount is 20-70%, preferably 30-50%. If the dosage is too small, the viscosity of the composition is low, and the heat conduction effect is influenced; if the amount is too large, the composition is too thick to be used.
The combination of the component C) aluminum oxide and the component D) zinc oxide can obtain higher heat conductivity coefficient, and the heat conductivity coefficient of the heat conductive filler of one component is lower.
In one embodiment, the component E) is added in an amount of 0.1 to 10%, preferably 0.1 to 1%.
In one embodiment, the component E) is a silane coupling agent represented by the following structural formula III:
wherein,
R7are the same or different and represent C1-10A saturated alkyl group; and
R8is represented by C1-10Saturated hydrocarbon groups containing amino groups.
In a preferred embodiment, in component E),
R7identical or different and selected from: methyl, methyl,Ethyl, propyl, butyl and pentyl, preferably methyl or ethyl; and
R8selected from: aminomethyl, aminoethyl, aminopropyl and aminobutyl, preferably aminoethyl or aminopropyl.
Any combination of the above embodiments, and preferred ones, is encompassed within the scope of the present invention.
In the heat conductive material composition of the present invention, additives such as inorganic fillers of magnesium oxide, boron nitride, silicon carbide and the like may be added as necessary within a range not impairing the object of the present invention, to improve the properties such as heat conductivity, rheology and the like of the composition.
The thermally conductive material composition may be applied after mixing using conventional equipment using methods known in the art.
The heat conducting material composition can be widely applied to the electric field and the electronic field. In particular to heat dissipation modules, LED lighting and other household appliances.
The invention is further illustrated by the following specific examples:
the test method adopted by the invention is as follows:
(1) viscosity of the oil
Measured according to standard GB/T2794 (at 25 ℃).
(2) Oil separation degree
Measured according to standard HG/T2502.
(3) Evaluation of non-pollution, easy-to-repair and washable
The oil separation degree is lower than 0.5, which means that the polymer is tightly connected with the filler, the polymer cannot be separated out, the pollution degree is small, otherwise, the pollution is large, the heat conduction material is coated on the aluminum substrate, the heat conduction material cannot be washed by water, represented by x, which indicates that the cleaning is difficult and the repairing is difficult, and the heat conduction material can be washed by the water, represented by ○, which indicates that the cleaning is simple and the repairing is easy.
Examples
The structural compositions of the organopolysiloxane, alkoxy-terminated vinyl polysiloxane, and silane coupling agent used in the examples and comparative examples are specifically shown in table 1, and they were prepared according to the principles and methods known in the art.
Example 1
4 parts of organopolysiloxane (viscosity is about 100 mPas) with a structure I, 6 parts of alkoxy-terminated vinyl polysiloxane (viscosity is about 100 mPas) with a structure II, 60 parts of spherical alumina with a diameter of 20 mu m and 40 parts of flaky zinc oxide with a diameter of 5 mu m are mixed in a planetary stirrer for 30min, then 0.5 part of silane coupling agent with a structure III is added, and the mixture is mixed and stirred for 10min to obtain the heat-conducting material composition. The oil separation of the composition at 150 ℃ was tested, and the composition was coated on an aluminum substrate to test the washing performance.
Example 2
4 parts of organopolysiloxane (viscosity is about 400 mPas) with a structure I, 8 parts of alkoxy-terminated vinyl polysiloxane (viscosity is about 300 mPas) with a structure II, 70 parts of spherical alumina with a diameter of 20 mu m and 40 parts of flaky zinc oxide with a diameter of 5 mu m are mixed in a planetary stirrer for 30min, 0.5 part of silane coupling agent with a structure III is added, and the mixture is mixed and stirred for 10min to obtain the heat-conducting material composition. The oil separation of the composition at 150 ℃ was tested, and the composition was coated on an aluminum substrate to test the washing performance.
Example 3
5 parts of organopolysiloxane (viscosity is about 500 mPas) with a structure I, 8 parts of alkoxy-terminated vinyl polysiloxane (viscosity is about 400 mPas) with a structure II, 70 parts of spherical alumina with a diameter of 20 mu m and 40 parts of flaky zinc oxide with a diameter of 5 mu m are mixed in a planetary stirrer for 30min, 0.5 part of silane coupling agent with a structure III is added, and the mixture is mixed and stirred for 10min to obtain the heat-conducting material composition. The oil separation of the composition at 150 ℃ was tested, and the composition was coated on an aluminum substrate to test the washing performance.
Example 4
2 parts of organopolysiloxane (viscosity is about 800 mPas) with a structure I, 10 parts of alkoxy-terminated vinyl polysiloxane (viscosity is about 700 mPas) with a structure II, 50 parts of spherical alumina with a diameter of 20 mu m and 50 parts of flaky zinc oxide with a diameter of 5 mu m are mixed in a planetary stirrer for 30min, 0.2 part of silane coupling agent with a structure III is added, and the mixture is mixed and stirred for 10min to obtain the heat-conducting material composition. The oil separation of the composition at 150 ℃ was tested, and the composition was coated on an aluminum substrate to test the washing performance.
Example 5
4 parts of organopolysiloxane (viscosity is about 300 mPas) with a structure I, 5 parts of alkoxy-terminated vinyl polysiloxane (viscosity is about 800 mPas) with a structure II, 80 parts of spherical alumina with a diameter of 20 mu m and 30 parts of flaky zinc oxide with a diameter of 5 mu m are mixed in a planetary stirrer for 30min, 0.8 part of silane coupling agent with a structure III is added, and the mixture is mixed and stirred for 10min to obtain the heat-conducting material composition. The oil separation of the composition at 150 ℃ was tested, and the composition was coated on an aluminum substrate to test the washing performance.
Comparative example 1
1 part of organopolysiloxane (viscosity is about 100 mPas) with a structure I, 9 parts of alkoxy-terminated vinyl polysiloxane (viscosity is about 100 mPas) with a structure II, 60 parts of spherical alumina with a diameter of 20 mu m and 40 parts of flaky zinc oxide with a diameter of 5 mu m are mixed in a planetary stirrer for 30min, then 0.5 part of silane coupling agent with a structure III is added, and the mixture is mixed and stirred for 10min to obtain the heat-conducting material composition. The oil separation of the composition at 150 ℃ was tested, and the composition was coated on an aluminum substrate to test the washing performance.
Comparative example 2
6 parts of organopolysiloxane (viscosity is about 600 mPas) with a structure I, 14 parts of alkoxy-terminated vinyl polysiloxane (viscosity is about 700 mPas) with a structure II, 65 parts of spherical alumina with a diameter of 20 mu m and 40 parts of flaky zinc oxide with a diameter of 5 mu m are mixed in a planetary stirrer for 30min, 0.5 part of silane coupling agent with a structure III is added, and the mixture is mixed and stirred for 10min to obtain the heat-conducting material composition. The oil separation of the composition at 150 ℃ was tested, and the composition was coated on an aluminum substrate to test the washing performance.
In the examples and comparative examples, the components used are summarized in table 1 below:
table 1 composition of heat conductive material
Injecting: when the viscosity is determined, n in the organopolysiloxane and m in the alkoxy-terminated vinyl polysiloxane are determined accordingly.
The results of the performance tests of the examples and comparative examples are summarized in table 2 below:
table 2 performance testing of thermally conductive material compositions
Finally, the above embodiments are only used to illustrate the technical solution of the present invention and are not limited. Modifications and equivalents of the present invention may be made by those skilled in the art without departing from the spirit and scope of the present invention, and are intended to be included within the scope of the appended claims.
Claims (16)
1. A heat conducting material composition comprises the following components in percentage by weight:
A) 2-5% of organopolysiloxane with the following structural formula I;
wherein,
R1are the same or different and represent C selected from substituted or unsubstituted1-20Saturated alkyl radical, C3-8Cycloalkyl radicalsAnd C6-10Aryl, wherein the substituents are halogen;
R2are the same or different and represent C1-8A saturated alkyl group;
R3are the same or different and represent C1-10An alkoxy group; and
n is an integer of 5 to 30;
B) 5-10% of alkoxy-terminated vinyl polysiloxane with the structural formula II;
wherein,
R4are the same or different and represent C1-6A saturated alkyl group;
R5are the same or different and represent C1-6A saturated alkyl group;
R6are the same or different and represent C selected from substituted or unsubstituted1-20Saturated alkyl radical, C3-8Cycloalkyl and C6-10Aryl, wherein the substituents are halogen; and
m is an integer of 5 to 30;
C) 50-80% of aluminum oxide;
D) 30-50% of zinc oxide; and
E) 0.1-1% of a silane coupling agent;
wherein the weight percentages of each of components A) to E) are based on the total weight of components A) to E), and the sum of the weight percentages of components A) to E) is 100%,
and
the component E) is a silane coupling agent represented by the following structural formula III:
wherein,
R7are the same or different and represent C1-10A saturated alkyl group; and
R8is represented by C1-10Saturated hydrocarbon groups containing amino groups.
2. The thermally conductive material composition of claim 1, wherein in component A),
R1are the same or different and represent C selected from substituted or unsubstituted1-8Saturated alkyl radical, C3-8Cycloalkyl and C6-10Aryl, wherein the substituents are halogen;
in the component B) described above, the component B),
R6are the same or different and represent C selected from substituted or unsubstituted1-8Saturated alkyl radical, C3-8Cycloalkyl and C6-10Aryl, wherein the substituents are halogen.
3. The composition of claim 1 or 2, wherein the halogen is chlorine.
4. The heat conductive material composition according to claim 1 or 2, wherein the component a) has a viscosity of 40 to 4000 mPa-s at 25 ℃.
5. The thermally conductive material composition of claim 4, wherein component A) has a viscosity of 50 to 1000 mPa-s at 25 ℃.
6. The thermally conductive material composition of claim 1, wherein in component A),
R1identical or different and selected from: methyl, ethyl, propyl, hexyl, octadecyl, cyclopentyl, cyclohexyl, phenyl, tolyl, benzyl, chloromethyl, and 3-chloropropyl;
R2identical or different and selected from: methyl, ethyl, propyl, butyl and pentyl;
R3identical or different and selected from: polyoxyethylene groups, polyoxypropylene groups and fatty alcohol polyoxyethylene groups; and
n is an integer of 5 to 30.
7. The thermally conductive material composition of claim 6, wherein in component A),
R1identical or different and selected from methyl or phenyl;
R2identical or different and selected from methyl or ethyl;
R3identical or different and are selected from polyoxyethylene groups.
8. The heat conductive material composition according to claim 1 or 2, wherein the viscosity of the component B) is 40 to 4000 mPa-s at 25 ℃.
9. The thermally conductive material composition of claim 8, wherein component B) has a viscosity of 50 to 1000 mPa-s at 25 ℃.
10. The thermally conductive material composition of claim 1, wherein, in component B),
R4identical or different and selected from: methyl, ethyl, propyl, butyl and pentyl;
R5identical or different and selected from: methyl, ethyl, propyl, butyl and pentyl;
R6identical or different and selected from: methyl, ethyl, propyl, hexyl, octadecyl, cyclopentyl, cyclohexyl, phenyl, tolyl, benzyl, chloromethyl, and 3-chloropropyl; and
m is an integer of 5 to 30.
11. The thermally conductive material composition of claim 10, wherein, in component B),
R4identical or different and selected from methyl or ethyl;
R5identical or different and selected from methyl or ethyl;
R6identical or different and selected from methyl or phenyl。
12. The thermally conductive material composition of claim 1, wherein in component E),
R7identical or different and selected from: methyl, ethyl, propyl, butyl and pentyl; and
R8selected from: aminomethyl, aminoethyl, aminopropyl and aminobutyl.
13. The thermally conductive material composition of claim 12, wherein in component E),
R7identical or different and selected from methyl or ethyl; and
R8selected from aminoethyl or aminopropyl.
14. The heat conductive material composition according to claim 1 or 2, wherein the component C) alumina is spherical alumina having an average particle diameter in the range of 1 to 100 μm; and/or the component D) zinc oxide is flaky zinc oxide, and the average particle size range of the zinc oxide is 0.1-50 mu m.
15. The heat conductive material composition of claim 14, wherein the component C) alumina has an average particle size in the range of 5 to 30 μ ι η; and/or the average particle size range of the component D), namely the zinc oxide, is 0.5-10 mu m.
16. Use of the thermally conductive material composition of any one of claims 1 to 15 in the electrical and electronic fields.
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| CN102504543A (en) * | 2011-12-12 | 2012-06-20 | 广州市白云化工实业有限公司 | Silicon grease composition with high thermal dissipation and preparation method thereof |
| CN104098914A (en) * | 2014-07-02 | 2014-10-15 | 深圳市安品有机硅材料有限公司 | Organosilicone heat-conduction interface material |
| CN104356649A (en) * | 2014-10-22 | 2015-02-18 | 重庆市旭星化工有限公司 | Macromolecule heat conduction material |
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| CN104098914A (en) * | 2014-07-02 | 2014-10-15 | 深圳市安品有机硅材料有限公司 | Organosilicone heat-conduction interface material |
| CN104356649A (en) * | 2014-10-22 | 2015-02-18 | 重庆市旭星化工有限公司 | Macromolecule heat conduction material |
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