JPH0525256Y2 - - Google Patents
Info
- Publication number
- JPH0525256Y2 JPH0525256Y2 JP1989001017U JP101789U JPH0525256Y2 JP H0525256 Y2 JPH0525256 Y2 JP H0525256Y2 JP 1989001017 U JP1989001017 U JP 1989001017U JP 101789 U JP101789 U JP 101789U JP H0525256 Y2 JPH0525256 Y2 JP H0525256Y2
- Authority
- JP
- Japan
- Prior art keywords
- reflector
- lead frame
- led
- resin
- cup
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011347 resin Substances 0.000 claims description 23
- 229920005989 resin Polymers 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 9
- 238000000465 moulding Methods 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 8
- 239000000463 material Substances 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989001017U JPH0525256Y2 (US07534539-20090519-C00280.png) | 1989-01-09 | 1989-01-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989001017U JPH0525256Y2 (US07534539-20090519-C00280.png) | 1989-01-09 | 1989-01-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0292954U JPH0292954U (US07534539-20090519-C00280.png) | 1990-07-24 |
| JPH0525256Y2 true JPH0525256Y2 (US07534539-20090519-C00280.png) | 1993-06-25 |
Family
ID=31200537
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989001017U Expired - Lifetime JPH0525256Y2 (US07534539-20090519-C00280.png) | 1989-01-09 | 1989-01-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0525256Y2 (US07534539-20090519-C00280.png) |
-
1989
- 1989-01-09 JP JP1989001017U patent/JPH0525256Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0292954U (US07534539-20090519-C00280.png) | 1990-07-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4341951B2 (ja) | 発光ダイオード及びそのパッケージ構造 | |
| JP4504662B2 (ja) | Ｌｅｄランプ | |
| JP3964590B2 (ja) | 光半導体パッケージ | |
| US4529907A (en) | Light emitting display device | |
| TW200305291A (en) | Light emitting diode, LED lighting module, and lamp apparatus | |
| US20090289274A1 (en) | Package structure of light emitting diode and method of manufacturing the same | |
| JP2006093470A (ja) | リードフレーム、発光装置、発光装置の製造方法 | |
| JP3685057B2 (ja) | Ｌｅｄランプ及びその製造方法 | |
| JPS62229883A (ja) | フオトインタラプタ | |
| JP2001111115A (ja) | 半導体発光装置 | |
| JP2007300018A (ja) | Ｌｅｄデバイス | |
| US7589354B2 (en) | Light emitting diode package and process of making the same | |
| JPH0525256Y2 (US07534539-20090519-C00280.png) | ||
| JPH0525257Y2 (US07534539-20090519-C00280.png) | ||
| WO2007013774A1 (en) | Light emitting device package structure, method of manufacturing the light emitting device package structure, and method of manufacturing light emitting device adopting the same | |
| JPH06177427A (ja) | 発光ダイオードランプ | |
| JPH0639467Y2 (ja) | Ｌｅｄ表示素子 | |
| JPH0525255Y2 (US07534539-20090519-C00280.png) | ||
| JPH0563068U (ja) | 樹脂封止型発光体 | |
| US6677707B1 (en) | Side-emitting surface mounted light emitting diode | |
| JPH05136463A (ja) | Ｌｅｄ用リードフレーム | |
| JP2519504Y2 (ja) | 発光ダイオード | |
| JPH06216412A (ja) | Ｌｅｄの製造方法 | |
| JPH09232637A (ja) | リードフレームおよび発光素子の製法 | |
| JP2951099B2 (ja) | 発光ダイオード |
