JPH05259310A - Hybrid ic - Google Patents

Abstract

PURPOSE:To facilitate and secure the connection between a ground lead terminal and a shield layer when forming the shield layer 6 of a hybrid IC by dip coating. CONSTITUTION:A protective layer 5 is made by soaking a substrate 1, where electronic part elements 2 and 3 are mounted, in insulating resin bath, in the condition that a conducive material 7 is laid on the ground lead terminal 4a, and a shield layer 6 is made by soaking the said substrate 1 in conductive coating bath, including a bend, after bending the conductive material 7 projecting from the protective layer 5 onto the top side of the protective layer 5.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid IC in which an electronic component element on a substrate is sealed by a protective layer made of an insulating resin and a shield layer is formed on the protective layer. It features a connection structure between the line and the shield layer.

[0002]

2. Description of the Related Art A hybrid IC is mounted on a printed wiring board for use, and its electronic component element is covered with a protective layer of an insulating resin to protect it from the external environment. A shield layer is formed to block the external influence of the electromagnetic wave emitted from the hybrid IC and the external influence on the hybrid IC.

To form the shield layer, there are means for providing an outer case of a metal case and means for applying a conductive substance as disclosed in Japanese Utility Model Laid-Open No. 61-75192. The former has a large shape and is expensive. On the other hand, the latter has the advantage that the entire hybrid IC can be downsized and the manufacturing cost is low.

As the connection structure between the ground line and the shield layer in the latter means, the above-mentioned publication discloses a structure in which a ground chip provided on the ground line between electronic component elements is used.

However, in this technique, since the chip is between the electronic component elements, the arrangement of the electronic component elements is limited, and if the ground chip is made small, the connection with the shield layer becomes uncertain. There is inconvenience.

In view of the above situation, it is an object of the present invention to easily connect the ground line and the shield layer outside the protective layer.

[0007]

In order to solve the above-mentioned problems, according to the present invention, an electronic component element is mounted on a substrate, and a protective layer of an insulating resin is formed on the electronic component element. In a conventionally known hybrid IC having a number of lead terminals protruding from the protective layer and a shield layer formed on the protective layer, a bend electrically connected to the ground lead terminal of the lead terminal and the protective layer. A possible conductive material is provided, and the conductive material is protruded from the protective layer and then bent inward to be interposed between the protective layer and the shield layer and electrically connected to the shield layer. It has been configured.

The hybrid IC thus constructed is
The board on which the electronic component element is mounted is immersed in an insulating resin bath with the conductive material stacked on the ground lead terminal to form the protective layer, and the conductive material protruding from the protective layer is bent on the upper surface of the protective layer. After that, the shield layer including the bent portion may be dipped in a conductive paint bath to form the shield layer.

As the above-mentioned conductive paint for the shield layer, various known ones, for example, the following blends (A) to (D) or (A ') to (E') are used. To do.

Note (A) 100 parts by weight of metallic copper powder surface-coated with 0.05 to 0.2 parts by weight of titanate, zirconate, or a mixture thereof (B) 5 to 33 parts by weight of resol type phenolic resin (C) Amino compound 0.5 to 3.5 parts by weight (D) Chelate layer forming agent 3.0 to 10 parts by weight.

(A ') 100 parts by weight of metal copper powder surface-coated with 0.05 to 0.2 parts by weight of titanate, zirconate, or a mixture thereof (B') 5 to 30 parts by weight of resol type phenolic resin ( C ′) 0.5 to 4 parts by weight of thixotropic adjusting material (D ′) 0.5 to 3.5 parts by weight of amino compound (E ′) 3.0 to 10 parts by weight of chelate layer forming material.

The above-mentioned resol type phenol resin is preferably the following. The 2-1 substitution product, 2,4-2 substitution product, 2,4,6-3 substitution product, methylol group, dimethylene ether, each infrared transmittance of phenyl group is 1, m, n, a, b, When we say c,
Between each transmittance, (a) l / n = 0.8 to 1.2 (b) m / n = 0.8 to 1.2 (c) b / a = 0.8 to 1.2 ( D) A resole-type phenol resin in which the relationship of c / a = 1.2 to 1.5 is established.

The substrate material is an insulating material such as epoxy resin, phenol resin, glass fiber or ceramics. As the conductive material, a bendable and highly conductive material such as copper foil is appropriately used. The details of the conductive paint are described in JP-A-2-1.
See Japanese Patent No. 6172 and Japanese Patent Laid-Open No. 3-6254.

[0014]

Since the grounding conductive material according to the present invention configured as described above is bendable, it can be used as a cland connecting material that can be bent in accordance with the order of dip coating of the protective layer and the shield layer, and the workability is improved. Good and secure connection with the shield layer.

[0015]

EXAMPLE First, 100 parts by weight of dendritic metal copper powder having a specific surface area of 0.4 m ² / g or less and a hydrogen reduction weight loss of 0.25% or less having a particle size of 5 to 10 μm was put into a stirrer to prepare a titanate. Was added little by little and stirred to coat the surface of the metallic copper powder with titanate. Thereafter, the metal copper powder was added to the reducing agent aminophenol, the chelate layer forming agent triethanolamine, the resol type phenol resin described in JP-A-2-16172, and the polyvinyl butyral resin (BM- 1, Sekisui Chemical Co., Ltd.) were mixed in the proportions shown in Table 1, a mixed solvent of ethyl carbitol and butyl cellosolve was added as a solvent, and the mixture was kneaded in place with a triaxial roll for 20 minutes to measure the viscosity by Rion A machine of VT-04 was used to obtain 20 to 40 P to obtain a conductive paint bath.

In place of ethyl carbitol or butyl cellosolve, known ones such as butyl carbitol, butyl carbitol acetate, butyl cellosolve acetate, methyl isobutyl ketone, toluene and xylene can be used.

[0017]

[Table 1]

On the other hand, as shown in FIG. 1, electronic component elements such as various chip components 2 and resistors 3 are mounted or printed on the epoxy resin substrate 1, and a required number of lead terminals 4 ... 4a is projected.

The substrate 1 is dipped in an epoxy resin bath with a copper foil conductive material 7 added to the base 4a 'of the ground lead terminal 4a to form a protective layer 5 having a required thickness. During the dipping, up to the exposed parts (connection parts) of the lead terminals 4, ..., 4a,
In other words, the lead terminal 4 is immersed by immersing it with the connection part left.
Ensure that the space is filled and covered with resin. this is,
This is because the shield layer 6 and the lead terminal 4 which will be described later are not short-circuited.

Subsequently, the protruding portion of the conductive material 7 is covered with the protective layer 5.
The substrate 1 bent to the side (inside) and in that state is dipped in each of the conductive paint baths to form a shield layer 6 having a required thickness.
The immersion depth should not reach the edge of the protective layer 5 on the side of the lead terminals 4 and 4a. At this time, the shield layer 6 is also formed on the conductive material 7, and the ground lead terminal 4 a and the shield layer 6 are electrically connected via the conductive material 7.

In each of the embodiments, the shield layer 6 having a sufficient effect can be obtained, and the conductivity of the shield layer 6 and the ground lead terminal 4a has no problem. In addition, since Examples 5-6 added the thixotropic adjuster, compared with Examples 1-4 which did not add,
No sagging after dip coating.

[0022]

Since the present invention is constructed as described above,
Make sure that the ground line on the board and the shield layer are conductive,
The hybrid IC has good manufacturability, and the manufacturing cost can be reduced.

[Brief description of drawings]

1 is a front view of one embodiment, and b is a sectional view taken along line XX of FIG.

[Explanation of symbols]

 1 substrate 2 chip component 3 resistor 4 lead terminal 4a ground lead terminal 5 protective layer 6 shield layer 7 conductive material

Claims (2)

[Claims] 1. An electronic component element is mounted on a substrate, a protective layer made of an insulating resin is coated on the electronic component element, a required number of lead terminals are projected from the protective layer, and a shield layer is formed on the protective layer. In the formed hybrid IC, a bendable conductive material electrically connected to the terminal is provided between the ground lead terminal of the lead terminal and the protective layer, and the conductive material is bent inward after protruding from the protective layer. Then, the hybrid IC is provided between the protective layer and the shield layer and electrically connected to the shield layer. 2. When manufacturing the hybrid IC according to claim 1, the substrate on which the electronic component element is mounted is immersed in an insulating resin bath in a state where the conductive material is placed on a ground lead terminal, and the protective layer is formed. And a conductive material protruding from the protective layer is bent on the upper surface of the protective layer, and then the substrate including the bent portion is immersed in a conductive paint bath to form the shield layer. IC manufacturing method.