CN105348811A - Heat-conduction material composition and application thereof - Google Patents
Heat-conduction material composition and application thereof Download PDFInfo
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- CN105348811A CN105348811A CN201510790700.XA CN201510790700A CN105348811A CN 105348811 A CN105348811 A CN 105348811A CN 201510790700 A CN201510790700 A CN 201510790700A CN 105348811 A CN105348811 A CN 105348811A
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- 239000000203 mixture Substances 0.000 title claims abstract description 69
- 239000000463 material Substances 0.000 title abstract 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims abstract description 38
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 33
- -1 polysiloxane Polymers 0.000 claims abstract description 32
- 239000011787 zinc oxide Substances 0.000 claims abstract description 19
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 14
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 14
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 14
- 230000005684 electric field Effects 0.000 claims abstract description 4
- 239000004020 conductor Substances 0.000 claims description 36
- 125000000217 alkyl group Chemical group 0.000 claims description 27
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 24
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 20
- 125000003545 alkoxy group Chemical group 0.000 claims description 12
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 12
- 229910052736 halogen Inorganic materials 0.000 claims description 10
- 150000002367 halogens Chemical class 0.000 claims description 10
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 10
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 8
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 8
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 8
- 125000006376 (C3-C10) cycloalkyl group Chemical group 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 6
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 5
- 239000000460 chlorine Substances 0.000 claims description 5
- 229910052801 chlorine Inorganic materials 0.000 claims description 5
- 125000006552 (C3-C8) cycloalkyl group Chemical group 0.000 claims description 4
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 claims description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 4
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 claims description 4
- 125000004218 chloromethyl group Chemical group [H]C([H])(Cl)* 0.000 claims description 4
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 claims description 4
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 claims description 4
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 4
- 229920001451 polypropylene glycol Polymers 0.000 claims description 4
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 4
- 125000003944 tolyl group Chemical group 0.000 claims description 4
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 claims description 2
- 125000004202 aminomethyl group Chemical group [H]N([H])C([H])([H])* 0.000 claims description 2
- 229910021529 ammonia Inorganic materials 0.000 claims description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 3
- 238000012360 testing method Methods 0.000 description 15
- 229910052782 aluminium Inorganic materials 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- 239000004411 aluminium Substances 0.000 description 8
- WSNMPAVSZJSIMT-UHFFFAOYSA-N COc1c(C)c2COC(=O)c2c(O)c1CC(O)C1(C)CCC(=O)O1 Chemical compound COc1c(C)c2COC(=O)c2c(O)c1CC(O)C1(C)CCC(=O)O1 WSNMPAVSZJSIMT-UHFFFAOYSA-N 0.000 description 7
- 238000003756 stirring Methods 0.000 description 7
- 238000005406 washing Methods 0.000 description 7
- 239000004519 grease Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 239000011231 conductive filler Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- 235000006508 Nelumbo nucifera Nutrition 0.000 description 2
- 240000002853 Nelumbo nucifera Species 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 239000012764 mineral filler Substances 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- PZZYQPZGQPZBDN-UHFFFAOYSA-N aluminium silicate Chemical compound O=[Al]O[Si](=O)O[Al]=O PZZYQPZGQPZBDN-UHFFFAOYSA-N 0.000 description 1
- 229910000323 aluminium silicate Inorganic materials 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229910052810 boron oxide Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 238000012958 reprocessing Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000010189 synthetic method Methods 0.000 description 1
- 230000003245 working effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
- C08L83/12—Block- or graft-copolymers containing polysiloxane sequences containing polyether sequences
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/42—Block-or graft-polymers containing polysiloxane sequences
- C08G77/46—Block-or graft-polymers containing polysiloxane sequences containing polyether sequences
Abstract
A provided heat-conduction material composition comprises the following compositions in percent by weight: A) 2-5% of organic polysiloxane; B) 5-10% of alkoxy-terminated vinyl polysiloxane; C) 50-80% of aluminium oxide; D) 30-50% of zinc oxide; and E) 0.1-1% of a silane coupling agent, wherein the weight percentage of each of the compositions A) to E) is based on the weight sum of the compositions A) to E), and the weight percentage sum of the compositions A) to E) is 100%. The heat-conduction material composition possesses the characteristics of being free of pollution, easy to repair and washable with water, and is widely applicable to electric field and electron field.
Description
Technical field
The present invention relates to thermally conductive material technical field, especially a kind of pollution-free, easily reprocess, the thermally conductive material composition that can wash and application thereof.
Background technology
Along with electronics is constantly by more powerful function i ntegration to more widgets, temperature controls to have become one of vital challenge in design, namely tighten at framework, when operating space is more and more less, how effectively to take away more heats that larger unit power produces.Heat-conducting silicone grease is a most important class in thermally conductive material.As conventional thermally conductive material, the composition of heat-conducting silicone grease is generally heat conduction matrix (high boiling solvent, dimethyl polydimethylsiloxane) and various dissimilar heat conductive filler, and the way of being closed by mechanical lotus root, makes it into as a whole.
Heat-conducting silicone grease becomes the very active developing direction in one, heat conduction field with its feature performance benefit.It has excellent heat conduction, insulation, protection against the tide, Inverter fed motor, tracking-resistant and chemical mediator-resitant property.Corrosion-free to components and parts, thermotolerance, moisture resistivity, winter hardiness are outstanding, can extend the work-ing life of accessory after application.Can in the temperature range of-65 DEG C ~ 200 DEG C life-time service.Therefore obtain a wide range of applications in fields such as heat radiation module, LED illumination, household electrical appliances.
But, due to heat-conducting silicone grease use saturated apolar substance, its surface energy is lower, therefore coating after be difficult to cleaning, not easily reprocess, need use special solvent could wiping removing.In addition, with the mechanical lotus root of various mineral filler merge can not for a long time hold key and steady state, easily cause " silicon pollution ".
In order to improve stability, usually pre-treatment need be carried out to filler.
Employ vinyl-based silane compound and polystyrene in EP1189278 as treatment agent, and use zinc oxide, pure aluminium silicate as filler, dryness heat-conducting silicone grease can be obtained.
US0041918 with the addition of 30% silicone resin in heat-conducting silicone grease, and collocation hexagon and ambiguity boron nitride, obtain the composition of high heat conduction.
But for pollution-free, easily reprocess, the thermally conductive material that can wash then rarely has report.
Summary of the invention
The object of the invention is to the problem overcoming prior art, provide a kind of thermally conductive material composition, it comprises the component of following weight percent:
A) organopolysiloxane of following structural formula I, 2 ~ 5%;
Wherein,
R
1identical or different, and expression is selected from substituted or unsubstituted C
1-20saturated alkyl, C
3-10cycloalkyl and C
6-20aryl, wherein substituting group is halogen, preferred chlorine;
R
2identical or different, and represent C
1-20saturated alkyl;
R
3identical or different, and represent C
1-40alkoxyl group; With
N is integer 0 ~ 50;
B) the alkoxy end-capped vinyl polysiloxane of following structural formula II, 5-10%;
Wherein,
R
4identical or different, and represent C
1-10saturated alkyl;
R
5identical or different, and represent C
1-10saturated alkyl;
R
6identical or different, and expression is selected from substituted or unsubstituted C
1-20saturated alkyl, C
3-10cycloalkyl and C
6-20aryl, wherein substituting group is halogen; With
M is integer 0 ~ 50;
C) aluminum oxide, 50 ~ 80%;
D) zinc oxide, 30 ~ 50%; With
E) silane coupling agent, 0.1 ~ 1%;
Wherein component A) to E) each weight percent is all based on component A) to E) total restatement, and component A) to E) the summation of weight percent be 100%.
The present invention also provides the application of described thermally conductive material composition in electric field and electronic applications.
Thermally conductive material composition of the present invention, has feature that is pollution-free, that easily reprocess, can wash.
Embodiment
In the present invention, if no special instructions, then all operations is all implemented under room temperature, condition of normal pressure; All numbers are parts by weight, and per-cent is weight percentage, and ratio is weight ratio.
Thermally conductive material composition of the present invention, comprises the component of following weight percent:
A) organopolysiloxane of following structural formula I, 2 ~ 5%;
Wherein,
R
1identical or different, and expression is selected from substituted or unsubstituted C
1-20saturated alkyl, C
3-10cycloalkyl and C
6-20aryl, wherein substituting group is halogen, preferred chlorine;
R
2identical or different, and represent C
1-20saturated alkyl;
R
3identical or different, and represent C
1-40alkoxyl group; With
N is integer 0 ~ 50;
B) the alkoxy end-capped vinyl polysiloxane of formula II under, 5-10%;
Wherein,
R
4identical or different, and represent C
1-10saturated alkyl;
R
5identical or different, and represent C
1-10saturated alkyl;
R
6identical or different, and expression is selected from substituted or unsubstituted C
1-20saturated alkyl, C
3-10cycloalkyl and C
6-20aryl, wherein substituting group is halogen, preferred chlorine; With
M is integer 0 ~ 50;
C) aluminum oxide, 50 ~ 80%;
D) zinc oxide, 30 ~ 50%; With
E) silane coupling agent, 0.1 ~ 1%;
Wherein component A) to E) each weight percent is all based on component A) to E) total restatement, and component A) to E) the summation of weight percent be 100%.
In one embodiment, described component A) in,
R
1identical or different, and expression is selected from substituted or unsubstituted C
1-8saturated alkyl, C
3-8cycloalkyl and C
6-10aryl, wherein substituting group is halogen;
R
2identical or different, and represent C
1-8saturated alkyl;
R
3identical or different, and represent C
1-10alkoxyl group; With
N is integer 5 ~ 30.
The synthetic method of described organopolysiloxane early has report (US0143490, US5877268, US6673359), but this organic polymer is applied to thermally conductive material then has no report.
In a preferred embodiment, described component A) in,
R
1identical or different, and be selected from: methyl, ethyl, propyl group, hexyl, octadecyl, cyclopentyl, cyclohexyl, phenyl, tolyl, benzyl, chloromethyl and 3-chloropropyl, preferable methyl or phenyl;
R
2identical or different, and be selected from: methyl, ethyl, propyl group, butyl and amyl group, preferable methyl or ethyl;
R
3identical or different, and be selected from: polyoxyethylene groups, polyoxypropylene base, aliphatic alcohol polyethenoxy base and polyoxypropylene ether, preferred polyoxyethylene groups; With
N is integer 5 ~ 30.
In one embodiment, described component A) at 25 DEG C, viscosity is 40 ~ 4000mPas, is preferably 50 ~ 1000mPas.Component A) add-on is 1 ~ 20%, preferably 2 ~ 5%.If consumption is very few, then do not reach the effect that can wash; If consumption is excessive, then composition viscosity is on the low side, easily separates out, and pollutes larger.
In one embodiment, described B component) in,
R
4identical or different, and represent C
1-6saturated alkyl;
R
5identical or different, and represent C
1-6saturated alkyl;
R
6identical or different, and expression is selected from substituted or unsubstituted C
1-8saturated alkyl, C
3-8cycloalkyl and C
6-10aryl, wherein substituting group is halogen; With
M is integer 5 ~ 30.
In a preferred embodiment, described B component) in,
R
4identical or different, and be selected from: methyl, ethyl, propyl group, butyl and amyl group etc., preferable methyl or ethyl;
R
5identical or different, and be selected from: methyl, ethyl, propyl group, butyl and amyl group etc., preferable methyl or ethyl;
R
6identical or different, and be selected from: methyl, ethyl, propyl group, hexyl, octadecyl, cyclopentyl, cyclohexyl, phenyl, tolyl, benzyl, chloromethyl and 3-chloropropyl, preferable methyl or phenyl; With
M is integer 5 ~ 30.
In one embodiment, described B component) at 25 DEG C, viscosity is 40 ~ 4000mPas, is preferably 50 ~ 1000mPas.B component) add-on is 1 ~ 20%, preferably 5 ~ 10%.If consumption is very few, then composition is feeding-up, cannot use; If consumption is excessive, then composition viscosity is on the low side, easily separates out, and pollutes larger.
Described component C) aluminum oxide is the heat conductive filler of this composition.In one embodiment, described component C) aluminum oxide is spherical aluminum oxide.Thisly substantially be preferably 1 ~ 100 μm for spherical its average particle size range of aluminum oxide, more preferably 5 ~ 30 μm.Add-on is 50 ~ 90%, preferably 50 ~ 80%.If consumption is very few, then composition viscosity is on the low side, affects heat-conducting effect; If consumption is excessive, then composition is feeding-up, cannot use.
Described component D) zinc oxide is the heat conductive filler of this composition.In one embodiment, described component D) zinc oxide is the zinc oxide of sheet.This basic its average particle size range of zinc oxide for sheet is preferably 0.1 ~ 50 μm, more preferably 0.5 ~ 10 μm (for aspherical particle, generally there are three kinds of methods to define its particle diameter, i.e. projected diameter, geometry equivalent footpath and equivalent physical footpath, adopt the definition of geometry equivalent footpath herein).Add-on is 20 ~ 70%, preferably 30 ~ 50%.If consumption is very few, then composition viscosity is on the low side, affects heat-conducting effect; If consumption is excessive, then composition is feeding-up, cannot use.
Said components C) aluminum oxide and component D) collocation of zinc oxide uses and can obtain higher thermal conductivity, and the thermal conductivity of the use of the heat conductive filler of independent a kind of component is lower.
In one embodiment, described component E) add-on is 0.1 ~ 10%, preferably 0.1 ~ 1%.
In one embodiment, described component E) be the silane coupling agent represented with following structural formula III:
Wherein,
R
7identical or different, and represent C
1-10saturated alkyl; With
R
8represent C
1-10containing amino saturated hydrocarbyl.
In a preferred embodiment, described component E) in,
R
7identical or different, and be selected from: methyl, ethyl, propyl group, butyl and amyl group, preferable methyl or ethyl; With
R
8be selected from: aminomethyl, aminoethyl, aminopropyl and ammonia butyl, preferred aminoethyl or aminopropyl.
Above-mentioned embodiment and preferred arbitrary combination thereof, all contain within the scope of the invention.
In thermally conductive material composition of the present invention, as required, additive can be added within the scope without prejudice to the object of the present invention, as mineral fillers such as magnesium oxide, boron oxide, boron nitride, silicon carbide, to improve the performance such as thermal conductivity, rheological of composition.
Described thermally conductive material composition is used after conventional equipment can be adopted to adopt methods known in the art mixing.
Thermally conductive material composition of the present invention can be widely used in electric field and electronic applications.Concrete as being applied in the equipment such as heat radiation module, LED illumination and other household electrical appliances.
Below by concrete example, the invention will be further described:
The testing method that the present invention adopts is as follows:
(1) viscosity
Measure (measuring at 25 DEG C) by standard GB/T2794.
(2) oily from degree
Measure by standard HG/T2502.
(3) pollution-free, the evaluation of easily reprocessing, can wash
Oil is from degree lower than 0.5, and represent that polymkeric substance is connected with filler closely, can not separate out, pollution level is little, otherwise, then pollute larger; Thermally conductive material is coated on aluminium base, thermally conductive material cannot by water rinse with × represents, cleaning difficulty is described, not easily reprocesses, thermally conductive material can be represented with zero by water flushing, illustrates and cleans simply, easily reprocess.
Embodiment
The structure composition of the organopolysiloxane used in embodiment and comparative example, alkoxy end-capped vinyl polysiloxane, silane coupling agent is specifically as shown in table 1, and they are all according to principle known in the art and method preparation.
Embodiment 1
The organopolysiloxane (viscosity is about 100mPas) 4 parts of structure I will be had, there is the alkoxy end-capped vinyl polysiloxane (viscosity is about 100mPas) 6 parts of structure II, the ball-aluminium oxide of 20 μm 60 parts, the sheet zinc oxide of 5 μm 40 parts, mix 30min in planetary stirrer after, add the silane coupling agent 0.5 part of structure III, remix obtains thermally conductive material composition after stirring 10min.Oily from degree at test said composition 150 DEG C, and said composition is coated on aluminium base, test washing performance.
Embodiment 2
The organopolysiloxane (viscosity is about 400mPas) 4 parts of structure I will be had, there is the alkoxy end-capped vinyl polysiloxane (viscosity is about 300mPas) 8 parts of structure II, the ball-aluminium oxide of 20 μm 70 parts, the sheet zinc oxide of 5 μm 40 parts, mix 30min in planetary stirrer after, add the silane coupling agent 0.5 part of structure III, remix obtains thermally conductive material composition after stirring 10min.Oily from degree at test said composition 150 DEG C, and said composition is coated on aluminium base, test washing performance.
Embodiment 3
The organopolysiloxane (viscosity is about 500mPas) 5 parts of structure I will be had, there is the alkoxy end-capped vinyl polysiloxane (viscosity is about 400mPas) 8 parts of structure II, the ball-aluminium oxide of 20 μm 70 parts, the sheet zinc oxide of 5 μm 40 parts, mix 30min in planetary stirrer after, add the silane coupling agent 0.5 part of structure III, remix obtains thermally conductive material composition after stirring 10min.Oily from degree at test said composition 150 DEG C, and said composition is coated on aluminium base, test washing performance.
Embodiment 4
The organopolysiloxane (viscosity is about 800mPas) 2 parts of structure I will be had, there is the alkoxy end-capped vinyl polysiloxane (viscosity is about 700mPas) 10 parts of structure II, the ball-aluminium oxide of 20 μm 50 parts, the sheet zinc oxide of 5 μm 50 parts, mix 30min in planetary stirrer after, add the silane coupling agent 0.2 part of structure III, remix obtains thermally conductive material composition after stirring 10min.Oily from degree at test said composition 150 DEG C, and said composition is coated on aluminium base, test washing performance.
Embodiment 5
The organopolysiloxane (viscosity is about 300mPas) 4 parts of structure I will be had, there is the alkoxy end-capped vinyl polysiloxane (viscosity is about 800mPas) 5 parts of structure II, the ball-aluminium oxide of 20 μm 80 parts, the sheet zinc oxide of 5 μm 30 parts, mix 30min in planetary stirrer after, add the silane coupling agent 0.8 part of structure III, remix obtains thermally conductive material composition after stirring 10min.Oily from degree at test said composition 150 DEG C, and said composition is coated on aluminium base, test washing performance.
Comparative example 1
The organopolysiloxane (viscosity is about 100mPas) 1 part of structure I will be had, there is the alkoxy end-capped vinyl polysiloxane (viscosity is about 100mPas) 9 parts of structure II, the ball-aluminium oxide of 20 μm 60 parts, the sheet zinc oxide of 5 μm 40 parts, mix 30min in planetary stirrer after, add the silane coupling agent 0.5 part of structure III, remix obtains thermally conductive material composition after stirring 10min.Oily from degree at test said composition 150 DEG C, and said composition is coated on aluminium base, test washing performance.
Comparative example 2
The organopolysiloxane (viscosity is about 600mPas) 6 parts of structure I will be had, there is the alkoxy end-capped vinyl polysiloxane (viscosity is about 700mPas) 14 parts of structure II, the ball-aluminium oxide of 20 μm 65 parts, the sheet zinc oxide of 5 μm 40 parts, mix 30min in planetary stirrer after, add the silane coupling agent 0.5 part of structure III, remix obtains thermally conductive material composition after stirring 10min.Oily from degree at test said composition 150 DEG C, and said composition is coated on aluminium base, test washing performance.
In embodiment and comparative example, the component of use is summarized in in following table 1:
Table 1 thermally conductive material composition forms
* note: when viscosity is determined, the m in the n in organopolysiloxane and alkoxy end-capped vinyl polysiloxane is also corresponding to be determined.
The performance test results of embodiment and comparative example is summarized in in following table 2:
The performance test of table 2 thermally conductive material composition
Finally illustrate, above embodiment is only in order to illustrate technical scheme of the present invention and unrestricted.Those skilled in the art are not when departing from aim and the scope of technical solution of the present invention, and the amendment carry out technical scheme of the present invention or equivalent replacement, all should be encompassed in the middle of right of the present invention.
Claims (10)
1. a thermally conductive material composition, comprises the component of following weight percent:
A) organopolysiloxane of following structural formula I, 2 ~ 5%;
Wherein,
R
1identical or different, and expression is selected from substituted or unsubstituted C
1-20saturated alkyl, C
3-10cycloalkyl and C
6-20aryl, wherein substituting group is halogen, preferred chlorine;
R
2identical or different, and represent C
1-20saturated alkyl;
R
3identical or different, and represent C
1-40alkoxyl group; With
N is integer 0 ~ 50;
B) the alkoxy end-capped vinyl polysiloxane of following structural formula II, 5-10%;
Wherein,
R
4identical or different, and represent C
1-10saturated alkyl;
R
5identical or different, and represent C
1-10saturated alkyl;
R
6identical or different, and expression is selected from substituted or unsubstituted C
1-20saturated alkyl, C
3-10cycloalkyl and C
6-20aryl, wherein substituting group is halogen, preferred chlorine; With
M is integer 0 ~ 50;
C) aluminum oxide, 50 ~ 80%;
D) zinc oxide, 30 ~ 50%; With
E) silane coupling agent, 0.1 ~ 1%;
Wherein component A) to E) each weight percent is all based on component A) to E) total restatement, and component A) to E) the summation of weight percent be 100%.
2. thermally conductive material composition according to claim 1, is characterized in that, described component A) in,
R
1identical or different, and expression is selected from substituted or unsubstituted C
1-8saturated alkyl, C
3-8cycloalkyl and C
6-10aryl, wherein substituting group is halogen;
R
2identical or different, and represent C
1-8saturated alkyl;
R
3identical or different, and represent C
1-10alkoxyl group; With
N is integer 5 ~ 30;
Described B component) in,
R
4identical or different, and represent C
1-6saturated alkyl;
R
5identical or different, and represent C
1-6saturated alkyl;
R
6identical or different, and expression is selected from substituted or unsubstituted C
1-8saturated alkyl, C
3-8cycloalkyl and C
6-10aryl, wherein substituting group is halogen; With
M is integer 5 ~ 30.
3. thermally conductive material composition according to claim 1 and 2, is characterized in that, described component A) at 25 DEG C, viscosity is 40 ~ 4000mPas, preferably 50 ~ 1000mPas.
4. the thermally conductive material composition according to any one of claims 1 to 3, is characterized in that, described component A) in,
R
1identical or different, and be selected from: methyl, ethyl, propyl group, hexyl, octadecyl, cyclopentyl, cyclohexyl, phenyl, tolyl, benzyl, chloromethyl and 3-chloropropyl, preferable methyl or phenyl;
R
2identical or different, and be selected from: methyl, ethyl, propyl group, butyl and amyl group, preferable methyl or ethyl;
R
3identical or different, and be selected from: polyoxyethylene groups, polyoxypropylene base, aliphatic alcohol polyethenoxy base and polyoxypropylene ether, preferred polyoxyethylene groups; With
N is integer 5 ~ 30.
5. the thermally conductive material composition according to any one of Claims 1-4, is characterized in that, described B component) at 25 DEG C, viscosity is 40 ~ 4000mPas, preferably 50 ~ 1000mPas.
6. the thermally conductive material composition according to any one of claim 1 to 5, is characterized in that, described B component) in,
R
4identical or different, and be selected from: methyl, ethyl, propyl group, butyl and amyl group etc., preferable methyl or ethyl;
R
5identical or different, and be selected from: methyl, ethyl, propyl group, butyl and amyl group etc., preferable methyl or ethyl;
R
6identical or different, and be selected from: methyl, ethyl, propyl group, hexyl, octadecyl, cyclopentyl, cyclohexyl, phenyl, tolyl, benzyl, chloromethyl and 3-chloropropyl, preferable methyl or phenyl; With
M is integer 5 ~ 30.
7. the thermally conductive material composition according to any one of claim 1 to 6, is characterized in that, described component E) be the silane coupling agent represented by following structural formula III:
Wherein,
R
7identical or different, and represent C
1-10saturated alkyl; With
R
8represent C
1-10containing amino saturated hydrocarbyl.
8. thermally conductive material composition according to claim 7, is characterized in that, described component E) in,
R
7identical or different, and be selected from: methyl, ethyl, propyl group, butyl and amyl group, preferable methyl or ethyl; With
R
8be selected from: aminomethyl, aminoethyl, aminopropyl and ammonia butyl, preferred aminoethyl or aminopropyl.
9. the thermally conductive material composition according to any one of claim 1 to 8, is characterized in that, described component C) aluminum oxide is spherical aluminum oxide, its average particle size range is 1 ~ 100 μm, preferably 5 ~ 30 μm; And/or, described component D) zinc oxide is the zinc oxide of sheet, its average particle size range is 0.1 ~ 50 μm, preferably 0.5 ~ 10 μm.
10. the application of thermally conductive material composition in electric field and electronic applications described in any one of claim 1 to 9.
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| CN102504543A (en) * | 2011-12-12 | 2012-06-20 | 广州市白云化工实业有限公司 | Silicon grease composition with high thermal dissipation and preparation method thereof |
| CN104098914A (en) * | 2014-07-02 | 2014-10-15 | 深圳市安品有机硅材料有限公司 | Organosilicone heat-conduction interface material |
| CN104356649A (en) * | 2014-10-22 | 2015-02-18 | 重庆市旭星化工有限公司 | Macromolecule heat conduction material |
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| CN102504543A (en) * | 2011-12-12 | 2012-06-20 | 广州市白云化工实业有限公司 | Silicon grease composition with high thermal dissipation and preparation method thereof |
| CN104098914A (en) * | 2014-07-02 | 2014-10-15 | 深圳市安品有机硅材料有限公司 | Organosilicone heat-conduction interface material |
| CN104356649A (en) * | 2014-10-22 | 2015-02-18 | 重庆市旭星化工有限公司 | Macromolecule heat conduction material |
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| CN115595115A (en) * | 2022-09-08 | 2023-01-13 | 东莞市佳迪新材料有限公司（Cn） | Organic silicon potting gel composition for micro inverter and preparation method thereof |
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