JPH0524658B2 - - Google Patents
Info
- Publication number
- JPH0524658B2 JPH0524658B2 JP58112843A JP11284383A JPH0524658B2 JP H0524658 B2 JPH0524658 B2 JP H0524658B2 JP 58112843 A JP58112843 A JP 58112843A JP 11284383 A JP11284383 A JP 11284383A JP H0524658 B2 JPH0524658 B2 JP H0524658B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- opening
- insulating film
- conductive layer
- insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11284383A JPS605514A (ja) | 1983-06-24 | 1983-06-24 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11284383A JPS605514A (ja) | 1983-06-24 | 1983-06-24 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS605514A JPS605514A (ja) | 1985-01-12 |
JPH0524658B2 true JPH0524658B2 (enrdf_load_stackoverflow) | 1993-04-08 |
Family
ID=14596917
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11284383A Granted JPS605514A (ja) | 1983-06-24 | 1983-06-24 | 半導体装置の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS605514A (enrdf_load_stackoverflow) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63190357A (ja) * | 1987-02-02 | 1988-08-05 | Matsushita Electronics Corp | 半導体装置の製造方法 |
JPH02135584U (enrdf_load_stackoverflow) * | 1989-04-17 | 1990-11-09 | ||
JPH04127523A (ja) * | 1990-09-19 | 1992-04-28 | Nec Corp | 半導体装置の製造方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5772321A (en) * | 1980-10-24 | 1982-05-06 | Toshiba Corp | Manufacture of seiconductor device |
JPS5818965A (ja) * | 1981-07-28 | 1983-02-03 | Toshiba Corp | 半導体装置の製造方法 |
-
1983
- 1983-06-24 JP JP11284383A patent/JPS605514A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS605514A (ja) | 1985-01-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0063916B1 (en) | Semiconductor intregrated circuits and manufacturing process thereof | |
US5093273A (en) | Method of manufacturing a semiconductor device | |
US4149307A (en) | Process for fabricating insulated-gate field-effect transistors with self-aligned contacts | |
US5677237A (en) | Process for removing seams in tungsten plugs | |
JPH0358173B2 (enrdf_load_stackoverflow) | ||
JPS58176975A (ja) | 集積mos電界効果トランジスタ回路の製造方法 | |
JPS615580A (ja) | 半導体装置の製造方法 | |
JPH07120795B2 (ja) | 半導体デバイスの製作方法 | |
JPS6144470A (ja) | 集積回路チップにおける金属充填方法 | |
EP0513639A2 (en) | Semiconductor field effect transistor device and fabrication thereof | |
JPS594057A (ja) | コンタクトホ−ル形成方法 | |
US4504333A (en) | Method of making field oxide regions | |
JPH0524658B2 (enrdf_load_stackoverflow) | ||
US4697328A (en) | Method of making hardened NMOS sub-micron field effect transistors | |
JPH08130309A (ja) | 半導体装置及びその製造方法 | |
JPH0697288A (ja) | 半導体装置の製造方法 | |
JP2550302B2 (ja) | 半導体装置の製造方法 | |
JPS6163059A (ja) | 半導体装置 | |
JPH09162392A (ja) | 半導体装置 | |
JP2855981B2 (ja) | 半導体装置の製造方法 | |
JPH05343515A (ja) | 半導体装置及びその製造方法 | |
JPH056345B2 (enrdf_load_stackoverflow) | ||
US5821165A (en) | Method of fabricating semiconductor devices | |
JPH11340326A (ja) | 半導体装置の製造方法 | |
JPH0481323B2 (enrdf_load_stackoverflow) |