JPH0524658B2 - - Google Patents

Info

Publication number
JPH0524658B2
JPH0524658B2 JP58112843A JP11284383A JPH0524658B2 JP H0524658 B2 JPH0524658 B2 JP H0524658B2 JP 58112843 A JP58112843 A JP 58112843A JP 11284383 A JP11284383 A JP 11284383A JP H0524658 B2 JPH0524658 B2 JP H0524658B2
Authority
JP
Japan
Prior art keywords
film
opening
insulating film
conductive layer
insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58112843A
Other languages
English (en)
Japanese (ja)
Other versions
JPS605514A (ja
Inventor
Masao Iwase
Masaki Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP58112843A priority Critical patent/JPS605514A/ja
Publication of JPS605514A publication Critical patent/JPS605514A/ja
Publication of JPH0524658B2 publication Critical patent/JPH0524658B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10D64/011—

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP58112843A 1983-06-24 1983-06-24 半導体装置の製造方法 Granted JPS605514A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58112843A JPS605514A (ja) 1983-06-24 1983-06-24 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58112843A JPS605514A (ja) 1983-06-24 1983-06-24 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS605514A JPS605514A (ja) 1985-01-12
JPH0524658B2 true JPH0524658B2 (en:Method) 1993-04-08

Family

ID=14596917

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58112843A Granted JPS605514A (ja) 1983-06-24 1983-06-24 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS605514A (en:Method)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63190357A (ja) * 1987-02-02 1988-08-05 Matsushita Electronics Corp 半導体装置の製造方法
JPH02135584U (en:Method) * 1989-04-17 1990-11-09
JPH04127523A (ja) * 1990-09-19 1992-04-28 Nec Corp 半導体装置の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5772321A (en) * 1980-10-24 1982-05-06 Toshiba Corp Manufacture of seiconductor device
JPS5818965A (ja) * 1981-07-28 1983-02-03 Toshiba Corp 半導体装置の製造方法

Also Published As

Publication number Publication date
JPS605514A (ja) 1985-01-12

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