JPH05261954A - Substrate for thermal head and manufacture thereof - Google Patents

Substrate for thermal head and manufacture thereof

Info

Publication number
JPH05261954A
JPH05261954A JP6024492A JP6024492A JPH05261954A JP H05261954 A JPH05261954 A JP H05261954A JP 6024492 A JP6024492 A JP 6024492A JP 6024492 A JP6024492 A JP 6024492A JP H05261954 A JPH05261954 A JP H05261954A
Authority
JP
Japan
Prior art keywords
slope
angle
substrate
extension line
thermal head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6024492A
Other languages
Japanese (ja)
Inventor
Koji Kamimoto
浩司 神本
Masako Yamashita
雅子 山下
Kazuko Yamashita
和子 山下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP6024492A priority Critical patent/JPH05261954A/en
Publication of JPH05261954A publication Critical patent/JPH05261954A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electronic Switches (AREA)

Abstract

PURPOSE:To reduce the surface roughness at respective corners of a substrate for thermal head, in which the angle formed by the extension line of the major surface of the substrate and the tilted surface, and the angle formed by the tilted surface and the end surface are different. CONSTITUTION:An angle A formed by the extension line of a major surface 2 and a tilted surface 4, and an angle formed by the extension line of the tilted surface 4 and an end surface 6 are compared, and the corner with a larger angle, i.e., either one of a rubbing area B at a tilted surface major surface side edge 3 or a rubbing area C at a tilted surface end surface side edge 5 is made larger than the other rubbing area.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、サーマルヘッド用基板
及びその製造方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermal head substrate and a method of manufacturing the same.

【0002】[0002]

【従来の技術】以下に主面と端面とが交差する角部に発
熱体を形成するための斜面を有する従来のサーマルヘッ
ド用基板(以下斜面型基板という)について説明する。
2. Description of the Related Art A conventional thermal head substrate (hereinafter referred to as a "slope type substrate") having a slope for forming a heating element at a corner where a main surface and an end surface intersect will be described below.

【0003】図3は従来の斜面型基板の断面図である。
但し基板表面のグレーズ層については省略した。図3に
おいて、1は基板、2は基板1の主面、3は主面2と後
述の斜面4とが交差する斜面主面側エッジ、4は基板1
の斜面、5は斜面4と後述の端面6とが交差する斜面端
面側エッジ、6は基板1の端面、Aは主面2の延長線と
斜面4とのなす角度、Bは斜面主面側エッジの研磨領
域、Cは斜面端面側エッジの研磨領域である。
FIG. 3 is a sectional view of a conventional slope type substrate.
However, the glaze layer on the substrate surface was omitted. In FIG. 3, reference numeral 1 is a substrate, 2 is a main surface of the substrate 1, 3 is an edge of a main surface of a slope where the main surface 2 and a slope 4 described later intersect, and 4 is a substrate 1.
, 5 is an edge of the slope end surface where the slope 4 intersects with an end surface 6 which will be described later, 6 is an end surface of the substrate 1, A is an angle between the extension of the main surface 2 and the slope 4, and B is the main surface side of the slope. An edge polishing area, C is an edge polishing area on the end surface of the inclined surface.

【0004】従来の斜面型基板においては、図3に示す
主面2の延長線と斜面4とのなす角度Aの大きさに関わ
らず研磨領域B,Cの大きさは同じであった。
In the conventional sloped substrate, the sizes of the polishing regions B and C are the same regardless of the size of the angle A formed by the extension line of the main surface 2 shown in FIG. 3 and the slope 4.

【0005】[0005]

【発明が解決しようとする課題】しかしながら上記の従
来の構成では、主面2の延長線と斜面4とのなす角度A
が45度以外の場合は角度Aと斜面4の延長線と端面6
とのなす角度が異なるために、基板1にグレーズ層を形
成したときの斜面主面側エッジ3と斜面端面側エッジ5
における面荒れの状態は同等にはならない。すなわち斜
面4の延長線と端面6とのなす角度のほうが角度Aより
も大きい(角度Aが45度未満)場合には斜面端面側エ
ッジ5において、また逆に角度Aのほうが斜面4の延長
線と端面6とのなす角度よりも大きい(角度Aが45度
より大きい)場合には斜面主面側エッジ3において著し
い面荒れを起こすという課題を有していた。
However, in the above-mentioned conventional configuration, the angle A formed by the extension line of the main surface 2 and the slope 4 is formed.
If the angle is not 45 degrees, the angle A and the extension line of the slope 4 and the end face 6
Since the angle formed by and is different, the slope main surface side edge 3 and the slope end surface side edge 5 when the glaze layer is formed on the substrate 1
The conditions of surface roughness in are not equal. That is, when the angle formed by the extension line of the slope 4 and the end face 6 is larger than the angle A (angle A is less than 45 degrees), the slope end face side edge 5 and conversely, the angle A is the extension line of the slope 4. When the angle is larger than the angle formed by the end surface 6 (angle A is larger than 45 degrees), there is a problem that the surface 3 on the side of the inclined main surface is significantly roughened.

【0006】本発明は上記従来の課題を解決するもの
で、主面の延長線と斜面とのなす角度Aが45度以外の
場合より面荒れの小さい良好な斜面型のサーマルヘッド
用基板及びその製造方法を提供することを目的とする。
The present invention solves the above-mentioned conventional problems, and is a good slope type thermal head substrate with less surface roughness than when the angle A formed by the extension line of the main surface and the slope is other than 45 degrees, and the same. It is intended to provide a manufacturing method.

【0007】[0007]

【課題を解決するための手段】この目的を達成するため
に本発明のサーマルヘッド用基板においては、主面の延
長線と斜面とのなす角度の大きさにより斜面エッジ部分
の研磨領域の大きさが斜面主面側と斜面端面側とで異な
る構成を有している。
In order to achieve this object, in the thermal head substrate of the present invention, the size of the polishing area at the edge portion of the slope is determined by the size of the angle formed between the extension line of the main surface and the slope. Have different configurations on the slope main surface side and the slope end surface side.

【0008】[0008]

【作用】この構成によって、主面の延長線と斜面とのな
す角度が45度未満の場合には斜面端面側エッジ部分で
の面荒れが軽減され、逆に主面の延長線と斜面とのなす
角度が45度より大きい場合には斜面主面側エッジ部分
での面荒れが軽減されて良好なサーマルヘッド用基板が
得られる。
With this structure, when the angle between the extension line of the main surface and the slope is less than 45 degrees, the surface roughness at the edge portion of the slope end face side is reduced, and conversely, the extension line of the main surface and the slope surface are reduced. When the angle formed is greater than 45 degrees, surface roughness at the edge portion of the inclined main surface side is reduced and a good thermal head substrate can be obtained.

【0009】[0009]

【実施例】以下本発明の一実施例について、図面を参照
しながら説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

【0010】図1は本発明の一実施例におけるサーマル
ヘッド用基板の断面図である。但し基板表面のグレーズ
層については省略してある。また図3に示す従来例と同
一箇所には同一符号を付して説明を省略する。本実施例
は主面1の延長線と斜面4とのなす角度Aの方が斜面4
の延長線と端面6とのなす角度よりも大きい場合、すな
わち角度Aが45度未満の場合の実施例で、斜面端面側
エッジ5における研磨領域Cを斜面主面側エッジ3にお
ける研磨領域Bよりも大きくしている。この場合研磨領
域Bについては、なくてもよいことは言うまでもない。
この構成により従来であれば斜面端面側エッジ5の面荒
れが斜面主面側エッジ3の面荒れに比して著しく大きく
なっていたのを防止している。
FIG. 1 is a sectional view of a thermal head substrate in an embodiment of the present invention. However, the glaze layer on the substrate surface is omitted. Further, the same parts as those in the conventional example shown in FIG. In this embodiment, the angle A formed by the extension line of the main surface 1 and the slope 4 is the slope 4
Is larger than the angle formed by the extension line and the end surface 6, that is, the angle A is less than 45 degrees, the polishing area C at the slope end surface side edge 5 is more than the polishing area B at the slope main surface side edge 3. Is also getting bigger. In this case, needless to say, the polishing area B may be omitted.
With this configuration, it is possible to prevent the surface roughness of the edge 5 on the end surface of the slope from becoming significantly larger than that of the edge 3 on the main surface of the slope.

【0011】図2は本発明の他の実施例におけるサーマ
ルヘッド用基板の断面図であり、斜面の延長線と端面と
のなす角度の方が角度Aよりも大きい場合、すなわち角
度Aが45度より大きい場合である。また図3に示す従
来例と同一箇所には同一符号を付して説明を省略する。
本実施例では、斜面主面側エッジ3における研磨領域B
を斜面端面側エッジ5における研磨領域Cよりも大きく
している。この場合研磨領域Cについては、なくてもよ
いことは言うまでもない。この構成により従来であれば
斜面主面側エッジ3の面荒れが斜面端面側エッジ5の面
荒れに比して著しく大きくなっていたのを防止してい
る。
FIG. 2 is a cross-sectional view of a thermal head substrate according to another embodiment of the present invention. When the angle between the extension line of the slope and the end face is larger than the angle A, that is, the angle A is 45 degrees. If it is larger. Further, the same parts as those in the conventional example shown in FIG.
In the present embodiment, the polishing area B on the edge 3 on the main surface side of the inclined surface
Is larger than the polishing region C on the edge 5 on the slope end face side. In this case, it goes without saying that the polishing region C may be omitted. With this configuration, it is possible to prevent the surface roughness of the slope main surface side edge 3 from becoming significantly larger than the surface roughness of the slope end surface side edge 5 in the conventional case.

【0012】以上説明した本発明のサーマルヘッド用基
板は、斜面主面側エッジ3の研磨領域Bと斜面端面側エ
ッジ5の研磨領域Cを研磨する際により大きく研磨する
必要のある研磨領域に対しては研磨回数を多くするかま
たは研磨荷重を大きくすることにより容易に製造するこ
とができる。
The thermal head substrate of the present invention described above is applied to the polishing area B of the edge 3 on the inclined main surface side and the polishing area C of the edge 5 on the end surface of the inclined surface for the polishing area which needs to be largely polished. As a result, it can be easily manufactured by increasing the number of polishing times or increasing the polishing load.

【0013】[0013]

【発明の効果】以上のように本発明は、基板の主面の延
長線と斜面とのなす角度と斜面の延長線と端面とのなす
角度を比較し、角度の大きい角部の斜面上の研磨領域を
大きくすることによって面荒れが小さい斜面型に適した
サーマルヘッド用基板及びその製造方法を実現できるも
のである。
As described above, according to the present invention, the angle formed by the extension line of the main surface of the substrate and the slope is compared with the angle formed by the extension line of the slope and the end face, and the angle on the slope of the large angle portion is compared. By enlarging the polishing area, it is possible to realize a thermal head substrate and a manufacturing method thereof which are suitable for a slope type with small surface roughness.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例におけるサーマルヘッド用基
板の断面図
FIG. 1 is a cross-sectional view of a thermal head substrate according to an embodiment of the present invention.

【図2】本発明の他の実施例におけるサーマルヘッド用
基板の断面図
FIG. 2 is a sectional view of a thermal head substrate according to another embodiment of the present invention.

【図3】従来のサーマルヘッド用基板の断面図FIG. 3 is a sectional view of a conventional thermal head substrate.

【符号の説明】[Explanation of symbols]

1 基板 2 主面 4 斜面 6 端面 A 主面の延長線と斜面とのなす角度 B 斜面主面側エッジの研磨領域(斜面エッジ部分) C 斜面端面側エッジの研磨領域(斜面エッジ部分) 1 Substrate 2 Main surface 4 Sloping surface 6 End surface A Angle formed by extension line of main surface and slope surface B Slope surface of main surface side edge (slope surface edge portion) C Slope surface end surface side edge polishing area (slope surface edge portion)

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】基板の主面と端面とが交差する角部に発熱
体を形成するための斜面を有し、主面の延長線と斜面と
のなす角度および斜面の延長線と端面とのなす角度のう
ち大きい方の角度を形成する角部の斜面エッジ部分が他
方の角部の斜面エッジよりも大きく研磨されたサーマル
ヘッド用基板。
1. A substrate has an inclined surface for forming a heating element at a corner where the main surface and the end surface intersect with each other, and an angle formed by the extension line of the main surface and the inclination surface and an extension line of the slope surface and the end surface. A thermal head substrate in which a beveled edge portion of a corner forming a larger one of the formed angles is polished to be larger than a beveled edge of the other corner.
【請求項2】主面と端面とが交差する角部に発熱体を形
成するための斜面を有し、主面の延長線と斜面とのなす
角度と斜面の延長線と端面とのなす角度が異なるサーマ
ルヘッド用基板の角部を加工する際、前記二つの角度の
うち大きい方の角度を有する角部の斜面エッジ部分の研
磨回数を他方の斜面エッジ部分の研磨回数よりも多くす
るかまたは大きい方の角度を有する角部の斜面エッジ部
分に対する研磨荷重を他方の斜面エッジ部分に対する研
磨荷重よりも大きくするサーマルヘッド用基板の製造方
法。
2. An angle formed by the extension line of the main surface and the slope, and an angle formed by the extension line of the slope and the end face, having a slope for forming a heating element at a corner where the main face and the end face intersect. When processing the corners of the thermal head substrate different from each other, either the number of times of polishing the beveled edge portion of the corner having the larger angle of the two angles is greater than the number of times of polishing of the other beveled edge portion, or A method of manufacturing a substrate for a thermal head, wherein a polishing load on a beveled edge portion of a corner having a larger angle is made larger than a polishing load on another beveled edge portion.
JP6024492A 1992-03-17 1992-03-17 Substrate for thermal head and manufacture thereof Pending JPH05261954A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6024492A JPH05261954A (en) 1992-03-17 1992-03-17 Substrate for thermal head and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6024492A JPH05261954A (en) 1992-03-17 1992-03-17 Substrate for thermal head and manufacture thereof

Publications (1)

Publication Number Publication Date
JPH05261954A true JPH05261954A (en) 1993-10-12

Family

ID=13136573

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6024492A Pending JPH05261954A (en) 1992-03-17 1992-03-17 Substrate for thermal head and manufacture thereof

Country Status (1)

Country Link
JP (1) JPH05261954A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6037961A (en) * 1995-12-12 2000-03-14 Fuji Photo Film Co., Ltd. Thermal printing method and thermal printer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6037961A (en) * 1995-12-12 2000-03-14 Fuji Photo Film Co., Ltd. Thermal printing method and thermal printer

Similar Documents

Publication Publication Date Title
US5021862A (en) Beveled semiconductor silicon wafer and manufacturing method thereof
US5716889A (en) Method of arranging alignment marks
JPH05261954A (en) Substrate for thermal head and manufacture thereof
US5471095A (en) Semiconductor integrated circuit device and method of fabricating same
JPH09321002A (en) Polishing method for semiconductor wafer and polishing template therefor
JP3530493B2 (en) Method for manufacturing semiconductor wafer
JPS6058579B2 (en) Method of manufacturing semiconductor wafers
JPH07328815A (en) Throw away chip
JP2833655B2 (en) Method for manufacturing semiconductor device
JP2001177096A (en) Vertical semiconductor device, and manufacturing method thereof
JPH05267290A (en) Semiconductor integrated circuit and manufacture thereof
JPH03124047A (en) Integrated circuit device
US6188124B1 (en) Semiconductor arrangement preventing damage during contact processing
JPS60116146A (en) Manufacture of semiconductor device
JPS63176001A (en) Transmission line
JP2715716B2 (en) Semiconductor device
JPH05110104A (en) Thin film transistor
JP2517104Y2 (en) Ceramic substrate for semiconductor package
JPH0574770A (en) Semiconductor device
JPS61158158A (en) Manufacture of semiconductor device
JPH03163828A (en) Semiconductor device
JPH02129953A (en) Semiconductor material
JPH02165631A (en) Semiconductor integrated circuit
JPH098441A (en) Semiconductor device
JPH04240567A (en) Semiconductor acceleration sensor