CN112757152A

CN112757152A - Wafer grinding device

Info

Publication number: CN112757152A
Application number: CN202011641849.9A
Authority: CN
Inventors: 杨启付; 李天春; 李谦平
Original assignee: Fujian Jiangle Changxing Electronics Co ltd
Current assignee: Fujian Jiangle Changxing Electronics Co ltd
Priority date: 2020-12-31
Filing date: 2020-12-31
Publication date: 2021-05-07

Abstract

The invention discloses a wafer grinding device which comprises a rack, a workbench, a carrier disc, a plurality of grinding discs, a pressurizing mechanism and a driving mechanism, wherein the workbench is arranged on the rack, the carrier disc is detachably connected to the top of the workbench through a chuck mechanism, a plurality of wafer carriers are rotatably connected onto the carrier disc, the grinding discs are arranged above the carrier disc, a plurality of driving motors are arranged on the grinding discs, the output shafts of the driving motors are connected with grinding heads, the grinding heads correspond to the wafer carriers one by one, the pressurizing mechanism is arranged on the rack and used for controlling the lifting of the grinding discs, the driving mechanism is arranged inside the workbench and used for driving the wafer carriers to rotate. The invention can save time and improve production efficiency.

Description

Wafer grinding device

Technical Field

The invention relates to the technical field of wafer processing equipment, in particular to a wafer grinding device.

Background

The wafer needs to be ground during the production process of the crystal resonator so as to enable the wafer to have high parallelism, flatness and surface finish. The existing wafer grinding device can process a plurality of wafers simultaneously and has higher processing efficiency, but before processing, an operator needs to place the wafers on a wafer carrier one by one, and after the processing is finished, the operator needs to take the wafers off the wafer carrier one by one, so that the time consumption is long, and the improvement of the production efficiency is restricted.

Disclosure of Invention

In view of the above, the present invention provides a wafer polishing apparatus to solve the above technical problems.

In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a wafer grinder, includes frame, workstation, carrier dish, a plurality of abrasive disc, loading system and actuating mechanism, the workstation sets up in the frame, the carrier dish passes through chuck mechanism detachably and connects the top of workstation, it has a plurality of wafer carrier to rotate on the carrier dish, the abrasive disc sets up the top of carrier dish, be provided with a plurality of driving motor on the abrasive disc, be connected with the grinding head on driving motor's the output shaft, a plurality of grinding head and a plurality of wafer carrier one-to-one, loading system sets up in the frame, loading system is used for control the lift of abrasive disc, actuating mechanism sets up the inside of workstation, actuating mechanism is used for driving a plurality of the wafer carrier is rotatory.

Further, chuck mechanism includes ring gear and a plurality of latch, the ring gear rotates and sets up in the ring channel at workstation top, the latch rotates and sets up in the ring channel, just the gear portion of latch with the ring gear meshes mutually, the convex column portion of carrier portion of trying to get to the heart of a matter stretches into in the ring channel, rotate the ring gear can make the block portion block of latch is in the draw-in groove on the convex column portion periphery.

Furthermore, the chuck mechanism further comprises a locking spring, one end of the locking spring is connected with the gear ring, the other end of the locking spring is connected with the workbench, and the locking spring enables the clamping block part to be clamped in the clamping groove.

Furthermore, the periphery of the gear ring is connected with a driving lever, one side of the annular groove is provided with a side sliding groove penetrating through the outer surface of the workbench, the driving lever penetrates through the side sliding groove to extend outwards, and the driving lever can move in the side sliding groove.

Furthermore, the driving mechanism comprises a speed reduction motor, a driving gear and a plurality of driven gears, an output shaft of the speed reduction motor is in transmission connection with the driving gear, the driven gears are uniformly distributed on the periphery of the driving gear and are all meshed with the driving gear, prism shafts are coaxially connected to the tops of the driving gear and the driven gears, a driving hole is formed in the lower portion of the wafer carrier, and when the carrier disc is mounted on the workbench, the prism shafts are inserted into the corresponding driving holes.

Furthermore, the middle shaft part of the wafer carrier is positioned in a concave cavity at the top of the carrier disc, a plurality of damping mechanisms are arranged in the concave cavity, the plurality of damping mechanisms correspond to the plurality of wafer carriers one by one, and the damping mechanisms can limit the rotation of the wafer carriers.

Furthermore, the damping mechanism comprises a swing arm, a friction head and an arc-shaped elastic sheet, wherein the swing arm is arranged in the concave cavity in a swinging mode, the friction head is connected with one end of the swing arm, one end of the arc-shaped elastic sheet is connected with the swing arm, the other end of the arc-shaped elastic sheet abuts against a stop column in the concave cavity, and the friction head is tightly abutted against the periphery of the middle shaft part through the arc-shaped elastic sheet.

Furthermore, a cover plate is buckled at the top of the carrier plate, and the wafer carrier penetrates through a through hole in the cover plate and extends upwards.

Further, be provided with vertical actuating mechanism in the frame, vertical actuating mechanism includes vertical slip table, vertical motor and vertical lead screw, vertical slip table is in along longitudinal sliding setting in the frame, vertical lead screw rotates the setting and is in the frame, just vertical lead screw with vertical slip table threaded connection, vertical motor with the one end of vertical lead screw is connected, be provided with horizontal actuating mechanism on the vertical slip table, horizontal actuating mechanism includes horizontal lead screw and horizontal motor, the workstation sets up along lateral sliding on the vertical slip table, horizontal lead screw rotates the setting and is in on the vertical slip table, just horizontal lead screw with workstation threaded connection, horizontal motor with the one end of horizontal lead screw is connected.

The technical scheme can show that the invention has the advantages that: because the wafer grinding device comprises a plurality of carrier discs which are detachably connected to the top of the workbench through the chuck mechanism, an operator can use the wafer grinding device to process the wafers, the wafers to be processed are placed on the vacant carrier discs one by one, and the processed wafers are taken down from the carrier discs, so that the time can be saved, and the production efficiency is improved.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the invention and, together with the description, serve to explain the invention and not to limit the invention.

FIG. 1 is a schematic structural diagram of the present invention.

Fig. 2 is an enlarged view of fig. 1 at B.

Fig. 3 is a schematic sectional view at a-a in fig. 1.

Fig. 4 is an enlarged view at C in fig. 3.

Fig. 5 is a schematic top view of the worktable according to the present invention.

List of reference numerals: the device comprises a frame 1, a base 11, a vertical frame 12, a workbench 2, a lower cavity 21, an annular groove 22, a second connecting column 221, a side sliding groove 23, a carrier disc 3, a wafer carrier 31, a driving hole 311, a middle shaft 312, a damping mechanism 32, a swing arm 321, a friction head 322, an arc-shaped elastic sheet 323, a cavity 33, a cover plate 34, a blocking column 35, a convex shaft 36, a convex column 37, a clamping groove 371, an assembling hole 38, a grinding disc 4, a grinding head 41, a driving motor 42, a pressurizing mechanism 5, a longitudinal driving mechanism 6, a longitudinal sliding table 61, a longitudinal motor 62, a transverse driving mechanism 7, a transverse screw rod 71, a transverse motor 72, a driving mechanism 8, a speed reducing motor 81, a driving gear 82, a driven gear 83, a prism shaft 84, a chuck mechanism 9, a gear ring 91, a first connecting column 911, a clamping tooth 92, a gear part 921, a clamping block.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the following embodiments and accompanying drawings. The exemplary embodiments and descriptions of the present invention are provided to explain the present invention, but not to limit the present invention.

Referring to fig. 1 and fig. 5, a wafer polishing apparatus shown in fig. 1 comprises a frame 1, a worktable 2, a plurality of carrier discs 3, a polishing disc 4, a pressurizing mechanism 5, a longitudinal driving mechanism 6, a transverse driving mechanism 7 and a driving mechanism 8, wherein the frame 1 comprises a base 11 and a vertical frame 12 connected to the top of the rear side of the base 11, the worktable 2 is movably arranged on the frame 1 through the longitudinal driving mechanism 6 and the transverse driving mechanism 7, the carrier discs 3 are detachably connected to the top of the worktable 2 through a chuck mechanism 9, the carrier discs 3 are rotatably connected with a plurality of wafer carriers 31, the polishing disc 4 is arranged above the carrier discs 3, the polishing disc 4 is provided with a plurality of driving motors 42, output shafts of the driving motors 42 are connected with polishing heads 41, the plurality of polishing heads 41 correspond to the plurality of wafer carriers 31 one by one, the pressurizing mechanism 5 is arranged on the vertical frame 12, the pressurizing mechanism 5 is used for controlling the lifting of the grinding disc 4, the driving mechanism 8 is arranged in the lower cavity 21 of the workbench 2, the driving mechanism 8 is used for driving a plurality of wafer carriers 31 to rotate, the rotation directions of the wafer carriers 31 and the grinding disc 4 are opposite, and the rotation speeds are the same. In this embodiment, six wafer carriers 31 are provided, correspondingly, six driving motors 42 and six polishing heads 41 are provided, the pressurizing mechanism 5 employs an air cylinder, and an output end of the air cylinder is connected with a top portion of the polishing disk 4.

As shown in fig. 1, the longitudinal driving mechanism 6 includes a longitudinal sliding table 61, a longitudinal motor 62 and a longitudinal screw rod, the longitudinal sliding table 61 is disposed on the base 11 along the longitudinal sliding direction, the longitudinal screw rod is rotatably disposed on the base 11, and the longitudinal screw rod is in threaded connection with the longitudinal sliding table 61, the longitudinal motor 62 is connected with one end of the longitudinal screw rod, the transverse driving mechanism 7 includes a transverse screw rod 71 and a transverse motor 72, the working table 2 is disposed on the top of the longitudinal sliding table 61 along the transverse sliding direction, the transverse screw rod 71 is rotatably disposed on the longitudinal sliding table 61, the transverse screw rod 71 is in threaded connection with the working table 2, and the transverse motor 72 is connected with one end of the transverse screw rod 71.

As shown in fig. 2 and 5, the chuck mechanism 9 includes a gear ring 91 and a plurality of latches 92, the gear ring 91 is rotatably disposed in the annular groove 22 at the top of the worktable 2, the periphery of the gear ring 91 abuts against the inner peripheral wall of the annular groove 22, the latches 92 are rotatably connected to the bottom wall of the annular groove 22 by a fixed shaft, the gear part 921 of the latches 92 is meshed with the gear ring 91, the plurality of latches 92 are uniformly distributed around the central axis of the gear ring 91, the protruding column 37 at the bottom of the carrier disc 3 extends into the annular groove 22, the periphery of the protruding column 37 is provided with a plurality of slots 371, the plurality of slots 371 correspond to the plurality of latches 92 one by one, the periphery of the gear ring 91 is connected with a shift lever 93, one side of the annular groove 22 is provided with a side sliding groove 23 penetrating through the outer surface of the worktable 2, the shift lever 93 extends outward through the side sliding groove 23, and the shift lever 93 can move, an operator stirs the shifting lever 93 to rotate the gear ring 91, the gear ring 91 drives all the latch gears 92 to rotate, the clamping block portions 922 of all the latch gears 92 are clamped in the corresponding clamping grooves 371 respectively, the carrier disc 3 is fixed on the workbench 2, when the carrier disc 3 is disassembled, the operator only needs to reversely stir the shifting lever 93 to reversely rotate the gear ring 91, the gear ring 91 can drive all the latch gears 92 to reversely rotate, the clamping block portions 922 of all the latch gears 92 are extracted from the corresponding clamping grooves 371, and the operator can disassemble the carrier disc 3 from the workbench 2 at the moment. In this embodiment, five latch teeth 92 are provided.

As shown in fig. 5, the chuck mechanism 9 further includes a plurality of locking springs 94, the locking springs 94 are uniformly distributed around the central axis of the gear ring 91, one end of each locking spring 94 is connected to the first connecting post 911 on the gear ring 91, the other end of each locking spring 94 is connected to the second connecting post 221 in the annular groove 22, and the locking springs 94 enable the clamping block portions 922 to be kept clamped in the clamping grooves 371, so that the carrier plate 3 and the workbench 2 are reliably connected. In the present embodiment, the lock springs 94 are provided with five.

As shown in fig. 2 and 5, the driving mechanism 8 includes a reduction motor 81, a driving gear 82 and a plurality of driven gears 83, the driving gear 82 and the plurality of driven gears 83 are rotatably disposed in the lower cavity 21 of the worktable 2, an output shaft of the reduction motor 81 is in transmission connection with the driving gear 82, the plurality of driven gears 83 are uniformly distributed on the periphery of the driving gear 82, the plurality of driven gears 83 are engaged with the driving gear 82, the driving gear 82 and the plurality of driven gears 83 have the same diameter, the tops of the driving gear 82 and the plurality of driven gears 83 are coaxially connected with prism shafts 84, the plurality of prism shafts 84 are in one-to-one correspondence with the plurality of wafer carriers 31, driving holes 311 are disposed at the lower portions of the wafer carriers 31, and when the carrier plate 3 is mounted on the worktable 2, the prism shafts 84 are inserted into the corresponding driving holes 311. In the present embodiment, the cross sections of the prism shaft 84 and the driving hole 311 are regular pentagons.

As shown in fig. 2, 3 and 4, the central shaft 312 of the wafer carrier 31 is located in the cavity 33 at the top of the carrier plate 3, the lower portion of the wafer carrier 31 is disposed in the assembly hole 38 through a bearing, the top of the carrier plate 3 is fastened with a cover plate 34, the upper portion of the wafer carrier 31 extends upward through a through hole on the cover plate 34, a plurality of damping mechanisms 32 are disposed in the cavity 33, the plurality of damping mechanisms 32 correspond to the plurality of wafer carriers 31 one by one, the damping mechanisms 32 include a pair of swing arms 321, a pair of friction heads 322 and a pair of arc-shaped elastic sheets 323, the pair of swing arms 321 are symmetrically disposed, one ends of the pair of swing arms 321 are respectively sleeved on a pair of protruding shafts 36 in the cavity 33, the pair of friction heads 322 are respectively connected to the other ends of the pair of swing arms 321, the pair of friction heads 322 are disposed oppositely, one ends of the pair of arc-shaped elastic sheets 323 are respectively connected to the pair of, the arc-shaped elastic sheet 323 is made of spring steel, and the arc-shaped elastic sheet 323 is deformed when being pressed during assembly, so that the friction head 322 tightly presses against the periphery of the middle shaft 312 under the elastic force of the arc-shaped elastic sheet 323, so that the wafer carrier 31 cannot rotate freely.

As shown in fig. 1, since the wafer polishing apparatus includes a plurality of carrier plates 3, and the carrier plates 3 are detachably connected to the top of the worktable 2 through the chuck mechanism 9, an operator can use the wafer polishing apparatus to process wafers, place the wafers to be processed on the empty carrier plates 3 one by one, and take the processed wafers off the carrier plates 3, thereby saving time and improving production efficiency.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes may be made to the embodiment of the present invention by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A wafer grinding device is characterized by comprising a rack (1), a workbench (2), a carrier disc (3), a plurality of grinding discs (4), a pressurizing mechanism (5) and a driving mechanism (8), wherein the workbench (2) is arranged on the rack (1), the carrier disc (3) is detachably connected to the top of the workbench (2) through a chuck mechanism (9), the carrier disc (3) is rotatably connected with a plurality of wafer carriers (31), the grinding discs (4) are arranged above the carrier disc (3), the grinding discs (4) are provided with a plurality of driving motors (42), output shafts of the driving motors (42) are connected with grinding heads (41), the grinding heads (41) correspond to the wafer carriers (31) one by one, and the pressurizing mechanism (5) is arranged on the rack (1), the pressurizing mechanism (5) is used for controlling the grinding disc (4) to lift, the driving mechanism (8) is arranged in the workbench (2), and the driving mechanism (8) is used for driving a plurality of wafer carriers (31) to rotate.

2. The wafer grinding device according to claim 1, characterized in that the chuck mechanism (9) comprises a gear ring (91) and a plurality of latch teeth (92), the gear ring (91) is rotatably disposed in an annular groove (22) at the top of the worktable (2), the latch teeth (92) are rotatably disposed in the annular groove (22), a gear portion (921) of the latch teeth (92) is engaged with the gear ring (91), a convex pillar portion (37) at the bottom of the carrier disc (3) extends into the annular groove (22), and the latch portion (922) of the latch teeth (92) can be engaged in a latch groove (371) at the periphery of the convex pillar portion (37) by rotating the gear ring (91).

3. The wafer polishing apparatus according to claim 2, wherein said chuck mechanism (9) further comprises a locking spring (94), one end of said locking spring (94) is connected to said ring gear (91), the other end of said locking spring (94) is connected to said table (2), said locking spring (94) enables said latch portion (922) to maintain a state of being latched in said latch groove (371).

4. The wafer grinding apparatus according to claim 3, wherein a deflector rod (93) is attached to the outer periphery of the ring gear (91), a side of the annular groove (22) is provided with a side sliding groove (23) penetrating the outer surface of the table (2), the deflector rod (93) extends outward through the side sliding groove (23), and the deflector rod (93) is movable within the side sliding groove (23).

5. Wafer grinding apparatus according to claim 4, characterized in that the drive mechanism (8) comprises a reduction motor (81), a driving gear (82) and a number of driven gears (83), the output shaft of the speed reducing motor (81) is in transmission connection with the driving gear (82), a plurality of driven gears (83) are uniformly distributed on the periphery of the driving gear (82), and a plurality of driven gears (83) are meshed with the driving gear (82), the tops of the driving gear (82) and the driven gears (83) are coaxially connected with a prism shaft (84), the lower part of the wafer carrier (31) is provided with a driving hole (311), when the carrier plate (3) is arranged on the worktable (2), the prismatic shafts (84) are inserted in the corresponding driving holes (311).

6. The wafer polishing apparatus as set forth in claim 5 wherein the central shaft portion (312) of the wafer carrier (31) is located in a cavity (33) at the top of the carrier plate (3), the cavity (33) having a plurality of damping mechanisms (32) disposed therein, the plurality of damping mechanisms (32) corresponding to the plurality of wafer carriers (31) one-to-one, the damping mechanisms (32) being capable of restricting the rotation of the wafer carriers (31).

7. The wafer grinding apparatus according to claim 6, wherein the damping mechanism (32) comprises a swing arm (321), a friction head (322), and a curved spring plate (323), the swing arm (321) is swing-disposed in the cavity (33), the friction head (322) is connected to one end of the swing arm (321), one end of the curved spring plate (323) is connected to the swing arm (321), the other end of the curved spring plate (323) abuts against a stop pillar (35) in the cavity (33), and the curved spring plate (323) causes the friction head (322) to tightly abut against the outer periphery of the middle shaft portion (312).

8. The wafer polishing apparatus as set forth in claim 7 wherein a cover plate (34) is fastened to the top of the carrier plate (3), the wafer carrier (31) protruding upward through a through hole in the cover plate (34).

9. The wafer grinding device according to claim 1, characterized in that a longitudinal driving mechanism (6) is provided on the frame (1), the longitudinal driving mechanism (6) comprises a longitudinal sliding table (61), a longitudinal motor (62) and a longitudinal screw rod, the longitudinal sliding table (61) is provided on the frame (1) in a longitudinal sliding manner, the longitudinal screw rod is rotatably provided on the frame (1) and is in threaded connection with the longitudinal sliding table (61), the longitudinal motor (62) is connected with one end of the longitudinal screw rod, a transverse driving mechanism (7) is provided on the longitudinal sliding table (61), the transverse driving mechanism (7) comprises a transverse screw rod (71) and a transverse motor (72), the worktable (2) is provided on the longitudinal sliding table (61) in a transverse sliding manner, the transverse screw rod (71) is rotatably provided on the longitudinal sliding table (61), and the transverse screw rod (71) is in threaded connection with the workbench (2), and the transverse motor (72) is connected with one end of the transverse screw rod (71).