JPH0527715B2 - - Google Patents
Info
- Publication number
- JPH0527715B2 JPH0527715B2 JP63306297A JP30629788A JPH0527715B2 JP H0527715 B2 JPH0527715 B2 JP H0527715B2 JP 63306297 A JP63306297 A JP 63306297A JP 30629788 A JP30629788 A JP 30629788A JP H0527715 B2 JPH0527715 B2 JP H0527715B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- plated
- strip
- nozzle
- masking tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30629788A JPH02153089A (ja) | 1988-12-02 | 1988-12-02 | ストライプめっき条の製造方法および装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30629788A JPH02153089A (ja) | 1988-12-02 | 1988-12-02 | ストライプめっき条の製造方法および装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02153089A JPH02153089A (ja) | 1990-06-12 |
| JPH0527715B2 true JPH0527715B2 (enrdf_load_stackoverflow) | 1993-04-22 |
Family
ID=17955403
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30629788A Granted JPH02153089A (ja) | 1988-12-02 | 1988-12-02 | ストライプめっき条の製造方法および装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02153089A (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4686816B2 (ja) * | 2000-05-30 | 2011-05-25 | 住友電気工業株式会社 | めっき法 |
| US7566390B2 (en) * | 2004-12-15 | 2009-07-28 | Lam Research Corporation | Wafer support apparatus for electroplating process and method for using the same |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5511101A (en) * | 1978-05-15 | 1980-01-25 | Hitachi Cable Ltd | Partial plating method of long-length strip |
| JPS62274092A (ja) * | 1986-05-21 | 1987-11-28 | Hitachi Cable Ltd | 帯状体へのメツキ方法およびメツキ装置 |
-
1988
- 1988-12-02 JP JP30629788A patent/JPH02153089A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02153089A (ja) | 1990-06-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100225909B1 (ko) | 웨이퍼 소잉 장치 | |
| US4264416A (en) | Method for continuous application of strip ribbon or patch-shaped coatings to a metal tape | |
| JPH0527715B2 (enrdf_load_stackoverflow) | ||
| JPH02153090A (ja) | ストライプめっき装置 | |
| JPH02153092A (ja) | 長尺条体へのストライプめっき装置 | |
| JPH02153093A (ja) | ストライプめっき装置 | |
| JPH02153091A (ja) | ストライプめっき装置 | |
| JP2669085B2 (ja) | 金属条体の連続部分めっきシステム | |
| JP2535862B2 (ja) | 部分めっき用ホルダ−およびこれを用いた部分めっき方法 | |
| JP2691487B2 (ja) | ワイヤカット放電加工装置 | |
| JPS62274092A (ja) | 帯状体へのメツキ方法およびメツキ装置 | |
| JP3409635B2 (ja) | テープ状ワークのプラズマクリーニング装置 | |
| JPH02190495A (ja) | ストライプめっき装置 | |
| KR100633766B1 (ko) | 리드프레임의 도금 피막 부분 제거장치 | |
| JPS61160944A (ja) | 半導体装置の製造方法 | |
| JP2007138229A (ja) | ストライプめっき方法及びストライプめっき装置 | |
| JPH03183793A (ja) | ストライプめっき装置 | |
| JPS63247392A (ja) | 部分めつき装置 | |
| KR20220113658A (ko) | 보조용제의 세정 시스템 | |
| JP2580810B2 (ja) | ストライプめっき装置 | |
| JPS6059997B2 (ja) | メツキ装置 | |
| JPH03183794A (ja) | ストライプめっき装置 | |
| JP3429686B2 (ja) | 長尺帯状体用給電装置 | |
| JPH0149797B2 (enrdf_load_stackoverflow) | ||
| CN1023738C (zh) | 阴极射线管面板清洗设备 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |