JPH05258787A - Connecting structure of contact pin - Google Patents

Connecting structure of contact pin

Info

Publication number
JPH05258787A
JPH05258787A JP4055028A JP5502892A JPH05258787A JP H05258787 A JPH05258787 A JP H05258787A JP 4055028 A JP4055028 A JP 4055028A JP 5502892 A JP5502892 A JP 5502892A JP H05258787 A JPH05258787 A JP H05258787A
Authority
JP
Japan
Prior art keywords
contact
pin
pad
contact pin
contacting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP4055028A
Other languages
Japanese (ja)
Inventor
Toshiyuki Miyazaki
敏行 宮崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP4055028A priority Critical patent/JPH05258787A/en
Publication of JPH05258787A publication Critical patent/JPH05258787A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps

Landscapes

  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

PURPOSE:To prevent poor performance of contacting by forming a contact pad in the form of a truncated cone, forming a contact pin spirally so as to be fitted on the cone part of the pact, and thereby enlarging the contacting area. CONSTITUTION:A contact pad 13 is made in the form of a truncated cone and installed on one of the electronic circuit boards 11. A contact pin 12 is installed on the other electronic circuit board 10, and the pin tip 12b extending from the mount part 12a of the pin is formed spirally so as to be fitted on the cone part of the pad 13. The pin 12 and pad 13 are contacted by fitting this spiral part, of pin on the cone part of the pail 13, and the two boards 10, 11 are put in electrical connection. Because therein the pin tip 12b contacts the cone part of pad circumferentially, eventual occurrence of poor contacting partially has no problem, as the other parts make good contacting for the total contacting to be well admitted. This prevents generation of poor contacting as a whole and enhances the reliability of electrical connections of the two boards 10, 12.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明はコンタクトピンの接続構
造に関する。詳しくは電子回路基板同士の信号を接続す
る手段として用いられるコンタクトピンの接続構造の改
良に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a contact pin connection structure. More specifically, the present invention relates to improvement of the connection structure of contact pins used as means for connecting signals between electronic circuit boards.

【０００２】現在、可動する電子回路の載った基板同士
の信号を接続する手段としてコンタクトピンによる方法
が用いられている。しかし、使われているコンタクトピ
ンは、平面になっているコンタクトパッドに対し、その
先端が垂直に接触する構造となっているため点接触とな
り、コンタクト不良が発生し易くなる。従ってこのコン
タクト不良に対する対策が必要となっている。At present, a method using contact pins is used as a means for connecting signals between substrates on which movable electronic circuits are mounted. However, the contact pin used has a structure in which the tip of the contact pin is in vertical contact with a contact pad which is flat, so that a point contact occurs, and a contact failure is likely to occur. Therefore, it is necessary to take measures against this contact failure.

【０００３】[0003]

【従来の技術】図２(a) は従来のコンタクトピンとコン
タクトパッドによる接続構造を示す図である。同図にお
いて、１及び２は電子回路基板であり、一方の電子回路
基板１にはコンタクトピン３が設けられ、他方の電子回
路基板２にはコンタクトパッド４が設けられている。そ
してコンタクトピン３は、その伸縮できる可動部３ａが
ばね５によって押し出されるように付勢されており、そ
のばね力によってコンタクトパッド４に接触している。2. Description of the Related Art FIG. 2 (a) is a view showing a conventional connection structure using contact pins and contact pads. In the figure, reference numerals 1 and 2 denote electronic circuit boards. One electronic circuit board 1 is provided with contact pins 3, and the other electronic circuit board 2 is provided with contact pads 4. The contact pin 3 is urged by the spring 5 so that the movable portion 3a that can expand and contract is pushed out, and is in contact with the contact pad 4 by the spring force.

【０００４】[0004]

【発明が解決しようとする課題】上記従来のコンタクト
ピンの接続構造では、コンタクトピン３とコンタクトパ
ッド４との接触が図２(b) の如く点接触であるため、接
触部分の接触状態が悪いと接触不良の発生する確率が高
くなり、接触部分の接触抵抗が大となったり、さらには
導通が無くなるという問題が生じていた。In the conventional contact pin connection structure described above, the contact between the contact pin 3 and the contact pad 4 is a point contact as shown in FIG. Therefore, there is a problem that the probability of occurrence of contact failure is increased, the contact resistance of the contact portion is increased, and the conduction is lost.

【０００５】本発明は、接触部分の接触方法を改善し、
接触面積を多く取ることにより接触不良の発生を防止し
たコンタクトピンの接続構造を実現しようとする。The present invention improves the contact method of the contact portion,
It aims to realize a contact pin connection structure that prevents occurrence of contact failure by taking a large contact area.

【０００６】[0006]

【課題を解決するための手段】本発明のコンタクトピン
の接続構造に於いては、コンタクトピンをコンタクトパ
ッドに接触させて電気的導通をとるコンタクトピンの接
続構造において、上記コンタクトパッド１３を円錐台状
に形成し、コンタクトピン１２を前記コンタクトパッド
１３の円錐部に嵌合するように螺旋状に形成して成るこ
とを特徴とする。According to the contact pin connection structure of the present invention, in the contact pin connection structure in which the contact pin is brought into contact with the contact pad for electrical conduction, the contact pad 13 is a truncated cone. The contact pin 12 is formed in a spiral shape so as to fit into the conical portion of the contact pad 13.

【０００７】また、それに加えて、上記螺旋状のコンタ
クトピン１２は、ばね性を有することを特徴とする。ま
た、それに加えて、上記コンタクトピン１２及びコンタ
クトパッド１３は、銅又は銅合金で形成され、表面に金
めっきが施されて成ることを特徴とする。この構成を採
ることに依り、接触部分の接触方法を改善し、接触面積
を多く取ることにより接触不良の発生を防止したコンタ
クトピンの接続構造が得られる。In addition to that, the spiral contact pin 12 is characterized by having a spring property. Further, in addition to the above, the contact pin 12 and the contact pad 13 are formed of copper or a copper alloy, and have a surface plated with gold. By adopting this configuration, a contact pin connection structure can be obtained in which a contact method of a contact portion is improved and a large contact area is taken to prevent occurrence of contact failure.

【０００８】[0008]

【作用】本発明では、図１の如く、螺旋状に形成された
コンタクトピン１２を円錐状のコンタクトパッド１３に
接触させると、コンタクトピン１２はコンタクトパッド
１３の円錐面に円周状に当たる。そしてコンタクトピン
１２は一部で接触不良となっても円周状の他の部分で接
触可能となる為、全体が接触不良となる確率は少なく、
従って接触不良は防止される。In the present invention, when the contact pin 12 formed in a spiral shape is brought into contact with the conical contact pad 13 as shown in FIG. 1, the contact pin 12 hits the conical surface of the contact pad 13 in a circular shape. Further, even if the contact pin 12 has a poor contact in one part, it can be contacted in the other part in the circumferential shape, so that the probability of a poor contact in the whole is small,
Therefore, poor contact is prevented.

【０００９】[0009]

【実施例】図１は本発明の実施例を示す図であり、(a)
はコンタクトピンとコンタクトパッドを分離した状態、
(b) はコンタクトピンとコンタクトパッドを接触させた
状態、(c) は接触点を示す図である。同図において、１
０，１１は電子回路基板、１２はコンタクトピン、１３
はコンタクトパッドを示している。そしてコンタクトパ
ッド１３は円錐台状に形成され、一方の電子回路基板１
１に取り付けられている。またコンタクトピン１２は他
方の電子回路基板１０に取り付けられ、その取り付け部
１２ａより延びたピン部１２ｂは、コンタクトパッド１
３の円錐部に嵌合できるように螺旋状に形成されてい
る。EXAMPLE FIG. 1 is a diagram showing an example of the present invention, (a)
Is a state where the contact pin and the contact pad are separated,
(b) is a state in which a contact pin and a contact pad are in contact with each other, and (c) is a diagram showing a contact point. In the figure, 1
0, 11 are electronic circuit boards, 12 are contact pins, 13
Indicates a contact pad. The contact pad 13 is formed in a truncated cone shape, and the one electronic circuit board 1
It is attached to 1. The contact pin 12 is attached to the other electronic circuit board 10, and the pin portion 12b extending from the attaching portion 12a is the contact pad 1.
It is formed in a spiral shape so that it can be fitted into the conical portion of 3.

【００１０】そして、コンタクトピン１２とコンタクト
パッド１３は、銅又は銅合金等の良導電材料で形成さ
れ、その表面には金めっきを施しておくことが好まし
い。またコンタクトピン１２には弾性を付与しておくこ
とが好ましい。このように形成されたコンタクトピン１
２及びコンタクトパッド１３は図１(b) に示すように、
コンタクトパッド１３の円錐部にコンタクトピン１２の
螺旋状部を嵌合させて接触させ、２枚の電子回路基板１
０，１１を電気的に接続することができる。The contact pins 12 and the contact pads 13 are preferably made of a good conductive material such as copper or copper alloy, and their surfaces are preferably plated with gold. It is preferable that the contact pin 12 has elasticity. Contact pin 1 formed in this way
2 and the contact pad 13 are as shown in FIG. 1 (b).
The spiral portion of the contact pin 12 is fitted into and brought into contact with the conical portion of the contact pad 13 so that the two electronic circuit boards 1
0 and 11 can be electrically connected.

【００１１】本実施例によれば、コンタクトピン１２の
螺旋状のピン部１２ｂはコンタクトパッド１３の円錐部
に円周状に当接するため、一部に接触不良が生じても他
の部分で接触しているため、全体としての接触は良好と
なる。According to this embodiment, since the spiral pin portion 12b of the contact pin 12 abuts on the conical portion of the contact pad 13 in a circumferential shape, even if a contact failure occurs in one part, the contact is made in another part. Therefore, the contact as a whole is good.

【００１２】[0012]

【発明の効果】本発明に依ればコンタクトパッドを円錐
状に形成し、コンタクトピンのピン部を螺旋状とするこ
とにより接触面積を大きくとることができ、接触不良の
発生を防止することができ、２枚の電子回路基板の電気
的接続において、信頼性の向上に寄与することができ
る。According to the present invention, the contact pad can be formed in a conical shape, and the pin portion of the contact pin can be formed in a spiral shape, so that a large contact area can be obtained and contact failure can be prevented. It is possible to contribute to the improvement of reliability in the electrical connection between the two electronic circuit boards.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の実施例を示す図で、(a) はコンタクト
ピンとコンタクトパッドを分離した状態、(b) はコンタ
クトピンとコンタクトパッドを接触させた状態、(c) は
接触点をそれぞれ示す図である。FIG. 1 is a view showing an embodiment of the present invention, (a) shows a state in which a contact pin and a contact pad are separated, (b) shows a state in which a contact pin and a contact pad are in contact, and (c) shows a contact point, respectively. It is a figure.

【図２】従来のコンタクトピンとコンタクトパッドによ
る接続構造を示す図である。FIG. 2 is a diagram showing a conventional connection structure using contact pins and contact pads.

【符号の説明】[Explanation of symbols]

１０，１１…電子回路基板 １２…コンタクトピン １２ａ…コンタクトピンの取付部 １２ｂ…コンタクトピンのピン部 １３…コンタクトパッド 10, 11 ... Electronic circuit board 12 ... Contact pin 12a ... Contact pin mounting portion 12b ... Contact pin pin portion 13 ... Contact pad

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０１Ｒ 13/04 Ａ 7129−5Ｅ 13/11 Ｂ 7129−5Ｅ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Internal reference number FI Technical indication H01R 13/04 A 7129-5E 13/11 B 7129-5E

Claims (3)

【特許請求の範囲】[Claims] 【請求項１】 コンタクトピンをコンタクトパッドに接
触させて電気的導通をとるコンタクトピンの接続構造に
おいて、 上記コンタクトパッド（１３）を円錐台状に形成し、コ
ンタクトピン（１２）を前記コンタクトパッド（１３）
の円錐部に嵌合するように螺旋状に形成して成ることを
特徴とするコンタクトピンの接続構造。1. A contact pin connection structure for bringing a contact pin into contact with a contact pad for electrical conduction, wherein the contact pad (13) is formed into a truncated cone shape, and the contact pin (12) is formed into the contact pad ( 13)
A contact pin connection structure, characterized in that it is formed in a spiral shape so as to fit into the conical part of the contact pin. 【請求項２】 上記螺旋状のコンタクトピン（１２）
は、ばね性を有することを特徴とする請求項１のコンタ
クトピンの接続構造。2. The spiral contact pin (12).
Has a spring property, and the contact pin connection structure according to claim 1. 【請求項３】 上記コンタクトピン（１２）及びコンタ
クトパッド（１３）は、銅又は銅合金で形成され、表面
に金めっきが施されて成ることを特徴とする請求項１の
コンタクトピンの接続構造。3. The contact pin connection structure according to claim 1, wherein the contact pin (12) and the contact pad (13) are formed of copper or a copper alloy, and the surface of which is plated with gold. ..
JP4055028A 1992-03-13 1992-03-13 Connecting structure of contact pin Withdrawn JPH05258787A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4055028A JPH05258787A (en) 1992-03-13 1992-03-13 Connecting structure of contact pin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4055028A JPH05258787A (en) 1992-03-13 1992-03-13 Connecting structure of contact pin

Publications (1)

Publication Number Publication Date
JPH05258787A true JPH05258787A (en) 1993-10-08

Family

ID=12987219

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4055028A Withdrawn JPH05258787A (en) 1992-03-13 1992-03-13 Connecting structure of contact pin

Country Status (1)

Country Link
JP (1) JPH05258787A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003036908A (en) * 2001-07-25 2003-02-07 Nec Corp Contact terminal for surface mounting, printed circuit board using this terminal, and portable information terminal

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003036908A (en) * 2001-07-25 2003-02-07 Nec Corp Contact terminal for surface mounting, printed circuit board using this terminal, and portable information terminal
JP4613457B2 (en) * 2001-07-25 2011-01-19 日本電気株式会社 Contact terminal for surface mounting, printed circuit board using the terminal, and portable information terminal device

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Legal Events

Date Code Title Description
A300 Withdrawal of application because of no request for examination

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 19990518