JPH05277914A - Flat plate polishing method and its device - Google Patents

Abstract

PURPOSE:To provide a polishing method in which the surface of a metal or non-metal flat plate, especially a large-size flat plate, to be polished can be precisely and uniformly polished as if it were a specular surface. CONSTITUTION:A flat-plate polishing member 9 is rotated via a crank while pushing against the surface of a flat plate 10 to be polished at a preset pressure to flatly polish time surface of the flat plate 10. Since the polishing member 9 is rotated via the crank while pushing against the surface of the flat plate 10 at a preset pressure in this way, a preset pressure is uniformly distributed over the whole polished surface to allow precise, uniform and specular polishing of the flat plate, if larger.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flat plate polishing method and a device for flatly polishing the surface of a metal plate or a non-metal plate, and particularly to a polishing method and a device suitable for polishing a large flat plate. It is about.

[0002]

2. Description of the Related Art Conventionally, as this type of polishing method,
Various things are implemented as follows. (A) Rotational buff polishing method This method can rotate at a high speed of about 3000 RPM, so the polishing speed is fast, and relatively good uniform polishing can be obtained by applying oscillation. (B) Rotating roll polishing method This method mainly uses felt rolls, has a good working environment and uniform polishing property, and is suitable for wet polishing.
Dry polishing is also possible. (C) True circle rotary lapping polishing method This method has excellent mirror surface resolution of polished mirror surface stainless steel, etc., both wet and dry polishing are possible, working environment is relatively good, and polishing cost is relatively low. is there. Also,
In wet polishing using an oxidizer, a thick non-conducting film is formed on a stainless steel plate and it has excellent corrosion resistance. (D) Multi-axis true circle lapping polishing method This method has the same characteristics as the above-mentioned method (c), but the polishing efficiency is improved by automation. (E) Electrolytic composite polishing method This method is a composite polishing of electrolytic action, mechanical polishing action and chemical polishing action, and has a high polishing rate, excellent uniform polishing property, and can be automated. It is relatively suitable for color stainless steel and etching materials. It can also be applied to other than planar polishing and has a high polishing speed.

[0003]

However, each of the above conventional polishing methods has the following problems. (A) Rotating buff polishing method It is dangerous because it rotates at high speed, and the flat plate to be polished runs, so it is dangerous unless vacuuming or clipping is performed. Due to dry polishing, buff slag and the like scatter around and deteriorate the working environment. Further, since the buffs remain, the mirror surface is not good, and it is not suitable for the mirror surface color stainless steel material and the mirror surface etching stainless steel material, and precise and uniform polishing is impossible.

(B) Rotating roll polishing method The buff surface and the roll surface cannot be completely removed. Since the polishing contact area is small, the polishing speed is slow, and it is dangerous unless the flat plate to be polished is fixed by vacuuming or clipping. A perfect mirror surface is difficult and not suitable for color materials, etching materials and plating materials. In addition, it requires a wastewater treatment facility, which increases equipment costs.

(C) True-Circular Rotation Lapping Polishing Method Since the polishing speed is slow, the polishing efficiency is poor, and the productivity is poor because the operation is complicated. Although it can be applied to mirror-finished stainless steel materials, there are many irregularities in polishing on a microscopic scale. It is unsuitable for mirror-colored stainless steel materials and mirror-etched materials because there are many irregularities, and it causes local corrosion such as pitching on the flat plate to be polished due to localized concentrated wet polishing, and cannot be applied to plated materials, especially gold plated materials.

(D) Multi-axis true circle lapping polishing method In addition to the same drawbacks as the method (c), the equipment cost is high, there are many failures, and complete automation is impossible. Also,
The defect rate is also high.

(E) Electrolytic compound polishing method Only the wet method can be applied, and the operation is complicated. The electric capacity is large, wastewater treatment is difficult, and the equipment cost and running cost are high. Since the mirror surface color after polishing is not preferred and the defective rate is high, the need for correction polishing is high. Even if electrolysis is used in combination, the method (d) is basically used, so there is local and microscopic unevenness, and it is unsuitable for a stainless color material, etching material, and plating material. Due to the combined use of electrolysis, there is a high risk of local corrosion such as pitching.

The above-described drawbacks of the conventional polishing method are particularly remarkable when the flat plate to be polished is large. for that reason,
The methods (a) and (b) do not allow perfect mirror polishing of large flat plates, and the methods (c), (d) and (e) do allow perfect mirror polishing but have many drawbacks. In particular, it is difficult to obtain a good product for a mirror surface color stainless material and a mirror surface etching material. The present invention has been made in view of such conventional problems, and an object thereof is to provide a polishing method and an apparatus therefor, which are excellent in uniform mirror polishing, whatever the flat plate to be polished. To do.

[0009]

In order to achieve the above object, a method of polishing a flat plate according to the present invention is such that a flat plate-shaped polishing member is pressed against the surface of a flat plate to be polished with a predetermined pressure while rotating through a crank. By doing so, the surface of the flat plate is polished. Then, when the polishing member is swung in the direction of the long axis of its rotational movement, the oscillation effect is increased, and better uniform polishing becomes possible. Further, when the polishing member is run in the minor axis direction of its rotary motion, or when the flat plate to be polished is fed in the minor axis direction of the rotary motion of the polish member, productivity is improved. The rotational speed of the polishing member is preferably 50 to 600 rotations per minute. this is,
If it is less than 50 rotations, the polishing effect is poor, and if it exceeds 600 rotations, there is a problem that the mechanism becomes complicated.

In order to carry out the above-mentioned polishing method, the flat plate polishing apparatus of the present invention is provided with a table on the upper surface of which a flat plate to be polished is placed in a horizontal state, and a gate-type frame structure is mounted on the platform. Is erected so as to straddle the upper part of the table, and the polishing head is hung up and down on the portal frame through the elevating means, and the polishing head has a flat plate-shaped polishing member and the polishing member is cranked in a horizontal plane. And a rotating means for rotating the polishing member via the blade. The long axis direction of the rotating motion of the polishing member is the opening direction of the portal frame.

A polishing member protection pad having the same thickness as the flat plate to be polished is provided along the side surface of the flat plate on the upper surface of the table to prevent the polishing member from being damaged by the side edge portion of the flat plate. When the polishing member is a buff, a plurality of grooves for storing the polishing liquid are provided on the polishing surface to prevent the polishing liquid containing the polishing agent from escaping from the polishing surface, and the gate of the polishing member. It is preferable that the width of the mold frame in the open leg direction is made larger than the width of the flat plate to be polished in the open leg direction to enable better uniform polishing. In order to swing the polishing member in the long axis direction of its rotation, a swinging means for swinging the polishing head in the opening leg direction of the portal frame is provided on the portal frame. In order to run the polishing member in the direction of the short axis of its rotational movement, running means is provided for running the portal frame on the pedestal in the direction perpendicular to the leg opening direction. In that case, it is preferable that the traveling means is provided with a lift-up mechanism and a roll-prevention mechanism of a gate type frame to prevent uneven polishing. Further, in order to feed the flat plate to be polished in the short axis direction of the rotary motion of the polishing member, a feeding means for feeding the flat plate to be polished on the table in the direction perpendicular to the opening leg direction of the gate frame is used. Set up.

[0012]

In the present invention having the above-mentioned structure, the flat plate to be ground is placed horizontally on the upper surface of the table, and the polishing head is lowered by the elevating means to press the polishing member against the surface of the flat plate with a predetermined pressure, while rotating means. By rotating the polishing member in the horizontal plane via the crank, the surface of the flat plate is polished. If this flat plate is large, the polishing member will also be large, but just by rotating the large polishing member into a simple circular shape as in the conventional case, the pressure that presses the polishing member against the flat plate will be the center of the polishing surface. Since it concentrates on a portion and is not uniformly distributed over the whole, polishing is not uniform in the central portion and the peripheral portion, and uniform mirror surface polishing cannot be performed. Therefore, in the present invention, by rotating the polishing member through the crank, the pressure for pressing the polishing member against the flat plate is uniformly distributed over the entire polishing surface, and even for a large flat plate, the pressure is uniform. Enables mirror polishing.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. In the polishing apparatus used in this example, as shown in FIGS. 1 and 2, a table 2 was mounted on a pedestal 1.
And the gate frame 3 is erected via the traveling means 4, the polishing head 7 is hung on the gate frame 3 via the swinging means 5 and the elevating means 6, and the polishing head 7 is rotated via the rotating means 8. A polishing member 9 is provided. 10 is a flat plate to be polished.

The pedestal 1 has a rectangular planar shape, and two traveling rails 11 and two rack rails 12 are laid on the upper surface along the long sides. Hereinafter, for convenience of explanation, the long side direction will be referred to as the front-back direction for the entire apparatus, and the short side direction will be referred to as the left-right direction (see FIG. 2). The table 2 is a surface plate for mounting the flat plate 10 to be polished on its upper surface, and is installed horizontally on the pedestal 1. A large rectangular plate is used as the flat plate 10 in FIG. On the upper surface of the table 2, the flat plate 1
A backing plate 13 having the same plate thickness as that of 0 is fixed along the side surface of the flat plate 10 to prevent the polishing member 9 from being damaged by the side edge portion of the flat plate 10. Therefore, the backing plate 1
The width of 3 is set so that the range of motion of the polishing member 9 does not protrude from the pad plate 13. The gate-shaped frame 3 is erected on the traveling rail 11 of the gantry 1 so as to straddle the upper side of the table 2 in the left-right direction, and is driven by the traveling means 4 to travel in the front-rear direction (direction perpendicular to the leg opening direction).

As shown in FIG. 3, the traveling means 4 comprises traveling wheels 14 and traveling gears 15 which are rotatably attached to the legs of the gate frame 3, and further comprises a floating prevention mechanism 16 and a lateral swinging prevention mechanism. 17 is attached. The traveling wheels 14 are
It supports the gate frame 3 and rolls on the traveling rail 11. The traveling gear 15 meshes with the rack rail 12 of the gantry 1 and is rotated by the traveling drive device 18 to drive the gate frame 3. The floating prevention mechanism 16 and the horizontal shaking prevention mechanism 17 each include a floating prevention roller 19 and a horizontal shaking prevention roller 20 rotatably attached to the leg portions, and the floating prevention roller 19 is the lower surface of the pedestal 1. The gate-shaped frame 3 is prevented from floating up from the traveling rail 11 by traveling along it, and the horizontal swing prevention roller 20 travels along the side surface of the traveling rail 11 to prevent the horizontal swing of the gate-shaped frame 3. However, both prevent the occurrence of uneven polishing.

The swinging means 5 supports the swinging plate 22 in the left-right direction (opening direction of the gate type frame 3) by a pair of left and right swing guide members 21 provided on the girder of the gate type frame 3, A rocking cylinder 23 is connected to the rocking plate 22. The elevating means 6 is composed of an elevating cylinder 24 and a pressure adjusting mechanism 25 which are provided on the rocking plate 22 in pairs of right and left, and these suspend the polishing head 7 so as to be vertically movable. The elevating cylinder 24 elevates and lowers the polishing head 7 by moving the piston rod 26 back and forth. The pressure adjusting mechanism 25 includes the swing plate 22.
A suspension rod 28, on which the polishing head 7 is suspended, is vertically inserted into a guide cylinder 27 provided upright, and compressed between an adjusting nut 29 screwed to the upper end of the suspension rod 28 and the bottom of the guide cylinder 27. The spring 30 is interposed, and the lifting cylinder 24 adjusts the polishing pressure that presses the polishing surface of the polishing member 9 against the flat plate 10 against the compression spring 30 by adjusting the adjustment nut 29 to a proper value.

The polishing head 7 has a support beam 31 suspended from a rocking plate 22 via an elevating means 6 between a pair of left and right elevating guide members 32 provided on both legs of the gate frame 3.
The rotating plate 33 is suspended from the supporting beam 31 via the rotating means 8, and the polishing member mounting plate 35 is fixedly mounted on the lower surface of the rotating plate 33 via the cushioning member 34 made of rubber or the like.
The rotating means 8 includes a supporting beam 31 of the polishing head 7 and a rotating plate 33.
The main crank 36 and the two auxiliary cranks 37 are arranged side by side in a line with the main crank 36 at the center.
The rotary drive motor 38 is provided on the top. The upper end of the main crank 36 is connected to the rotary drive motor 38, and the lower end is rotatably connected to the rotary plate 33.
The upper and lower ends of the auxiliary crank 37 are rotatably connected to the support beam 31 and the rotary plate 33, respectively. When the main crank 36 rotates, both auxiliary cranks 37 rotate together with the rotary plate 33, so that the rotary plate 33 rotates. The long axis of the rotary motion of the rotary plate 33 is oriented in the left-right direction (the direction in which the gate frame 3 is opened). Rotary drive motor 3
8 rotates the main crank 36 at a rotational speed of at least 50 revolutions per minute and a maximum of 600 revolutions per minute. If the rotation speed is less than 50 rotations, the polishing effect is poor, and if it exceeds 600 rotations, there is a problem that the mechanism becomes complicated.

The polishing member 9 consists of a rectangular plate-shaped grindstone, Scotch glite, buff, etc., and is removably attached to the lower surface of the polishing member attachment plate 35 of the polishing head 7 and the rotary plate 3
Rotate with 3. The width of the polishing member 9 in the left-right direction (the opening leg direction of the gate frame 3) is set larger than the width of the flat plate 10 to be polished in the left-right direction, which enables uniform polishing. In the case of a buff, the polishing member 9 shown in FIG. 1 is accommodated in a buff case 39, and a plurality of polishing liquid storage concave grooves 40 as shown in FIGS. Is formed. The groove 40 holds the polishing liquid containing the polishing agent with which the polishing surface is impregnated by scraping and holding the polishing liquid at the time of polishing, preventing the polishing liquid from escaping from the polishing surface and gradually polishing the polishing liquid stored during polishing. To improve the polishing efficiency.

The flat plate 10 is a polishing object made of a metal plate such as a stainless plate, a brass plate, an aluminum plate, or a non-metal plate such as a glass plate. The flat plate 10 shown in FIG. 2 is a large rectangular cut plate, which is placed horizontally on the upper surface of the table 2 and the side surfaces of which are fixed by a backing plate 13.

In order to polish the flat plate 10 to be polished by the polishing method of the present invention using the polishing apparatus having the above construction, after the polishing surface of the polishing member 9 is impregnated with the polishing liquid containing the polishing agent, While the polishing head 7 is lowered by the elevating cylinder 24 to press the polishing member 9 against the surface of the flat plate 10 with a predetermined pressure, the rotary driving motor 38 causes the polishing member 9 to rotate in the horizontal plane through the cranks 36 and 37. The predetermined pressure in this case is appropriate to be about 0.5 to 1.5 kg / cm ^2, and is adjusted in advance by tightening or tightening the adjusting nut 29 of the pressure adjusting mechanism 25. Further, the rotation speed of the rotary drive motor 38 is 100 to 4 per minute by the vector inverter control.
It is controlled to 50 rotations, and the rotation radius of each crank 36, 37 is set to about 50 mm.

Then, the rocking plate 23 is moved by the rocking cylinder 23.
At the same time as the polishing head 7 is swung in the left-right direction via 2, the gate drive frame 3 is moved in the front-back direction by the traveling drive device 18. In this case, the swing stroke of the swing cylinder 23 is controlled to 100 to 200 mm by inverter control, and the swing cycle is set to about 6 to 30 strokes per minute. Also, the running speed of the gate frame 3 during polishing is
It is preferably about 1 to 5 m / min. Thus, the polishing member 9 planarly polishes the surface of the flat plate 10 under appropriate conditions. that time,
Since the polishing member 9 rotates through the crank, the pressure with which the polishing member 9 presses the flat plate 10 is evenly distributed over the entire polishing surface, and the polishing member 9 moves along with the polishing head 7.
Since it also swings, the oscillation effect is added, and precise uniform mirror polishing can be performed even on the large flat plate 10.

In this embodiment, the flat plate 10 to be polished is used.
Since the gate plate was used as a cutting plate, the gate-shaped frame 3 was run in the front-back direction, but as another example (not shown), the flat plate 1 to be polished was used.
If 0 is like winding a strip plate in a coil shape, instead of running the gate-shaped frame 3, a feeding means for unwinding the coiled flat plate 10 and feeding it in the front-back direction is provided. Good. As a result, continuous polishing becomes possible and the productivity is remarkably improved.

Next, an example in which a cut plate made of various materials is polished by the polishing method of the present invention will be described. Example 1 Material to be polished: Stainless steel SUS304 bright annealing material (BA
Material) Size: 1.5 mm thickness x 2438 mm x 1219 mm Polishing conditions Method: Buff polishing [ferrous tetroxide (red iron) 40 g /
Use of a compounded abrasive containing 1 and 15% nitric acid] Rotation speed: ²⁰⁰ RPM Travel speed: 300 mm / min Crimping pressure: 1.5 kg / cm ^{2 A} perfect mirror-finished stainless steel plate was obtained by polishing for about 10 minutes. ..
After polishing, washing with a water washing machine and finishing hot water washing were performed, and after drying, a protective tape was attached to finish.

Example 2 Material to be ground: Stainless steel SUS304 material (2B material) Dimension: 1.5 mm thickness x 2438 mm x 1219 mm Polishing condition Method: 1-step grinding wheel grinding (PVA grinding wheel # 800) 2 steps Grinding wheel (using PVA whetstone # 1500) 3-step buffing (using compound abrasive of 60g / l of ferrosoferric oxide and 15% nitric acid) Rotation speed ... 200RPM for both whetstone and buff Running speed ... Whetstone , Buff 150 mm / min Pressure bonding ... Both grindstone and buff 1.5 kg / cm ² 20 minutes × 2 grindstone grinding and 20 minutes buff polishing to obtain a perfectly mirror-finished stainless steel plate. In addition, after grinding with a whetstone, after washing with a water washing machine and finishing mirror surface processing by buff polishing,
After washing with water and finishing hot water with a water washing machine, a protective tape was applied after drying to finish.

Example 3 Material to be Polished Material: Brass Plate with 90% Copper and 10% Zinc Dimensions: 2.0 mm Thickness x 1000 mm x 2000 mm Polishing Conditions Method: Ground Grinding Wheel (PVA Grinding Wheel # 1500 Surface Scratch removal) Finishing buff polishing [using a mixture of Picard (commercially available) and an alumina abrasive] Rotation speed: ²⁰⁰ RPM Travel speed: 300 mm / min Crimping pressure: 1.5 kg / cm ² Perfect mirror brass I got a board. After buffing, stains were removed with a solvent, wiped off, and a protective tape was attached to finish.

Example 4 Material to be Polished Material: An alumite plate (alumite film 27 μm) secondary electrolytically developed in wine red color Dimensions: 3.0 mm thickness × 1000 mm × 2000 mm Polishing conditions Method: Buff polishing [4 40 g / l iron trioxide and 2 alumina
Use of 0 g / l composite abrasive (particle size 2 μm or less)] Rotation speed: ²⁰⁰ RPM Travel speed: 150 mm / min Crimping pressure: 2 kg / cm 2 Average of 1 to ² μm without damaging alumite coating By polishing, it was a lustrous candy-colored wine red color and had a lacquer-like luster like organic matter. Moreover, the coating on the sealed portion did not fall off, and the corrosion resistance did not deteriorate.

The following application examples 1 to 3 are application examples in which the perfect mirror-finished stainless steel plates obtained in Examples 1 and 2 are subjected to coloring, etching and gold plating. Application Example 1 Coloring conditions Coloring agent: sulfuric acid 450 g / l, chromic anhydride 2
50g / l (according to Incocolor method) Liquid temperature ... 80 ° C Treatment process ... Degreasing-Washing-Oxidative color development-Recovery-Water washing-Hardening treatment-Water washing-Finishing water washing-Drying Mirror surface stainless steel obtained by the conventional method The plate had a lot of uneven polishing, and it was not a good product due to uneven coloring.However, the colored stainless steel plate obtained in this application example had almost no uneven coloring, and the difference between the two was clear under visual observation. I was there.

Application Example 2 Etching conditions Etching agent: Ferric chloride solution 46 ° Baume solution, containing 0.5% hydrochloric acid. Liquid temperature ・ ・ ・ 40 ℃ Treatment process ・ ・ ・ Screen printing-Drying-High pressure shower etching (10 minutes) -Washing-Caustic soda film removal-Water washing-
Nitric acid neutralization-washing With a mirror-finished stainless steel plate that has been polished by the conventional method, the thickness of the oxide film produced by the composite abrasive of the abrasive used for polishing and the oxidizing agent is uneven, so it is difficult If it was directly etched without any treatment, uneven etching was caused and a good product was not obtained. On the other hand, in the etched stainless steel plate obtained in this application example, since the oxide film is finished uniformly during polishing, there is almost no etching unevenness, so that a uniform etched product can be obtained without special pretreatment. Was obtained.

Application Example 3 Gold Plating Conditions Gold plating solution ... Hydrochloric acid acidic gold plating solution Liquid temperature ... 40 ° C. Current density ... 3 A / dm Treatment process ... Alkaline electrolytic degreasing-Washing-Activated pickling-
Washing-Flash gold plating (45 seconds) -Recovery-Washing-
Neutralization-Washing-Washing In the conventional perfect circular lapping polishing method, since the buff surface is small and the localized polishing is performed locally, that portion is heated to about 100 ° C by friction heat and pitched with an abrasive such as nitric acid. Local corrosion such as. This can be confirmed with a microscope of about 150 times. Therefore, when the mirror-finished stainless steel plate polished by this method is gold-plated, the state where the luster is partly reduced appears remarkably. However, almost no pitting phenomenon is observed in the mirror-finished stainless steel plate polished by the method of the present invention. Therefore, in this application example, no opaque and cloudy condition is observed on the specular gold-plated stainless steel plate plated with gold (97% purity).

[0030]

Since the present invention is constructed as described above, it has the following advantages. (1) Since the flat plate-shaped polishing member is pressed against the surface of the flat plate to be polished with a predetermined pressure and rotated by a crank, the surface of the flat plate is ground flat, so that the predetermined pressure is uniformly applied to the entire polishing surface. It is distributed and can perform precise uniform mirror polishing even on a large flat plate. Therefore, it is optimal for manufacturing large-sized mirror-colored stainless steel materials, mirror-surface etched stainless steel materials, mirror-surface pure gold plated stainless steel materials, and the like. (2) It is applicable not only to metal plates but also to non-metal plates. (3) When the polishing member is swung in the direction of the long axis of its rotary motion, the oscillation effect is increased, and better uniform mirror polishing is possible. (4) By running the polishing member in the direction of the short axis of its rotational motion, it is possible to efficiently polish an object to be polished on a large-sized cutting plate. (5) When the flat plate to be polished is fed in the short axis direction of the rotary motion of the polishing member, continuous polishing becomes possible when the target to be polished is a strip plate wound in a coil shape. Productivity is significantly improved. (6) In addition, it has the following various advantages. The productivity of manufacturing perfect mirror surface material is significantly superior to the conventional method. The operation and maintenance of the device is very easy and there are few failures. It is an energy-saving type with a relatively small electric capacity, and the running cost is very low. Suitable for both wet and dry types. Although it requires wastewater treatment, it has a better working environment compared to the dry method, and the wastewater treatment is much easier than the electrolytic composite polishing method.

[Brief description of drawings]

FIG. 1 is a front view showing an embodiment of a polishing apparatus used in a polishing method of the present invention.

FIG. 2 is a plan view of FIG.

FIG. 3 is an enlarged view of a traveling device used in the polishing device of FIG.

FIG. 4 is an enlarged front view of a buff used in the polishing apparatus of FIG.

5 is a plan view of the buff shown in FIG.

[Explanation of symbols]

1 Platform 2 Table 3 Gate-type Frame 4 Traveling Means 5 Swinging Means 5 Lifting Means 6 Elevating Means 7 Polishing Heads 8 Rotating Means 9 Polishing Members 10 Flat Plates 13 Abutting Plates 16 Floating Prevention Mechanisms 17 Side Shaking Prevention Mechanisms 40 Abrasive Grooves

 ─────────────────────────────────────────────────── ─── Continued Front Page (72) Inventor Yoshito Yoshihara 830 Misa Ikeda, Onoe Town, Kakogawa City, Hyogo Prefecture (72) Inventor Yasuhiro Sawada 19-5 Shijo Town, Higashi Osaka City, Osaka Prefecture (72) Inventor Kazuo Morishita, Osaka Prefecture Honda Minoru Building, 3-2-24 Karaya-cho, Chuo-ku, Osaka (72) Inventor Tamaki Kurano 5-7-10 Morofuku, Daito City, Osaka Prefecture Bonjour Kimura 302

Claims (13)

[Claims] 1. A method for polishing a flat plate, wherein the flat plate-shaped polishing member is pressed against the surface of the flat plate to be polished by a predetermined pressure to rotate the flat plate to rotate the surface of the flat plate. .. 2. The method of polishing a flat plate according to claim 1, wherein the polishing member is swung in the longitudinal direction of its rotary motion. 3. The method of polishing a flat plate according to claim 1, wherein the polishing member is caused to run in the minor axis direction of its rotary motion. 4. The method of polishing a flat plate according to claim 1, wherein the flat plate to be polished is fed in the minor axis direction of the rotary motion of the polishing member. 5. The rotational speed of the polishing member is 50 rpm.
The method for polishing a flat plate according to claim 1, 2, 3 or 4, wherein the number of rotations is about 600 rotations. 6. A table on which a flat plate to be ground is placed is provided on an upper surface in a horizontal state, and a gate frame is erected on the frame so as to extend over the table. The polishing head is hung up and down via the elevating means, and the polishing head is provided with a flat plate-like polishing member and a rotating means for rotating the polishing member in a horizontal plane through a crank.
A flat plate polishing apparatus, wherein a long axis direction of a rotary motion of the polishing member is set to an opening leg direction of the portal frame. 7. The flat plate polishing apparatus according to claim 6, wherein a polishing member protection pad having the same thickness as the flat plate to be polished is provided on the upper surface of the table along the side surface of the flat plate. 8. The flat plate polishing apparatus according to claim 6, wherein the polishing member is a buff having a plurality of grooves for storing polishing liquid on the polishing surface. 9. The flat plate polishing apparatus according to claim 6, wherein the width of the polishing member in the opening leg direction of the gate frame is larger than the width of the flat plate to be polished in the opening leg direction. 10. The flat-plate polishing apparatus according to claim 6, wherein the gate-shaped frame is provided with rocking means for rocking the polishing head in the opening direction of the gate-shaped frame. 11. A traveling means for traveling the portal frame in a direction at right angles to the direction in which the legs are opened.
The flat plate polishing apparatus described. 12. The flat plate polishing apparatus according to claim 11, wherein the traveling means is provided with a lift-prevention mechanism and a roll-prevention mechanism of a gate frame. 13. The flat plate polishing apparatus according to claim 6, further comprising a feeding means for feeding the flat plate to be polished on the table in a direction perpendicular to the opening leg direction of the portal frame.