JPH05275567A - Manufacture of ceramic circuit board for power module - Google Patents
Manufacture of ceramic circuit board for power moduleInfo
- Publication number
- JPH05275567A JPH05275567A JP6820692A JP6820692A JPH05275567A JP H05275567 A JPH05275567 A JP H05275567A JP 6820692 A JP6820692 A JP 6820692A JP 6820692 A JP6820692 A JP 6820692A JP H05275567 A JPH05275567 A JP H05275567A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- silver
- molybdenum alloy
- alloy plate
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、パワーＩＣ、パワート
ランジスター等搭載のモジュールやスイッチ電源用モジ
ュール用回路基板等のパワーモジュール用セラミックス
回路基板の製造方法に係り、特に、セラミックス基板と
銅板とを直接接合して得られる、高品質かつ高性能で安
価に提供されるパワーモジュール用セラミックス回路基
板の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a ceramic circuit board for a power module such as a module equipped with a power IC, a power transistor or the like, or a circuit board for a switch power supply module, and more particularly to a ceramic board and a copper plate. The present invention relates to a method for manufacturing a ceramic circuit board for a power module, which is obtained by direct bonding and is provided with high quality, high performance and low cost.
【０００２】[0002]
【従来の技術】近年、パワーＩＣ、パワートランジスタ
ー等搭載のモジュールやスイッチ電源用モジュールで
は、使用電力が増々増大し、大電力を使用することか
ら、発生する熱量が多く、そのため高温化に対処した高
熱放散性と高信頼性を具備したパワーモジュール用回路
基板が要望されてきた。2. Description of the Related Art In recent years, in a module equipped with a power IC, a power transistor, etc. and a module for a switch power source, the amount of power used has been increased and a large amount of power has been used. There has been a demand for a circuit board for a power module that has high heat dissipation and high reliability.
【０００３】従来、この種のパワーモジュール用回路基
板は、一般に厚さが０．６〜１ｍｍ程度、表面粗さＲａ
が０．５〜０．６μｍ程度のアルミナ基板と、厚さが
０．３〜０．５ｍｍの回路用銅板とを接触させながら、
微量酸素を含む窒素雰囲気中で銅−酸素の共晶温度、即
ち１０６０〜１０９０℃の温度で加熱して直接接合する
ことにより製造された、所謂、ＤＢＣ回路基板が製品化
されている。Conventionally, this kind of power module circuit board generally has a thickness of about 0.6 to 1 mm and a surface roughness Ra.
While contacting an alumina substrate having a thickness of about 0.5 to 0.6 μm with a circuit copper plate having a thickness of 0.3 to 0.5 mm,
A so-called DBC circuit board, which is manufactured by heating at a eutectic temperature of copper-oxygen, that is, a temperature of 1060 to 1090 ° C. and directly bonding in a nitrogen atmosphere containing a small amount of oxygen, has been commercialized.
【０００４】このＤＢＣ回路基板は、アルミナ基板と銅
板との間の接合層が比較的薄く、しかも、銅ないし銅酸
化物から形成されるので、比較的熱放散性に優れるとい
う利点があり、大電力用のモジュール用回路基板として
適用されている。Since this DBC circuit board has a relatively thin bonding layer between the alumina board and the copper plate and is formed of copper or copper oxide, it has the advantage of being relatively excellent in heat dissipation. It is used as a circuit board for power modules.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、上述の
ＤＢＣ回路基板には、次のような欠点があった。 アルミナ基板と銅板との接合力にバラツキがあり、
これが弱い場合には剥離が生ずることがあった。この原
因は、焼成窒素雰囲気中の酸素量の微量コントロールが
難しいことと、アルミナ基板表面の粗さが大きいので接
合層の接触面積が小さいことによると思われる。However, the above-mentioned DBC circuit board has the following drawbacks. There is variation in the bonding force between the alumina substrate and the copper plate,
If it is weak, peeling may occur. It is considered that this is because it is difficult to control the amount of oxygen in the firing nitrogen atmosphere and the contact surface of the bonding layer is small because the surface roughness of the alumina substrate is large.
【０００６】 使用するアルミナ基板の厚みが厚いた
め、熱伝導性が低く、系外への熱放散性が十分でないた
め、熱的問題が発生する。Since the thickness of the alumina substrate used is large, the thermal conductivity is low, and the heat dissipation to the outside of the system is not sufficient, which causes a thermal problem.
【０００７】 基板と銅板との熱膨張係数が大きく異
なるため、両者を接合した回路基板は、ヒートショック
に弱く、例えば半田付け等により、アルミナ基板自体の
クラック、割れが発生したり、アルミナ基板／銅板間で
の剥離が生じることがある。Since the thermal expansion coefficient of the substrate and that of the copper plate are greatly different, the circuit board bonded to each other is vulnerable to heat shock, and cracks or breakage of the alumina substrate itself may occur due to soldering, for example. Peeling between copper plates may occur.
【０００８】このように、従来の回路基板では、いずれ
も品質、性能、価格等の面で問題があった。As described above, all the conventional circuit boards have problems in terms of quality, performance, price and the like.
【０００９】本発明は上記従来の問題点を解決し、ハイ
パワー、大電力用パワーハイブリッド用回路基板として
好適な、高品質、高性能かつ安価なパワーモジュール用
回路基板の製造方法を提供することを目的とする。The present invention solves the above-mentioned conventional problems, and provides a method of manufacturing a high-quality, high-performance and inexpensive power module circuit board suitable as a power hybrid circuit board for high power and large power. With the goal.
【００１０】[0010]
【課題を解決するための手段】請求項１のパワーモジュ
ール用セラミックス回路基板の製造方法は、銅被覆を有
するパターン化した銀−モリブデン合金板と、厚さ３０
〜１５０μｍのアルミナ基板とを積層して、酸素雰囲気
中、１０６５〜１０８５℃に加熱することにより接合す
ることを特徴とする。According to a first aspect of the present invention, there is provided a method of manufacturing a ceramic circuit board for a power module, comprising a patterned silver-molybdenum alloy plate having a copper coating and a thickness of 30.
It is characterized in that an alumina substrate having a thickness of up to 150 μm is laminated and bonded by heating at 1065 to 1085 ° C. in an oxygen atmosphere.
【００１１】請求項２のパワーモジュール用セラミック
ス回路基板の製造方法は、請求項１の方法において、銀
−モリブデン合金板が銀５〜３０重量％を含有すること
を特徴とする。According to a second aspect of the present invention, there is provided a method of manufacturing a ceramic circuit board for a power module according to the first aspect, wherein the silver-molybdenum alloy plate contains 5 to 30% by weight of silver.
【００１２】請求項３のパワーモジュール用セラミック
ス回路基板の製造方法は、請求項１又は２の方法におい
て、アルミナ基板の銀−モリブデン合金板との積層面の
表面粗さＲａが０．２μｍ以下であることを特徴とす
る。According to a third aspect of the present invention, there is provided a method of manufacturing a ceramic circuit substrate for a power module according to the first or second aspect, wherein the surface roughness Ra of the laminated surface of the alumina substrate with the silver-molybdenum alloy plate is 0.2 μm or less. It is characterized by being.
【００１３】以下に本発明を詳細に説明する。本発明に
おいて使用される銀−モリブデン合金板は、例えば、モ
リブデン粉末を焼結して多孔体とし、これに銀を溶浸さ
せることにより製造される複合材料であって、銀とモリ
ブデンとの配合比によりその熱膨張係数をある程度任意
に変えることができる。このような銀−モリブデン合金
板には市販品があり、それを購入して使用することがで
きる。アルミナの熱膨張係数に適応する銀−モリブデン
合金中の銀含有量は、５〜３０重量％の範囲が好適であ
り、特に１０〜３０重量％の範囲が好ましい。The present invention will be described in detail below. The silver-molybdenum alloy plate used in the present invention is, for example, a composite material produced by sintering molybdenum powder into a porous body, and infiltrating silver into the porous body, which is a mixture of silver and molybdenum. The coefficient of thermal expansion can be changed to some extent by the ratio. There are commercial products of such silver-molybdenum alloy plates, which can be purchased and used. The silver content in the silver-molybdenum alloy that is compatible with the coefficient of thermal expansion of alumina is preferably in the range of 5 to 30% by weight, and particularly preferably in the range of 10 to 30% by weight.
【００１４】この銀−モリブデン合金板は、回路用とし
て用いるものであるため、プレスでパターン状に打ち抜
くことにより、或いは、エッチング等によりパターン状
とすることによりパターン化されたものである。このよ
うな銀−モリブデン合金板の厚みは、通常０．３〜０．
５ｍｍ程度であることが好ましいが、この範囲外の厚み
のものであっても良い。Since this silver-molybdenum alloy plate is used for circuits, it is patterned by punching in a pattern with a press or by etching to form a pattern. The thickness of such a silver-molybdenum alloy plate is usually 0.3 to 0.
The thickness is preferably about 5 mm, but the thickness may be outside this range.
【００１５】このような銀−モリブデン合金板は、アル
ミナ基板との接合のために、好ましくは１００μｍ厚さ
程度の銅被覆を施す。銅被覆は電気又は無電界によるめ
っき、更には、スパッタ、イオンプレーティング等によ
り形成することができる。Such a silver-molybdenum alloy plate is preferably coated with copper to a thickness of about 100 μm for bonding with an alumina substrate. The copper coating can be formed by electroplating or electroless plating, and further by sputtering, ion plating or the like.
【００１６】一方、アルミナ基板は厚さ３０〜１５０μ
ｍで、その少なくとも銅被覆銀−モリブデン合金板との
積層面の表面粗さ（以下、単に「表面粗さ」と称す。）
Ｒａが好ましくは０．２μｍ以下のものである。アルミ
ナ基板の厚さが３０μｍ未満であると基板としての機械
的特性を満足し得ず、１５０μｍを超えると本発明によ
る熱放散性の改善効果が十分に得られない。On the other hand, the alumina substrate has a thickness of 30 to 150 μm.
m, the surface roughness of at least the laminated surface with the copper-coated silver-molybdenum alloy plate (hereinafter, simply referred to as "surface roughness").
Ra is preferably 0.2 μm or less. If the thickness of the alumina substrate is less than 30 μm, the mechanical properties of the substrate cannot be satisfied, and if it exceeds 150 μm, the effect of improving the heat dissipation property of the present invention cannot be sufficiently obtained.
【００１７】また、アルミナ基板の表面粗さＲａが０．
２μｍを超えると、アルミナ基板と銅被覆銀−モリブデ
ン合金板との接合層の接触面積が十分に得られず、剥離
の問題を確実に解決し得ない。Further, the surface roughness Ra of the alumina substrate is 0.
If it exceeds 2 μm, the contact area of the bonding layer between the alumina substrate and the copper-coated silver-molybdenum alloy plate cannot be sufficiently obtained, and the problem of peeling cannot be reliably solved.
【００１８】このような極薄フィルム状のアルミナ基板
は、従来のアルミナ粉末法では製造が困難であり、好ま
しくは、水酸化アルミニウムのコロイド物質を出発原料
とする製造法、例えば、アルコキシド加水分解法により
製造するのが有利である。Such an ultrathin film alumina substrate is difficult to manufacture by the conventional alumina powder method, and preferably, a manufacturing method using a colloidal substance of aluminum hydroxide as a starting material, for example, an alkoxide hydrolysis method. It is advantageous to manufacture
【００１９】アルコキシド加水分解法による場合、アル
ミニウムアルコキシドを合成した後、これに水を加えて
加水分解し、ベーマイトを生成させる。更に、これに酸
を添加して解膠させ、超微粒子のコロイドを作製する。
次いで、これに有機バインダーを加えて粘度調整し、成
形乾燥した後、得られたグリーンシートを焼成すること
によって、３０〜１５０μｍという極薄で、しかも、表
面粗さＲａ０．２μｍ以下の緻密なアルミナ基板を得る
ことができる。In the case of the alkoxide hydrolysis method, after synthesizing an aluminum alkoxide, water is added to this to hydrolyze it to form boehmite. Further, an acid is added to this to peptize it to produce a colloid of ultrafine particles.
Then, an organic binder is added to this to adjust the viscosity, and after molding and drying, the obtained green sheet is fired to obtain an extremely thin alumina having a surface roughness Ra of 0.2 μm or less and an ultrathin thickness of 30 to 150 μm. A substrate can be obtained.
【００２０】もちろん、本発明に係るアルミナ基板の製
造方法は、上記アルコキシド加水分解法に何ら限定され
るものでなく、無機塩加水分解法、その他の従来の一般
的な製造方法である粉末法により得たアルミナ基板を必
要に応じて研磨することにより製造することもできる。Of course, the method for producing an alumina substrate according to the present invention is not limited to the above-mentioned alkoxide hydrolysis method, and it is possible to use an inorganic salt hydrolysis method or other conventional general production method such as a powder method. It can also be manufactured by polishing the obtained alumina substrate as needed.
【００２１】銅被覆銀−モリブデン合金板とアルミナ基
板との接合は、銅被覆銀−モリブデン合金板とアルミナ
基板とを積層した状態で加熱することにより、積層面に
銅酸化層を形成させて直接接合することにより行なう。The copper-coated silver-molybdenum alloy plate and the alumina substrate are joined together by directly heating the copper-coated silver-molybdenum alloy plate and the alumina substrate in a laminated state to form a copper oxide layer on the laminated surface. It is done by joining.
【００２２】この加熱接合は、酸化雰囲気中、１０６５
〜１０８５℃で、５〜３０分程度、好ましくは１０〜２
０分程度行なう。なお、加熱時の酸化雰囲気としては、
空気、酸素、或いは、酸素と不活性ガスとの混合ガスが
挙げられる。This heat bonding is performed in an oxidizing atmosphere at 1065.
-1085 ° C, 5-30 minutes, preferably 10-2
Do about 0 minutes. The oxidizing atmosphere during heating is
Air, oxygen, or a mixed gas of oxygen and an inert gas can be used.
【００２３】この加熱接合温度が１０６５℃未満である
と十分な接合強度が得られず、１０８５℃を超えると銅
が融解する。加熱処理後は冷却し、必要に応じて銅被覆
銀−モリブデン合金板の表面に形成された酸化膜を酸処
理等により除去して製品とする。If the heating bonding temperature is lower than 1065 ° C., sufficient bonding strength cannot be obtained, and if it exceeds 1085 ° C., copper is melted. After the heat treatment, the product is cooled and, if necessary, the oxide film formed on the surface of the copper-coated silver-molybdenum alloy plate is removed by acid treatment or the like to obtain a product.
【００２４】[0024]
【作用】本発明においては、厚さ３０〜１５０μｍとい
う超薄型アルミナ基板を用いるため、アルミナ基板によ
る熱伝導性の問題が改善され、系外への熱放散性の高い
セラミックス回路基板が提供される。In the present invention, since an ultrathin alumina substrate having a thickness of 30 to 150 μm is used, the problem of thermal conductivity due to the alumina substrate is improved, and a ceramic circuit board having high heat dissipation to the outside of the system is provided. It
【００２５】しかも、このような超薄型アルミナ基板を
回路基板として銅被覆銀−モリブデン合金板と酸化加熱
接合するため、回路基板とアルミナ基板との熱膨張係数
を同等とすることができ、両板間の熱膨張係数の差に起
因する割れや剥離の問題は解決される。Moreover, since such an ultra-thin alumina substrate is used as a circuit substrate to oxidize and bond it to a copper-coated silver-molybdenum alloy plate, the circuit substrate and the alumina substrate can have the same thermal expansion coefficient. The problems of cracking and peeling due to the difference in the coefficient of thermal expansion between the plates are solved.
【００２６】特に、請求項２の方法によれば、銅被覆銀
−モリブデン合金板の熱膨張係数をアルミナ基板の熱膨
張係数に一致させて、両板間の熱膨張係数の差に起因す
る割れや剥離の問題をより一層確実に防止することがで
きる。In particular, according to the method of claim 2, cracks caused by the difference in the coefficient of thermal expansion between the copper-coated silver-molybdenum alloy plate are made to match the coefficient of thermal expansion of the alumina substrate. The problem of peeling and peeling can be more reliably prevented.
【００２７】特に、請求項３の方法によれば、アルミナ
基板の表面が平滑であるため、銅被覆銀−モリブデン合
金板との接触面積を大きく確保することができ、より一
層接合強度が高められる。In particular, according to the method of claim 3, since the surface of the alumina substrate is smooth, a large contact area with the copper-coated silver-molybdenum alloy plate can be secured, and the bonding strength is further enhanced. .
【００２８】[0028]
【実施例】以下に実施例を挙げて本発明をより具体的に
説明するが、本発明はその要旨を超えない限り、以下の
実施例に限定されるものではない。The present invention will be described in more detail with reference to the following examples, but the present invention is not limited to the following examples as long as the gist thereof is not exceeded.
【００２９】実施例１ 超微粒子のベーマイトゾルを出発原料とし、アルコキシ
ド加水分解法によりアルミナ基板を作製した。具体的に
は、アルミニウムインゴットとアルコールとを反応さ
せ、アルミニウムアルコキシドを合成し、加水分解した
後、更に酸を添加して解膠し、ベーマイトゾルを生成さ
せた。これに有機バインダーを加え、スラリー化した
後、ドクターブレードを通してキャスティングしながら
成形、乾燥してグリーンシートとした。その後、所定の
形状に切断して電気炉で焼成し、表面粗さＲａが０．２
μｍで、厚さ１００μｍの緻密なアルミナ基板を得た。
なお、このようにして得られるアルミナ基板は、微粒子
から構成されているため、厚みが薄くてもピンホールを
生成することがなく、表面粗さが小さく、平滑性が非常
に良いものであった。また、厚さも所望の厚さに容易に
制御することができた。Example 1 Using an ultrafine particle boehmite sol as a starting material, an alumina substrate was prepared by an alkoxide hydrolysis method. Specifically, an aluminum ingot and alcohol were reacted to synthesize an aluminum alkoxide, which was hydrolyzed, and then an acid was further added for peptization to generate a boehmite sol. An organic binder was added to this to make a slurry, which was then molded and dried while casting through a doctor blade to obtain a green sheet. After that, it is cut into a predetermined shape and fired in an electric furnace to have a surface roughness Ra of 0.2.
A dense alumina substrate having a thickness of 100 μm and a thickness of 100 μm was obtained.
Since the alumina substrate thus obtained was composed of fine particles, it did not generate pinholes even when it was thin, had a small surface roughness, and had very good smoothness. .. Moreover, the thickness could be easily controlled to a desired thickness.
【００３０】このアルミナ基板と、電気めっきにより１
００μｍ厚さの銅被覆を形成したパターン状の銀−モリ
ブデン合金板（銀１０重量％，モリブデン９０重量％，
厚さ０．５ｍｍ）とを積層配置して加熱炉内に入れ、酸
素１００ｐｐｍを含む窒素雰囲気中、１０６５℃で２０
分間加熱し、その後冷却した。1 by electroplating with this alumina substrate
Patterned silver-molybdenum alloy plate with a copper coating of 00 μm thickness (silver 10% by weight, molybdenum 90% by weight,
(Thickness 0.5 mm) are placed in a stack and placed in a heating furnace, and at 20 ° C. at 1065 ° C. in a nitrogen atmosphere containing 100 ppm of oxygen.
Heated for minutes and then cooled.
【００３１】このようにして得た回路付きアルミナ基板
は、大電力用のパワーモジュール用セラミックス回路基
板として好適に使用することができた。The alumina substrate with a circuit thus obtained could be suitably used as a ceramic circuit substrate for a power module for high power.
【００３２】実施例２ 実施例１と同様のゾルゲル法により、表面粗さＲａ０．
１μｍ程度で、厚さ５０μｍのアルミナ基板を作製し
た。このアルミナ基板と、１００μｍ厚さの銅被覆を有
するパターン化した銀−モリブデン合金板（銀２０重量
％，モリブデン８０重量％，厚さ０．５ｍｍ）とを積層
してバッチタイプの加熱炉に入れ、酸素５００ｐｐｍ含
有の窒素ガス雰囲気にて１０８０℃で１０分間加熱した
後、冷却した。このようにして得た回路付きアルミナ基
板は、大電力用のパワーモジュール用セラミックス回路
基板として好適に使用することができた。Example 2 By the same sol-gel method as in Example 1, the surface roughness Ra0.
An alumina substrate having a thickness of about 1 μm and a thickness of 50 μm was produced. This alumina substrate and a patterned silver-molybdenum alloy plate having a copper coating with a thickness of 100 μm (20% by weight of silver, 80% by weight of molybdenum, thickness of 0.5 mm) were laminated and placed in a batch type heating furnace. After heating at 1080 ° C. for 10 minutes in a nitrogen gas atmosphere containing 500 ppm of oxygen, it was cooled. The alumina substrate with a circuit thus obtained could be suitably used as a ceramic circuit substrate for power modules for high power.
【００３３】実施例３ 実施例１と同様のゾルゲル法により、表面粗さＲａ０．
０５μｍ程度で、厚さ３０μｍのアルミナ基板を作製し
た。このアルミナ基板と、１００μｍ厚さの銅被覆を有
するパターン化した銀−モリブデン合金板（銀３０重量
％，モリブデン７０重量％，厚さ０．５ｍｍ）とを積層
して連続加熱炉に入れ、酸素２００ｐｐｍ含有の窒素ガ
ス雰囲気にて１０７０℃で１０分間加熱した後、冷却し
た。このようにして得た回路付きアルミナ基板は、大電
力用のパワーモジュール用セラミックス回路基板として
好適に使用することができた。Example 3 By the same sol-gel method as in Example 1, the surface roughness Ra0.
An alumina substrate having a thickness of about 05 μm and a thickness of 30 μm was produced. This alumina substrate and a patterned silver-molybdenum alloy plate (30% by weight of silver, 70% by weight of molybdenum, 0.5 mm in thickness) having a copper coating with a thickness of 100 μm were laminated and placed in a continuous heating furnace to obtain oxygen. After heating at 1070 ° C. for 10 minutes in a nitrogen gas atmosphere containing 200 ppm, it was cooled. The alumina substrate with a circuit thus obtained could be suitably used as a ceramic circuit substrate for power modules for high power.
【００３４】[0034]
【発明の効果】以上詳述した通り、本発明のパワーモジ
ュール用セラミックス回路基板の製造方法によれば、回
路用銅被覆銀−モリブデン合金板とアルミナ基板との接
合強度が強く、また、熱放散性の良い、高信頼性、高性
能、高品質、低コストのパワーモジュール用セラミック
ス回路基板が提供される。As described above in detail, according to the method for manufacturing a ceramic circuit board for a power module of the present invention, the bonding strength between the copper-coated silver-molybdenum alloy plate for a circuit and the alumina board is strong, and the heat dissipation is high. Provided is a ceramic circuit board for power modules, which has good performance, high reliability, high performance, high quality, and low cost.
【００３５】請求項２のパワーモジュール用セラミック
ス回路基板の製造方法によれば、銅被覆銀−モリブデン
合金板とアルミナ基板との熱膨張係数を一致させること
ができ、両板の熱膨張係数の差に起因する割れや剥離の
問題はより一層確実に防止される。According to the method for manufacturing a ceramic circuit board for a power module of claim 2, the thermal expansion coefficients of the copper-coated silver-molybdenum alloy plate and the alumina substrate can be made equal to each other, and the difference in thermal expansion coefficient between the two plates can be made. The problem of cracking and peeling due to the is further reliably prevented.
【００３６】請求項３のパワーモジュール用セラミック
ス回路基板の製造方法によれば、接合強度はより一層改
善される。According to the method for manufacturing a ceramic circuit board for a power module of claim 3, the bonding strength is further improved.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 豊永 敬二 埼玉県秩父郡横瀬町大字横瀬2270番地 三 菱マテリアル株式会社セラミックス研究所 内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Keiji Toyonaga 2270 Yokose, Yokose, Chichibu-gun, Saitama Sanryo Materials Co., Ltd.
Claims (3)
ブデン合金板と、厚さ３０〜１５０μｍのアルミナ基板
とを積層して、酸素雰囲気中、１０６５〜１０８５℃に
加熱することにより接合することを特徴とするパワーモ
ジュール用セラミックス回路基板の製造方法。1. A patterned silver-molybdenum alloy plate having a copper coating and an alumina substrate having a thickness of 30 to 150 μm are laminated and bonded by heating to 1065 to 1085 ° C. in an oxygen atmosphere. A method for manufacturing a ceramic circuit board for a power module, which is characterized.
％を含有することを特徴とする請求項１に記載のパワー
モジュール用セラミックス回路基板の製造方法。2. The method for manufacturing a ceramic circuit board for a power module according to claim 1, wherein the silver-molybdenum alloy plate contains 5 to 30% by weight of silver.
の積層面の表面粗さＲａが０．２μｍ以下であることを
特徴とする請求項１又は２に記載のパワーモジュール用
セラミックス回路基板の製造方法。3. The production of a ceramic circuit board for a power module according to claim 1, wherein the surface roughness Ra of the laminated surface of the alumina substrate with the silver-molybdenum alloy plate is 0.2 μm or less. Method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6820692A JPH05275567A (en) | 1992-03-26 | 1992-03-26 | Manufacture of ceramic circuit board for power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6820692A JPH05275567A (en) | 1992-03-26 | 1992-03-26 | Manufacture of ceramic circuit board for power module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05275567A true JPH05275567A (en) | 1993-10-22 |
Family
ID=13367093
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6820692A Pending JPH05275567A (en) | 1992-03-26 | 1992-03-26 | Manufacture of ceramic circuit board for power module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05275567A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008277716A (en) * | 2007-03-30 | 2008-11-13 | Tdk Corp | Varistor, and light emitting device |
-
1992
- 1992-03-26 JP JP6820692A patent/JPH05275567A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008277716A (en) * | 2007-03-30 | 2008-11-13 | Tdk Corp | Varistor, and light emitting device |
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